Datasheet

UNISONIC TECHNOLOGIES CO., LTD
L1136
CMOS IC
HIGH RIPPLE-REJECTION LOW
DROPOUT HIGH OUTPUT
CURRENT CMOS VOLTAGE
REGULATOR

4
5
1
2
3
SOT-25
DESCRIPTION
The UTC L1136 is an extremely low dropout regulator providing
designers with low current dissipation, high output voltage accuracy
and it is developed based on CMOS technology.
The internal transistor with low-resistance provides small
dropout voltage and the large output current. Various capacitors, as
well as small ceramic capacitors, can be used for this IC more than
for the conventional regulator ICs which have CMOS technology.
The ON/OFF circuit can guarantee longer sure the battery life.
1
SOP-8
The over-current protection circuit is designed to protect the device from being damaged because of load
current while exceeding the capacitance of output transistor. The thermal shutdown protection circuit protects
against heat and the rush current control protection circuit and limits the excessive rush current during start-up.
The UTC L1136 is universally suitable for power supply of battery-powered devices, power supply of TV,
notebook PCs and home electric appliances, and constant-voltage power supply of portable equipment.

FEATURES
* Output Voltage Ranges from 1.2 to 3.3V Selectable in 0.05V Step
* Input Voltage Varies From 1.5 to 5.5V
* Low Equivalent Series Resistance Capacitor: Ceramic Capacitor of 4.7μF or More can be used as the I/O Capacitor
* High Accuracy Output Voltage: ±1.0%(1.0~1.5V output product: ±15mV)
* Low Current Consumption:
During operation: 70μA (TYP.), 90μA (MAX.)
During shutdown: 1.0μA (TYP.)
* Low Dropout Voltage: 70mV (TYP.)
* Output current:
600mA
(Attention should be paid to the power dissipation of the package when the output current is large.)
* High ripple rejection:
70dB (TYP.) @ 1.0kHz
* Internal Protection Circuits: Over-Current Protection Circuit, Thermal Shutdown Circuit And Rush Current Control Circuit
* Internal Power On/Off Circuit Ensures Longer Battery Life
* Special Care should be Taken to the Power Consumption of the Package when the Output Current is Large.

ORDERING INFORMATION
Ordering Number
L1136G-xx-AF5-R
L1136G-xx-S08-R
Note: xx: Output Voltage, refer to Marking Information.
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Copyright © 2014 Unisonic Technologies Co., Ltd
Package
SOT-25
SOP-8
Packing
Tape Reel
Tape Reel
1 of 9
QW-R502-464.g
L1136

CMOS IC
MARKING INFORMATION
PACKAGE
VOLTAGE CODE
MARKING
4
5
SOT-25
HXXFG
12: 1.2V
15: 1.5V
18: 1.8V
25 :2.5V
33 :3.3V
1
2
Voltage Code
3
SOP-8

PIN CONFIGURATION
SOT-25
VOUT
5
1
VIN
SOP-8
NC
4
2
ON/OFF
1
8
GND
VIN
2
7
GND
VOUT
3
6
GND
NC
4
5
GND
3
VSS ON/OFF
SOT-25
PIN NO.
PIN NAME
DESCRIPTION
1
VIN
Input voltage pin
2
VSS
GND pin
3
ON/OFF
Shutdown pin
4
NC (Note)
No connection
5
VOUT
Output voltage pin
Note: The NC pin is electrically open and it can be connected to VIN or VSS.
SOP-8
PIN NO.
1
PIN NAME
ON/OFF
2
VIN
3
VOUT
4
5, 6, 7, 8
NC
GND
DESCRIPTION
Shutdown pin
Input supply pin. Supply voltage can range from 2.9V to 6V. Bypass with a
1µF capacitor to GND.
Regulator Output. Sources up to 600mA. A small capacitor (2.2mF, typical)
is needed from this pin to ground to assure stability.
No connection
Ground.
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L1136

CMOS IC
BLOCK DIAGRAM
VIN
Thermal
Shutdown Circuit
ON/OFF
ON/OFF
Circuit
Reference
Voltage Circuit
Overcurrent
Protection
Circuit
-
(Note)
VOUT
+
VSS
Note : Parasitic diode
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L1136

