IDT IDTRC5000-180G

MULTI-ISSUE
64-BIT MICROPROCESSOR
IDT RC5000
Integrate d Device Technology, Inc.
FEATURES
•
•
Dual issue super-scalar execution core, executing at
high-frequency
- 250 MHz frequency
- Dual issue floating-point ALU operations with other
instruction classes
- Traditional 5-stage pipeline, minimizes load and
branch latencies
- Single cycle repeat rate for most floating point ALU
operations
• High level of performance for a variety of applications
- High-performance 64-bit integer unit achieves 330
dhrystone MIPS (dhrystone 2.1)
- Ultra high-performance floating-point accelerator,
directly implementing single- and double-precision
operations achieves 500mflops
- Extremely large on-chip primary caches
- On-chip secondary cache controller
• Large, efficient on-chip caches
- 32KB Instruction Cache, 32KB Data Cache
- 2-set associative in each cache
- Virtually indexed and physically tagged to minimize
cache flushes
- Write-back and write-through selectable on a per
page basis
- Critical word first cache miss processing
- Supports back-to-back loads and stores in any combination at full pipeline rate
•
•
•
•
•
High-performance memory system
- Large primary caches integrated on-chip
- Secondary cache control interface on-chip
- High-frequency 64-bit bus interface runs up to
100MHz
- Aggregate bandwidth of on-chip caches, system
interface of 5GB/s
- High-performance write protocols for graphics and
data communications
MIPS-IV 64-bit ISA for improved computation
- Compound floating-point operations for 3D graphics
and floating-point DSP
- Conditional move operations
Compatible with a variety of operating systems
- Windows™ CE
- Numerous MIPS-compatible real-time operating systems
Uses input system clock, with processor pipeline
clock multiplied by a factor of 2-8
Large on-chip TLB
Active power management, including use of WAIT
operation
BLOCK DIAGRAM
Phase Lock Loop
Data Set A
Instruction Set A
Data Tag A
Store Buffer
DTLB Physical
Instruction Select
SysAD
Integer Instruction Register
Address Buffer
Write Buffer
FP Instruction Register
Instruction Tag A
Read Buffer
ITLB Physical
Data Set B
Instruction Set B
Instruction Tag B
DBus
FPIBus
IntIBus
Control
Tag
AuxTag
Load Aligner
Unpacker/Packer
Joint TLB
Integer Register File
Coprocessor 0
System/Memory
Control
DVA
IVA
PC Incrementer
Branch Adder
Instruction TLB Virtual
Integer Control
Floating Point
MAdd,Add,Sub, Cvt
Div, SqRt
Floating-point Control
Floating Point Register File
Integer/Address Adder
Data TLB Virtual
Shifter/Store Aligner
Logic Unit
ABus
Integer Multiply, Divide
Program Counter
The IDT logo is a registered trademark and ORION, R4600, R4640, R4650, R4700, R5000, RV5000, and RISController are trademarks of Integrated Device Technology, Inc. MIPS is a registered
trademark of MIPS Computer Systems, Inc.
COMMERCIAL TEMPERATURE RANGE
 1998 Integrated Device Technology, Inc.
June, 1998
1
IDT RC5000
COMMERCIAL TEMPERATURE RANGE
DESCRIPTION
Integer Pipeline
The RC5000 is a limited dual-issue machine that
The RC5000 serves many performance critical
utilizes
a traditional 5-stage integer pipeline. This basic
embedded applications, such as high-end internetinteger
pipeline
of the RC5000 is illustrated in Figure 1.
working systems, color printers, and graphics terminals.
The
integer
instruction execution speed is tabulated
The RC5000 is optimized for high-performance appli(in
number
of
pipeline
clocks) as follows:
cations, with special emphasis on system bandwidth and
floating point operations, through integration of highOperation
Latency
Repeat
performance computational units and a high-performance
Load
2
1
memory hierarchy. For this class of application, the result
is a relatively low-cost CPU capable of approximately 330
Store
2
1
Dhrystone MIPS.
MULT/MULTU
8
8
IDT’s objectives in offering the RC5000 include:
DMULT/DMULTU
12
12
• Offering a high performance upgrade path to existing
DIV/DIVU
36
36
embedded customers in the internetworking, office
DDIV/DDIVU
68
68
automation and visualization markets.
Other Integer ALU
1
1
• Providing a significant improvement in the floatingBranch
2
2
point performance currently available in a moderately
priced MIPS CPU.
