CT RODU P UCT E T E L PROD E T OBSO U IT BST LE S U L322 2 OSSIB IC P Data Sheet ® ICL3310 July 2004 FN4995.3 +3V to +5.5V, 1 Microamp, 250kbps, RS-232 Transmitter/Receiver Features The Intersil ICL3310 contains 3.0V to 5.5V powered RS-232 transmitters/receivers which meet ElA/TIA-232 and V.28/V.24 specifications, even at VCC = 3.0V. Targeted applications are PDAs, Palmtops, and notebook and laptop computers where the low operational, and even lower standby, power consumption is critical. Efficient on-chip charge pumps, coupled with a manual powerdown function reduces the standby supply current to a 1µA trickle. Small footprint packaging, and the use of small, low value capacitors ensure board space savings as well. Data rates greater than 250kbps are guaranteed at worst case load conditions. This device is fully compatible with 3.3V only systems, mixed 3.3V and 5.0V systems, and 5.0V only systems. • Low Power, Pin Compatible Upgrade for 5V MAX222, SP310A, and LT1X80/A The single pin powerdown function (SHDN = 0) disables all the transmitters and receivers, while shutting down the charge pump to minimize supply current drain. • Wide Power Supply Range . . . . . . . Single +3V to +5.5V Table 1 summarizes the features of the ICL3310, while Application Note AN9863 summarizes the features of each device comprising the ICL32XX 3V family. Applications • ±15kV ESD Protected (Human Body Model) Pinout ICL3310 (SOIC) TOP VIEW • Single SHDN Pin Disables Transmitters and Receivers • Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V • Latch-Up Free • On-Chip Voltage Converters Require Only Four External 0.1µF Capacitors • Receiver Hysteresis For Improved Noise Immunity • Very Low Supply Current . . . . . . . . . . . . . . . . . . . . 0.3mA • Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps • Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/µs • Low Supply Current in Powerdown State. . . . . . . . . .<1µA • Any System Requiring RS-232 Communication Ports - Battery Powered, Hand-Held, and Portable Equipment - Laptop Computers, Notebooks, Palmtops - Modems, Printers and other Peripherals - Digital Cameras - Cellular/Mobile Phones 18 SHDN NC 1 C1+ 2 17 VCC Related Literature 3 16 GND • Technical Brief TB363 “Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)” V+ C1- 4 15 T1OUT C2+ 5 14 R1IN C2- 6 13 R1OUT V- 7 12 T1IN T2OUT 8 11 T2IN Part # Information PART NO. 10 R2OUT R2IN 9 TEMP. RANGE (oC) PACKAGE PKG. NO. ICL3310CB 0 to 70 18 Ld SOIC M18.3 ICL3310CB-T 0 to 70 Tape and Reel M18.3 ICL3310IB -40 to 85 18 Ld SOIC M18.3 ICL3310IB-T -40 to 85 Tape and Reel M18.3 TABLE 1. SUMMARY OF FEATURES PART NUMBER ICL3310 NO. OF NO. OF Tx. Rx. 2 2 1 NO. OF MONITOR Rx. (ROUTB) DATA RATE (kbps) Rx. ENABLE FUNCTION? READY OUTPUT? MANUAL POWERDOWN? AUTOMATIC POWERDOWN FUNCTION? 0 250 NO NO YES NO CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2001, 2002, 2004. All Rights Reserved ICL3310 Pin Descriptions PIN VCC FUNCTION System power supply input (3.0V to 5.5V). V+ Internally generated positive transmitter supply (+5.5V). V- Internally generated negative transmitter supply (-5.5V). GND Ground connection. C1+ External capacitor (voltage doubler) is connected to this lead. C1- External capacitor (voltage doubler) is connected to this lead. C2+ External capacitor (voltage inverter) is connected to this lead. C2- External capacitor (voltage inverter) is connected to this lead. TIN TTL/CMOS compatible transmitter Inputs. TOUT RS-232 level (nominally ±5.5V) transmitter outputs. RIN RS-232 compatible receiver inputs. ROUT TTL/CMOS level receiver outputs. SHDN Active low input to shut down transmitters, receivers, and on-board power supply, to place device in low power mode. Typical Operating Circuits ICL3310 C3 (OPTIONAL CONNECTION, NOTE) C1 0.1µF C2 0.1µF T1IN T2IN TTL/CMOS LOGIC LEVELS R1OUT + 0.1µF 2 + 4 5 + 6 12 11 + +3.3V to +5V 17 C1+ VCC 3 V+ C1C2+ 7 V- C2- + T1 15 T2 C4 0.1µF T1OUT 8 T2OUT 14 13 R1IN 5kΩ R1 9 10 R2OUT R2IN 5kΩ R2 SHDN GND 16 NOTE: The negative terminal of C3 can be connected to either VCC or GND. 2 + C3 0.1µF 18 VCC RS-232 LEVELS ICL3310 Absolute Maximum Ratings Thermal Information VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V V- to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V Input Voltages TIN, SHDN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table Thermal Resistance (Typical, Note 1) θJA (oC/W) 18 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75 Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (Lead Tips Only) Operating Conditions ICL3310CX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC ICL3310IX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF; Unless Otherwise Specified. Typicals are at TA = 25oC PARAMETER TEST CONDITIONS TEMP (oC) MIN TYP MAX UNITS 25 - 0.1 10 µA Full - - 50 µA Full - 0.3 3.0 mA DC CHARACTERISTICS Supply Current, Powerdown SHDN = GND Supply Current, Enabled All Outputs Unloaded, SHDN = VCC, VCC = 3.15V LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS Input Logic Threshold Low TIN, SHDN Full - - 0.8 V Input Logic Threshold High TIN, SHDN Full 2.4 - - V Input Leakage Current TIN, SHDN Full - ±0.01 ±1.0 µA Output Leakage Current SHDN = VCC Full - ±0.05 ±10 µA Output Voltage Low IOUT = 3.2mA Full - - 0.4 V Output Voltage High IOUT = -1.0mA Full - V VCC -0.6 VCC -0.1 RECEIVER INPUTS Input Voltage Range Full -25 - 25 V VCC = 3.3V 25 0.6 1.2 - V VCC = 5.0V Full 0.8 1.5 - V VCC = 3.3V 25 - 1.5 2.4 V VCC = 5.0V Full - 1.8 2.4 V Input Hysteresis Full 0.2 0.5 1 V Input Resistance Full 3 5 7 kΩ Input Threshold Low Input Threshold High TRANSMITTER OUTPUTS Output Voltage Swing All Transmitter Outputs Loaded with 3kΩ to Ground Full ±5.0 ±5.4 - V Output Resistance VCC = V+ = V- = 0V, Transmitter Output = ±2V Full 300 10M - Ω Full ±7 ±35 - mA Full - - ±10 µA Output Short-Circuit Current VOUT = ±12V, VCC = 0V or 3V to 5.5V, SHDN = GND Output Leakage Current 3 ICL3310 Electrical Specifications Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF; Unless Otherwise Specified. Typicals are at TA = 25oC (Continued) PARAMETER TEMP (oC) MIN TYP MAX UNITS Full 250 500 - kbps tPHL Full - 0.6 3.5 µs tPLH Full - 0.7 3.5 µs tPHL Full - 0.2 1 µs tPLH Full - 0.3 1 µs TEST CONDITIONS TIMING CHARACTERISTICS Maximum Data Rate RL = 3kΩ, CL = 1000pF, One Transmitter Switching Transmitter Propagation Delay Transmitter Input to Transmitter Output, CL = 1000pF Receiver Propagation Delay Receiver Input to Receiver Output, CL = 150pF Transmitter Output Enable Time From SHDN Rising Edge to TOUT = ±3V 25 - 50 - µs Transmitter Output Disable Time From SHDN Falling Edge to TOUT = ±5V 25 - 600 - ns Transmitter Skew tPHL - tPLH (Note 2) 25 - 100 - ns Receiver Skew tPHL - tPLH 25 - 100 - ns Transition Region Slew Rate RL = 3kΩ to 7kΩ, Measured From 3V to -3V or -3V to 3V VCC = 3.3V, CL = 150pF to 2500pF 25 4 - - V/µs VCC = 4.5V, CL = 150pF to 2500pF 25 6 - - V/µs Human Body Model 25 - ±15 - kV IEC1000-4-2 Contact Discharge 25 - ±8 - kV IEC1000-4-2 Air Gap Discharge 25 - >±8 - kV Human Body Model 25 - ±3 - kV ESD PERFORMANCE RS-232 Pins (TOUT, RIN) All Other Pins NOTE: 2. Transmitter skew is measured at the transmitter zero crossing points. Detailed Description Transmitters ICL3310 interface ICs operate from a single +3V to +5.5V supply, guarantee a 250kbps minimum data rate, require only four small external 0.1µF capacitors, feature low power consumption, and meet all ElA RS-232C and V.28 specifications. The circuit is divided into three sections: The charge pump, the transmitters, and the receivers. The transmitters are proprietary, low dropout, inverting drivers that translate TTL/CMOS inputs to EIA/TIA-232 output levels. Coupled with the on-chip ±5.5V supplies, these transmitters deliver true RS-232 levels over a wide range of single supply system voltages. Charge-Pump Intersil’s new ICL3310 utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate ±5.5V transmitter supplies from a VCC supply as low as 3.0V. This allows these devices to maintain RS-232 compliant output levels over the ±10% tolerance range of 3.3V powered systems. The efficient on-chip power supplies require only four small, external 0.1µF capacitors for the voltage doubler and inverter functions at VCC = 3.3V. See the “Capacitor Selection” section, and Table 3 for capacitor recommendations for other operating conditions. The charge pumps operate discontinuously (i.e., they turn off as soon as the V+ and V- supplies are pumped up to the nominal values), resulting in significant power savings. 