MPW Calendar and Price List 2016

MPW Shuttle Service 2016
Schedule
Services
Process
Data and Order to
Tape In
8)
Samples Out 1)
Technologies available for MPW service
For pricing information please contact your local ams sales representative.
0.18 µm HV-CMOS 20V / 50V 7)
Process
Technology
Issue November 2015
Features
H18
ams
29-Feb-16
20-May-16
H18
0.18 µm HV-CMOS
1.8/5V Gates
1.8/5/20/50V FETs
HighRes-Poly
MIM-Cap
6 Metal Layer
H18
ams
30-May-16
19-Aug-16
C18
0.18 µm CMOS
1.8/5V Gates
1.8/5V FETs
HighRes-Poly
MIM-Cap
6 Metal Layer
H18
ams
29-Aug-16
18-Nov-16
H35
0.35 µm HV-CMOS
3.3/5/20V Gates
3.3/5/20/50/120V FETs
HighRes-Poly
PIP-Cap
4 Metal Layer
H18
ams
5-Dec-16
24-Feb-17
C35
0.35 µm CMOS
3.3/5V Gates
3.3/5 FETs
HighRes-Poly
PIP-Cap
4 Metal Layer
S35
0.35 µm SiGe-BiCMOS
3.3/5V Gates
3.3/5/12V HBTs
HighRes-Poly
PIP- & MIM-Cap
4 Metal Layer
0.18 µm CMOS 1.8V / 5V
7)
C18
ams
29-Feb-16
20-May-16
C18
ams
30-May-16
19-Aug-16
The participation in the ams MPW service includes the delivery of 40 dice.
C18
ams
29-Aug-16
18-Nov-16
Process stops, wafer probe tests or wafer shipments are not possible for MPWs.
ams
5-Dec-16
24-Feb-17
C18
0.35 µm HV-CMOS 20V / 50V / 120V (embedded Flash 6))
Additional Services
Comment
H35B4D3
ams
22-Feb-16
22-Apr-16
Additional Dice
Up to 100 possible from single placement on MPW
H35B4D3
ams
9-May-16
08-Jul-16
Ceramic Packages
10 parts with taped lid
H35B4D3
ams
22-Aug-16
21-Oct-16
Scoop & Goop Packages
10 parts / availability check necessary at tape in
H35B4D3
ams
7-Nov-16
05-Jan-17
Plastic Packages
50 parts with up to 84 pins / requires an additional cycle time of 2 to 3 weeks
WLCSP with RDL
WLCSP (Balls 250µm, 400µm min. pitch) with redistribution layer available on request(0.35µm only)
6)
0.35 µm CMOS 3.3V / 5V 2P/4M (embedded Flash ) and 0.35 µm Opto-CMOS
2)
ams
2) 3) 4)
2)
C35B4xx
C35B4xx
C35B4xx
C35B4xx
2) 3) 4) 5)
1-Feb-16
18-Mar-16
0.35 µm CMOS with Embedded Flash
High reliability EEPROM and Flash with block sizes from 1kx8 to 32kx16 bit
Fraunhofer IIS
18-Apr-16
24-Jun-16
0.35 µm HV-CMOS with Embedded Flash
High reliability EEPROM and Flash with block sizes from 1kx8 - 4kx16 bit
ams
20-Jun-16
5-Aug-16
0.35 µm Opto CMOS
Opto process with optional EPI wafer startmaterial and antireflective coating layer
Fraunhofer IIS
01-Aug-16
07-Oct-16
Notes
2)
ams
3-Oct-16
18-Nov-16
1)
2) 3) 5)
Fraunhofer IIS
21-Nov-16
27-Jan-17
C35B4xx
C35B4xx
3)
ams
S35D4M5
7-Mar-16
ams
13-Jun-16
The total cycle time includes MPW cluster preparation, wafer manufacturing & back-lapping, dicing, assembling in ceramic or in scoop&goop package.
2)
Represents different process options in ams Fab B (exception: RF-CMOS, e.g. C35B4M3).
13-May-16
3)
Opto option available on request. Opto CMOS process only available for 2 poly / 4 metal.
19-Aug-16
4)
Opto CMOS process with ARC/BARC
WLCSP with RDL
0.35 µm SiGe-BiCMOS 3.3V / 5V 2P/4M
S35D4M5
The Sample Out dates are without obligation.
S35D4M5
ams
19-Sep-16
18-Nov-16
5)
S35D4M5
ams
19-Dec-16
10-Feb-17
6)
EEPROM resp. Flash option available on request for every MPW-start in 0.35µm CMOS and 0.35µm HV-CMOS technology.
7)
When submitting a database in 0.18 µm technologies, a completed ENG-21A document must be provided in addition to the standard Foundry Service Request Form
Additional MPW Shuttles are scheduled by our partners
Fraunhofer IIS
Europractice
www.iis.fraunhofer.de
www.europractice-ic.com
CMP
MOSIS
cmp.imag.fr
www.mosis.com
MEDs Technologies
TOPPAN
www-meds-tech.com
www.toptdc.com
(ENG-21). Please refer to the web links given below under "Technical Information".
8)
Please provide a completed Foundry Service Request Form (ENG-21; s.link below "Technical Information"), when providing a database.
Disclaimer
No implied offer:
Technical Information
The usage of ams design kits and/or libraries or the participation on Multi Project Wafer runs shall
In any case each integrated circuit, which is planned for production, requires an official quotation
Contacts
ams
mailto:[email protected]
Foundry Support Server:
asic.ams.com
Tape-out form:
Foundry Request Form & 0.18 µm Addendum
not be regarded as an implied offer by ams to subsequently manufacture such integrated circuit.
by ams.
Fraunhofer IIS
mailto:[email protected]
Delivery dates are subject to change without notice.
AMS RESERVES THE RIGHTS TO MAKE CHANGES WITHOUT NOTICE!
Purchase orders are based on ams General Terms of Trade.