AOS Semiconductor Product Reliability Report AOTF4185, rev B Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOTF4185. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOTF4185 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AOTF4185 combines advanced trench MOSFET technology with a low resistance package to provide extremely low RDS(ON). This device is ideal for load switch and battery protection applications. -RoHS Compliant Details refer to the datasheet. II. Die / Package Information: AOTF4185 Standard sub-micron Low voltage P channel process Package Type 3 leads TO220FL Lead Frame Bare Cu Die Attach Soft solder Bond wire Al & Au wire Mold Material Epoxy resin with silica filler Moisture Level Up to Level 1 * Note * based on info provided by assembler and mold compound supplier Process 2 III. Result of Reliability Stress for AOTF4185 Test Item Test Condition Time Point MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@250°c Temp = 150°c , Vgs=100% of Vgsmax - Temp = 150°c , Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs HTGB Lot Attribution 11 lots 168hrs 500 hrs 1000 hrs Pressure Pot Temperature Cycle 130 +/- 2°c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 121°c , 29.7psi, RH=100% -65°c to 150°c , air to air, 1815pcs 0 JESD22A113 77pcs 0 JESD22A108 0 JESD22A108 275pcs 0 JESD22A110 0 JESD22A102 0 JESD22A104 77 pcs / lot 77pcs 77 pcs / lot 100 hrs 5 lots 96 hrs (Note A*) 11 lots 55 pcs / lot 847pcs (Note A*) 77 pcs / lot 250 / 500 cycles Reference Standard 1 lot (Note A*) HAST Number of Failures 1 lot (Note A*) HTRB Total Sample size 9 lots (Note A*) 693pcs 77 pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 46 MTTF = 2478 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOTF4185). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)] = 1.83 x 109 / [2x2x77x500x258] = 46 9 7 MTTF = 10 / FIT = 2.17 x 10 hrs = 2478 years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 3