4 All transmitter outputs disable and assume a high impedance state when the device enters the powerdown mode (see Table 2). These outputs may be driven to ±12V when disabled. All devices guarantee a 250kbps data rate for full load conditions (3kΩ and 1000pF), VCC ≥ 3.0V, with one transmitter operating at full speed. Under more typical conditions of VCC ≥ 3.3V, RL = 3kΩ, and CL = 250pF, one transmitter easily operates at 900kbps. ICL3310 Transmitter inputs float if left unconnected (there are no pullup resistors), and may cause ICC increases. Connect unused inputs to GND for the best performance. TABLE 2. POWERDOWN AND ENABLE LOGIC TRUTH TABLE SHDN TRANSMITTER RECEIVER INPUT OUTPUTS OUTPUTS MODE OF OPERATION H Active Active Normal Operation L High-Z High-Z Manual Powerdown Receivers The ICL3310 contains standard inverting receivers that three-state via the SHDN control line. Receivers driving powered down peripherals must be disabled to prevent current flow through the peripheral’s protection diodes (see Figures 2 and 3). All the receivers convert RS-232 signals to CMOS output levels and accept inputs up to ±30V while presenting the required 3kΩ to 7kΩ input impedance (see Figure 1) even if the power is off (VCC = 0V). The receivers’ Schmitt trigger input stage uses hysteresis to increase noise immunity and decrease errors due to slow input signal transitions. Powerdown Functionality The already low current requirement drops significantly when the device enters powerdown mode. In powerdown, supply current drops to 1µA, because the on-chip charge pump turns off (V+ collapses to VCC, V- collapses to GND), and the transmitter and receiver outputs three-state. This micro-power mode makes these devices ideal for battery powered and portable applications. Software Controlled (Manual) Powerdown The ICL3310 may be forced into its low power, standby state via a simple shutdown (SHDN) pin (see Figure 4). Driving this pin high enables normal operation, while driving it low forces the IC into it’s powerdown state. The time required to exit powerdown, and resume transmission is less than 50µs. Connect SHDN to VCC if the powerdown function isn’t needed. VCC VCC CURRENT FLOW VCC VOUT = VCC Rx VCC RXOUT RXIN -25V ≤ VRIN ≤ +25V POWERED DOWN UART GND ≤ VROUT ≤ VCC 5kΩ GND Tx OLD RS-232 CHIP SHDN = GND GND FIGURE 1. INVERTING RECEIVER CONNECTIONS Low Power Operation This 3V device requires a nominal supply current of 0.3mA, even at VCC = 5.5V, during normal operation (not in powerdown mode). This is considerably less than the 11mA current required by comparable 5V RS-232 devices, allowing users to reduce system power simply by replacing the old style device with the ICL3310. Low Power, Pin Compatible Replacement Pin compatibility with existing 5V products (e.g., MAX222), coupled with the wide operating supply range, make the ICL3310 a potential lower power, higher performance dropin replacement for existing 5V applications. As long as the ±5V RS-232 output swings are acceptable, and transmitter pull-up resistors aren’t required, the ICL3310 should work in most 5V applications. When replacing a device in an existing 5V application, it is acceptable to terminate C3 to VCC as shown on the “Typical Operating Circuit”. Nevertheless, terminate C3 to GND if possible, as slightly better performance results from this configuration. 