DS4723 00

RT4723
Dual Output AMOLED Bias
General Description
Features
The RT4723 is a highly integrated Boost, LDO and
inverting charge pump to generate positive and
negative output voltage. The negative output voltages
can be adjusted from 0.6V to 2.4V with 100mV steps
by SWIRE interface protocol. The part maintains the
highest efficiency by utilizing a 0.33x/0.5x mode
fractional charge pump with automatic mode transition.
With its input voltage range of 2.5V to 4.6V, RT4723 is
optimized for products powered by single-cell battery

and the output current up to 30mA. The RT4723 is
available in WL-CSP-15B 1.39x2.07 (BSC) package to
achieve optimized solution for PCB space.










Ordering Information

RT4723
2.5V to 4.6V Supply Voltage Range
Single Wire Protocol
Fixed 4.6V Positive Voltage Output
Negative Voltage Output from 0.6V to 2.4V per
0.1V by SWIRE Pin
Auto-Mode Transition of 0.33x/0.5x Charge
Pump
Built-in Soft-Start
30mA Maximum Output Current
Programmable Output Fast Discharge Function
High Impedance Output when IC Shutdown
UVLO, OCP, SCP, OTP Protection
Shutdown Current < 1A
Available in 15-Ball WL-CSP Package
Applications
Package Type
WSC : WL-CSP-15B 1.39x2.07 (BSC)

AMOLED Bias in Portable Device
Marking Information
Note :
Richtek products are :

36W
RoHS compliant and compatible with the current
36 : Product Code
W : Date Code
requirements of IPC/JEDEC J-STD-020.

Suitable for use in SnPb or Pb-free soldering
processes.
Simplified Application Circuit
L1
VIN
VIN
LXP
CBOOST
BOOST
CIN
VOP
VOP
COP
RT4723
C2P
VON
VON
CF2
CON
C2N
C1P
SWIRE
CF1
C1N
GND
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS4723-00
April 2016
PGND
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
1
RT4723
Pin Configurations
(TOP VIEW)
GND
A1
A2
A3
C2N
B3
C2P
C3
C1N
D3
C1P
E3
VOP
VON
SWIRE
B1
B2
PGND
VIN
C1
C2
GND
LXP
D1
D2
GND
PGND
E1
E2
BOOST
WL-CSP-15B 1.39x2.07 (BSC)
Functional Pin Description
Pin No.
Pin Name
Pin Function
A1, C2, D2
GND
Ground.
A2
VON
Negative Terminal Output.
A3
C2N
Flying Capacitor 2 Negative Connection.
B1
SWIRE
Enable and VON Voltage Setting.
B2, E1
PGND
Power Ground.
B3
C2P
Flying Capacitor 2 Positive Connection.
C1
VIN
Power Input.
C3
C1N
Flying Capacitor 1 Negative Connection.
D1
LXP
Switching Node of Boost Converter.
D3
C1P
Flying Capacitor 1 Positive Connection.
E2
BOOST
Output Voltage of Boost Converter.
E3
VOP
Positive Terminal Output.
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
2
is a registered trademark of Richtek Technology Corporation.
DS4723-00
April 2016
RT4723
Function Block Diagram
BOOST
LXP
VIN
UVLO
SCP1
Bandgap
Reference
VREF
LDO
VOP
-0.33x/-0.5x
Charge Pump
C1P
C1N
C2P
C2N
P1
PWM
Logic
N1
GM
+
DAC
RP2
OCP1
VREF
RP1
Oscillator
Fast
Discharge
VOP
VON
Soft-Start
SWIRE
Pulse
Counter
VON
RN2
PGND
SCP2
+
DAC
RN1
GND
VREF
Operation
The RT4723 is a highly integrated Boost, LDO and
inverting charge pump to generate positive and
negative output voltage. It can support input voltage
range from 2.5V to 4.6V and the output current up to
30mA. The VOP positive output voltage is set at a
typical value of 4.6V. The VON negative output voltage
is set at a typical value of -2.4V and can be
programmed through single wire protocol (SWIRE pin).
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS4723-00
April 2016
The available voltage range is from -0.6V to -2.4V with
100mV per step. The RT4723 provides OverTemperature Protection (OTP) and Short Circuit
Protection (SCP) mechanisms to prevent the device
from damage with abnormal operations. When the
SWIRE voltage is logic low for more than 350us, the IC
will be shut down with low input supply current less
than 1A.
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
3
RT4723
Absolute Maximum Ratings
(Note 1)
 Supply Input Voltage VIN Pin ------------------------------------------------------------------------------------- 0.3V to 6V