Jump
2
2
• Providing improvements in the memory hierarchy of
The RC5000’s short pipeline keeps the load and
desktop systems by using large primary caches and
integrating a secondary cache controller.
branch latencies very low. The caches contain special
• Enabling improvements in performance through the
logic that allows any combination of loads and stores to
use of the MIPS-IV ISA.
execute in back-to-back cycles without requiring pipeline
slips or stalls. (This presumes, of course, that the operaInstruction Issue Mechanism
The RC5000 recognizes two general classes of tion does not miss in the cache.)
instructions for multi-issue:
• Floating-point ALU
• All others
These instruction classes are pre-decoded by the
RC5000, as they are brought on-chip. The pre-decoded
information is stored in the instruction cache.
Assuming that there are no pending resource
conflicts, the RC5000 can issue one instruction per class
per pipeline clock cycle. Note that this broad separation of
classes insures that there are no data dependencies to
restrict multi-issue.
However, long-latency resources in either the floatingpoint ALU (e.g. DIV or SQRT instructions) or instructions
in the integer unit (such as multiply) can restrict the issue
of instructions. Note that the R5000 does not perform outof-order or speculative execution; instead, the pipeline
slips until the required resource becomes available.
There are no alignment restrictions on dual-issue
instruction pairs. The RC5000 fetches two instructions
from the cache per cycle. Thus, for optimal performance,
compilers should attempt to align branch targets to allow
dual-issue on the first target cycle, since the instruction
cache only performs aligned fetches.
Instruction Set Architecture
The RC5000 implements the MIPS-IV 64-bit ISA,
including CP1 and CP1X functional units (and their
instruction set).
2
IDT RC5000
I0
I1
COMMERCIAL TEMPERATURE RANGE
1I
2I
1R
2R
1A
2A
1D
2D
1W
2W
1I
2I
1R
2R
1A
2A
1D
2D
1W
2W
1I
2I
1R
2R
1A
2A
1D
2D
1W
•••
1I
2I
1R
2R
1A
2A
1D
•••
1I
2I
1R
2R
1A
•••
I2
I3
I4
one cycle
Key to Figure
1I-1R
Instruction cache access
2I
Instruction virtual to physical address translation
2A-2D
Data cache access and load align
1D
Data virtual to physical address translation
1D-2D
Virtual to physical address translation
2R
Register file read
2R
Bypass calculation
2R
Instruction decode
2R
Branch address calculation
1A
Issue or slip decision
1A-2A
Integer add, logical, shift
1A
Data virtual address calculation
2A
Store align
1A
Branch decision
2W
Register file write
Figure 1. R5000 Integer Pipeline Stages
RC5000 Computational Units
The RC5000 contains the following computational units:
Integer ALU. The RC5000 implements a full, single-cycle 64-bit ALU for all integer ALU functions other than
multiply and divide. Bypassing is used to support back-to-back ALU operations at the full pipeline rate, without requiring
stalls for data dependencies.
Integer Multiply/Divide Unit. This unit is separated from the primary ALU, to allow these longer latency operations
to run in parallel with other operations. The pipeline stalls only if an attempt to access the HI or LO registers is made
before the operation completes.
Floating-point ALU. This unit is responsible for all CP1/CP1X ALU operations other than DIV/SQRT. The unit is
pipelined to allow a single-cycle repeat rate for single-precision operations
Floating-point DIV/SQRT unit. This unit is separated from the other floating-point ALU, so that these long latency
operations do not prevent the issue of other floating point operations.
In addition, the RC5000 implements separate logical units to implement loads, stores, and branches.
Electrical Specifications
Operating Frequency
The input clock operates in a frequency range of 33MHz to 100MHz. The pipeline frequency for the RC5000 is 2 to
8 times the input clock (up to the maximum for the speed grade of CPU).
THERMAL CONSIDERATIONS
The RC5000 utilizes special packaging techniques, to improve the thermal properties of high-speed processors.
The RC5000 is packaged using cavity down packaging in a 223-pin PGA package with integral thermal slug, and a
272-pin BGA package. These packages effectively dissipate the power of the CPU, increasing device reliability.