CMOS IC
ABSOLUTE MAXIMUM RATING
PARAMETER
RATINGS
UNIT
VSS -0.3 ~ VSS +6
V
Input Voltage
VSS -0.3 ~ VIN +0.3
V
Output Voltage
VSS -0.3 ~ VIN +0.3
V
SOT-25
360
Power Dissipation
PD
mW
SOP-8
500
Ambient Operating Temperature
TOPR
-40 ~ +85
°C
Storage Temperature
TSTG
-40 ~ +125
°C
Note: 1. Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.

SYMBOL
VIN
VON/OFF
VOUT
ELECTRICAL CHARACTERISTICS (TA=25°C, unless otherwise specified.)
PARAMETER
SYMBOL
TEST
CIRCUIT
1
Output Voltage
(Note 1)
VOUT(E)
1
TEST CONDITIONS
VIN=VOUT(S)+1.0V 1.0V≤VOUT(S)≤1.5V
,
IOUT=100mA
1.5V≤VOUT(S)≤4.5V
MIN
VOUT(S)
-0.015
VOUT(S)
×0.99
TYP
VOUT(S)
VOUT(S)
MAX
VOUT(S)
+0.015
VOUT(S)
×1.01
UNIT
V
V
VIN=5.5V,
VOUT(S)
VOUT(S)
4.5V≤VOUT(S)≤5.0V
V
VOUT(S)
IOUT=100mA
×0.99
×1.01
3
VIN≥VOUT(S)+1.0V 1.0V≤VOUT(S)≤4.5V 600(Note 5)
mA
Output Current
IOUT
(Note 2)
3
VIN=5.5V
4.5V≤VOUT(S)≤5.0V 600(Note 5)
mA
1
1.1V≤VOUT(S)≤1.2V
0.44
0.48
V
1
1.2V<VOUT(S)≤1.3V
0.34
0.38
V
1
1.3V<VOUT(S)≤1.4V
0.24
0.28
V
Dropout Voltage
VDROP
IOUT=200mA
(Note 3)
1
1.4V<VOUT(S)≤1.5V
0.14
0.18
V
1
1.5V<VOUT(S)≤2.6V
0.10
0.15
V
1
2.6V<VOUT(S)≤5.0V
0.07
0.10
V
VIN=VOUT(S)+1.0V
,
1.0V≤VOUT(S)≤4.5V
±130
1
ppm/°C
IOUT=100mA
Output Voltage
VOUT
-40≤TA ≤85°C
Temperature
TA  VOUT
Coefficient (Note 4)
VIN=5.5V,
IOUT=100mA
1
±130
4.5V≤VOUT(S)≤5.0V
ppm/°C
-40≤TA ≤85°C
Notes: 1. VOUT(S): Specified output voltage; VOUT(E): Actual output voltage
The output voltage when fixing IOUT (=100mA) and inputting VOUT(S)+1.0V or 5.5V
2. The output current at which the output voltage becomes 95% of VOUT(E) after gradually increasing the output
current
3. VDROP = VIN1-(VOUT3×0.98)
VOUT3 is the output voltage when VIN = VOUT(S)+1.0V or 5.5V, and IOUT = 200mA.
VIN1 is the input voltage at which the output voltage becomes 98% of VOUT3 after gradually decreasing the
input voltage.
4. The change in temperature [mV/°C] is calculated using the following equation.
1
 VOUT
 VOUT
[ppm /  C ] * 3  1000
[mV /  C ] *1  VOUT ( S ) [ V ] * 2 
 TA  VOUT
 TA
*1. Change in temperature of the output voltage
*2. Specified output voltage
*3. Output voltage temperature coefficient
5. The output current can be at least this value.
Due to limitation of the package power dissipation, this value may not be satisfied. Attention should be
paid to the power dissipation of the package when the output current is large.