Output voltage VOP Pin ------------------------------------------------------------------------------------------- 0.3V to 6V

Output voltage VON Pin ------------------------------------------------------------------------------------------- 6V to 0.3V

Others pin to GND -------------------------------------------------------------------------------------------------- 0.3V to 6V

Power Dissipation, PD @ TA = 25°C

WL-CSP-15B 1.39x2.07 (BSC) --------------------------------------------------------------------------------- 2W
Package Thermal Resistance (Note 2)
WL-CSP-15B 1.39x2.07 (BSC), JA --------------------------------------------------------------------------- 49.8°C/W

Lead Temperature (Soldering, 10 sec.) ----------------------------------------------------------------------- 260C

Junction Temperature --------------------------------------------------------------------------------------------- 150C

Storage Temperature Range ------------------------------------------------------------------------------------ 65C to 150C

ESD Susceptibility (Note 3)
HBM (Human Body Model) -------------------------------------------------------------------------------------- 2kV
MM (Machine Model) --------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions
(Note 4)

Supply Input Voltage Range ---------------------------------------------------------------------------------------- 2.5V to 4.6V

Positive Output Voltage ---------------------------------------------------------------------------------------------- 4.6V

Negative Output Voltage Range ----------------------------------------------------------------------------------- 2.4V to 0.6V

Ambient Temperature Range--------------------------------------------------------------------------------------- 40C to 85C

Junction Temperature Range -------------------------------------------------------------------------------------- 40C to 125C
Electrical Characteristics
(VIN = 3.7V, VOP = 4.6V, VON = 2.4V, CIN = 4.7F, CBOOST = COP = 10F, CON = 20F, CF1 = 1F, L1 = 2.2H, TA = 25°C,
unless otherwise specified.)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
2.5
--
4.6
V
Power Supply
Input Voltage Range
VIN
Under Voltage Lockout
Threshold Voltage
VUVLO_H
VIN Rising
--
2.2
2.5
V
VUVLO_L
VIN Falling
--
2.1
2.3
V
Over-temperature Protection
TOTP
(Note 5)
--
140
--
C
Over-temperature Protection
Hysteresis
TOTP_HYST
(Note 5)
--
15
--
C
Shutdown Current
ISHDN
SWIRE = 0V
--
--
1
A
Efficiency Peak 1
Eff_1
IOP = ION = 1mA
--
58
--
%
Efficiency Peak 2
Eff_2
IOP = ION = 5mA
--
75
--
%
Efficiency Peak 3
Eff_3
IOP = ION = 15mA
--
83
--
%
--
4.6
--
V
LDO Output
Positive Output Voltage Range VOP
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
4
is a registered trademark of Richtek Technology Corporation.
DS4723-00
April 2016
RT4723
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Positive Output Voltage
Accuracy
VOP_ACC
1
--
1
%
Positive Output Current
Capability
IOP_MAX
--
--
30
mA
Positive Output Voltage Ripple
VOP_RIPPLE IOP = 20mA
--
10
--
mV
Line Regulation
VOP_LINE
VIN = 2.9 to 4.5V, IOP = 20mA
--
5
--
mV
Load Regulation
VOP_LOAD
IOP = 0mA to 30mA
--
5
--
mV
Fast Discharge Resistance
RDISP
--
105
--

