CSP Array 3X3 MR16 Application Legal and additional information. About Samsung Electronics Co., Ltd. Samsung Electronics Co., Ltd. inspires the world and shapes the future with transformative ideas and technologies, redefining the worlds of TVs, smartphones, wearable devices, tablets, cameras, digital appliances, printers, medical equipment, network systems and semiconductors. We are also leading in the Internet of Things space through, among others, our Digital Health and Smart Home initiatives. We employ 307,000 people across 84 countries. To discover more, please visit our official website at www.samsung.com and our official blog at global.samsungtomorrow.com. CSP Array 2X2 Candle Application CSP 6V Bulb Application Copyright © 2015 Samsung Electronics Co., Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. Specifications and designs are subject to change without notice. Non-metric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged. Samsung Electronics Co., Ltd. 95, Samsung 2-ro Giheung-gu Yongin-si, Gyeonggi-do, 446-711 KOREA www.samsungled.com Samsung Chip scale package (CSP) LEDs Significantly scale down the size that allows for more flexible and compact designs Added value provided with the advanced chip scale packaging technology LM101A CRI Min. Compact form factor for design flexibility • 1 W class mid power LED • LM80 (6000hrs) : Nov. 2015 • Compact footprint: 1.18 × 1.18 ㎟ Low Thermal Resistance 1.18 Anode 1.18 0.25 (Top Phosphor) 80 0.70 0.30 Small Form Factor 70% Flip-chip CSP Epi-up lead frame package 30% 0.82 Cathode 0.17 Circuit board Current Better lm/W at high current CRI Min. • LM80 (6000hrs) : Jun. 2016 High Reliability • Compact footprint: 1.34 × 1.34 ㎟ 0.223 Simple structure: no wire, no silver reflector Easy to design optics • Suitable design for omni directional bulb applications • 0.98 1.34 Low FIT & No sulfurization 0.246 0.20 0.17 80 Anode 0.98 0.278 140∘Wide 0.25 (Top Phosphor) 0.278 1.34 120∘ Phosphor Wall CRI Min. • 1W class mid power LED with white side wall • Film on Chip structure • Compact footprint: 1.42 x 1.42 ㎟ 0.30 Anode SCS8WT78EPL1W0S06E SCS8VT78EPL1V0S06E 3500 52 68 4000 56 72 5000 58 74 SCS8UT78EPL1U0S06E 150 SCS8TT78EPL1T0S06E SCS8RT78EPL1R0S06E 5700 53 69 SCS8QT78EPL1Q0S06E 6500 52 68 SCS8PT78EPL1P0S06E CCT (K) Luminous Flux (lm) Typ. IF (mA) Part Number 2700 102 SCS8WT93HPL2W0S0XX 3000 106 SCS8VT93HPL2V0S0XX 3500 109 4000 116 SCS8UT93HPL2U0S0XX 150 (5.9V) SCS8TT93HPL2T0S0XX 5000 119 SCS8RT93HPL2R0S0XX 5700 116 SCS8QT93HPL2Q0S0XX 6500 112 SCS8PT93HPL2P0S0XX CCT (K) Luminous Flux (lm) IF (mA) Part Number Min. Max. 2700 82 106 SCS8WT78EFL1W08ECK 3000 86 110 SCS8VT78EFL1V09FCK 300 94 118 98 122 SCS8RT78EFL1R0CICK 6500 94 118 SCS8PT78EFL1P0BHCK 0.82 4000 5000 SCS8TT78EFL1T0BHCK ※ Bin option is available, please refer to data sheet for more details. LH141A CRI Min. Samsung flip chip provides optimized solution for torch / flash light 68 • Film on Chip structure • Compact footprint: 1.46 x 1.46 ㎟ 1.08 Anode 0.39 1.20 1.20 Cathode 0.39 0.17 Anode Mark 0.30 1.46 0.13 0.07 (Top Phosphor) Luminous Flux (lm) Min. Typ. 110 135 6000 110 131 7600 110 124 IF (mA) Part Number SCS6RTB6EFL1R0FZ6K 350 SCS6JTB6EFL1J0FZ6K SCS6NTB6EFL1N0FZ6K ※ Bin option is available, please refer to data sheet for more details. Bulb, Candle, MR16, PAR, Spot light 1.46 CCT (K) 5000 • 2 W class high power LED • Plastic-free structure delivers low thermal resistance Applications 65 67 0.30 1.42 5000K 0.70 Cathode 0.17 3X3 Block Customizable array arrangement • Greater freedom of design • One time certification • Faster time-to-market cycle • Low inventory burden 80 0.82 Anode Mark 0.20 0.10 (Top Phosphor) 0.25 1.42 2700K • 49 51 LM131A CCT Tunability 2X2 Block 2700 [Under development] Superior Design Flexibility 1X1 Block Part Number ※ Bin option is available, please refer to data sheet for more details. Compact form factor for design flexibility Building Block IF (mA) LM102A • 6V, 1W class mid power LED CSP Max. ※ Bin option is available, please refer to data sheet for more details. Compact form factor for design flexibility Wide Beam Angle Min. 3000 Flip-chip CSP Epi-up lead frame package Rth(K/W) Luminous Flux (lm) 0.30 LES 0.20 1.18 lm/W CCT (K)