APL3202

APL3202
Li+ Battery Charger with Thermal Regulation
General Description
Features
•
•
•
•
The APL3202 is a constant-current/constant-voltage linear charger for single cell Li+ batteries. The APL3202
Programmable Charge Current Up to 500mA
Charge Status Output Pin
needs no external MOSFETs or diodes, and accepts input voltages up to 6.5V. The small package and low ex-
Soft-Start Limits Inrush Current
4.2V Charge Termination Voltage with ±1%
ternal component counts make the APL3202 an idea part
for portable applications.
Accuracy
•
•
•
•
•
45mA Pre-charge Current (RSET=2K)
On-chip thermal regulation protects the APL3202 from
excessive temperature and optimizes the board design
Thermal Regulation Simplifies Board Design
Enable/Disable Control
for compact size and typical thermal conditions. When
the junction temperature reaches the thermal regulation
Available in a SOT-23-5 Package
threshold, the charger does not shut down but simply
reduces the charge current. Charge current can be pro-
Lead Free and Green Devices Available
(RoHS Compliant)
grammed by connecting an external resistor from ISET
pin to GND. Using an external MOSFET to disconnect the
Applications
•
•
•
•
resistor from ground shuts down the charger, and reduces the input supply current down to 25µA. The
MP3 Players
APL3202 also has the STAT pin to indicate charge status.
The APL3202 is available in a SOT-23-5 package, and
Cell Phones
operates over the -40°C to +85°C temperature range.
Bluetooth Applications
Wireless Appliances
Pin Configuration
Simplified Application Circuit
APL3202
5V
Adapter
STAT 1
VIN
STAT
BATT 3
APL3202
ISET
BATT
GND
5 ISET
GND 2
4 VIN
SOT-23-5
(Top View)
Li+
Battery
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Mar., 2012
1
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APL3202
Ordering and Marking Information
Package Code
B : SOT-23-5
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APL3202
Assembly Material
Handling Code
Temperature Range
Package Code
APL3202 B:
302X
X - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol
VIN
VSET, VSTAT, VBATT
ICHG
TJ
Parameter
Rating
Unit
VIN to GND
-0.3 to 7
V
ISET, STAT, BATT to GND
-0.3 to 7
V
Charge Current
0.8
A
Maximum Junction Temperature
150
°C
-65 to 150
°C
260
°C
TSTG
Storage Temperature Range
TSDR
Maximum Lead Soldering Temperature, 10 Seconds
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Thermal Characteristics
Symbol
θJA
Parameter
Junction to Ambient Resistance (Note 2)
SOT-23-5
Typical Value
Unit
125
°C/W
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Recommended Operating Conditions (Note 3)
Symbol
VIN
ICHG
Parameter
VIN to GND
Range
Unit
4.35 to 6.5
V
Charge Current
0.1 to 0.5
A
TJ
Junction Temperature
-40 to 125
°C
TA
Ambient Temperature
-40 to 85
°C
Note 3 : Refer to the typical application circuit.
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Mar., 2012
2
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APL3202
Electrical Characteristics
Refer to the typical application circuit. These specifications apply over VIN=5V, TA= -40~85°C, unless otherwise specified. Typical
values are at TA=25°C.
Symbol
Parameter
APL3202
Test Conditions
Unit
Min.
Typ.
Max.
