Reliability Report

AOS Semiconductor
Product Reliability Report
AOTF4185,
rev B
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
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This AOS product reliability report summarizes the qualification result for AOTF4185. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOTF4185 passes AOS quality
and reliability requirements. The released product will be categorized by the process family and
be monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AOTF4185 combines advanced trench MOSFET technology with a low resistance package
to provide extremely low RDS(ON). This device is ideal for load switch and battery protection
applications.
-RoHS Compliant
Details refer to the datasheet.
II. Die / Package Information:
AOTF4185
Standard sub-micron
Low voltage P channel process
Package Type
3 leads TO220FL
Lead Frame
Bare Cu
Die Attach
Soft solder
Bond wire
Al & Au wire
Mold Material
Epoxy resin with silica filler
Moisture Level
Up to Level 1 *
Note * based on info provided by assembler and mold compound supplier
Process
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III. Result of Reliability Stress for AOTF4185
Test Item
Test Condition
Time
Point
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
reflow@250°c
Temp = 150°c ,
Vgs=100% of
Vgsmax
-
Temp = 150°c ,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
HTGB
Lot
Attribution
11 lots
168hrs
500 hrs
1000 hrs
Pressure Pot
Temperature
Cycle
130 +/- 2°c ,
85%RH,
33.3 psi, Vgs =
80% of Vgs max
121°c , 29.7psi,
RH=100%
-65°c to 150°c ,
air to air,
1815pcs
0
JESD22A113
77pcs
0
JESD22A108
0
JESD22A108
275pcs
0
JESD22A110
0
JESD22A102
0
JESD22A104
77 pcs / lot
77pcs
77 pcs / lot
100 hrs
5 lots
96 hrs
(Note A*)
11 lots
55 pcs / lot
847pcs
(Note A*)
77 pcs / lot
250 / 500
cycles
Reference
Standard
1 lot
(Note A*)
HAST
Number
of
Failures
1 lot
(Note A*)
HTRB
Total
Sample size
9 lots
(Note A*)
693pcs
77 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 46
MTTF = 2478 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOTF4185). Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion hours.
Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)] = 1.83 x 109 / [2x2x77x500x258] = 46
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MTTF = 10 / FIT = 2.17 x 10 hrs = 2478 years
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
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Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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