3
IDT RC5000
COMMERCIAL TEMPERATURE RANGE
The RC5000 utilizes an all-aluminum package with
the die attached to a normal copper lead frame mounted
to the aluminum casing. Due to the heat-spreading effect
of the aluminum, the package allows for an efficient
thermal transfer between the die and the case. The
aluminum offers less internal resistance from one end of
the package to the other, reducing the temperature
gradient across the package and therefore presenting a
greater area for convection and conduction to the PCB for
a given temperature. Even nominal amounts of airflow will
dramatically reduce the junction temperature of the die,
resulting in cooler operation.
The RC5000 is guaranteed in a case temperature
range of 0° to +85° C. The type of package, speed
(power) of the device, and airflow conditions affect the
equivalent ambient temperature conditions that will meet
this specification.
The equivalent allowable ambient temperature, TA,
can be calculated using the thermal resistance from case
to ambient (∅CA) of the given package. The following
equation relates ambient and case temperatures:
TA = TC - P * ∅CA
DATA SHEET REVISION HISTORY
Changes to version dated January 1996:
Pin Description section:
- Corrected pin list for Clock/Control, Initialization,
and Secondary Cache interfaces.
Advance Pin-Out section:
- Changed pins AA19 and AA21 from Vcc to Vss.
Changes to version dated March 1997:
- Upgraded data sheet status from “Preliminary” to
Final.
- Added section on thermal considerations
- Added section on absolute maximum ratings
Changes to version dated June 1997:
- Revised Power Consumption and System Interface
Parameters
Changes to version dated September 1997:
- Added user notation on Boot Mode Bits 20 and 33
for 200 MHz frequency
Changes to version dated June 1998:
- Added 250 MHz; changed naming conventions
where P is the maximum power consumption at hot
temperature, calculated by using the maximum ICC specification for the device. Typical values for ∅CA at various
airflows are shown in Table 1.
∅CA
Airflow (ft/min)
0
200
400
600
800
1000
PGA
16
7
5
3
2.5
2
BGA
14
6
4
3
2.5
2
Table 1. Thermal Resistance (∅CA) at Various Airflows
Note: The RC5000 implements advanced power
management to substantially reduce the average power
dissipation of the device. This operation is described in
Reference
the IDT79RV5000 RISC Microprocessor
Manual.
4
IDT RC5000
COMMERCIAL TEMPERATURE RANGE
LOGIC SYMBOL
ScTCE*
9
SysCmd(8:0)
ScTDE*
SysCmdP
ScTOE*
ValidIn*
ScCLR*
ValidOut*
ScDCE*
ExtRqst*
ScDOE*
Release*
ScCWE*
16
RdRdy*
WrRdy*
ScLine (15:0)
ScMATCH
ScVALID
RC5000
Logic
Symbol
SysClock
VccP
6
Int (5:0)*
NMI*
VssP
Vcc
Vss
34
BigEndian
34
ModeClock
ModeIN
VccOk
ColdReset*
Initialization
Interface
Clock Interface
ScWord (1:0)
Secondary Cache Interface
2
8
Reset*
JTDI
JTDO
JTMS
JTAG
Interface
System Interface
SysADC(7:0)
64
Interrupt
Interface
SysAD(63:0)
JTCK
Figure 1. RC5000 Logic Symbol
5
IDT RC5000
COMMERCIAL TEMPERATURE RANGE
Pin Description
RC5000 implements a bus similar to that of the RC4700. Table 2 lists and describes the RC5000 signals.
Pin Name
Type
Description
System interface:
ExtRqst*
Input
Release*
Output
RdRdy*
Input
Read Ready.
Signals that an external agent can now accept a processor read.
WrRdy*
Input
Write Ready.
Signals that an external agent can now accept a processor write request.
ValidIn*
Input
Valid Input.
Signals that an external agent is now driving a valid address or data on the SysAD bus and a valid command or data identifier on the SysCmd bus.
ValidOut*
Output
External Request.
Signals that the system interface needs to submit an external request.
Release Interface.
Signals that the processor is releasing the system interface to slave state
Valid Output.
Signals that the processor is now driving a valid address or data on the SysAD bus and a valid command or data identifier on the SysCmd bus.
SysAD(63:0)
Input/Output
System Address/Data bus.
A 64-bit address and data bus for communication between the processor and an external agent.
SysADC(7:0)
Input/Output
System Address/Data check bus.
An 8-bit bus containing parity check bits for the SysAD bus during data bus cycles.
SysCmd(8:0)
Input/Output
System Command/data identifier bus.
A 9-bit bus for command and data identifier transmission between the processor and an external agent.
SysCmdP
Input/Output
Reserved System Command/data identifier bus parity.
