Multi-Tap .030 x .030 Thin Film Multi-Tap Chip Resistor (.030 x .030) Chip resistors provide options resistor values, tolerance, style and gold backing option. Features Photo Chip Size: .030” x .030” Silicon Substrate Resistor material of tantalum nitride. Optimal for hybrid prototyping Standard resistor ranges Selectable values by wire bond • • • • • • Available Options Include: • Gold backing • Two styles available API Technologies thin film multi-tapped chip resistor (.030 x .030) are available in a wide range of resistances and tolerances with values available from 800 ohms to 24 kiloohm. Chip resistors are standard for values up to 24K, on an oxidized silicon substrate. The thin film resistor layer is made of Tantalum Nitride (TaN), with a gold conductor layer. Applications for thin film center-tapped chip resistors include military and industrial hybrids, and medical, aerospace and communications equipment. Multi-tapped Chip Resistors are available with tantalum-nitride resistor metalization. • Tantalum-nitride provides superior moisture-resistance for non-hermetic applications. Electrical Specifications Parameter Power Rating Limit 250 mW Test conditions (at 70 C derated to 0 mW @ 150 C) Life +/-1% max 1000 hours @ 125 degrees C Noise -35 dB typ MIL-STD-202 method 308 High Temp Exposure TCR +/-0.5% max +100 to -125 ppm/C 100 hours at 150 degrees C -55 to 125 degrees C Operating voltage 100 VDC max Moisture resistance +/-0.5% max MIL-STD-202 method 106 Thermal shock +/-0.25% max MIL-STD-202 method 107 Rev Date: 6/10/2014 © API Technologies Corp. Proprietary Information Page # 1 | www.apitech.com | micro.apitech.com | +1.888.553.7531 | [email protected] Multi-Tap .030 x .030 Mechanical Specifications Substrate Silicon with thermal oxide Bond pad metalization Gold 100 microinches Size .030 x .030 +/-.003 (0.762 x 0.762 mm +/- .08mm) Thickness .013 +/-.003 (0.33 +/-0.07 mm) Bond pad dimensions .004 x .004 minimum (0.1 x 0.1 mm) Back side Lapped silicon or 3000 Angstroms gold Typical Configurations Packaging Options • • • • Waffle Pack (400 resistors per pack) - standard Waffle Pack (50 resistors per pack) Waffle Pack (100 resistors per pack) Tape and reel Ordering Information All parts are 100% electrically tested, sample tested per MIL-STD-38534 section 3.4, and visually inspected to MIL-STD883 requirements. Chips are supplied in standard 2”x 2” matrix tray packaging. Resistor Tap Information Resistors R1 – R7 are each 12.5% of the total resistor value. Resistors R8 – R12 are each 2.5% of the total resistor value. Part Number Breakout/Designation Base Code Type 1MTR- NNNE X -N ZZ Value Tolerance J=5% K=10% L=15% M=20% Style -1 -2 Backing Blank = Lapped Silicon GB = 3000 Angstroms Gold NNN = Value E = Exponent Rev Date: 6/10/2014 © API Technologies Corp. Proprietary Information Page # 2 | www.apitech.com | micro.apitech.com | +1.888.553.7531 | [email protected]