Multi Tap .030 x .030 Series

Multi-Tap .030 x .030
Thin Film Multi-Tap Chip Resistor (.030 x .030)
Chip resistors provide options resistor values, tolerance, style and gold backing option.
Features
Photo
Chip Size: .030” x .030”
Silicon Substrate
Resistor material of tantalum nitride.
Optimal for hybrid prototyping
Standard resistor ranges
Selectable values by wire bond
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Available Options Include:
• Gold backing
• Two styles available
API Technologies thin film multi-tapped chip resistor (.030 x .030) are available in a wide range of resistances and
tolerances with values available from 800 ohms to 24 kiloohm. Chip resistors are standard for values up to 24K, on an
oxidized silicon substrate. The thin film resistor layer is made of Tantalum Nitride (TaN), with a gold conductor layer.
Applications for thin film center-tapped chip resistors include military and industrial hybrids, and medical, aerospace
and communications equipment.
Multi-tapped Chip Resistors are available with tantalum-nitride resistor metalization.
• Tantalum-nitride provides superior moisture-resistance for non-hermetic applications.
Electrical Specifications
Parameter
Power Rating
Limit
250 mW
Test conditions
(at 70 C derated to 0 mW @ 150 C)
Life
+/-1% max
1000 hours @ 125 degrees C
Noise
-35 dB typ
MIL-STD-202 method 308
High Temp Exposure
TCR
+/-0.5% max
+100 to -125 ppm/C
100 hours at 150 degrees C
-55 to 125 degrees C
Operating voltage
100 VDC max
Moisture resistance
+/-0.5% max
MIL-STD-202 method 106
Thermal shock
+/-0.25% max
MIL-STD-202 method 107
Rev Date: 6/10/2014
© API Technologies Corp. Proprietary Information
Page # 1
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micro.apitech.com
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+1.888.553.7531
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[email protected]
Multi-Tap .030 x .030
Mechanical Specifications
Substrate
Silicon with thermal oxide
Bond pad metalization
Gold 100 microinches
Size
.030 x .030 +/-.003 (0.762 x 0.762 mm +/- .08mm)
Thickness
.013 +/-.003 (0.33 +/-0.07 mm)
Bond pad dimensions
.004 x .004 minimum (0.1 x 0.1 mm)
Back side
Lapped silicon or 3000 Angstroms gold
Typical Configurations
Packaging Options
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Waffle Pack (400 resistors per pack) - standard
Waffle Pack (50 resistors per pack)
Waffle Pack (100 resistors per pack)
Tape and reel
Ordering Information
All parts are 100% electrically tested, sample tested per MIL-STD-38534 section 3.4, and visually inspected to MIL-STD883 requirements. Chips are supplied in standard 2”x 2” matrix tray packaging.
Resistor Tap Information
Resistors R1 – R7 are each 12.5% of the total resistor value.
Resistors R8 – R12 are each 2.5% of the total resistor value.
Part Number Breakout/Designation
Base
Code
Type
1MTR-
NNNE
X
-N
ZZ
Value
Tolerance
J=5%
K=10%
L=15%
M=20%
Style
-1
-2
Backing
Blank = Lapped Silicon
GB = 3000 Angstroms Gold
NNN = Value
E = Exponent
Rev Date: 6/10/2014
© API Technologies Corp. Proprietary Information
Page # 2
|
www.apitech.com
|
micro.apitech.com
|
+1.888.553.7531
|
[email protected]