Short Circuit Protection
VSCP1
--
< 80%
VOP
--
V
2.4
--
0.6
V
--
100
--
mV
(Note 5)
(Note 5)
Charge Pump Output
Negative Output Voltage
Range
VON
Negative Output Voltage
Setting Range
VON_SET
Negative Output Voltage
Accuracy
VON_ACC
1
--
1
%
Negative Output Current
Capability
ION_MAX
--
--
30
mA
Negative Charge Pump
Switching Frequency
fOSC_N
0.8
1
1.2
MHz
Negative Output Voltage
Ripple
VON_RIPPLE ION = 20mA
--
20
--
mV
Line Regulation
VON_LINE
VIN = 2.9 to 4.5V, ION = 20mA
--
10
--
mV
Load Regulation
VON_LOAD
ION = 0mA to 30mA
--
30
--
mV
Fast Discharge Resistance
RDISN
--
60
--

Short Circuit Protection
VSCP2
--
> 80%
VON
--
V
SWIRE Turn-off Detection
Time
Toff_dly
350
--
--
s
SWIRE Signal Stop Indicate
Time
Tstop
350
--
--
s
Twait after Data
Twait_int
10
--
--
ms
Rising Input High Threshold
Voltage Level
VIH
1.2
--
VIN
V
Falling Input Low Threshold
Voltage Level
VIL
0
--
0.4
V
SWIRE Pull Low Resistor
RSWIRE
--
300
--
k
Wake up Delay
Twkp
--
--
1
s
SWIRE Rising Time
TR
--
--
200
ns
SWIRE Falling Time
TF
--
--
200
ns
Clocked SWIRE High
TON
2
10
40
s
Clocked SWIRE Low
TOFF
2
10
40
s
Per step
(Note 5)
(Note 5)
Logic Input (SWIRE)
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS4723-00
April 2016
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
5
RT4723
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
SWIRE to VOP On Time
TVOP_ON
--
1.6
--
ms
Input Clocked SWIRE
Frequency
f SWIRE
25
--
250
kHz
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect
device reliability.
Note 2. JA is measured at TA = 25C on a high effective thermal conductivity four-layer test board per JEDEC 51-7.
Note 3. Devices are ESD sensitive. Handling precaution recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Spec. is guaranteed by design.
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
6
is a registered trademark of Richtek Technology Corporation.
DS4723-00
April 2016
RT4723
Typical Application Circuit
L1
2.2µH
VIN
2.5V to 4.6V
CIN
4.7µF
D1
LXP
C1 VIN
CBOOST
10µF
E2
BOOST
VOP
E3
RT4723
B3 C2P
CF2
1µF
VON
A2
CON1
10µF
A3 C2N
B1
C1P D3
SWIRE
GND
A1, C2, D2
VOP
4.6V
COP
10µF
C1N C3
CON2
10µF
VON
-0.6V to -2.4V
CF1
1µF
PGND
B2, E1
Table 1. Component List of Evaluation Board
Reference
Qty.
CIN
1
CBOOST, COP, CON1, CON2
Part Number
Description
Package
Supplier
GRM188R61C475KAAJ 4.7F/16V/X5R
0603
Murata
1
GRM188R61A106KE69 10F/10V/X5R
0603
Murata
CF1, CF2
1
GRM155R61C105KE01
1F/16V/X5R
0402
Murata
L1
1
GLCLK2R201A
2.2H
2.5mm x 2.0mm x 1.0mm
ALPS
Time Diagram
SWIRE Interface
TON
TOFF
90%
Twkp
10%
TR
TF
Power Sequence
Twait_int > 10ms
VIN
SWIRE
0
Tss2 ≤ 2ms
Tss1 ≤ 3ms
Toff_dly > 350μs
Tstop > 350μs
…
0
1 2
1.5ms ≤ Tdly ≤ 2.5ms
10 11
4.6V
Hi-Z
VOP
0
0
TVOP_ON
-1.4V
VON
Hi-Z
-2.4V
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS4723-00
April 2016
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
7
RT4723
Table 2. VON Output Voltage with SWIRE Pulse
Pulse
VON(V)
0
2.4 (default)
1
2.4
2
2.3
3
2.2
4
2.1
5
2.0
6
1.9
7
1.8
8
1.7
9
1.6
10
1.5
11
1.4
12
1.3
13
1.2
14
1.1
15
1.0
16
0.9
17
0.8
18
0.7
19
0.6
20
0
Table 3. VOP/VON Shutdown Discharge Selection with SWIRE Pulse
Pulse
Discharge
21
Enable
Once pulse 21 received on SWIRE pin, the RT4723 will enable the discharge function to discharge the VOP/VON
outputs for 20ms and then enter high impedance state when fault or power-off condition. The discharge function
is default disabled and outputs keep high impedance state when fault or power-off condition .
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
8
is a registered trademark of Richtek Technology Corporation.
DS4723-00
April 2016
RT4723
Typical Operating Characteristics
Efficiency vs. Output Current
VOP vs. Output Current
4.620
90
4.615
85
80
VOP (V)
Efficiency (%)
4.610
VIN = 4.5V
75
VIN = 3.7V
VIN = 2.7V
70
65
VOP = 4.6, VON = 2.4V
0.005
0.01
0.015
0.02
0.025
4.600
4.595
VIN = 2.7V
4.590
VIN = 3.7V
4.585
VIN = 4.5V
VOP = 4.6, VON = 2.4V
4.580
60
0
4.605
0
0.03
0.005
0.01
Output Current (A)
