RT8809A/B Reliability Report For RT8809A/B Richtek Technology Corporation 5F, No. 20, Tai Yuen Street, Chupei City, Hsinchu, Taiwan 30288 TEL: 886-3-5526789 FAX: 886-3-5526611 www.richtek.com RT8809A/B Dec. 2011 1 RT8809A/B Purpose The HTOL test is to demonstrate the quality or reliability of device subjects to the specified conditions over an extended time period. The ESD tests are used to classify the electrostatic discharge of microcircuits. The latch-up test is used to check IC latch-up characteristics. The environment tests are to ensure the process of assembly of this package type that meets Richtek quality specifications. Test Items and Conditions Items Condition Readout HTOL Ta=125℃, 1000 hours Q’ty Rejects Reference 77 0 JESD22-A108 VIN=1.1*VIN_MAX ESD Latch-up HBM -- 3/ VOLT 0 JESD22-A114 MM -- 3/ VOLT 0 JESD22-A115 CDM -- 3/ VOLT 0 JESD22-C101 I-TEST -- 9 0 JESD78A JESD22-A113 V-TEST Preconditioning MSL-3 Bake 125℃ 24 hours 385 0 MSL-3 Soaking 30℃/ 60% RH 192 hours 385 0 Reflow 260 +0/-5℃ 3 cycles 385 0 HTST Ta=150℃ 1000 hours 77 0 JESD22-A103 THT Ta=85℃, 85%RH 1000 hours 77 0 JESD22-A101 TCT Ta=-65℃ ~ 150℃ 500 cycles 77 0 JESD22-A104 PCT Ta=121℃,100%RH,2ATM 168 hours 77 0 JESD22-A102 uHAST Ta=130℃, 85%RH 77 0 JESD22-A118 NOTE: 96 hours 1. Preconditioning MSL-3 test was done before HTST, THT, TCT, PCT and uHAST tests. 2. All assembly houses are Richtek qualified suppliers. Summary The test results can be applied to all of the products including a series of RT8809A/B. Any questions or inquiries for regarding related products or service of Richtek, you may contact us through our technical support center. (http://www.Richtek.com/contact10.1.jsp) www.richtek.com RT8809A/B Dec. 2011 2