AOS Semiconductor Product Reliability Report AO4407 / AO4407L, rev D Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com Dec 27, 2005 1 This AOS product reliability report summarizes the qualification result for AO4407. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AO4407 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. V. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation Quality Assurance Information I. Product Description: The AO4407 uses advanced trench technology to provide excellent RDS(ON), and ultra-low low gate charge with a 25V gate rating. This device is suitable for use as a load switch or in PWM applications. Standard Product AO4407 is Pb-free (meets ROHS & Sony 259 specifications). AO4407L is a Green Product ordering option. AO4407 and AO4407L are electrically identical. Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol Maximum Units Drain-Source Voltage VDS -30 V Gate-Source Voltage VGS ±25 V Continuous Drain Current TA=25°C TA=70°C Pulsed Drain Current TA=25°C Power Dissipation TA=70°C Junction and Storage Temperature Range Thermal Characteristics Parameter Maximum Junction-toAmbient Maximum Junction-toAmbient Maximum Junction-to-Lead -12 ID -10 IDM -60 3 PD W 2.1 TJ, TSTG -55 to 150 Symbol T ≤ 10s SteadyState SteadyState A RθJA RθJL °C Typ Max Units 28 40 °C/W 54 75 °C/W 21 30 °C/W 2 II. Die / Package Information: AO4407 AO4407L (Green Compound) Process Standard sub-micron Standard sub-micron low voltage P channel process low voltage P channel process Package Type Lead Frame Die Attach Bond wire Mold Material Filler % (Spherical/Flake) Flammability Rating Backside Metallization Moisture Level 8 leads SOIC Ag with Solder Plate Silver-filled Epoxy 2 mils Au wire Epoxy resin with silica filler 90/10 UL-94 V-0 Ti / Ni / Ag Up to Level 1 * 8 leads SOIC Ag with Solder Plate Silver-filled Epoxy 2 mils Au wire Epoxy resin with silica filler 100/0 UL-94 V-0 Ti / Ni / Ag Up to Level 1* Note * based on info provided by assembler and mold compound supplier III. Result of Reliability Stress for AO4407 (Standard) & AO4407L (Green) Test Item Test Condition Time Point Solder Reflow Precondition Standard: 1hrPCT+3 cycle reflow@260°c Green: 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c, 0hr HTGB Vgs=100% of Vgsmax Lot Attribution Total Sample size Number of Failures Standard: 6 lots Green: 16 lots 3300 pcs 0 168 / 500 hrs 6 lots 492 pcs 0 1000 hrs (Note A*) 168 / 500 hrs 6 lots 1000 hrs (Note A*) 100 hrs Standard: 6 lots Green: 13 lots 77+5 pcs / lot HTRB Temp = 150°c, Vds=80% of Vdsmax 492 pcs 0 77+5 pcs / lot HAST Pressure Pot Temperature Cycle 130 +/- 2°c, 85%RH, 33.3 psi, Vgs = 80% of Vgs max 121°c, 15+/-1 PSIG, RH=100% -65°c to 150°c, air to air, 0.5hr per cycle 1045 pcs 0 50+5 pcs / lot 96 hrs 250 / 500 cycles (Note B**) Standard: 5 lots Green: 16 lots (Note B**) Standard: 5 lots Green: 15 lots 1155 pcs 0 50+5 pcs / lot 1100 pcs 0 50+5 pcs / lot (Note B**) 3 III. Result of Reliability Stress for AO4407 (Standard) & AO4407L (Green) Continues DPA Internal Vision Cross-section X-ray CSAM NA 5 5 5 5 5 5 0 NA 5 5 0 Bond Integrity Room Temp 150°C bake 150°C bake 0hr 250hr 500hr 40 40 40 40 wires 40 wires 40 wires 0 Solderability 230°c 5 sec 15 15 leads 0 Die Shear 150°c 0hr 10 10 0 Note A: The HTGB and HTRB reliability data presents total of available AO4407 and AO4407L burn-in data up to the published date. Note B: The pressure pot, temperature cycle and HAST reliability data for AO4407 and AO4407L comes from the AOS generic package qualification data. IV. Reliability Evaluation FIT rate (per billion): 7 MTTF =16307 years In general, 500 hrs of HTGB, 150 deg C accelerated stress testing is equivalent to 15 years of lifetime at 55 deg C operating conditions (by applying the Arrhenius equation with an activation energy of 0.7eV and 60% of upper confidence level on the failure rate calculation). AOS reliability group also routinely monitors the product reliability up to 1000 hr at and performs the necessary failure analysis on the units failed for reliability test(s). The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AO3401). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)] = 1.83 x 109 / [2 (3×164) (168) (258) + 2 (164) (500)(258) + 2 (2×164) (1000) (258)] =7 MTTF = 109 / FIT = 1.42×108hrs =16307 years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u = The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5e V / K 4 V. Quality Assurance Information Acceptable Quality Level for outgoing inspection: 0.1% for electrical and visual. Guaranteed Outgoing Defect Rate: < 25 ppm Quality Sample Plan: conform to Mil-Std-105D 5