For the RC5000, unused on input and zero on output.
Clock/control interface:
SysClock
Input
Master Clock.
Master clock input at the bus frequency. The pipeline clock is derived by multiplying this clock up.
VCCP
Input
Quiet VCC for PLL.
Quiet VCC for the internal phase locked loop.
VSSP
Input
Quiet VSS for PLL.
Quiet VSS for the internal phase locked loop.
Int(5:0)*
Input
Interrupt.
Six general processor interrupts, bit-wise ORed with bits 5:0 of the interrupt register.
NMI*
Input
Non-maskable interrupt.
Non-maskable interrupt, ORed with bit 6 of the interrupt register.
JTDI
Input
JTAG Data In.
Connected directly to JTDO. No JTAG implemented; should be pulled High.
JTCK
Input
JTAG Clock Input.
Unused input; should be pulled High.
JTDO
Output
Interrupt interface:
JTAG interface:
JTAG Data Out.
Connected directly to JTDI. If no external scan used, this is a no connect.
Table 2. RC5000 Signal Names and Descriptions (Page 1 of 2)
6
IDT RC5000
COMMERCIAL TEMPERATURE RANGE
Pin Name
Type
Description
JTMS
Input
JTAG Command.
Unused input. Should be pulled High.
VCCOk
Input
VCC is OK.
When asserted, this signal indicates to the RC5000 that the power supply has been aboveVcc minimum for more than 100 milliseconds and will remain stable. The assertion of VCCOk initiates the reading of the boot-time mode control serial stream.
ColdReset*
Input
Cold Reset.
This signal must be asserted for a power on reset or a cold reset. ColdReset must be de-asserted synchronously with SysClock.
Reset*
Input
Reset.
This signal must be asserted for any reset sequence. It may be asserted synchronously or asynchronously for a cold reset, or synchronously to initiate a warm reset. Reset must be synchronously deasserted with SysClock.
Output
Boot Mode Clock.
Serial boot-mode data clock output at the system clock frequency divided by two hundred and fifty six.
Initialization interface:
ModeClock
ModeIn
Input
Boot Mode Data In.
Serial boot-mode data input.
BigEndian
Input
Endian mode select.
Allows the system to change the processor addressing mode without rewriting the mode ROM. If endianness is to be specified by using the BigEndian pin, program mode ROM bit 8 to 0; if endianness is to
be specified by the mode ROM, ground the BigEndian pin.
Secondary cache interface:
ScCLR*
Output
Secondary Cache Block Clear.
Clears all valid bits in those Tag RAM’s which support this function.
ScCWE*(1:0)
Output
Secondary Cache Write Enable.
Asserted during writes to the secondary cache
ScDCE*(1:0)
Output
Data RAM Chip Enable.
Chip Enable for Secondary Cache Data RAM
ScDOE*
ScLine (15:0)
ScMATCH
Input
Output
Input
Data RAM Output Enable.
Asserted by the external agent to enable data onto the SysAD bus
Data RAM Output Enable.
Cache line index for secondary cache
Secondary cache Tag Match.
Asserted by Tag RAM on Secondary cache tag match
ScTCE*
Output
Secondary cache Tag RAM Chip Enable.
Chip enable for secondary cache tag RAM.
ScTDE*
Output
Secondary cache Tag RAM Data Enable.
Data Enable for Secondary Cache Tag RAM.
ScTOE*
Output
Secondary cache Tag RAM Output Enable.
Tag RAM Output enable for Secondary Cache Tag RAM’s
ScWord (1:0)
Input/Output
Secondary cache Word Index.
Determines correct double-word of Secondary cache Index
ScValid
Input/Output
Secondary cache Valid.
Always driven by the CPU except during a cache probe operation, when it is driven by the tag RAM.
Table 2. RC5000 Signal Names and Descriptions (Page 2 of 2)
7
IDT RC5000
COMMERCIAL TEMPERATURE RANGE
ABSOLUTE MAXIMUM RATINGS1
RC5000
3.3V±5%
Symbol
Rating
Commercial
Unit
VTERM
Terminal Voltage with
respect to GND
–0.5(2) to +4.6
V
TC
Operating Temperature
(case)
0 to +85
°C
TBIAS
Case Temperature
Under Bias
–55 to +125
°C
TSTG
Storage Temperature
–55 to +125
°C
IIN
DC Input Current
20(3)
mA
IOUT
DC Output Current
50(4)
mA
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. VIN minimum = –2.0V for pulse width less than 15ns. VIN should not exceed VCC +0.5 Volts.
