Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: 176 TQFP (1.4mm) with matte Sn Plating Total Device Weight 1.90 Grams August, 2008 % of Total Pkg. Wt. Weight (g) Die 0.89% 0.017 Mold 78.30% 1.488 % of Total Weight (g) Pkg. Wt. 66.55% 3.91% 3.91% 0.78% 0.47% 2.66% 1.264 0.074 0.074 0.015 0.009 0.051 MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Notes / Assumptions: Silicon chip 7440-21-3 Die size: 4.00 x 5.05 mm Silica Fused Epoxy Resin Phenol Resin Antimony Trioxide Carbon black Other (trade secret) 60676-86-0 1309-64-4 1333-86-4 - Mold Compound Density between 1.7 and 2.1 grams/cc 80 to 90% Silica Fused (LSC uses 85% in our calculation) 5 to 10% Epoxy Resin (LSC uses 5% in our calculation). 5 to 10% Phenol Resin (LSC uses 5% in our calculation). 0.1% to 1% Antimony Trioxide (LSC uses 1% in our calculation) 0.1 to 1% Carbon black (LSC uses 0.6% in our calculation) 1 to 4% Other (LSC uses 3.4% in our calculation) D/A Epoxy 0.11% 0.002 Silver filled epoxy 7440-22-4 Wire 0.27% 0.005 Gold (Au) 7440-57-5 (silver content: 70-90%; LSC uses 80% in our calculation) Die attach epoxy Density: 4 grams/cc 0.8 to 1.0 mil diameter; 1 wire per package lead; wire length 3 mm Lead Plating 1.10% 0.021 Tin (Sn) 7440-31-5 Plating is 100% Sn; thickness is 0.015mm Leadframe 19.33% 0.367 Copper (Cu) Silicon (Si) Zinc (Zn) Tin (Sn) Chromium (Cr) Nickel (Ni) Magnesium (Mg) 7440-50-8 7440-21-3 7440-66-6 7440-31-5 7440-47-3 7440-02-0 7439-95-4 Leadframe thickness is nominal (per Case Outline) Cu (LSC uses 97.5% in our calculation) 0 to 0.65% Si (LSC uses 0.4% in our calculation) 0 to 0.2% Zn (LSC uses 0.1% in our calculation) 0 to 0.25% Sn (LSC uses 0.2% in our calculation) 0 to 0.3% Cr (LSC uses 0.2% in our calculation) 0 to 3% Ni (LSC uses 1.5% in our calculation) 0 to 0.15% Mg (LSC uses 0.1% in our calculation) 18.85% 0.077% 0.02% 0.04% 0.04% 0.29% 0.02% 0.358 0.0015 0.0004 0.0007 0.0007 0.0055 0.0004 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. E1