VON vs. Output Current
4.600
-2.365
4.599
-2.370
4.598
VIN = 3.7V
VIN = 2.7V
-2.390
4.596
-2.400
4.592
-2.405
0.02
0.025
2.5
0.03
3.5
4.0
Output Current (A)
VON vs. Input Voltage
Power On
SWIRE
(4V/Div)
-2.36
VON (V)
3.0
Input Voltage (V)
-2.35
IOP = 30mA
-2.37
VOP = 4.6, V ON = 2.4V
4.590
-2.410
0.015
IOP = 30mA
4.591
VOP = 4.6, V ON = 2.4V
0.01
IOP = 10mA
4.594
4.593
0.005
0.03
IOP = 0mA
4.595
-2.395
0
0.025
4.597
VIN = 4.5V
VOP (V)
VON (V)
-2.375
-2.385
0.02
VOP vs. Input Voltage
-2.360
-2.380
0.015
Output Current (A)
4.5
5.0
VIN = 3.7V, VOP = 4.6V, VON = 2.4V
VON
(0.5V/Div)
-2.38
IOP = 10mA
-2.39
VOP
(1V/Div)
IOP = 0mA
-2.40
VOP = 4.6, VON = 2.4V
-2.41
2.5
3
3.5
4
Input Voltage (V)
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS4723-00
April 2016
4.5
IVIN
(0.1A/Div)
Time (1ms/Div)
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
9
RT4723
Power Off with Discharge
VIN = 3.7V, VOP = 4.6V, VON = 2.4V
SWIRE
(4V/Div)
Power OFF without Discharge
SWIRE
(4V/Div)
VIN = 3.7V, VOP = 4.6V, VON = 2.4V
VON
(0.5V/Div)
VON
(0.5V/Div)
VOP
(1V/Div)
IVIN
(0.1A/Div)
VOP
(1V/Div)
IVIN
(0.1A/Div)
Time (5ms/Div)
Time (10ms/Div)
Power On with SWIRE is Low
Power On with SWIRE is High
SWIRE
(4V/Div)
SWIRE
(4V/Div)
VIN
(2V/Div)
VIN
(2V/Div)
VBOOST
(2V/Div)
VBOOST
(2V/Div)
VIN = 3.7V, VOP = 0V, VON = 0V
VIN = 3.7V, VOP = 4.6V, VON = -2.4V
Time (10ms/Div)
Time (10ms/Div)
Power On with SWIRE from Low to High
SWIRE
(4V/Div)
VIN
(2V/Div)
VBOOST
(2V/Div)
VIN = 3.7V
Time (10ms/Div)
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
10
is a registered trademark of Richtek Technology Corporation.
DS4723-00
April 2016
RT4723
Application Information
The RT4723 is a highly integrated Boost, LDO and
inverting charge pump to generate positive and
negative output voltages for AMLOED bias. It can
support input voltage range from 2.5V to 4.6V and the
output current up to 30mA. The VOP positive output
voltage is generated from the LDO supplied from a
synchronous Boost converter, and VOP is set at a
The inductance can eventually
according to the following equation :
typical value of 4.6V. The Boost converter output also
drives an inverting charge pump controller to generate
VON negative output voltage which is set at a typical
value of 2.4V. The negative output voltage can be
programmed through the dedicated pin which
implements single wire protocol and the available
voltage range is from 0.6V to 2.4V with 100mV per
step.
system performance, a shielded inductor is preferred to
Input Capacitor Selection
Input ceramic capacitor with 4.7F capacitance is
suggested for applications. For better voltage filtering,
select ceramic capacitors with low ESR, X5R and X7R
types are suitable because of their wider voltage and
temperature ranges.
Boost Inductor Selection
The inductance depends on the maximum input current.
As a general rule, the inductor ripple current range is
20% to 40% of the maximum input current. If 40% is
selected as an example, the inductor ripple current can
be calculated according to the following equations :
VOUT  IOUT(MAX)
IIN(MAX) =
  VIN
IL = 0.4  IIN(MAX)
where η is the efficiency of the VOP Boost converter,
IIN(MAX) is the maximum input current, and IL is the
inductor ripple current. The input peak current can then
be obtained by adding the maximum input current with
half of the inductor ripple current as shown in the
following equation :
be
determined
η   VIN    VOUT  VIN 
2
L
0.4   VOUT   I OUT(MAX)fOSC
2
where f OSC is the switching frequency. For better
avoid EMI problems.
Boost Output Capacitor Selection
The output ripple voltage is an important index for
estimating IC performance. This portion consists of two
parts. One is the product of ripple current with the ESR
of the output capacitor, while the other part is formed
by the charging and discharging process of the output
capacitor. As shown in Figure 1, VOUT1 can be
evaluated based on the ideal energy equalization.
According to the definition of Q, the VOUT1 value can
