Tech Note

Vishay Semiconductors
The Constituents of Semiconductor Components
Responsible electronic component and equipment
manufacturers are already preparing for the time when
the lifespan of their products comes to an end by
scrutinizing the materials incorporated and their future
recyclability. Recycling laws have already come into
force in Germany (“Kreislauf-Wirtschaftsgesetz”) and
guidelines for electronic scrap are in preparation.
The aim is a suitable waste disposal program
and * as a preventative measure * a reduction in
the content of hazardous damaging materials in such
components. In order to conform to this procedure,
detailed information about the materials and their
quantities is needed.
This overview answers questions put forward by
customers as to the constituents and their function in
the most important of Vishay Semiconductor’s
semiconductor products. Special significance is given
to so-called “Hazardous Substances”. It demonstrates
that Vishay Semiconductor products under normal
operating conditions do not expose the applier or
environment to any hazard. However, most products
nevertheless contain small but necessary quantities of
“Hazardous Substances” which can * if not treated
correctly or through accidents * be released on a
small scale into the environment.
The present information was produced with the
greatest possible care. Any suggestions for
improvement of this brochure are welcome.
Definitions
Vishay Semiconductor offers a wide range of
semiconductor components including transistors,
diodes and opto-electronic components. These have
been manufactured in various standard packages.
On the following pages, these packages are listed
together with their materials shown in weight
percentages. In order to limit the number of tables, all
components whose structure and composition are the
same have been compiled in families. In many cases,
different lead frames together with chips of different
sizes may be used for the one package. This usually
means that there may be slight differences in the
quantities of the declared material. The weight percent
is, however, valid for a representative sample of the
relevant family. In order to sensibly reduce the number
and quantities of materials contained in the respective
components, quantities smaller than 0.1% by weight
have been stated in the following list as traces. This
is the case unless lower limits are forced by law, e.g.
cadmium < 75 ppm and PCDD as well as PCDF
(known as dioxin) < 2 ppb. In the lists themselves,
details of content and composition are separated into
Document Number 80110
02-02
the individual parts of the semiconductor component.
The most important of these are:
Active element: The active element is either a silicon
chip or for optoelectronic components a chip
containing combinations of Ga (Al) (As, P). These are
doped with very small amounts of boron, arsenic,
phosphorus, zinc and germanium etc. The
metallisation consists of thin layers of aluminium, gold
or titanium. The chips are generally bonded to the lead
frame with a silver epoxy and have gold or aluminium
wires bonded to the lead frame.
Lead frame: For electrical connection, a metal lead
frame made from alloys such as FeNi (42) or CuFe (2)
and partly or totally plated with silver is commonly
used. The metal alloys contain traces of silver, zinc
and phosphorus. Part of the lead frame is also coated
with tin/ lead.
Case: The semiconductor chip is protected from the
environment by a case of glass, plastic or metal.
The glass is composed of oxides of silicon and lead
together with boron and aluminium.
Plastic cases are composed of an epoxy resin filled
with up to 70% by weight of quartz particles. Antimony
trioxide and brominated epoxy resin (no TBA) are
added as flame retardents. Antimony and bromine
amount to about 1.6 and 1.0% respectively.
In use: In use, it is the content of hazardous
substances which is of importance. In Germany, there
are a series of lists which give the materials which are
potentially hazardous to people and the environment,
for example:
Appendix II and IV of the “Hazardous Materials
Regulations”, the TRGS 900 (“MAK-Wert-Liste”) and
the “Catalog of Materials Hazardous to the Water
Supply”. These lists, however, are only partially
consistent.
The names used are often different for materials with
the same chemical composition. Furthermore, the use
of trivial and trade names often adds to the confusion.
Vishay Semiconductor therefore for their descriptions
use those proposed by the Zentralverband Elektrotechnik und Elektronikindustrie e.V. (ZVEI; Central
Association of Electrical Engineering and Electronic
Industry) for the harmonization of the nomenclature of
hazardous substances.
Statements are made on the safety precautions to be
used during storage and disposal by mechanical,
chemical and thermal means of the more important
chemicals (so-called “Leitchemikalien”). These are
listed in the tables in the order of their potential risk.
Their effect upon people and the environment are also
listed and any special precautions emphasized.
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1
Vishay Semiconductors
Notes: The following information has been prepared
to be as exact and reliable as possible.