5 FIGURE 2. POWER DRAIN THROUGH POWERED DOWN PERIPHERAL VCC TRANSITION DETECTOR TO WAKE-UP LOGIC ICL3310 V- VCC RX POWERED DOWN UART VOUT = HI-Z TX FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN ICL3310 5V/DIV. SHDN SHDN T1 PWR MGT LOGIC ICL3310 2V/DIV. T2 I/O UART VCC = +3.3V C1 - C4 = 0.1µF CPU TIME (20µs/DIV.) FIGURE 5. TRANSMITTER OUTPUTS WHEN EXITING POWERDOWN FIGURE 4. CONNECTIONS FOR MANUAL POWERDOWN Capacitor Selection The charge pumps require 0.1µF or greater capacitors for operation with 3.3V ≤ VCC ≤ 5.5V. Increasing the capacitor values (by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2 , C3 , and C4 can be increased without increasing C1’s value, however, do not increase C1 without also increasing C2 , C3 , and C4 to maintain the proper ratios (C1 to the other capacitors). When using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor’s equivalent series resistance (ESR) usually rises at low temperatures and it influences the amount of ripple on V+ and V-. High Data Rates The ICL3310 maintain the RS-232 ±5V minimum transmitter output voltages even at high data rates. Figure 6 details a transmitter loopback test circuit, and Figure 7 illustrates the loopback test result at 120kbps. For this test, all transmitters were simultaneously driving RS-232 loads in parallel with 1000pF, at 120kbps. Figure 8 shows the loopback results for a single transmitter driving 1000pF and an RS-232 load at 250kbps. The static transmitters were also loaded with an RS-232 receiver. VCC + 0.1µF + C1+ VCC V+ C1 C1- + C3 ICL3310 Power Supply Decoupling + V- C2+ C2 C4 + C2- In most circumstances a 0.1µF bypass capacitor is adequate. In applications that are particularly sensitive to power supply noise, decouple VCC to ground with a capacitor of the same value as the charge-pump capacitor C1. Connect the bypass capacitor as close as possible to the IC. TIN ROUT TOUT RIN 1000pF 5k Transmitter Outputs when Exiting Powerdown Figure 5 shows the response of two transmitter outputs when exiting powerdown mode. As they activate, the two transmitter outputs properly go to opposite RS-232 levels, with no glitching, ringing, nor undesirable transients. Each transmitter is loaded with 3kΩ in parallel with 2500pF. Note that the transmitters enable only when the magnitude of the supplies exceed approximately 3V. 6 VCC SHDN FIGURE 6. TRANSMITTER LOOPBACK TEST CIRCUIT ICL3310 Interconnection with 3V and 5V Logic 5V/DIV. T1IN The ICL3310 directly interface with most 5V logic families, including ACT and HCT CMOS. See Table 3 for more information on possible combinations of interconnections. T1OUT TABLE 3. LOGIC FAMILY COMPATIBILITY WITH VARIOUS SUPPLY VOLTAGES VCC SYSTEM POWER-SUPPLY SUPPLY VOLTAGE VOLTAGE (V) (V) R1OUT VCC = +3.3V C1 - C4 = 0.1µF COMPATIBILITY 3.3 3.3 Compatible with all CMOS families. 5 5 Compatible with all TTL and CMOS logic families. 5 3.3 Compatible with ACT and HCT CMOS, and with TTL. Incompatible with AC, HC, or CD4000 CMOS. 5µs/DIV. FIGURE 7. LOOPBACK TEST AT 120kbps 5V/DIV. T1IN T1OUT R1OUT VCC = +3.3V C1 - C4 = 0.1µF 2µs/DIV. FIGURE 8. LOOPBACK TEST AT 250kbps Typical Performance Curves VCC = 3.3V, TA = 25oC 25 VOUT+ 4.0 20 SLEW RATE (V/µs) TRANSMITTER OUTPUT VOLTAGE (V) 6.0 2.0 1 TRANSMITTER AT 250kbps 1 TRANSMITTER AT 30kbps 0 -2.0 15 -SLEW +SLEW 10 VOUT - -4.0 -6.0 0 1000 2000 3000 4000 5000 LOAD CAPACITANCE (pF) FIGURE 9. TRANSMITTER OUTPUT VOLTAGE vs LOAD CAPACITANCE 7 5 0 1000 2000 3000 4000 LOAD CAPACITANCE (pF) FIGURE 10. SLEW RATE vs LOAD CAPACITANCE 5000 ICL3310 Typical Performance Curves VCC = 3.3V, TA = 25oC (Continued) 3.5 45 40 3.0 SUPPLY CURRENT (mA) SUPPLY CURRENT (mA) 250kbps 35 30 25 120kbps 20 15 NO LOAD ALL OUTPUTS STATIC 20kbps 10 2.5 2.0 1.5 1.0 0.5 5 0 0 1000 2000 3000 4000 5000 LOAD CAPACITANCE (pF) FIGURE 11. SUPPLY CURRENT vs LOAD CAPACITANCE WHEN TRANSMITTING DATA Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 338 PROCESS: Si Gate CMOS 8 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 SUPPLY VOLTAGE (V) FIGURE 12. SUPPLY CURRENT vs SUPPLY VOLTAGE 6.0 ICL3310 Small Outline Plastic Packages (SOIC) N M18.3 (JEDEC MS-013-AB ISSUE C) INDEX AREA 0.25(0.010) M H B M 18 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE E INCHES -B- 1 2 SYMBOL 3 L SEATING PLANE -A- h x 45o A D -C- e µα A1 B 0.10(0.004) 0.25(0.010) M C A M B S 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. MILLIMETERS MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - 0.0040 0.0118 0.10 0.30 - B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.4469 0.4625 11.35 11.75 3 E 0.2914 0.2992 7.40 7.60 4 0.050 BSC 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 8o 0o N NOTES: MAX A1 e C MIN α 18 0o 18 7 8o Rev. 0 12/93 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 9