Reliability Data Report Product Family R549 LTC2312 \ LTC2313 \ LTC2314 \ LTC2315 \ LTC2321 \ LTC2323 \ LTC2326 \ LTC2327 \ LTC2328 \ LTC2336 \ LTC2337 \ LTC2338 \ LTC2345 \ LTC2348 \ LTC2364 \ LTC2367 \ LTC2368 \ LTC2370 \ LTC2376 \ LTC2377 \ LTC2378 \ LTC2379 \ LTC2380 \ LTC2381 \ LTC2382 \ LTC2383 \ LTC2386 \ LTC2387 \ LTC2389 \ LTC2391 \ LTC2392 \ LTC2393 Reliability Data Report Report Number: R549 Report generated on: Mon Sep 22 10:14:09 PDT 2014 OPERATING LIFE TEST PACKAGE TYPE SOIC/MSOP QFN/DFN SOT Totals SAMPLE SIZE 443 154 308 905 OLDEST DATE NEWEST DATE K DEVICE HRS 1 No. of FAILURES 2,3 CODE CODE (+125°C) 1023 0936 1203 - 1323 1315 1319 - 340 154 141 635 0 0 0 0 K DEVICE HRS No. of FAILURES PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SOIC/MSOP Totals 201 77 278 OLDEST DATE NEWEST DATE CODE CODE 0904 1001 - 1310 1001 - 34 12 46 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 1001 1001 - 1310 1001 - 63 38 101 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 1001 1001 - 1310 1001 - 63 38 101 TEMP CYCLE FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SOIC/MSOP Totals 127 77 204 THERMAL SHOCK FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SOIC/MSOP Totals 127 76 203 (1) Assumes Activation Energy = 0.7 Electron Volts (2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =18.66 FITS (3) Mean Time Between Failure in Years = 6117.67 Note: 1 FIT = 1 Failure in One Billion Hours. Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL1 Preconditioning 0 0 0 Reliability Data Report Report Number: R549 Report generated on: Wed Feb 10 17:20:27 PST 2016 OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE NEWEST DATE K DEVICE HRS CODE CODE (+125°C) 1 No. of FAILURES 2,3 SOIC/MSOP 308 1023 1310 205 0 QFN/DFN 231 0936 1403 231 0 SOT Totals 231 770 1210 - 1319 - 129 565 0 0 K DEVICE HRS No. of FAILURES PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C PACKAGE TYPE QFN/DFN SOIC/MSOP SOT Totals SAMPLE SIZE 251 77 77 405 OLDEST DATE NEWEST DATE CODE CODE 0904 1001 1241 - 1310 1001 1241 - 35 12 12 59 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 1001 1001 1241 - 1310 1001 1241 - 68 38 37 143 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 1001 1001 1241 - 1310 1001 1241 - 68 38 77 183 TEMP CYCLE FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SOIC/MSOP SOT Totals 177 77 75 329 THERMAL SHOCK FROM -65 TO 150 DEG C PACKAGE TYPE QFN/DFN SOIC/MSOP SOT Totals SAMPLE SIZE 177 76 77 330 (1) Assumes Activation Energy = 0.7 Electron Volts (2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =20.97 FITS (3) Mean Time Between Failure in Years = 5443.28 Note: 1 FIT = 1 Failure in One Billion Hours. Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL1 Preconditioning 0 0 0 0