The
manufacture
of
semiconductor
components is, however, subject to regular
change without special notification.
The publication of this brochure excludes any
responsibility resulting from its use.
Explanation of Abbreviations 1
While the information on weight percent is believed
correct, discrepancies depending upon component
type may be possible.
1)
Material information etc. Material listed as
“Material Hazardous in Production”
2)
S: Trace material < 0.1% by weight;
Cd < 75 ppm; concerning Cd see ***)
PCDD and PCDF < 2 ppb
*)
Dioxin content – lies below agreed limits
**)
No. 85 “Rules for Hazardous Materials”, to be
replaced as soon as a technically suitable
alternative material is available
***)
Traces of cadmium can only be found in lead
frames made of copper
CMT: Material containing carcinogens, mutagens or
terratogens
Tox:
Material is toxic or very toxic
S
Material with allergy producing characteristics
HAL Halogen containing material
WKG Material hazardous to the water supply
L
Storage, suitable for disposal
D
Disposable
M
Mechanical disposal
N
Chemical disposal
T
Thermal disposal
H
Handling
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Ozone Depleting Substances2
The use of Ozone Depleting Substances has been totally eliminated by Vishay Semiconductor and by doing
so meets the legal requirements as defined in the following documents.
1. The “Montreal Protocol” together with the “London
Amendments” Appendix A, B, and the “List of
Transitional Substances”
2. “Clean
Air
Act”,
Amendments
1990,
“Environmental Protection Agency” (EPA), USA,
Class I and II – Ozone Depleting Substances
3. “European
Council
Resolution”
number
88/540/EEC and 91/690/eec Appendix A, B and C
(Transitional Substances)
Vishay Semiconductor guarantees that its components do not contain and are manufactured without the
use of Ozone Depleting Substances.
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Vishay Semiconductors
The Constituents of Package Forms
Package form 22:
Epoxy resin (55.0%)
50% resin
50% hardener
Lead frame (44.7%)
96% copper
2% iron
2% silver
Traces of
Ni, Ag, Zn, P, Cd ***)
Silver epoxy (< 0.1%)
80% silver
10% resin
10% hardener
Traces of Cl, Na, K
Total weight 130 mg
IR chip (< 0.1%)
50.0%gallium
50.0%arsenic
Traces of
Al, Au, Zn, Ge, Ti
Detector chip (< 0.1%)
99.9%silicon
Traces of
Ag, Al, Au, Sb, Ti, SiO2
Bond wire (< 0.1%)
99.99%
gold
Traces of BE, Mg
Significant Materials for Disposal
No. Material and/or Group 1)
1
C
M
T
T
O
X
S
Lead and lead compounds
H
A
L
W Available
G in the Compound
K Used for
Lead plating
Part in 2)
Weight
Percent L D M N T H
0.1
Package form 23:
Epoxy resin (31.1%)
47.0%resin
50.0%hardener
3.0% filter color
Mold (20.1%)
70.0%PBTP
30.0%glass fiber
Lead frame (48.8%)
98.8%copper
1.2% iron
Traces of
Ni, Ag, Zn, P, Cd ***)
95 10530
Total weight 150 mg
Bond wire (< 0.1%)
99.99%
gold
Emitter chip (< 0.1%)
50.0%gallium
50.0%arsenic and
phosphorus
Traces of
Al, Au, Zn, Ge, Si3N4
Detector chip (< 0.1%)
99.0%silicon
Traces of Al, SiO2,
Si3N4
Silver epoxy (< 0.1%)
80% silver
10% resin
10% hardener
Traces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group
1
Note:
Arsenic
*), **), ***), 1), 2),
Document Number 80110
02-02
1)
C
M
T
T
O
X S
H W Available
A G in the Compound
L K Used for
Chip
Part in 2)
Weight
Percent L D M N T H
Traces
CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