This specification is guaranteed by design.
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CMOS IC
ELECTRICAL CHARACTERISTICS (Cont.)
PARAMETER
Line Regulation
Load Regulation
Current Consumption
During Operation
Current Consumption
During Shutdown
Input Voltage
Shutdown Pin
Voltage “H”
Shutdown Pin
Voltage “L”
Input
Input
Shutdown Pin Input
Current “H”
Shutdown Pin Input
Current “L”
Ripple Rejection
TEST
TEST CONDITIONS
SYMBOL CIRCUIT
1
VOUT(S)+0.5V≤VIN≤5.5V 1.0V≤VOUT(S)≤3.6V
VOUT1
, IOUT=100mA
1
3.6V≤VOUT(S)≤4.8V
VIN  VOUT
5.3V≤VIN≤5.5V,
4.8V≤VOUT(S)≤5.0V
1
IOUT=100mA
VIN=VOUT(S)+1.0V,
1
1.0V≤VOUT(S)≤4.5V
1mA≤IOUT≤200mA
∆VOUT2
VIN=5.5V,
1
4.5V≤VOUT(S)≤5.0V
1mA≤IOUT≤200mA
VIN=VOUT(S)+1.0V, ON/OFF pin=ON,
2
no load, 1.0V≤VOUT(S)<1.8V
VIN=VOUT(S)+1.0V, ON/OFF pin=ON,
2
ISS1
no load, 1.8V≤VOUT(S)<4.5V
VIN=5.5V, ON/OFF pin=ON,
2
no load, 4.5V≤VOUT(S)<5.0V
VIN=VOUT(S)+1.0V,
2
ON/OFF pin= OFF,
1.0V≤VOUT(S)≤4.5V
no load
ISS2
VIN=5.5V,
2
ON/OFF pin= OFF,
4.5V≤VOUT(S)≤5.0V
no load
VIN
VIN=VOUT(S)+1.0V,
4
RL=1.0kΩ, Determined 1.0V≤VOUT(S)≤4.5V
by VOUT output level
VSH
VIN=5.5V, RL=1.0 kΩ,
determined by VOUT 4.5V≤VOUT(S)≤5.0V
4
output level
VIN=VOUT(S)+1.0V,
4
RL=1.0kΩ, Determined 1.0V≤VOUT(S)≤4.5V
by VOUT output level
VSL
VIN=5.5V,RL=1.0kΩ,
Determined by VOUT 4.5V≤VOUT(S)≤5.0V
4
output level
0.2
10
%/V
mV
2.5
10
mV
15
30
mV
15
30
mV
90
110
μA
70
90
μA
70
90
μA
1.0
μA
1.0
μA
1.5
5.5
V
1.5
V
1.5
V
0.3
V
0.3
V
4
VIN=5.5V, VON/OFF=5.5V
-0.1
0.1
μA
ISL
4
VIN=5.5V, VON/OFF=0V
-0.1
0.1
μA
5
5
5
VIN=VOUT(S)+1.0V,
f=1kHz,IOUT=100mA,
∆VRIP=0.5Vrms
VIN=5.5V,f=1kHz,
∆VRIP=0.5Vrms,
IOUT=100mA
VIN=VOUT(S)+1.0V,
ON/OFF pin=ON,
VOUT=0V
VIN=5.5V, VOUT=0V,
ON/OFF pin=ON
|RR|
3
ISHORT
3
Thermal Shutdown
Detection Temperature
Thermal Shutdown
Release Temperature
0.05
2.5
ISH
5
Short-Circuit Current
MIN TYP MAX UNIT
1.0V≤VOUT(S)≤1.2V
1.2V≤VOUT(S)≤3.0V
3.0V≤VOUT(S)≤4.5V
70
65
60
dB
dB
dB
4.5V≤VOUT(S)≤5.0V
60
dB
1.0V≤VOUT(S)≤4.5V
200
mA
4.5V≤VOUT(S)≤5.0V
200
mA
TSD
Junction temperature
150
°C
TSR
Junction temperature
120
°C
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L1136

CMOS IC
TEST CIRCUITS
1.
2.
+
VOUT
VIN
A
ON/OFF
VSS
Set to VIN or GND
3.
VIN
VOUT
+
A
+
ON/OFF
V
VSS
Set to power ON
4.
5.
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L1136

