MPW Shuttle Service 2016 Schedule Services Process Data and Order to Tape In 8) Samples Out 1) Technologies available for MPW service For pricing information please contact your local ams sales representative. 0.18 µm HV-CMOS 20V / 50V 7) Process Technology Issue November 2015 Features H18 ams 29-Feb-16 20-May-16 H18 0.18 µm HV-CMOS 1.8/5V Gates 1.8/5/20/50V FETs HighRes-Poly MIM-Cap 6 Metal Layer H18 ams 30-May-16 19-Aug-16 C18 0.18 µm CMOS 1.8/5V Gates 1.8/5V FETs HighRes-Poly MIM-Cap 6 Metal Layer H18 ams 29-Aug-16 18-Nov-16 H35 0.35 µm HV-CMOS 3.3/5/20V Gates 3.3/5/20/50/120V FETs HighRes-Poly PIP-Cap 4 Metal Layer H18 ams 5-Dec-16 24-Feb-17 C35 0.35 µm CMOS 3.3/5V Gates 3.3/5 FETs HighRes-Poly PIP-Cap 4 Metal Layer S35 0.35 µm SiGe-BiCMOS 3.3/5V Gates 3.3/5/12V HBTs HighRes-Poly PIP- & MIM-Cap 4 Metal Layer 0.18 µm CMOS 1.8V / 5V 7) C18 ams 29-Feb-16 20-May-16 C18 ams 30-May-16 19-Aug-16 The participation in the ams MPW service includes the delivery of 40 dice. C18 ams 29-Aug-16 18-Nov-16 Process stops, wafer probe tests or wafer shipments are not possible for MPWs. ams 5-Dec-16 24-Feb-17 C18 0.35 µm HV-CMOS 20V / 50V / 120V (embedded Flash 6)) Additional Services Comment H35B4D3 ams 22-Feb-16 22-Apr-16 Additional Dice Up to 100 possible from single placement on MPW H35B4D3 ams 9-May-16 08-Jul-16 Ceramic Packages 10 parts with taped lid H35B4D3 ams 22-Aug-16 21-Oct-16 Scoop & Goop Packages 10 parts / availability check necessary at tape in H35B4D3 ams 7-Nov-16 05-Jan-17 Plastic Packages 50 parts with up to 84 pins / requires an additional cycle time of 2 to 3 weeks WLCSP with RDL WLCSP (Balls 250µm, 400µm min. pitch) with redistribution layer available on request(0.35µm only) 6) 0.35 µm CMOS 3.3V / 5V 2P/4M (embedded Flash ) and 0.35 µm Opto-CMOS 2) ams 2) 3) 4) 2) C35B4xx C35B4xx C35B4xx C35B4xx 2) 3) 4) 5) 1-Feb-16 18-Mar-16 0.35 µm CMOS with Embedded Flash High reliability EEPROM and Flash with block sizes from 1kx8 to 32kx16 bit Fraunhofer IIS 18-Apr-16 24-Jun-16 0.35 µm HV-CMOS with Embedded Flash High reliability EEPROM and Flash with block sizes from 1kx8 - 4kx16 bit ams 20-Jun-16 5-Aug-16 0.35 µm Opto CMOS Opto process with optional EPI wafer startmaterial and antireflective coating layer Fraunhofer IIS 01-Aug-16 07-Oct-16 Notes 2) ams 3-Oct-16 18-Nov-16 1) 2) 3) 5) Fraunhofer IIS 21-Nov-16 27-Jan-17 C35B4xx C35B4xx 3) ams S35D4M5 7-Mar-16 ams 13-Jun-16 The total cycle time includes MPW cluster preparation, wafer manufacturing & back-lapping, dicing, assembling in ceramic or in scoop&goop package. 2) Represents different process options in ams Fab B (exception: RF-CMOS, e.g. C35B4M3). 13-May-16 3) Opto option available on request. Opto CMOS process only available for 2 poly / 4 metal. 19-Aug-16 4) Opto CMOS process with ARC/BARC WLCSP with RDL 0.35 µm SiGe-BiCMOS 3.3V / 5V 2P/4M S35D4M5 The Sample Out dates are without obligation. S35D4M5 ams 19-Sep-16 18-Nov-16 5) S35D4M5 ams 19-Dec-16 10-Feb-17 6) EEPROM resp. Flash option available on request for every MPW-start in 0.35µm CMOS and 0.35µm HV-CMOS technology. 7) When submitting a database in 0.18 µm technologies, a completed ENG-21A document must be provided in addition to the standard Foundry Service Request Form Additional MPW Shuttles are scheduled by our partners Fraunhofer IIS Europractice www.iis.fraunhofer.de www.europractice-ic.com CMP MOSIS cmp.imag.fr www.mosis.com MEDs Technologies TOPPAN www-meds-tech.com www.toptdc.com (ENG-21). Please refer to the web links given below under "Technical Information". 8) Please provide a completed Foundry Service Request Form (ENG-21; s.link below "Technical Information"), when providing a database. Disclaimer No implied offer: Technical Information The usage of ams design kits and/or libraries or the participation on Multi Project Wafer runs shall In any case each integrated circuit, which is planned for production, requires an official quotation Contacts ams mailto:[email protected] Foundry Support Server: asic.ams.com Tape-out form: Foundry Request Form & 0.18 µm Addendum not be regarded as an implied offer by ams to subsequently manufacture such integrated circuit. by ams. Fraunhofer IIS mailto:[email protected] Delivery dates are subject to change without notice. AMS RESERVES THE RIGHTS TO MAKE CHANGES WITHOUT NOTICE! Purchase orders are based on ams General Terms of Trade.