3. When VIN < 0V or VIN > VCC.
4. Not more than one output should be shorted at a time. Duration of the short should not exceed 30 seconds.
RECOMMENDED OPERATION TEMPERATURE AND SUPPLY VOLTAGE
RC5000
Grade
Temperature
GND
VCC
Commercial
0°C to +85°C (Case)
0V
3.3V±5%
8
IDT RC5000
COMMERCIAL TEMPERATURE RANGE
AC ELECTRICAL CHARACTERISTICS
(VCC= 3.3V± 5%; Tcase = 0°C to +85°C )
Clock Parameters—RC5000
180MHz
200MHz†
250MHz†#
Parameter
Symbol
Min
Max
Min
Max
Min
Max
SysClock HIGH
tSCHIGH
3
—
3
—
2.5
—
ns
SysClock LOW
tSCLOW
3
—
3
—
2.5
—
ns
33
90
33
100
33
125
MHz
11.1
30
10
30
8
30
ns
SysClock Frequency
—
Units
SysClock Period
tSCP
SysClock Rise Time
tSCRise
—
2.5
—
2
—
2
ns
SysClock Fall Time
tSCFall
—
2.5
—
2
—
2
ns
ModeClock Period
tModeCKP
—
256
tSCP
—
256
tSCP
—
256
tSCP
ns
Capacitive Load Deration—RC5000
180MHz
200MHz†
250MHz†#
Parameter
Symbol
Test Conditions
Min
Max
Min
Max
Min
Max
Units
Load Derate
CLD
—
—
2
—
2
—
2
ns/25pF
Power Consumption—RC5000
180MHz
200MHz†
250MHz†#
Max
Max
Max
Parameter
System Condition
Icc
180/45MHz
200/50MHz
Conditions
250/62.5MHz —
Standby
120mA
120mA
120mA
CL = 50 pF
Active
1100mA
1300mA
1800mA
CL = 50pF
Pipelined writes or write re-issue
Tc = 25oC
System Interface Parameters—RC5000
180MHz
Parameter
Data Output
Symbol
tDM= Min
tDO = Max
Test Conditions
200MHz†
250MHz†#
Min
Max
Min
Max
Min
Max
Units
mode14..13 = 10 (fastest)
1.5*
7
1.5*
5
1.5*
5
ns
mode14..13 = 01 (slowest)
1.5*
11
1.5*
11
1.5*
11
ns
9
IDT RC5000
COMMERCIAL TEMPERATURE RANGE
180MHz
Parameter
Symbol
Test Conditions
tDS
Data Input
tDH
200MHz†
250MHz†#
Min
Max
Min
Max
Min
Max
Units
trise = 3ns
1.5
—
1.5
—
1.5
—
ns
tfall = 3ns
0.5
—
0.5
—
0.5
—
ns
*Guaranteed by design
Boot Time Interface Parameters—RV5000
180MHz
Parameter
200MHz†
250MHz†#
Symbol
Test Conditions
Min
Max
Min
Max
Min
Max
Mode Data Setup
tDS
—
4
—
4
—
4
—
Master Clock Cycle
Mode Data Hold
tDH
—
0
—
0
—
0
—
Master Clock Cycle
Units
† Boot Mode Bits 20 and 33 must be set to “1” for operation at this frequency.
# Preliminary information for 250MHz.
10
IDT RC5000
COMMERCIAL TEMPERATURE RANGE
DC ELECTRICAL CHARACTERISTICS
(Vcc = 3.3V± 5%; Tcase = 0°C to +85°C)
180MHz
Parameter
Min
Max
200MHz†
Min
Max
250MHz†#
Min
Max
VOL
—
0.1V
—
0.1V
—
0.1V
VOH
VCC
—
VCC
—
VCC
—
- 0.1V
- 0.1V
Conditions
|IOUT|= 20uA
- 0.1V
VOL
—
0.4V
—
0.4V
—
0.4V
|IOUT|= 4mA
VOH
2.4V
—
2.4V
—
2.4V
—
VIL
–0.5V
0.2VCC
–0.5V
0.2VCC
–0.5V
0.2VCC
—
VIH
0.7VCC
VCC +
0.5V
0.7VCC
VCC + 0.5V
0.7VCC
VCC + 0.5V
—
IIN
—
±10uA
—
±10uA
—
±10uA
CIN
—
10pF
—
10pF
—
10pF
—
CIO
—
10pF
—
10pF
—
10pF
—
Cclk
—
10pF
—
10pF
—
10pF
I/OLEAK
—
20uA
—
20uA
—
20uA
0 ≤ VIN ≤ VCC
Input/Output Leakage
† Boot Mode Bits 20 and 33 must be set to “1” for operation at this frequency.
