R527 Reliability Data

Reliability Data Report
Product Family R527
LTC1955 / LTC4307 / LTC4308 / LTC4309 /
LTC4310 / LTC4311 / LTC4316 / LTC4317 /
LTC4318 / LTC4556 / LTC4357 / LTC4358
Reliability Data Report
Report Number: R527
Report generated on: Thu Aug 21 13:38:14 PDT 2014
OPERATING LIFE TEST
PACKAGE TYPE
QFN/DFN
SOIC/MSOP
Totals
SAMPLE SIZE
154
231
385
OLDEST DATE
NEWEST DATE
K DEVICE HRS
1
CODE
CODE
(+125°C)
0723
0722
-
0750
0923
-
154
166
320
No. of FAILURES
2,3
0
0
0
HIGHLY ACCELERATED STRESS TEST AT +130 DEG C / 85% RH
PACKAGE TYPE
QFN/DFN
SSOP/TSSOP
Totals
SAMPLE SIZE
132
56
188
OLDEST DATE
NEWEST DATE
K DEVICE HRS
No. of FAILURES
4
CODE
CODE
(+85°C)
1136
1115
-
1136
1115
-
443
241
684
0
0
0
K DEVICE HRS
No. of FAILURES
PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C
PACKAGE TYPE
SAMPLE SIZE
SSOP/TSSOP
SOIC/MSOP
QFN/DFN
SOT
Totals
150
50
1248
98
1,546
OLDEST DATE
NEWEST DATE
CODE
CODE
1017
1024
0222
0820
-
1115
1024
1007
0916
-
3
1
48
2
54
0
0
0
0
0
OLDEST DATE
NEWEST DATE
K DEVICE
No. of FAILURES
CODE
CODE
CYCLES
1017
1024
0222
-
1115
1024
1117
-
15
5
198
218
0
0
0
0
OLDEST DATE
NEWEST DATE
K DEVICE
No. of FAILURES
CODE
CODE
CYCLES
1017
0949
0816
-
1115
1024
1223
-
15
15
10
40
TEMP CYCLE FROM -65 TO 150 DEG C
PACKAGE TYPE
SAMPLE SIZE
SSOP/TSSOP
SOIC/MSOP
QFN/DFN
Totals
150
50
1222
1,422
THERMAL SHOCK FROM -65 TO 150 DEG C
PACKAGE TYPE
SAMPLE SIZE
SSOP/TSSOP
SOIC/MSOP
QFN/DFN
Totals
150
150
100
400
(1) Assumes Activation Energy = 0.7 Electron Volts
(2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =37.03 FITS
(3) Mean Time Between Failure in Years = 3082.92
(4) Assumes 20X Acceleration from 85 °C to +130 °C
Note: 1 FIT = 1 Failure in One Billion Hours.
Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL1 Preconditioning
0
0
0
0