be calculated as the following equation :
1 =C
OUT  VOUT1
fSOC
IOUT  D
=
fSOC  COUT
Q = IOUT  D 
VOUT1
where f OSC is the switching frequency and D is the duty
cycle.
Finally, taking ESR into consideration, the overall
output ripple voltage can be determined by the
following equation :
VOUT = VESR + VOUT1 = VESR +
IOUT  D
fOSC  COUT
where VESR = ICrms x RCESR
The output capacitor, COUT, should be selected
accordingly.
IPEAK = 1.2 x IIN(MAX)
Note that the saturated current of the inductor must be
greater than IPEAK.
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS4723-00
April 2016
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
11
RT4723
Over Current Protection
The RT4723 includes a cycle-by-cycle current limit
IL
Input Current
function which monitors the inductor current during
each ON period. The power switch will be forced off to
avoid large current damage once the current is over the
limit level.
Inductor Current
Short Circuit Protection
Output Current
Time
DTs
Output Ripple (ac)
Time
VOUT1
The RT4723 has an advanced output short-circuit
protection mechanism which prevents the IC from
damage by unexpected applications. When the output
becomes shorted to ground, and the output voltage is
under the limit level with 1ms (typ.) duration, the bias
function enters shutdown mode and can only re-start
normal operation after triggering the SWIRE pin.
Figure 1. Output Ripple Voltage Without Contribution of
ESR
Under Voltage Lockout
To prevent abnormal operation of the IC in low voltage
condition, an under voltage lockout is included which
shuts down IC operation when input voltage is lower
than the specified threshold voltage.
Soft-Start
The RT4723 employs an internal soft-start feature to
avoid high inrush current during start-up. The soft-start
function is achieved by clamping the output voltage of
the internal error amplifier with another voltage source
that is increased slowly from zero to near VIN during
the soft-start period.
Negative Output Voltage Setting
The Negative output voltage can be programmed by a
MCU through the dedicated pin according to Table 2
“VON Output Voltage with SWIRE Pulse”.
Shutdown Delay and Discharge
When the SWIRE signal is logic low for more than
350s, the IC function will be shut down. The output
VOP/VON can be actively discharged to GND with
discharge function enabled referring to Table 3
“VOP/VON Shutdown Discharge Selection with SWIRE
Pulse”. In shutdown mode, the input supply current for
the IC is less than 1A.
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
12
Over Temperature Protection
The RT4723 equips an over temperature protection
circuitry to prevent overheating due to excessive power
dissipation. The OTP will shut down the bias operation
when ambient temperature exceeds 140C. Once the
ambient temperature cools down by approximately
15C, IC will automatically resume normal operation.
To maintain continuous operation, the maximum
junction temperature should be prevented from rising
above 125C.
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature.
The maximum power dissipation can be calculated by
the following formula :
PD(MAX) = (TJ(MAX)  TA) / JA
where TJ(MAX) is the maximum junction temperature,
TA is the ambient temperature, and JA is the junction to
ambient thermal resistance.
For recommended operating condition specifications,
the maximum junction temperature is 125C. The
junction to ambient thermal resistance, JA, is layout
dependent. For WL-CSP-15B 1.39x2.07 (BSC)
package, the thermal resistance, JA, is 49.8C/W on a
standard JEDEC 51-7 four-layer thermal test board.
is a registered trademark of Richtek Technology Corporation.
DS4723-00
April 2016
RT4723
The maximum power dissipation at TA = 25C can be
calculated by the following formula :
PD(MAX) = (125C  25C) / (49.8C/W) = 2W for
WL-CSP-15B 1.39x2.07 (BSC) package
Layout Considerations
For the best performance of RT4723, the following
PCB layout guidelines should be strictly followed.

