AOS Semiconductor Product Reliability Report AOD210, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOD210. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOD210 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AOD210 uses Trench MOSFET technology that is uniquely optimized to provide the most efficient high frequency switching performance. Power losses are minimized due to an extremely low combination of RDS(ON) and Crss. In addition, switching behavior is well controlled with a “Schottky style” soft recovery body diode. -RoHS Compliant -Halogen Free Details refer to the datasheet. II. Die / Package Information: AOD210 Standard sub-micron Low voltage N channel process Package Type 3 leads TO252 Lead Frame Bare Cu Die Attach Soft solder Bond wire Al & Au wire Mold Material Epoxy resin with silica filler Moisture Level Up to Level 1 * Note * based on info provided by assembler and mold compound supplier Process 2 III. Result of Reliability Stress for AOD210 Test Item Test Condition Time Point MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax - 9 lots 1210pcs 0 JESD22A113 168hrs 500 hrs 1000 hrs 1 lot 77pcs 0 JESD22A108 Temp = 150°c , Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs 0 JESD22A108 0 JESD22A110 0 JESD22A102 0 JESD22A104 HTGB Lot Attribution (Note A*) HTRB 1 lot (Note A*) HAST Pressure Pot 130 +/- 2°c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 121°c , 29.7psi, RH=100% 100 hrs 9 lots (Note A*) 96 hrs 5 lots (Note A*) Temperature Cycle -65°c to 150°c , air to air, 250 / 500 cycles 8 lots (Note A*) Total Sample size Number of Failures Reference Standard 77 pcs / lot 77pcs 77 pcs / lot 495pcs 55 pcs / lot 275pcs 55 pcs / lot 440pcs 55 pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 137 MTTF = 833 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOD210). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10 9 6 MTTF = 10 / FIT = 7.30 x 10 hrs = 833 years / [2x2x77x168x258] = 137 Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 3