R549 - Reliability Data

Reliability Data Report
Product Family R549
LTC2312 \ LTC2313 \ LTC2314 \
LTC2315 \ LTC2321 \ LTC2323 \
LTC2326 \ LTC2327 \ LTC2328 \
LTC2336 \ LTC2337 \ LTC2338 \
LTC2345 \ LTC2348 \ LTC2364 \
LTC2367 \ LTC2368 \ LTC2370 \
LTC2376 \ LTC2377 \ LTC2378 \
LTC2379 \ LTC2380 \ LTC2381 \
LTC2382 \ LTC2383 \ LTC2386 \
LTC2387 \ LTC2389 \ LTC2391 \
LTC2392 \ LTC2393
Reliability Data Report
Report Number: R549
Report generated on: Mon Sep 22 10:14:09 PDT 2014
OPERATING LIFE TEST
PACKAGE TYPE
SOIC/MSOP
QFN/DFN
SOT
Totals
SAMPLE SIZE
443
154
308
905
OLDEST DATE
NEWEST DATE
K DEVICE HRS
1
No. of FAILURES
2,3
CODE
CODE
(+125°C)
1023
0936
1203
-
1323
1315
1319
-
340
154
141
635
0
0
0
0
K DEVICE HRS
No. of FAILURES
PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C
PACKAGE TYPE
SAMPLE SIZE
QFN/DFN
SOIC/MSOP
Totals
201
77
278
OLDEST DATE
NEWEST DATE
CODE
CODE
0904
1001
-
1310
1001
-
34
12
46
0
0
0
OLDEST DATE
NEWEST DATE
K DEVICE
No. of FAILURES
CODE
CODE
CYCLES
1001
1001
-
1310
1001
-
63
38
101
0
0
0
OLDEST DATE
NEWEST DATE
K DEVICE
No. of FAILURES
CODE
CODE
CYCLES
1001
1001
-
1310
1001
-
63
38
101
TEMP CYCLE FROM -65 TO 150 DEG C
PACKAGE TYPE
SAMPLE SIZE
QFN/DFN
SOIC/MSOP
Totals
127
77
204
THERMAL SHOCK FROM -65 TO 150 DEG C
PACKAGE TYPE
SAMPLE SIZE
QFN/DFN
SOIC/MSOP
Totals
127
76
203
(1) Assumes Activation Energy = 0.7 Electron Volts
(2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =18.66 FITS
(3) Mean Time Between Failure in Years = 6117.67
Note: 1 FIT = 1 Failure in One Billion Hours.
Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL1 Preconditioning
0
0
0
Reliability Data Report
Report Number: R549
Report generated on: Wed Feb 10 17:20:27 PST 2016
OPERATING LIFE TEST
PACKAGE TYPE
SAMPLE SIZE
OLDEST DATE
NEWEST DATE
K DEVICE HRS
CODE
CODE
(+125°C)
1
No. of FAILURES
2,3
SOIC/MSOP
308
1023
1310
205
0
QFN/DFN
231
0936
1403
231
0
SOT
Totals
231
770
1210
-
1319
-
129
565
0
0
K DEVICE HRS
No. of FAILURES
PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C
PACKAGE TYPE
QFN/DFN
SOIC/MSOP
SOT
Totals
SAMPLE SIZE
251
77
77
405
OLDEST DATE
NEWEST DATE
CODE
CODE
0904
1001
1241
-
1310
1001
1241
-
35
12
12
59
0
0
0
0
OLDEST DATE
NEWEST DATE
K DEVICE
No. of FAILURES
CODE
CODE
CYCLES
1001
1001
1241
-
1310
1001
1241
-
68
38
37
143
0
0
0
0
OLDEST DATE
NEWEST DATE
K DEVICE
No. of FAILURES
CODE
CODE
CYCLES
1001
1001
1241
-
1310
1001
1241
-
68
38
77
183
TEMP CYCLE FROM -65 TO 150 DEG C
PACKAGE TYPE
SAMPLE SIZE
QFN/DFN
SOIC/MSOP
SOT
Totals
177
77
75
329
THERMAL SHOCK FROM -65 TO 150 DEG C
PACKAGE TYPE
QFN/DFN
SOIC/MSOP
SOT
Totals
SAMPLE SIZE
177
76
77
330
(1) Assumes Activation Energy = 0.7 Electron Volts
(2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =20.97 FITS
(3) Mean Time Between Failure in Years = 5443.28
Note: 1 FIT = 1 Failure in One Billion Hours.
Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL1 Preconditioning
0
0
0
0