Reliability Data Report Product Family R527 LTC1955 / LTC4307 / LTC4308 / LTC4309 / LTC4310 / LTC4311 / LTC4316 / LTC4317 / LTC4318 / LTC4556 / LTC4357 / LTC4358 Reliability Data Report Report Number: R527 Report generated on: Thu Aug 21 13:38:14 PDT 2014 OPERATING LIFE TEST PACKAGE TYPE QFN/DFN SOIC/MSOP Totals SAMPLE SIZE 154 231 385 OLDEST DATE NEWEST DATE K DEVICE HRS 1 CODE CODE (+125°C) 0723 0722 - 0750 0923 - 154 166 320 No. of FAILURES 2,3 0 0 0 HIGHLY ACCELERATED STRESS TEST AT +130 DEG C / 85% RH PACKAGE TYPE QFN/DFN SSOP/TSSOP Totals SAMPLE SIZE 132 56 188 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES 4 CODE CODE (+85°C) 1136 1115 - 1136 1115 - 443 241 684 0 0 0 K DEVICE HRS No. of FAILURES PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C PACKAGE TYPE SAMPLE SIZE SSOP/TSSOP SOIC/MSOP QFN/DFN SOT Totals 150 50 1248 98 1,546 OLDEST DATE NEWEST DATE CODE CODE 1017 1024 0222 0820 - 1115 1024 1007 0916 - 3 1 48 2 54 0 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 1017 1024 0222 - 1115 1024 1117 - 15 5 198 218 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 1017 0949 0816 - 1115 1024 1223 - 15 15 10 40 TEMP CYCLE FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE SSOP/TSSOP SOIC/MSOP QFN/DFN Totals 150 50 1222 1,422 THERMAL SHOCK FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE SSOP/TSSOP SOIC/MSOP QFN/DFN Totals 150 150 100 400 (1) Assumes Activation Energy = 0.7 Electron Volts (2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =37.03 FITS (3) Mean Time Between Failure in Years = 3082.92 (4) Assumes 20X Acceleration from 85 °C to +130 °C Note: 1 FIT = 1 Failure in One Billion Hours. Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL1 Preconditioning 0 0 0 0