# Preliminary information for 250MHz.
11
IDT RC5000
COMMERCIAL TEMPERATURE RANGE
PHYSICAL SPECIFICATIONS
The RC5000 is available in two packages, the 223-pin CPGA and the 272-ball SBGA. Information on the CPGA
package is shown in Figure 2 and Table 3; information on the SBGA package is shown in Figure 3 and Table 4.
V
U
T
R
P
N
M
L
K
223-Pin CPGA
J
H
G
F
E
D
C
B
A
1
2
3
4
5
Figure 2.
6
7
8
9 10 11 12 13 14 15 16 17 18
RC5000 CPGA Pin Orientation (Bottom View)
12
IDT RC5000
COMMERCIAL TEMPERATURE RANGE
223-Pin CPGA Pinout
Pkg
Pin
Function
Pkg
Pin
Function
Pkg
Pin
Function
Pkg
Pin
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
B18
C1
C2
C3
C4
Vcc
Vss
Vcc
Vss
Vss
Vcc
Vss
Vcc
Vss
Vcc
Vss
Vcc
Vss
Vss
Vcc
Vss
Vss
Vss
Vss
Vcc
SysADC[4]
SysADC[0]
SysAD[18]
SysAD[20]
SysAD[54]
SysAD[26]
SysAD[58]
SysAD[30]
SysAD[46]
SysAD[12]
SysAD[40]
SysAD[6]
Vss
Vcc
Vcc
Vcc
Vcc
ValidOut*
NMI*
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
C16
C17
C18
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
D16
D17
D18
E1
E2
E3
E4
E15
E16
E17
SysADC[6]
SysAD[16]
SysAD[50]
SysAD[22]
SysAD[24]
SysAD[28]
SysAD[62]
SysAD[44]
SysAD[10]
SysAD[38]
SysAD[4]
SysAD[34]
SysAD[2]
Vss
Vss
INT3*
INT5*
Release*
Vcc
SysADC[2]
SysAD[48]
SysAD[52]
SysAD[56]
SysAD[60]
SysAD[14]
SysAD[42]
SysAD[8]
SysAD[36]
ColdReset*
SysAD[0]
ScTOE*
Vcc
Vss
INT[0]*
INT[2]*
INT[4]*
SysAD[32]
ScDCE[1]*
ScCWE[1]*
E18
F1
F2
F3
F4
F15
F16
F17
F18
G1
G2
G3
G4
G15
G16
G17
G18
H1
H2
H3
H4
H15
H16
H17
H18
J1
J2
J3
J4
J15
J16
J17
J18
K1
K2
K3
K4
K15
K16
Vcc
K17
Vcc
K18
Reserved
L1
ScValid
L2
INT[1]*
L3
ScDCE[0]* L4
ScCWE[0]* L15
ScTDE*
L16
Vss
L17
Vss
L18
Reserved
M1
Reserved
M2
Reserved
M3
ScCLR*
M4
ScTCE*
M15
ModeIn
M16
Vcc
M17
Vcc
M18
Reserved
N1
Reserved
N2
Reserved
N3
VccOK
N4
ModeClock N15
SysClock
N16
Vss
N17
Vss
N18
WrRdy*
P1
ValidIn*
P2
ExtReq*
P3
JTDO
P4
JTDI
P15
JTCK
P16
Vcc
P17
Vcc
P18
ScMatch
R1
RdRdy*
R2
ScDOE*
R3
JTMS
R4
VccP
R5
Function
Pkg
Pin
Function
VssP
Vss
Vss
SysCmd[8]
SysCmd[7]
SysCmd[5]
ScLine[12]
ScLine[14]
ScLine[15]
Vcc
Vcc
SysCmd[6]
SysCmd[4]
SysCmd[1]
ScLine[8]
ScLine[10]
ScLine[13]
Vss
Vss
SysCmd[3]
SysCmd[2]
SysADC[7]
ScLine[5]
ScLine[7]
ScLine[11]
Vcc
Vcc
SysCmd[0]
SysCmdP
SysADC[1]
ScLine[2]
ScLine[4]
ScLine[9]
Vss
Vcc
SysADC[5]
SysADC[3]
BigEndian
SysAD[49]