Charge mode, RSET=10K
-
300
600
Standby mode (Charge terminated)
-
200
500
Shutdown mode (RSET not
connected, VIN<VBATT, or VIN<VUVLO)
-
25
50
BATT Standby Input Current
Standby mode, VBATT=4.2V
0
2.5
6
BATT Shutdown Input Current
Shutdown mode (RSET not
connected)
-
-
1
BATT Sleep Input Current
Sleep mode, VIN=0V
-
-
1
3.75
3.85
3.95
V
0.15
0.20
0.30
V
-
4.20
-
V
-0.5
-
0.5
%
SUPPLY CURRENT
IIN
VIN Supply Current
(Note 4)
µA
BATT REVERSE CURRENT
IBATT
µA
UNDER-VOLTAGE LOCKOUT
VUVLO
VIN UVLO Threshold
VIN rising
VIN UVLO Hysteresis
BATTERY VOLTAGE AND THRESHOLD VOLTAGE
VTERM
BATT Charge Termination Voltage
BATT Charge Termination Voltage
Accuracy
TA=25°C, VIN=4.35~6.5V
TA =-40~85°C
-1
-
1
%
BATT Pre-charge Threshold Voltage
VBATT rising
2.8
2.9
3.0
V
60
80
110
mV
VIN from low to high
80
120
160
VIN from high to low
40
80
120
3.9
4.05
4.2
VSET rising
1.15
1.21
1.3
VSET falling
0.9
1.0
1.1
RSET=10K
Without thermal regulation
91
100
109
RSET=2K
Without thermal regulation
455
500
545
ISET Regulation Voltage
Without thermal regulation
-
1
-
V
ISET Regulation Voltage Accuracy
TJ=-40~125°C, VIN=4.35~6.5V
-0.7
-
0.7
%
ISET Pull-Up Current
VSET=1V, TA=25°C
-
2.5
-
µA
Charging Current Set Factor
0.1A≤ ICHG ≤0.5A
940
1000
1060
-
Pre-charging Current
VBATT<2.8V, RSET=2K
20
45
70
mA
C/10 Termination Current Threshold
RSET=2K to 10K
8.5
10
11.5
%
-
800
1200
mΩ
-
400
600
mV
BATT Pre-charge Hysteresis Voltage
VASD
VRECHRG
VMSD
VIN-VBATT Lockout Threshold Voltage
Recharge Threshold Voltage
Manual Shutdown Threshold Voltage
mV
V
V
BATTERY CHARGING AND PRE-CHARGE CURRENT
ICHG
VSET
KSET
ITERM
Charging Current
mA
DROPOUT VOLTAGE
Power FET On Resistance
VIN to VBATT Dropout Voltage
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Mar., 2012
ICHG=0.5A, VIN=5V
3
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APL3202
Electrical Characteristics (Cont.)
Refer to the typical application circuit. These specifications apply over VIN=5V, TA= -40~85°C, unless otherwise specified. Typical
values are at TA=25°C.
Symbol
Parameter
APL3202
Test Conditions
Unit
Min.
Typ.
Max.
STAT PIN AND THERMAL REGULATION
VSTAT
TLIM
STAT Output Low Voltage
ISTAT = 5mA
-
0.35
0.6
V
STAT Off-leakage Current
VSTAT=5V
-
-
1
µA
-
120
-
°C
-
100
-
µs
Thermal Regulation Threshold
SOFT-START AND TIMING
TSS
TRECHARGE
TTERM
Soft-Start Interval
ICHG=0A to full charging current
TA=25°C
Recharge Comparator Filter Time
VBATT high to low, TA=25°C
0.75
2
4.5
ms
Termination Comparator Filter Time
ICHG falling below ITERM, TA=25°C
0.4
1
2.5
ms
Note 4 : Supply current includes ISET pin current but does not include any current delivered to the battery through the BATT pin.
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Mar., 2012
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APL3202
Typical Operating Characteristics
Refer to the typical application circuit, VIN=5V, TA= 25°C, unless otherwise specified.
ISET Pin Voltage vs. Junction
Temperature
ISET Pin Voltage vs. VIN Supply Voltage
1.015
1.04
VBATT = 4V
ISET Pin Voltage (V)
ISET Pin Voltage (V)
1.010
1.005
1.000
0.995
0.990
1.02
1.01
1
0.99
0.98
0.97
0.985
4
4.5
5
5.5
VIN Supply Voltage (V)
0.96
-50
6
0.5
ISET Pin Pull-Up Current (µA)
RSET= 2K
0.4
Charge Current (A)
100
4.5
VIN = 5V
0.3
0.2
0.1
0
0.2
0.4
0.6
0.8
ISET Pin Voltage (V)
3.5
3
2.5
2
1.5
1
0.5
0
-50
1
-25
0
25
50
75
Junction Temperature ( oC)
100
BATT Charge Termination Voltage
vs. Junction Temperature
3
BATT Charge Termination Voltage (V)
4.3
VIN = 5V
VBATT = 4.3V
2.5
2
1.5
1
0.5
0
0
VIN = 6.5V
VBATT = 4.3V
VSET = 0V
4
ISET Pin Pull-Up Current vs. ISET Pin
Voltage
ISET Pin Pull-Up Current (µA)
-25
0
25
50
75
Junction Temperature ( oC)
ISET Pin Pull-Up Current vs. Junction
Temperature
Charge Current vs. ISET Pin Voltage
0
VIN = 5V
VBATT = 4V
RSET = 10K
1.03
RSET = 10k
1
2
3
ISET Pin Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Mar., 2012
4
5
5
VIN = 5V
RSET = 10K
4.25
4.2
4.15
4.1
-50
-25
0
25
50
75
Junction Temperature (oC)
100
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APL3202
Typical Operating Characteristics (Cont.)
