Reliability Report

AOS Semiconductor
Product Reliability Report
AO8803/L,
rev C
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
This AOS product reliability report summarizes the qualification result for AO8803/L.
Accelerated environmental tests are performed on a specific sample size, and then followed
by electrical test at end point. Review of final electrical test result confirms that AO8803/L
passes AOS quality and reliability requirements. The released product will be categorized by
the process family and be monitored on a quarterly basis for continuously improving the
product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AO8803/L uses advanced trench technology to provide excellent RDS(ON), low gate charge
and operation with gate voltages as low as 1.8V. This device is suitable for use as a load
switch or in PWM applications. It is ESD protected.
-RoHS Compliant
-AO8803L is Halogen Free
Detailed information refers to datasheet.
II. Die / Package Information:
AO8803/L
Standard sub-micron
Low voltage N+P channel, dual die
Package Type
TSSOP8
Lead Frame
Copper
Die Attach
Silver epoxy
Bonding Wire
Au wire
Mold Material
Epoxy resin with silica filler
MSL (moisture sensitive level) Level 1 based on J-STD-020
Process
Note * based on information provided by assembler and mold compound supplier
III. Result of Reliability Stress for AO8803/L
Test Item
Test Condition
Time
Point
Lot
Attribution
Total
Sample
size
Number
of
Failures
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
reflow@260°c
HTGB
Temp = 150 °c,
Vgs=100% of
Vgsmax
Standard
-
4 lots
550pcs
0
JESD22A113
168hrs
500 hrs
1000 hrs
231pcs
0
3 lots
JESD22A108
0
JESD22A108
77pcs / lot
HTRB
Temp = 150 °c,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
3 lots
130 +/- 2°°c,
85%RH, 33.3 psi,
Vgs = 80% of Vgs
max
121°°c, 29.7psi,
RH=100%
100 hrs
3 lots
165pcs
0
JESD22A110
96 hrs
4 lots
55pcs / lot
220pcs
0
JESD22A102
-65°°c to 150°°c,
air to air
250 / 500
cycles
3 lots
55pcs / lot
165pcs
0
JESD22A104
231pcs
77pcs / lot
HAST
Pressure Pot
Temperature
Cycle
55pcs / lot
IV. Reliability Evaluation
FIT rate (per billion): 15
MTTF = 7435 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in sample size of the selected product (AO8803/L). Failure Rate Determination is based
on JEDEC Standard JESD 85. FIT means one failure per billion hours.
2
9
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10
9
7
MTTF = 10 / FIT = 6.51 x 10 hrs = 7435 years
/ [2x (3x2x77) x (500) x258] = 15
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
-5
K = Boltzmann’s constant, 8.617164 X 10 eV / K