CMOS IC
TYPICAL APPLICATION CIRCUIT
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CMOS IC
FUNCTIONAL DESCRIPTION
1. Basic Operation
The UTC L1136‘s block diagram is shown in the following. (Fig.1)
The UTC L1136 has an error amplifier, and it compares the reference voltage (VREF) with VFB, which is the
output voltage resistance-divided by feedback resistors RS and RF. It supplies the gate voltage necessary to
maintain the constant output voltage which is not influenced by the input voltage and temperature change, to the
output transistor.
VIN
Parasitic
Diode
Current
Supply
VOUT
Error Amplifier
VREF
+
RF
VFB
Reference
Voltage Circuit
VSS
RS
Fig.1
2. Output Transistor
For L1136, the output transistor is a P-channel MOSFET with low on-resistance.
In order to protect against inverse current, make sure that VOUT does not exceed VIN+0.3V, because of a
parasitic diode between the VIN and VOUT pin, when the potential of VOUT became higher than VIN.
3. Shutdown Pin (ON/OFF pin)
The shutdown pin is used to turn on and turn off this regulator.
When the ON/OFF pin is set to the shutdown level, the entire internal circuit stops operating. For reducing the
current dissipation, the internal P-channel MOSFET is shut down. The VOUT pin is set to the VSS level by the internal
dividing resistor of several hundred kΩ between the VOUT and VSS pin.
Note: When the ON/OFF pin voltage is in the range of 0.3V~1.0V, the current dissipation increases. The
architecture of the ON/OFF pin can be seen in Fig. 2 Since the ON/OFF pin is neither pulled down nor pulled up
internally, do not use it in the floating state.
ON/OFF Pin
“L”: Power off
“H”: Power on
Internal Circuits
Stop
Operate
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VOUT Pin Voltage
VSS level
Set value
Current Consumption
ISS2
ISS1
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CMOS IC
FUNCTIONAL DESCRIPTION (Cont.)
4. Over-current protection circuit
An over-current protection circuit is contained in the UTC L1136. It aims at preventing the output transistor from
damage due to an excessive output current and short circuiting between the VOUT and VSS pin. The current (ISHORT) is
internally-fixed to about typically 200mA when short-circuit condition is applied in output pin, and the initial value is
restored for the output voltage, if releasing a short circuit once.
Caution: This over-current protection circuit does not work as for thermal protection. If this IC maintains short
circuiting for a long time inside, take care to the conditions of input voltage and the load current, therefore,
under the usage conditions including short circuit, the IC’s consumption will not exceed power dissipation
of the package.
5. Thermal shutdown circuit
A thermal shutdown circuit is included to prevent this device from being damaged for overheat. The thermal
shutdown circuit operates to stop regulating when the junction temperature becomes higher than 150°C (TYP.), and
it turns back to normal operation when the junction temperature is lower than 120°C (TYP.).
Due to self-heating of the UTC L1136, if the thermal shutdown circuit starts operating, it stops regulating so that
the output voltage drops. When the regulating operation stops, the IC’s temperature goes down due to the UTC
L1136 does not generate heat itself. When the temperature drops, the thermal shutdown circuit is released to restart
regulating, thus this IC generates heat again. Repeating this procedure makes waveform of the output voltage
pulse-like form. Stop/Restart of regulation continues unless decreasing either/both of the input voltage and the
output voltage for reducing the internal current consumption, or decreasing the ambient temperature.
Thermal Shutdown Circuit (Note)
Operation: 150°C (Typ.)
Release: 120°C (Typ.)
Note: Junction Temperature
VOUT Pin Voltage
VSS level
Set value
6. Rush current control circuit
The rush current control circuit is designed to protect against the rush current occurs during power-on or when
the ON/OFF pin is ON. The rush current is specified to typically 400mA immediately after power-on or from the
ON/OFF pin is ON until the specified time (100μs min.) which is set internally.
Caution: Due to the thermal shutdown protection circuit, the junction temperature drops to 120°C (TYP.), after
stopping regulation, the circuit is released to restart regulation; in this case, pay attention to the period
which is to limit rush current to be shorter (10μs min.).
UTC assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.
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