R6
R7
R8
R9
R10
R11
R12
R13
R14
R15
R16
R17
R18
T1
T2
T3
T4
T5
T6
T7
T8
T9
T10
T11
T12
T13
T14
T15
T16
T17
T18
U1
U2
U3
U4
U5
U6
U7
U8
SysAD[51]
SysAD[55]
SysAD[27]
SysAD[31]
SysAD[43]
SysAD[39]
SysAD[35]
SysAD[1]
ScWord[1]
ScLine[0]
ScLine[3]
ScLine[6]
Vss
Vss
SysAD[15]
SysAD[47]
SysAD[17]
SysAD[19]
SysAD[23]
SysAD[57]
SysAD[29]
Vcc
SysAD[45]
SysAD[41]
SysAD[7]
SysAD[5]
SysAD[33]
Reset*
ScLine[1]
Vcc
Vcc
Vcc
Vcc
Vss
SysAD[21]
SysAD[53]
SysAD[25]
SysAD[59]
SysAD[61]
Pkg
Pin
Function
U9
U10
U11
U12
U13
U14
U15
U16
U17
U18
V1
V2
V3
V4
V5
V6
V7
V8
V9
V10
V11
V12
V13
V14
V15
V16
V17
V18
SysAD[63]
SysAD[13]
SysAD[11]
SysAD[9]
SysAD[37]
SysAD[3]
ScWord[0]
Vcc
Vss
Vss
Vss
Vss
Vcc
Vss
Vss
Vcc
Vss
Vcc
Vss
Vcc
Vss
Vcc
Vss
Vcc
Vss
Vss
Vcc
Vss
Table 3. 223-Pin CPGA Pinout
13
IDT RC5000
COMMERCIAL TEMPERATURE RANGE
21 20 19 18 17 16 15 14 13 12 11 10 9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
272-Ball SBGA
L
M
N
P
R
T
U
V
W
Y
AA
Figure 3. Ball Grid Array Package (Bottom View)
14
IDT RC5000
COMMERCIAL TEMPERATURE RANGE
272-Ball SBGA Pinout
Pkg
Pin
Function
Pkg
Pin
Function
Pkg
Pin
Function
Pkg
Pin
Function
Pkg
Pin
Function
AA1
AA2
AA3
AA4
AA5
AA6
AA7
AA8
AA9
AA10
AA11
AA12
AA13
AA14
AA15
AA16
AA17
AA18
AA19
AA20
AA21
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
B1
B2
B3
B4
Vss
Vcc
Vss
ValidOut*
Vss
Int*0
Vss
Reserved
Vss
WrRdy*
Vss
ScMatch
Vss
SysCmd6
Vss
SysCmd2
Vss
SysADC3
Vss
Vcc
Vss
Vss
Vcc
Vss
SysAD32
Vss
ScCWE*1
Vss
VCCOK
Vss
MasterClk
Vss
ScLine15
Vss
ScLine12
Vss
ScLine7
Vss
ScLine2
Vss
Vcc
Vss
Vcc
Vcc
Vcc
SysAD2
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
B21
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C20
C21
D1
D2
D3
D4
D5
D6
D7
D8
SysAD0
ScTOE*
ScCLR*
ScTDE*
ModeClock
JTDI
JTCK
N/C
ScLine14
ScLine10
ScLine9
ScLine6
ScLine3
ScLine1
Vcc
Vcc
Vcc
Vss
Vcc
ColdReset*
SysAD34
ScDCE*1
ScDCE*0
ScCWE*0
ScTCE*
ModeIn
JTDO
Vssp
JTMS
ScLine13
ScLine11
ScLine8
ScLine5
ScLine4
ScLine0
Reset*
Vcc
Vss
Vcc
Vcc
Vcc
Vss
Vcc
Vss
Vcc
Vcc
D9
D10
D11
D12
D13
D14
D15
D16
D17
D18
D19
D20
D21
E1
E2
E3
E4
E18
E19
E20
E21
F1
F2
F3
F4
F18
F19
F20
F21
G1
G2
G3
G4
G18
G19
G20
G21
H1
H2
H3
H4
H18
H19
H20
H21
J1
Vss
Vcc
Vccp
Vcc
Vss
Vcc
Vcc
Vss
Vcc
Vss
Vcc
Vcc
Vcc
Vss
SysAD36
SysAD4
Vcc
Vcc
ScWord1
ScWord0
Vss
SysAD8
SysAD38
