RT8809AB

RT8809A/B
Reliability Report
For
RT8809A/B
Richtek Technology Corporation
5F, No. 20, Tai Yuen Street, Chupei City,
Hsinchu, Taiwan 30288
TEL: 886-3-5526789
FAX: 886-3-5526611
www.richtek.com
RT8809A/B Dec. 2011
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RT8809A/B
Purpose
The HTOL test is to demonstrate the quality or reliability of device subjects to the
specified conditions over an extended time period.
The ESD tests are used to classify the electrostatic discharge of microcircuits.
The latch-up test is used to check IC latch-up characteristics.
The environment tests are to ensure the process of assembly of this package type that
meets Richtek quality specifications.
Test Items and Conditions
Items
Condition
Readout
HTOL
Ta=125℃,
1000 hours
Q’ty
Rejects
Reference
77
0
JESD22-A108
VIN=1.1*VIN_MAX
ESD
Latch-up
HBM
--
3/ VOLT
0
JESD22-A114
MM
--
3/ VOLT
0
JESD22-A115
CDM
--
3/ VOLT
0
JESD22-C101
I-TEST
--
9
0
JESD78A
JESD22-A113
V-TEST
Preconditioning MSL-3
Bake
125℃
24 hours
385
0
MSL-3 Soaking
30℃/ 60% RH
192 hours
385
0
Reflow
260 +0/-5℃
3 cycles
385
0
HTST
Ta=150℃
1000 hours
77
0
JESD22-A103
THT
Ta=85℃, 85%RH
1000 hours
77
0
JESD22-A101
TCT
Ta=-65℃ ~ 150℃
500 cycles
77
0
JESD22-A104
PCT
Ta=121℃,100%RH,2ATM 168 hours
77
0
JESD22-A102
uHAST
Ta=130℃, 85%RH
77
0
JESD22-A118
NOTE:
96 hours
1. Preconditioning MSL-3 test was done before HTST, THT, TCT, PCT and uHAST tests.
2. All assembly houses are Richtek qualified suppliers.
Summary
The test results can be applied to all of the products including a series of RT8809A/B.
Any questions or inquiries for regarding related products or service of Richtek, you
may contact us through our technical support center.
(http://www.Richtek.com/contact10.1.jsp)
www.richtek.com
RT8809A/B Dec. 2011
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