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Vishay Semiconductors
Package form 24:
Type
Weight/ mg
TCSS1100/TCST1000/TCST1x0x
TCSS2100/TCST2000/TCST2x0x
TCST1030
TCST1210
TCST1230
TCST5123
TCST5250
800
900
250
500
280
395
640
IR emitting diode
IR photodetector
Epoxy resin (55.0%)
55.5%resin
45.5%hardener
Epoxy resin (54.0%)
55.5%resin
45.5%hardener
Lead frame (44.7%)
98.8%copper
1.2% iron
Traces of
Ni, Ag, Zn, P, Cd ***)
Emitter chip (< 0.1%)
50.0%gallium
50.0%arsenic and
phosphorus
Traces of
Al, Au, Zn, Ge, Si3N4
Silver epoxy (< 0.1%)
80% silver
10% resin
10% hardener
Traces of Cl, Na, K
Lead frame (45.7%)
98.8%copper
1.2% iron
Traces of
Ni, Ag, Zn, P, Cd ***)
Detector chip (< 0.1%)
50.0%silicon
Traces of SiO2, Al,
Al3N4
Silver epoxy (< 0.1%)
80% silver
10% resin
10% hardener
Traces of Cl, Na, K
Bond wire (< 0.1%)
99.99%
gold
Housing
100% Polycarbonate
Bond wire (< 0.1%)
99.99% gold
Significant Materials for Disposal
No. Material and/or Group 1)
1
Note:
Arsenic
*), **), ***), 1), 2),
Document Number 80110
02-02
C
M
T
T
O
X S
H W Available
A G in the Compound
L K Used for
Chip
Part in 2)
Weight
Percent L D M N T H
Traces
CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
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Vishay Semiconductors
Package form 25:
Housing
100% Polycarbonate
95 10755
95 10756
TCYS5201
Total weight 1100 mg
TCYS6201
Total weight 2700 mg
Connector (10%)
40%
polyamid
59%
copper
1%
SnPb (60/40)
IR emitting diode
Epoxy resin (34.5%)
50.0% resin
50.0% hardener
Traces of N, Fe, C, Cl
Lead frame (65.2%)
98.8%
copper
1.2%
iron
Traces of
Ni, Ag, Zn, P, Cd ***)
IR emitting diode
(0.2%)
50.0%gallium
50.0%arsenic and
phosphorus
Traces of
Al, Au, Zn, Ge, Si3N4
Silver epoxy (< 0.1%)
80% silver
10% resin
10% hardener
Traces of Cl, Na, K
PWB (20%)
53.9%
glass
41% Epoxy resin
(50% hardener
50% resin)
5.1%
copper
>0.1%
PVC
(Solder Resist)_
IR photodetector
Epoxy resin (29%)
50.0%
resin
50.0%
hardener
Traces of Fe, C, Cl
Lead frame (70.7%)
89.0%iron
4.1%
copper
2.4%
silver
4.5%
SnPb
Traces of Ni, Zn, P
Bond wire (< 0.1%)
99.99%
gold
Traces of Be, Mg
IR Photodetector (<
0.1%)
99.0%silicon
Traces of
Ag, Al, Au, Sb, Ti, SiO2
Silver epoxy (< 0.1%)
80.0%silver
10.0%resin
10.0%hardener
Traces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group
1
2
Note:
1)
Arsenic
Lead and - compounds
*), **), ***), 1), 2),
Document Number 80110
02-02
C
M
T
T
O
X S
H W Available
A G in the Compound
L K Used for
Chip
Lead frame
Part in 2)
Weight
Percent L D M N T H
Traces
0.4
CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
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Vishay Semiconductors
Package form 26:
Epoxy resin (31.1%)
47.0%resin
50.0%hardener
3.0% filter color
Mold (20.1%)
70.0%PBTP
30.0%glass fiber
Lead frame (48.8%)
98.8%copper
1.2% iron
Traces of
Ni, Ag, Zn, P, Cd ***)
94 9318
Total weight 150 mg
Bond wire (< 0.1%)
99.99%
gold
Emitter chip (< 0.1%)
50.0%gallium
50.0%arsenic and
phosphorus
Traces of
Al, Au, Zn, Ge, Si3N4
Detector chip (< 0.1%)
99.0%silicon
Traces of Al, SiO2,
Si3N4
Silver epoxy (< 0.1%)
80% silver
10% resin
10% hardener
Traces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group
1
Note:
Arsenic
*), **), ***), 1), 2),
Document Number 80110
02-02
1)
C
M
T
T
O
X S
H W Available
A G in the Compound
L K Used for
Chip
Part in 2)
Weight
Percent L D M N T H
Traces
CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
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Vishay Semiconductors
Package form 27:
Housing
100% Polycarbonate
IR emitting diode
Epoxy resin (34.5%)
50.0% resin
50.0% hardener
Traces of N, Fe, C, Cl
Lead frame (65.2%)
98.8%copper
1.2% iron
Traces of
Ni, Ag, Zn, P, Cd ***)
IR emitting diode
(0.2%)
50.0%gallium
50.0%arsenic and
phosphorus
Traces of
Al, Au, Zn, Ge, Si3N4
Silver epoxy (< 0.1%)
80% silver
10% resin
10% hardener
Traces of Cl, Na, K
94 9442
Total weight 230 mg
IR photodetector
Epoxy resin (29%)
50.0%resin
50.0%hardener
Traces of Fe, C, Cl
Lead frame (70.7%)
89.0%iron
4.1% copper
2.4% silver
4.5% SnPb
Traces of Ni, Zn, P
Bond wire (< 0.1%)
99.99%
gold
Traces of Be, Mg
IR Photodetector (<
0.1%)
99.0%silicon
Traces of
Ag, Al, Au, Sb, Ti, SiO2
Silver epoxy (< 0.1%)
80.0%silver
10.0%resin
10.0%hardener
Traces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group
1
2
Note:
1)
Arsenic
Lead and - compounds
*), **), ***), 1), 2),
Document Number 80110
02-02
C
M
T
T
O
X S
H W Available
A G in the Compound
L K Used for
Chip
Lead frame
Part in 2)
Weight
Percent L D M N T H
Traces
0.4
CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
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Vishay Semiconductors
Package form 28:
Housing
100% Polycarbonate
IR emitting diode
Epoxy resin (34.5%)
50.0% resin
50.0% hardener
Traces of N, Fe, C, Cl
Lead frame (65.2%)
98.8%copper
1.2% iron
Traces of
Ni, Ag, Zn, P, Cd ***)
IR emitting diode
(0.2%)
50.0%gallium
50.0%arsenic and
phosphorus
Traces of
Al, Au, Zn, Ge, Si3N4
Silver epoxy (< 0.1%)
80% silver
10% resin
10% hardener
Traces of Cl, Na, K
94 9320
CNY70
Total weight 700 mg
IR photodetector
Epoxy resin (29%)
50.0%resin
50.0%hardener
Traces of Fe, C, Cl
Lead frame (70.7%)
89.0%iron
4.1% copper
2.4% silver
4.5% SnPb
Traces of Ni, Zn, P
Bond wire (< 0.1%)
99.99%
gold
Traces of Be, Mg
IR Photodetector (<
0.1%)
99.0%silicon
Traces of
Ag, Al, Au, Sb, Ti, SiO2
Silver epoxy (< 0.1%)
80.0%silver
10.0%resin
10.0%hardener
Traces of Cl, Na, K
Significant Materials for Disposal
No. Material and/or Group
1
2
Note:
1)
Arsenic
Lead and - compounds
*), **), ***), 1), 2),
Document Number 80110
02-02
C
M
T
T
O
X S
H W Available
A G in the Compound
L K Used for
Chip
Lead frame
Part in 2)
Weight
Percent L D M N T H
Traces
0.4
CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
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Vishay Semiconductors
Package form 29:
14848
14849
TCPT1200
Total weight 150 mg
TCUT1200
Total weight 150 mg
Molding Compound
(77.6%)
71.4% SiO2
26% Epoxy resin
1.6% Sb
(as antimony trioxide)
Traces of
N,Fe,C,CI ***)
Lead frame (65.2%)
58% copper
42% nickel
Traces of
Ag, Zn, P, Cd ***)
Emitter – Chip
(<0.1%)
50.0%gallium
50.0%arsenic and
phosphorus
Traces of
Al, Au, Zn, Ge, Si3N4
Bond wire (< 0.1%)
99.99%
gold
Detector–Chip (< 0.1%)
99.0%silicon
Traces of
Al, Al3, N4, SiO2
Silver epoxy (< 0.1%)
78.0%silver
11.0%resin
11.0%hardener
Significant Materials for Disposal
No. Material and/or Group
1
2
Note:
1)
Halide compounds
Antimony and - compounds
*), **), ***), 1), 2),
Document Number 80110
02-02
C T
M O
T X S
H W Available
A G in the Compound
L K Used for
Mold
Mold
Part in 2)
Weight
Percent L D M N T H
0.6
1.0
CMT, T etc.: see ‘Explanation of Abbreviations’, page 2
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