SysAD6
Vss
Vss
SysAD1
SysAD33
SysAD3
Vss
SysAD10
SysAD40
Vcc
Vcc
SysAD35
SysAD5
Vss
SysAD42
SysAD44
SysAD12
Vcc
Vcc
SysAD7
SysAD39
SysAD37
Vss
J2
J3
J4
J18
J19
J20
J21
K1
K2
K3
K4
K18
K19
K20
K21
L1
L2
L3
L4
L18
L19
L20
L21
M1
M2
M3
M4
M18
M19
M20
M21
N1
N2
N3
N4
N18
N19
N20
N21
P1
P2
P3
P4
P18
P19
P20
SysAD46
SysAD14
Vss
Vss
SysAD9
SysAD41
Vss
SysAD60
SysAD30
SysAD62
Vcc
Vcc
SysAD11
SysAD43
SysAD13
Vss
SysAD58
SysAD28
Vcc
Vcc
SysAD45
SysAD63
Vss
SysAD26
SysAD56
SysAD24
Vcc
Vcc
SysAD29
SysAd61
SysAD31
Vss
SysAD54
SysAD22
Vss
Vss
SysAD27
SysAD59
Vss
SysAD50
SysAD52
SysAD20
Vcc
Vcc
SysAD25
SysAD57
P21
R1
R2
R3
R4
R18
R19
R20
R21
T1
T2
T3
T4
T18
T19
T20
T21
U1
U2
U3
U4
U18
U19
U20
U21
V1
V2
V3
V4
V5
V6
V7
V8
V9
V10
V11
V12
V13
V14
V15
V16
V17
V18
V19
V20
V21
SysAD55
Vss
SysAD18
SysAD48
Vcc
Vcc
SysAD53
SysAD23
Vss
SysAD16
SysADC0
SysADC2
Vss
Vss
SysAD19
SysAD51
SysAD21
Vss
SysADC4
SysADC6
Vcc
Vcc
SysAD17
SysAD49
Vss
Vcc
Vcc
Vcc
Vss
NMI*
Vss
Vcc
Vcc
Vss
Vcc
Vcc
Vcc
Vss
Vcc
Vcc
Vss
Vcc
Vss
Vcc
Vcc
Vcc
Pkg
Pin
Function
W1
W2
W3
W4
W5
W6
W7
W8
W9
W10
W11
W12
W13
W14
W15
W16
W17
W18
W19
W20
W21
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
Y10
Y11
Y12
Y13
Y14
Y15
Y16
Y17
Y18
Y19
Y20
Y21
Vss
Vcc
Vcc
Vcc
Int*5
Int*4
Int*1
Reserved
Reserved
Reserved
ValidIn*
ScDOE*
SysCmd7
SysCmd4
SysCmd1
SysADC7
SysADC5
SysAD47
BigEndian
Vcc
Vss
Vcc
Vcc
Vcc
Release*
Int*3
Int*2
ScValid
Reserved
Reserved
Reserved
ExtRqst*
RdRdy*
SysCmd8
SysCmd5
SysCmd3
SysCmd0
SysCmdP
SysADC1
SysAD15
Vcc
Vcc
Table 4. 272-Ball SBGA Pinout
15
IDT RC5000
COMMERCIAL TEMPERATURE RANGE
ORDERING INFORMATION
IDT79
YY
Operating
Voltage
XXXX
999
Device
Type
Speed
A
Package
A
Temp range/
Process
Blank Commercial
(0°C to +85°C Case)
G
BS
223-pin CPGA
272-pin SBGA
180
200
250
180 MHz PClk
200 MHz PClk
250 MHz PClk
5000 Multi-Issue
64-bit Microprocessor
RV
3.3+/-5%
VALID COMBINATIONS
IDT79RV5000 - 180, 200MHz
G
IDT79RV5000 - 180, 200, 250MHz BS
CPGA package
SBGA package
Integrated Device Technology, Inc. reserves the right to make changes to the specifications in this data sheet in order to improve design or performance and to supply the best possible product.
Integrated Device Technology, Inc.
2975 Stender Way, Santa Clara, CA 95054-3090
Telephone: (408) 727-6116
FAX 408-492-8674
16