10-FZ122PB100SC02-M819F08 10-F0122PB100SC02-M819F09 target datasheet flow PHASE 0 1200 V / 100 A Features flow 0 housing ● High efficiency IGBT4 half-bridge ● Full current FWD ● Thermistor 12 mm housing 17 mm housing Schematic Target applications ● ● ● ● ● Industrial Drives Power Supply Solar UPS Welding Types ● 10-FZ122PB100SC02-M819F08 ● 10-F0122PB100SC02-M819F09 Maximum Ratings Tj=25°C, unless otherwise specified Parameter Condition Symbol Value Unit 1200 V 90 A 300 A 207 W ±20 V µs Half-bridge Switch Collector-emitter voltage Collector current V CES IC T j = T jmax Repetitive peak collector current I CRM t p limited by T jmax Total power dissipation P tot T j = T jmax Gate-emitter voltage V GES Short circuit ratings Maximum Junction Temperature Copyright Vincotech T s =80 °C T s =80 °C t SC Tj ≤ 150°C 10 V CC VGE = 15V 800 V 175 °C T jmax 1 01 Nov. 2015 / Revision 1 10-FZ122PB100SC02-M819F08 10-F0122PB100SC02-M819F09 target datasheet Parameter Conditions Symbol Value Unit 1200 V 84 A 200 A 144 W 175 °C Half-bridge Diode Peak Repetitive Reverse Voltage Continuous (direct) forward current V RRM IF Repetitive peak forward current I FRM Total power dissipation P tot Maximum Junction Temperature T jmax T j = T jmax T s = 80°C T j = T jmax T s = 80°C Module Properties Parameter Conditions Symbol Value Unit Thermal Properties Storage temperature T stg -40…+125 °C Operation Junction Temperature T jop -40…+(T jmax - 25) °C 4000 V min 12,7 mm Isolation Properties Isolation voltage V isol DC voltage Creepage distance t p=2s Clearance for 12 mm housing 9,12 mm Clearance for 17 mm housing min 12,7 mm Comparative Tracking Index Copyright Vincotech >200 CTI 2 01 Nov. 2015 / Revision 1 10-FZ122PB100SC02-M819F08 10-F0122PB100SC02-M819F09 target datasheet Characteristic Values Half-bridge Switch Parameter Symbol Conditions Value V GE [V] V CE [V] I C [A] T j[ °C] Unit Min Typ Max 5,1 5,8 6,4 1,53 1,90 2,1 Static Gate-emitter threshold voltage V GE(th) Collec tor-emitter saturation voltage V CEsat V GE=V CE 0,0038 25 125 25 15 100 125 V 150 Collec tor-emitter c ut-off current I CES 0 1200 Gate-emitter leakage c urrent I GES 20 0 Internal gate resistance Input capacitance 2,30 25 10 125 25 120 125 7,5 rg µA nA Ω 6300 C ies f=1 MHz Reverse transfer capac itance V 0 25 25 pF 270 C res Thermal Thermal resistance junc tion to sink R th(j-s) phase-change material ʎ =3,4W /mK 0,46 K/W Value Unit Half-bridge Diode Parameter Symbol Conditions V r [V] I F [A] T j [°C] Min Typ Max 1,83 2,05 Static Forward voltage VF Reverse leakage current Ir 100 1200 25 125 1,35 1,86 25 18 150 V µA Thermal Thermal resistance junction to sink Copyright Vincotech R th(j-s) phase-change material ʎ =3,4W/mK 0,66 3 K/W 01 Nov. 2015 / Revision 1 10-FZ122PB100SC02-M819F08 10-F0122PB100SC02-M819F09 target datasheet Thermistor Parameter Conditions Symbol V GE [V] Rated resistance ΔR/R Power dissipation P I C [A] T j[ °C] Min 25 R Deviation of R100 V CE [V] Value R100=1486 Ω 100 Power dissipation constant Typ Unit Max 21,5 -4,5 kΩ +4,5 % 25 210 mW 25 3,5 mW/K B-value B(25/50) 25 3884 K B-value B(25/100) 25 3964 K Vincotech NTC Reference Copyright Vincotech F 4 01 Nov. 2015 / Revision 1 10-FZ122PB100SC02-M819F08 10-F0122PB100SC02-M819F09 target datasheet Ordering Code & Marking Version without thermal paste 12mm housing without thermal paste 17mm housing NN-NNNNNNNNNNNNNN NNNNNNNN WWYY UL Vinco LLLLL SSSS Ordering Code 10-FZ122PB100SC02-M819F08 10-F0122PB100SC02-M819F09 Text Datamatrix in DataMatrix as M819F08 M819F09 in packaging barcode as M819F08 M819F09 Name Date code UL & Vinco Lot Serial NN-NNNNNNNNNNNNNN-NNNNNNNN WWYY UL Vinco LLLLL SSSS Type&Ver Lot number Serial Date code TTTTTTTVV LLLLL SSSS WWYY Outline Pin table [mm] Pin X Y Function 1 0 0 DC- 2 0 2,3 DC- 3 0 4,6 DC- 4 0 6,9 DC- 5 0 15,6 DC+ 6 0 17,9 DC+ 7 0 20,2 DC+ 8 0 22,5 DC+ 9 13,85 16,45 G12 10 16,75 16,45 S12 11 12 33,5 33,5 11,5 9,2 Ph Ph 13 33,5 6,9 Ph 14 33,5 4,6 Ph 15 33,5 2,3 Ph 16 33,5 0 Ph 17 13,85 13,55 Ph 18 19,55 4,95 S11 19 19,55 7,85 G11 20 21 33,5 26,1 22,5 22,5 Therm1 Therm2 Copyright Vincotech 12 mm housing 17 mm housing 5 01 Nov. 2015 / Revision 1 10-FZ122PB100SC02-M819F08 10-F0122PB100SC02-M819F09 target datasheet Pinout Identification ID Component Voltage Current Function T11,T12 IGBT 1200V 100A Half-bridge Switch D11,D12 FWD 1200V 100A Half-bridge Diode Rt NTC - - Thermistor Copyright Vincotech 6 Comment 01 Nov. 2015 / Revision 1 10-FZ122PB100SC02-M819F08 10-F0122PB100SC02-M819F09 target datasheet Packaging instruction Standard packaging quantity (SPQ) 135 >SPQ Standard <SPQ Sample Handling instruction Handling instructions for flow 0 packages see vincotech.com website. Package data Package data for flow 0 packages see vincotech.com website. Document No.: Date: 10-Fx122PB100SC02-M819F0x-T1-14 01 Nov. 2015 Modification: Pages Product status definition Datasheet Status Product Status Target Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. The data contained is exclusively intended for technically trained staff. DISCLAIMER The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability, function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine the suitability of the information and the product for reader’s intended use. LIFE SUPPORT POLICY Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval of Vincotech. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Copyright Vincotech 7 01 Nov. 2015 / Revision 1