LR530 Dec2010 R08

Z-Power LED
X10490
Technical
Data
Sheet
Specification
LR530
SSC
Drawn
Customer
Approval
Approval
Rev. 08
December 2010
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
CONTENTS
1. Full code of Lamp LED series
2. Feature & Application
3. Absolute Maximum Ratings
4. Electro Characteristics
5. Outline Dimension
6. Optical characteristics
7. Rank of LR530
8. Standard of Taping Empty Space
9. Packing
10. Soldering
11. Precaution for use
12. Reliability Test Item and Condition
Rev. 08
December 2010
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서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
1. Full Code of HIGH FLUX LED Series
Full code form : X1X2X3X4X5X6X7X8 -X10X11
1. Part Number
-X1 : Model
-X2 : Number of Die *1
-X3 : Color
-X4 : Lens Shape
-X5 : Directivity
-X6 : Revision Symbol
-X7 : High Reliability
*2
-X8 : Surface coloring & Diffusion *3
*1, 2, 3 are added to the Product Type only in necessary cases.
2. Internal Number
-X10
-X11
3. Sticker Diagram on Box & Aluminum Vinyl Bag
For more information about binning and labeling, refer to the Application Note -1
Rev. 08
December 2010
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서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
LR530
Description
Lamp LEDs are effective in hot
thermal and humid condition. This
high brightness and weatherresistant packaging design makes
these Lamp LEDs ideal for
LR530
Features
• High luminous
emission
• Non-standoff leads
• 5mm package
• Transparent epoxy
lens
• Viewing angle : 30 º
• Dominant Wavelength
: 625nm
Outdoor applications such as
traffic signals, variable message
signs and backlighting for
transparent sign panels.
Applications
• Electronic signs
and signals
• Specialty lighting
• Small area
illumination
• Torches and
head lamps
• Backlighting
• Other outdoor
displays
Rev. 08
December 2010
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서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
3. Absolute maximum ratings
Item
Symbol
Value
Unit
DC Forward Current
IF
30
mA
Forward Peak Pulse Current
IFP[1]
100
mA
Reverse Voltage
VR
5
V
Power Dissipation
PD
78
mW
Operating Temperature
Topr
-40 ~ 100
℃
Storage Temperature
Tstg
-50 ~ 105
℃
Solder Temperature
Ts
260ºC for 10second [2]
℃
Notes :
[1] t≤0.1ms, D = 1/10
[2] No lower than 3mm from the base of the epoxy bulb.
4. Electro-Optical characteristics
Value
Parameter
Symbol
Condition
Unit
Min.
Typ.
Max.
Luminous Intensity [3]
IV
IF=20mA
3000
6500
-
mcd
Luminous Flux
ФV
IF=20mA
-
2.0
-
lm
Dominant Wavelength [4]
λd
IF=20mA
619
625
631
nm
Forward Voltage [5]
VF
IF=20mA
-
2.2
2.6
V
View Angle
2θ½
IF=20mA
Optical Efficiency
ŋelc
IF=20mA
-
45
-
lm/W
Reverse Current
IR
VR=5V
-
-
5
μA
30
deg.
[3] SSC maintains a tolerance of ±10% on intensity and power measurements.
[4] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of ±0.5nm for dominant wavelength.
[5] A tolerance of ±0.05V on forward voltage measurements
[Note] All measurements were made under the standardized environment of SSC.
Rev. 08
December 2010
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
5. Outline Dimensions
Unit : mm
Notes : Protruded epoxy is 1.0mm maximum.
*
※
Rev. 08 ※
December 2010
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서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
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6. Optical characteristics
Rev. 08
December 2010
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서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
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6. Optical characteristics
Rev. 08
December 2010
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서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
7. Rank of LR530
Bin Code
Forward Voltage
Dominant
Wavelength
Luminous Intensity
B
-
3
Forward Voltage (V)
@ IF =20mA
Dominant Wavelength (nm)
@ IF =20mA
Luminous Intensity (mcd)
@ IF =20mA
Min.
Max.
Bin
Code
Min.
Max.
619
631
1
3000
4000
2.1
2
4000
4500
2.1
2.2
3
45000
5500
D
2.2
2.3
4
5500
7000
E
2.3
2.4
5
7000
10000
F
2.4
2.5
G
2.5
2.6
Bin
Code
Min.
Max.
A
1.9
2.0
B
2.0
C
Bin
Code
8. Standard of Taping Empty Space
Available Empty Space : 2ea
Before
After
*Purpose : Prevention of being Mixed & Reverse mounting
※Before : Insert the right PKG after removing defective product
※After
: Attaching the right PKG on the backside after removing defective
product
Rev. 08
December 2010
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서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
9. Packing
Rev. 08
December 2010
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서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
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1 Box contain quantity.
