Z-Power LED X10490 Technical Data Sheet Specification LY350 SSC Drawn CUSTOMER Approval Approval Rev. 02 December 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Features 2. Absolute Maximum Ratings 3. Electric-Optical Characteristics 4. Reliability Tests 5. Characteristic Diagrams 6. Color & Binning 7. Outline Dimensions 8. Standard of Taping Empty Space 9. Packing 10. Soldering 11. Precaution for use Rev. 02 December 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet LY350 Description Lamp LEDs are effective in hot thermal and humid condition. This high brightness and weatherresistant packaging design makes these Lamp LEDs ideal for LW520A Features • High luminous white emission • Non-standoff leads • 3mm type package • Transparent epoxy lens • Viewing angle : 45º • Dominant Wavelength : 590nm Outdoor applications such as traffic signals, variable message signs and backlighting for transparent sign panels. Applications • Electronic signs and signals • Specialty lighting • Small area illumination • Torches and head lamps • Backlighting • Outdoor displays Rev. 02 December 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings ( Ta = 25ºC ) Item Symbol Value Unit DC Forward Current IF 30 mA Forward Peak Pulse Current IFP[1] 100 mA Reverse Voltage VR 5 V Power Dissipation PD 78 mW Operating Temperature Topr -40 ~ 100 ℃ Storage Temperature Tstg -50 ~ 105 ℃ Solder Temperature Ts 260ºC for 10second [2] ℃ Notes : [1] t≤0.1ms, D = 1/10 [2] No lower than 3mm from the base of the epoxy bulb. 3. Electric & Optical characteristics ( Ta = 25ºC, IF =20mA ) Value Parameter Symbol Unit Min. Typ. Max. Luminous Intensity [3] IV[4] 125 0 250 0 - mcd Luminous Flux ФV - 2.0 - lm Dominant Wavelength [5] λd 584 590 596 nm Forward Voltage [6] VF - 2.2 2.6 V View Angle 2θ½ Optical Efficiency Ŋelc - 45 - lm/W Reverse Current (at VR=5V) IR - - 5 μA 45 deg. Notes : [3] SSC maintains a tolerance of ±10% on intensity and power measurements. [4] IV is the luminous intensity output as measured with a cylinder. [5] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram. A tolerance of ±0.5nm for dominant wavelength. [6] A tolerance of ±0.05V on forward voltage measurements Rev. 02 December 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 4. Reliability Tests Item Condition Note Failures Life Test Ta= RT, IF= 30mA 1000hrs 0/22 High Temperature Operating Ta= 100ºC, IF= 10mA 1000hrs 0/22 Low Temperature Operating Ta= -40ºC, IF= 20mA 1000hrs 0/22 Thermal Shock Ta= -50ºC (30min) ~ 105º(30min) (Transfer time : 10sec, 1Cycle = 1hr) 100 cycles 0/40 Resistance to soldering Heat Ts= 255 ±5ºC, t= 10sec 1 time 0/22 ESD (Human Body Model) 1kV, 1.5kΩ; 100pF 1 time 0/22 High Temperature Storage Ta= 105ºC 1000hrs 0/22 Low Temperature Storage Ta= -50ºC 1000hrs 0/22 Temperature Humidity Storage Ta= 85ºC, RH = 85% 1000hrs 0/22 Temperature Humidity Operating Ta= 85ºC, RH = 85%, IF= 15mA 100hrs 0/22 < Judging Criteria For Reliability Tests > VF USL[1]X 1.2 IR USL X 2.0 ФV LSL[2]X 0.7 Notes : [1] USL : Upper Standard Level [2] LSL : Lower Standard Level Rev. 02 December 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Characteristic Diagrams Rev. 02 December 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Color & Binning Bin Code Luminous Intensity Dominant Wavelength Forward Voltage N 2 4 Luminous Intensity (mcd) @ IF =20mA Dominant Wavelength (nm) @ IF =20mA Forward Voltage (V) @ IF =20mA Bin Code Min. Max. Bin Code Min. Max. Bin Code Min. Max. M 1250 1750 1 584 588 2 1.6 1.8 N 1750 2500 2 588 592 3 1.8 2.0 O 2500 3500 3 592 596 4 2.0 2.2 P 3500 5000 5 2.2 2.4 6 2.4 2.6 7 2.6 2.8 8 2.8 3.0 Rev. 02 December 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 7. Outline Dimensions Unit : mm Notes : Protruded epoxy is 1.0mm maximum. 8. Standard of Taping Empty Space Available Empty Space : 2ea Before After ＊Purpose : Prevention of being Mixed & Reverse mounting ※Before : Insert the right PKG after removing defective product ※After : Attaching the right PKG on the backside after removing defective product Rev. 02 December 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 9. Packing Rev. 02 December 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. Soldering Profile 1) Wave Soldering Conditions / Profile • Preliminary heating to be at 85ºC(120 ºC max) for 20 seconds(60 seconds max). • Soldering heat to be at 255 ºC (260ºC max) for 10 seconds • Soak time above 200 ºC is 5 seconds 2) Hand Soldering conditions • Not more than 3 seconds at max. 350ºC, under Soldering iron. 3) Caution • Lead frames are silver plated copper alloy. This substance has a low thermal coefficient (easily conducts heat) • The LEDs must not be repositioned after soldering. • Do not apply any stress to the lead particularly when heat. Note : In case the soldered products are reused in soldering process, we don’t guarantee the products Rev. 02 December 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 11. Precaution for Use 1) Storage • Before opening the package Avoid the absorption of moisture, we recommended to store Lamp LEDs in a dry box(or desiccators) with a desiccant . Otherwise, store them in the following environment: Temperature : 5 ℃~30 ℃ Humidity : 50% max. • After opening the package a. Soldering should be done right after opening the package(within 24Hrs). b. Keeping of a fraction - Sealing - Temperature : 5 ~ 40 ℃, Humidity : less than 30% c. If the package has been opened more than 1week or the color of desiccant changes, Components should be dried for 10-12hr at 60 ±5 ℃ • Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. • Avoid quick cooling • Leadframes are silver plated SPCC. The silver plate surface may be affected by environments which contains corrosive substances. Please avoid conditions which may cause the LEDs to corrode, tarnish or discolor. 2) Lead Forming • When the lead forming is required before soldering , care must be taken to avoid any bending and mechanical stress. The stress to the base may damage the LEDs. • When mounting the LEDs onto a PCB, the holes on the circuit board should be exactly aligned with the leads of the LEDs. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely on hand operating. Rev. 02 December 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 3) Static Electricity • Static Electricity and surge voltage damage the LEDs. So it is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. • All devices, equipment and machinery must be properly grounded. It is recommended precautions be taken against surge voltage to the equipment that mounts the LEDs. 4) Heat Generation • Thermal is one of the important parameter to design the end product. Please consider the heat generation of the LEDs. • The operating current should be decided after considering the ambient maximum temperature of LEDs. 5) Others • The color of the LEDs is changed a little by an operating current and thermal. • Anti radioactive ray design is not considered for the products listed here in. • Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or smashed in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. • This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA(Isopropyl Alcohol) should be used. • When the LEDs are illuminating, operating current should be decided after considering the junction temperature. Cf.) Please refer Ambient temperature vs. Forward Current graph on page 5 • The appearance and specifications of the product may be modified for improvement without notice. Rev. 02 December 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00)