Refer to the typical application circuit, VIN=5V, TA= 25°C, unless otherwise specified.
STAT Pin I-V Curve
4.2
30
R SET = 10K
4.18
STAT Pin Sink Current (mA)
BATT Charge Termination Voltage (V)
BATT Charge Termination Voltage
vs. VIN Supply Voltage
4.16
4.14
4.12
4.1
4
4.5
5
5.5
6
6.5
VIN Supply Voltage (V)
25
20
15
10
5
0
7
VIN = 5V
VBATT = 4V
0
STAT Pin Current vs. Junction
Temperature
16
Pre-charge Current (mA)
STAT Pin Current (mA)
5
60
12
8
VIN = 5V
VBATT = 4V
VSTAT = 1V
4
0
-50
-25
50
RSET = 2K
40
VIN = 5V
VBATT = 2.5V
30
20
RSET = 10K
10
0
25
50
75
Junction Temperature ( oC)
0
-50
100
-25
0
25
50
75
100
Junction Temperature ( oC)
Pre-charge Current vs. VIN Supply
Voltage
Pre-charge Threshold Voltage vs.
Junction Temperature
3.2
60
Pre-charge Threshold Voltage (V)
70
Pre-charge Current (mA)
2
3
4
STAT Pin Voltage (V)
Pre-charge Current vs. Junction
Temperature
20
RSET= 2K
50
40
30
VBATT = 2.5V
20
RSET = 10K
10
04
1
4.5
5
5.5
6
VIN Supply Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Mar., 2012
6.5
3.1
3
2.9
2.8
2.7
2.6
2.5
-50
7
6
VIN = 5V
RSET= 10K
-25
0
25
50
75
Junction Temperature ( oC)
100
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APL3202
Typical Operating Characteristics (Cont.)
Refer to the typical application circuit, VIN=5V, TA= 25°C, unless otherwise specified.
Power FET On Resistance vs.
Junction Temperature
Charge Current vs. BATT Voltage
1.5
Power FET On Resistance (Ω)
600
Charge Current ( mA)
500
400
VIN = 5V
RSET = 2K
300
200
100
0
2.7
3
3.3
3.6
3.9
BATT Voltage (V)
4.2
VIN = 4.2V
ICHG = 0.1A
1.3
1.1
0.9
0.7
0.5
0.3
-50
4.5
Recharge Threshold Voltage vs.
Junction Temperature
VIN = 5V
RSET = 2K
RSET = 10K
0.4
Charge Current (A)
Recharge Threshold Voltage (V)
0.5
4.07
4.05
4.03
0.3
0.2
0.1
4.01
3.99
-50
150
Charge Current vs. VIN-VBATT
4.11
4.09
0
50
100
Junction Temperature (oC)
0
-25
0
25
50
75
Junction Temperature ( oC)
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Mar., 2012
100
7
0
0.2
0.4
0.6
VIN-VBATT (V)
0.8
1
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APL3202
Operating Waveforms
Refer to the typical application circuit, VIN=5V, TA= 25°C, unless otherwise specified.
Start-up
(Reconnecting RSET to GND)
VIN Power On
VS E T
VIN
2
1
3
VS TA T
ICHG
4
ICHG
4
44
RSET = 2K, VBATT=3.8V
CH2: VSET, 2V/div, DC
CH3: VSTAT, 5V/div, DC
CH4: ICHG, 0.2A/div, DC
TIME: 0.1ms/div
RSET = 2K, VBATT=3.8V
CH1: VIN, 2V/div, DC
CH4: ICHG, 0.2A/div, DC
TIME: 0.1ms/div
Shutdown
(Disconnecting RSET from GND)
VSET
2
VS TA T
3
ICHG
4
RSET = 2K, VBATT=3.8V
CH2: VSET, 2V/div, DC
CH3: VSTAT, 5V/div, DC
CH4: ICHG, 0.2A/div, DC
TIME: 0.1ms/div
Copyright  ANPEC Electronics Corp.
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APL3202
Pin Description
PIN
FUNCTION
NO.
NAME
Enable in Charge Done
1
STAT
Open-Drain Charge Status Output Pin. When the battery is charging, the STAT pin is pulled low by
an internal switch. In other states the STAT pin is in a high impedance state.
2
GND
Ground.