The maximum power dissipation depends on the
operating ambient temperature for fixed TJ(MAX) and
thermal resistance, JA. The derating curve in Figure 2
allows the designer to see the effect of rising ambient
temperature on the maximum power dissipation.
close to the IC as possible. The traces should be
wide and short especially for the high current output
loop.

The input and output bypass capacitor should be
placed as close to the IC as possible and connected
2.5
Maximum Power Dissipation (W)1
For good regulation, place the power components as
Four-Layer PCB
to the ground plane of the PCB.
2.0

The flying capacitor should be placed as close to the
C1P/C1N/C2P/C2N pin as possible to avoid noise
1.5
injection.

1.0
Minimize the size of the LXP node and keep the
traces wide and short. Care should be taken to avoid
0.5
running traces that carry any noise-sensitive signals
near LXP or high-current traces.
0.0
0
25
50
75
100
Ambient Temperature (°C)
125

Separate power ground (PGND) and analog ground
(GND). Connect the GND and the PGND islands at
Figure 2. Derating Curve of Maximum Power
a single end. Make sure that there are no other
Dissipation
connections between these separate ground planes.
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS4723-00
April 2016
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
13
CON2
RT4723
CON1
VON
GND
SWIRE
CIN
VIN
GND
VON
C2N
SWIRE
PGND
C2P
VIN
GND
C1N
LXP
GND
C1P
PGND
BOOST
VOP
CF2
CF1
CBST
VOP
L1
COP
GND
Figure 3. PCB Layout Guide
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
14
is a registered trademark of Richtek Technology Corporation.
DS4723-00
April 2016
RT4723
Outline Dimension
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min.
Max.
Min.
Max.
A
0.500
0.600
0.020
0.024
A1
0.170
0.230
0.007
0.009
b
0.240
0.300
0.009
0.012
D
2.020
2.120
0.080
0.083
D1
E
1.600
1.340
0.063
1.440
0.053
0.057
E1
0.800
0.031
e
0.400
0.016
WL-CSP-15B 1.39x2.07 (BSC)
Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume
responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and
reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS4723-00
April 2016
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
15