* 3φ Series : 3000pcs/box
* 5φ Series : 2000pcs/box
Rev. 08
December 2010
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서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
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10. Soldering
1) Wave Soldering Conditions / Profile
• Preliminary heating to be at 85ºC(120 ºC max) for 20 seconds(60 seconds max).
• Soldering heat to be at 255 ºC (260ºC max) for 10 seconds
• Soak time above 200 ºC is 5 seconds
2) Hand Soldering conditions
• Not more than 3 seconds at max. 350ºC, under Soldering iron.
3) Caution
• The LEDs must not be repositioned after soldering.
• Do not apply any stress to the lead particularly when heat.
Note : In case the soldered products are reused in soldering process, we don’t guarantee the products
Rev. 08
December 2010
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서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
11. Precaution for Use
1) Storage
• Before opening the package
Avoid the absorption of moisture, we recommended to store Lamp LEDs in a dry
box(or desiccators) with a desiccant . Otherwise, store them in the following environment:
Temperature : 5 ℃~30 ℃ Humidity : 50% max.
• After opening the package
a. Soldering should be done right after opening the package(within 24Hrs).
b. Keeping of a fraction
- Sealing
- Temperature : 5 ~ 40 ℃, Humidity : less than 30%
c. If the package has been opened more than 1week or the color of desiccant changes,
Components should be dried for 10-12hr at 60 ±5 ℃
• Any mechanical force or any excess vibration shall not be accepted to apply during cooling
process to normal temp. after soldering.
• Avoid quick cooling
• Leadframes are silver plated SPCC. The silver plate surface may be affected by
environments which contains corrosive substances. Please avoid conditions which may cause
the LEDs to corrode, tarnish or discolor.
2) Lead Forming
• When the lead forming is required before soldering , care must be taken to avoid any bending
and mechanical stress. The stress to the base may damage the LEDs.
• When mounting the LEDs onto a PCB, the holes on the circuit board should be exactly
aligned with the leads of the LEDs.
• It is recommended that tooling made to precisely form and cut the leads to length rather than
rely on hand operating.
Rev. 08
December 2010
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서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
3) Static Electricity
• Static Electricity and surge voltage damage the LEDs. So it is recommended that a wrist
band or an anti-electrostatic glove be used when handling the LEDs.
• All devices, equipment and machinery must be properly grounded.
It is recommended precautions be taken against surge voltage to the equipment that mounts
the LEDs.
4) Heat Generation
• Thermal is one of the important parameter to design the end product. Please consider the
heat generation of the LEDs.
• The operating current should be decided after considering the ambient maximum
temperature of LEDs.
5) Others
• The color of the LEDs is changed a little by an operating current and thermal.
• Anti radioactive ray design is not considered for the products listed here in.
• Gallium arsenide is used in some of the products listed in this publication. These products
are dangerous if they are burned or smashed in the process of disposal. It is also dangerous
to drink the liquid or inhale the gas generated by such products when chemically disposed.
• This device should not be used in any type of fluid such as water, oil, organic solvent and
etc.
When washing is required, IPA(Isopropyl Alcohol) should be used.
• When the LEDs are illuminating, operating current should be decided after considering the
junction temperature.
Cf.) Please refer Ambient temperature vs. Forward Current graph on page 5
• The appearance and specifications of the product may be modified for improvement without
notice.
Rev. 08
December 2010
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서식번호 : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
12. Reliability Test and Condition
Item
Condition
Note
Failures
Life Test
Ta= RT, IF= 30mA
1000hrs
0/22
High Temperature Operating
Ta= 100ºC, IF= 10mA
1000hrs
0/22
Low Temperature Operating
Ta= -40ºC, IF= 20mA
1000hrs
0/22
Thermal Shock
Ta= -50ºC (30min) ~ 105º(30min)
(Transfer time : 10sec, 1Cycle = 1hr)
100
cycles
0/40
Resistance to soldering Heat
Ts= 255 ±5ºC, t= 10sec
1 time
0/22
ESD
(Human Body Model)
1kV, 1.5kΩ; 100pF
1 time
0/22
High Temperature Storage
Ta= 105ºC
1000hrs
0/22
Low Temperature Storage
Ta= -50ºC
1000hrs
0/22
Temperature Humidity
Storage
Ta= 85ºC, RH = 85%
1000hrs
0/22
Temperature Humidity
Operating
Ta= 85ºC, RH = 85%, IF= 15mA
100hrs
0/22
< Judging Criteria For Reliability Tests >
VF
USL[1]X 1.2
IR
USL X 2.0
ФV
LSL[2]X 0.7
Notes :
[1] USL : Upper Standard Level
[2] LSL : Lower Standard Level
Rev. 08
December 2010
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-24 (Rev.00)