3
BATT
Charger Output Pin. Connect this pin to the positive terminal of a Li+ battery.
4
VIN
Input Supply Pin. Provides power to the charger, VIN can range from 4.35V to 6.5V and should be
bypassed with a 4.7µF capacitor.
5
ISET
Charging Current Setting and Shutdown Pin. Connecting a resistor from this pin to GND to set the
charge current. Disconnecting the RSET from GND allows an internal 2.5µA current to pull the ISET
pin high, and when the ISET pin voltage exceeds the shutdown threshold voltage, the IC enters
shutdown mode.
Block Diagram
VIN
BATT
Constant Voltage
Loop Amp.
UVLO
1.21V
Charge Control Circuit
SHUTDOWN
Thermal
Regulation
STAT
GND
Pre-charge
Comp.
VIN
2.5µA
2.9V
1V
1.21V
Constant
Current
Loop Amp.
0.1V
ISET
Copyright  ANPEC Electronics Corp.
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APL3202
Typical Application Circuit
R2
4.35~6.5V
4
10k to 100kΩ
1
VIN
STAT
4.7µF
R3
2kΩ
(Option)
C1
APL3202
R1
ON
Q1
5
ISET
BATT
2kΩ
3
GND
Li+ Battery
2
OFF
Designation
C1
Q1
Description
4.7µF, 10V, X5R, 0805
Murata GRM188R61A475K
SOT-23, N-Channel MOSFET ANPEC
APM2300CA
Murata website: www.murata.com
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Mar., 2012
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APL3202
Function Description
Charge Cycle
Manual Shutdown
When the APL3202 is powered with a battery connected,
the IC firstly detects if the cell voltage is ready for full
The ISET pin provides two functions: connecting the resistor RSET from the ISET pin to ground to set the full
charge current. If the battery voltage is below pre-charge
threshold (2.9V typ.), the device supplies 1/10 the pro-
charge current; and disconnecting the RSET from GND to
shut down the device. Once the RSET is disconnected, an
grammed charge current. On the contrary, when the battery voltage is over the pre-charge threshold, the device
internal 2.5µA current pulls the ISET pin high. When the
ISET pin voltage reaches the 1.21V shutdown threshold
supplies the full charge current, as programmed by RSET
from ISET pin to GND. When the battery voltage ap-
voltage, the device enters shutdown mode. In shutdown
mode, the charging stops, the VIN supply current drops
proaches the 4.2V termination voltage, the device enters
constant-voltage mode and the full charge current gradu-
to 25µA and the battery drain current is below 1µA. Reconnecting RSET to ground enables the charger to opera-
ally decreases until the charge current drops to the termination current threshold, which is equal to 1/10 full charg-
tion normally. The STAT output keeps high state when the
charger is turned to shutdown mode.
ing current, and the IC stops charging (see Figure 1).
Thermal Regulation
Full Charge Current Setting
The APL3202 is thermally regulated to keep the junction
temperature at 120°C. When the junction temperature
The full charge current is programmed by connecting a
resistor from the ISET pin to ground. The full charge cur-
reaches 120°C, the charger does not shut down but reduces charge current to keep the junction temperature at
rent is 1000 times of the current flowing out of the ISET
pin and can be calculated by the following equation:
ICHG =
120°C. This feature protects the APL3202 from excessive temperature and allows the charger to operate with
KSET × VSET
RSET
maximum power dissipation by reudcing the charge cur-
where
VSET is ISET regulation voltage (1V, typical).
rent and optimizes the board design for compact size
and typical thermal conditions.
KSET is the charging current set factor (1000, typical).
The charging current set factor and the ISET regulation
Charge Status Output (STAT)
The STAT is an open-drain output. When the charger is in
voltage are shown in the Electrical Characteristics. The
ISET regulation voltage is reduced by thermal regulation
function.
charge mode, the STAT output is in pull-low state. Until
the charge current drops to the termination current
Charge Termination Detection and Recharge
threshold, the charging stops, and the STAT output is in
high impedance state.
Charging is terminated when ICHG falls to 10% of the full
charge current set by RSET and the charger is in voltage
mode (VBATT is nearly 4.2V). The charge termination is
detected by monitoring the ISET pin. When the ISET pin
voltage falls below 0.1V and takes longer than TTERM (1ms,
typical), charging is terminated. The STAT output keeps
high state when the charger operates in standby mode.
After charge termination, the battery voltage is monitored
by the APL3202 continuously. If the battery voltage drops
below 4.05V and takes longer than TRECHARGE (2ms, typical),
a new charge cycle starts to recharge the battery.
