NTE812 Integrated Circuit Audio Power Amplifier, 1W Description: The NTE812 is a monolithic integrated circuit in a 14−Lead DIP type package designed for use in driver and power amplifier applications at frequencies from 50Hz to 40kHz. This device will deliver up to 1W RMS output power into an 8Ω load. The high input impedance and low standby current provide excellent low−power audio output performance for portable applications. The high peak current capability can be utilized for direct driving of complementary power transistors in high power amplifier applications. Features: D 1 Watt RMS Power into 8Ω with THD = 0.65% Typ D Peak Output Current: 1A D Wide Supply Voltage Range: 4V to 13V D High Input Impedance Applications: D Radios D Phonographs D Portable Communications Receivers D Complementary Power Amplifier Drivers D Servo Drivers Absolute Maximum Ratings: (TA = +25°C unless otherwise specified) Supply Voltage (Note 1), VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V Output Current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A Continuous Power Dissipation (TA ≤ +25°C, Note 2), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1W Derate Above 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14.7mW/°C Operating Ambient Temperature Range, Topr . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55° to +100°C Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65° to +150°C Lead Temperature (During Soldering, 1/16” from case, 10sec), TL . . . . . . . . . . . . . . . . . . . . . +260°C Note 1. Voltage values are with respect to network GND terminal. Note 2. This rating is valid for the condition that all pins are soldered into a printed circuit board with a 2” x 2” copper layer area of 14 mil thickness. Most of the heat is conducted to the printed circuit board copper layer through Pin8 (Input GND). Electrical Characteristics: (TA = +25°C, VCC = 12V unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Unit Continuous RMS Power Output PO THD < 5%, RL = 8Ω, f = 1kHz 1 − − W Input Voltage Vin PO = 1W, RL = 8Ω, f = 1kHz − 45 70 mV Electrical Characteristics (Cont’d): (TA = +25°C, VCC = 12V unless otherwise specified) Parameter Symbol Min Typ Max Unit − 0.6 − % PO = 1W − 0.65 5.0 % Efficiency PO = 1W, RL = 8Ω, f = 1kHz − 52 − % Cutoff Frequency Lower Reference PO = 1W at 1kHz, RL = 8Ω − 50 − Hz − 40 − kHz 80 99 − kΩ − 22 − kΩ Total Harmonic Distortion THD Test Conditions PO = 0.05W RL = 8Ω, f = 1kHz Upper Input Impedance Zin Output Impedance Zout Reference plane is test R1 = 100kΩ circuit input terminal R1 = 22kΩ Ω Reference plane is device output terminal Noise Output Level (Unfiltered) Reference PO = 1W, Input open − −70 − dB Quiescent Output Voltage No Signal − 6.2 − V Quiescent Supply Current No Signal − 5.5 9.0 mA Pin Connection Diagram Bootstrap 1 14 VCC N.C. 2 13 VCC Compensation 1 3 12 Output Compensation 2 4 11 N.C. Feedback 5 10 Output GND N.C. 6 9 N.C. Input 7 8 Input GND 14 8 1 7 .785 (19.95) Max .300 (7.62) .200 (5.08) Max .100 (2.45) .600 (15.24) .099 (2.5) Min