AOS Semiconductor Product Reliability Report AO8803/L, rev C Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com This AOS product reliability report summarizes the qualification result for AO8803/L. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AO8803/L passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AO8803/L uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 1.8V. This device is suitable for use as a load switch or in PWM applications. It is ESD protected. -RoHS Compliant -AO8803L is Halogen Free Detailed information refers to datasheet. II. Die / Package Information: AO8803/L Standard sub-micron Low voltage N+P channel, dual die Package Type TSSOP8 Lead Frame Copper Die Attach Silver epoxy Bonding Wire Au wire Mold Material Epoxy resin with silica filler MSL (moisture sensitive level) Level 1 based on J-STD-020 Process Note * based on information provided by assembler and mold compound supplier III. Result of Reliability Stress for AO8803/L Test Item Test Condition Time Point Lot Attribution Total Sample size Number of Failures MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c HTGB Temp = 150 °c, Vgs=100% of Vgsmax Standard - 4 lots 550pcs 0 JESD22A113 168hrs 500 hrs 1000 hrs 231pcs 0 3 lots JESD22A108 0 JESD22A108 77pcs / lot HTRB Temp = 150 °c, Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs 3 lots 130 +/- 2°°c, 85%RH, 33.3 psi, Vgs = 80% of Vgs max 121°°c, 29.7psi, RH=100% 100 hrs 3 lots 165pcs 0 JESD22A110 96 hrs 4 lots 55pcs / lot 220pcs 0 JESD22A102 -65°°c to 150°°c, air to air 250 / 500 cycles 3 lots 55pcs / lot 165pcs 0 JESD22A104 231pcs 77pcs / lot HAST Pressure Pot Temperature Cycle 55pcs / lot IV. Reliability Evaluation FIT rate (per billion): 15 MTTF = 7435 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AO8803/L). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10 9 7 MTTF = 10 / FIT = 6.51 x 10 hrs = 7435 years / [2x (3x2x77) x (500) x258] = 15 Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u = The use junction temperature in degree (Kelvin), K = C+273.16 -5 K = Boltzmann’s constant, 8.617164 X 10 eV / K