Copyright  ANPEC Electronics Corp.
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APL3202
Function Description (Cont.)
Charge Status Output (STAT) (Cont.)
ICHG
VBATT
ICHG
1C
4.2V
4.05V
VBATT
3.0V
0.1C
Pre-charge
Full Charge
Constant Current Mode
Constant Voltage
Mode
Figure1. Typical Charging Profile
STAT Output
Low
Mode
Charge Mode
Shutdown Mode
High
Standby Mode
Sleep Mode
VIN
VIN>VUVLO &
VIN>VBATT+VASD
VSET
VBATT<4.2V
0.1V<VSET<1.2V
-
VSET>1.2V
VBATT>4.2V
-
Battery is connected
-
VIN>VUVLO &
VIN>VBATT+VASD
VIN<VUVLO or
VIN<VBATT+VASD
VBATT
Table1. STAT Pin Summary
Copyright  ANPEC Electronics Corp.
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APL3202
Application Information
Input and Output Capacitors
PCB Layout Consideration
Typically, a 4.7µF ceramic capacitor is used to connect
from VIN to GND. Place the capacitor as close as pos-
Connect the battery to BATT as close as possible to provide accurate battery voltage sensing. The input and out-
sible to the VIN pin and GND pin for well operation. In
some start-up conditions, it maybe necessary to protect
put decoupling capacitors and the programmed resistor
RSET should be placed as close as possible to the device.
the device against a hot plug input voltage. Adding a 6V
input zener diode between the VIN pin and GND clamps
The high-current charge paths into VIN and from the BATT
pins must be short and wide to minimize voltage drops.
the input voltage peak. In most applications, it is also
recommended to connect an X5R ceramic capacitor (1µF,
Recommended Minimum Footprint
typical) from BATT to GND for proper stability.
0.076
STAT Pin
0.1
The STAT pin can be used to drive a LED or communicate
with the host processor to show the charge status. When
the status is displayed by a LED, which has a current
rating less than 5mA, a resistor should be selected to
0.05
connect the LED in series, for programming at the desired current value. The resistor is calculated by the following equation:
RLED =
( VIN − VLED - ON )
ILED
0.038
0.02
Unit : Inch
SOT-23-5
When STAT pin is monitored by a processor, there should
be a 10kΩ to 100kΩ pull-up resistor to connect the STAT
pin and the supply voltage of the processor.
Thermal Consideration
The most common measure of package thermal performance is thermal resistance measured from the device
junction to the air surrounding the package surface (θJA).
The θJA can be calculated by the following equation:
θJA =
TJ − TA
PD
where:
TJ= device junction temperature, maximum TJ=120°C
TA= ambient temperature
PD= device power dissipation
The device power dissipation, PD, is a function of the
charge rate and the voltage drop across the internal FET.
It can be calculated by the following equation:
PD = ( VIN − VBATT ) × ICHG
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Mar., 2012
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APL3202
Package Information
SOT-23-5
D
e
E
E1
SEE
VIEW A
b
c
0.25
A
L
0
GAUGE PLANE
SEATING PLANE
A1
A2
e1
VIEW A
S
Y
M
B
O
L
SOT-23-5
INCHES
MILLIMETERS
MIN.
MIN.
MAX.
A
MAX.
0.057
1.45
A1
0.00
0.15
0.000
0.006
A2
0.90
1.30
0.035
0.051
b
0.30
0.50
0.012
0.020
c
0.08
0.22
0.003
0.009
0.122
0.118
D
2.70
3.10
0.106
E
2.60
3.00
0.102
E1
1.40
1.80
0.055
e
0.95 BSC
e1
0.071
0.037 BSC
1.90 BSC
0.075 BSC
L
0.30
0.60
0
0°
8°
0.012
0°
0.024
8°
Note : 1. Follow JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Copyright  ANPEC Electronics Corp.
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APL3202
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
SOT-23-5
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
4.0±0.10
4.0±0.10
(mm)
Devices Per Unit
Package Type
SOT-23-5
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Mar., 2012
Unit
Tape & Reel
Quantity
3000
15
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APL3202
Taping Direction Information
SOT-23-5
USER DIRECTION OF FEED
Classification Profile
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Mar., 2012
16
www.anpec.com.tw
APL3202
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Mar., 2012
17
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
www.anpec.com.tw
APL3202
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Mar., 2012
18
www.anpec.com.tw