ATS625LSG True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC Discontinued Product This device is no longer in production. The device should not be purchased for new design applications. Samples are no longer available. Date of status change: October 31, 2011 Recommended Substitutions: For existing customer transition, and for new customers or new applications, refer to the ATS627LSGTN-T. NOTE: For detailed information on purchasing options, contact your local Allegro field applications engineer or sales representative. Allegro MicroSystems, Inc. reserves the right to make, from time to time, revisions to the anticipated product life cycle plan for a product to accommodate changes in production capabilities, alternative product availabilities, or market demand. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringements of patents or other rights of third parties which may result from its use. ATS625LSG True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC Features and Benefits Description ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ The ATS625 true zero-speed gear tooth sensor IC is an optimized Hall IC and rare earth pellet configuration that provides a manufacturer-friendly solution for digital gear tooth sensing applications. The over-molded package holds together a samarium cobalt pellet, a pole piece concentrator, and a true zero-speed Hall IC that has been optimized to the magnetic circuit. This small package can be easily assembled and used in conjunction with gears of various shapes and sizes. Highly repeatable over operating temperature range Tight timing accuracy over operating temperature range True zero-speed operation Air-gap–independent switchpoints Vibration immunity Large operating air gaps Defined power-on state Wide operating voltage range Digital output representing target profile Single-chip sensing IC for high reliability The device incorporates a dual-element Hall IC that switches in response to differential magnetic signals created by a ferrous target. Digital processing of the analog signal provides zerospeed performance independent of air gap as well as dynamic adaptation of device performance to the typical operating conditions found in automotive applications (reduced vibration sensitivity). High-resolution peak detecting DACs are used to set the adaptive switching thresholds of the device. Switchpoint hysteresis reduces the negative effects of any anomalies in the magnetic signal associated with the targets used in many automotive applications. This device is optimized for crank applications that utilize targets that possess signature regions. Continued on the next page… Package: 4 pin SIP (suffix SG) The ATS625 is provided in a 4-pin SIP. It is lead (Pb) free, with 100% matte tin plated leadframe. Not to scale Functional Block Diagram V+ VCC Voltage Regulator Automatic Gain Control 0.1 F CBYPASS Hall Amp PDAC Threshold Comparator PPeak PThresh VPROC Reference Generator NDAC NPeak Threshold Logic NThresh Current Limit GND AUX (Recommended) ATS625LSG-DS, Rev. 5 Output Transistor VOUT True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG Features and Benefits (continued) ▪ ▪ ▪ ▪ ▪ Small mechanical size Optimized Hall IC magnetic system Fast start-up AGC and reference adjust circuit Undervoltage lockout Selection Guide Part Number ATS625LSGTN-T2 Packing1 Tape and Reel 13-in. 800 pcs./reel 1Contact Allegro 2Some for additional packing options. restrictions may apply to certain types of sales. Contact Allegro for details. Absolute Maximum Ratings Characteristic Symbol Notes Rating Units 26.5 V Supply Voltage VCC Reverse-Supply Voltage VRCC –18 V Reverse-Supply Current IRCC 50 mA Reverse-Output Voltage VROUT –0.5 V IOUT 10 mA Output Sink Current See Power Derating section Operating Ambient Temperature TA –40 to 150 ºC Maximum Junction Temperature TJ(max) 165 ºC Tstg –65 to 170 ºC Storage Temperature Pin-out Diagram Range L Terminal List Name VCC VOUT 1 2 3 4 Description Connects power supply to chip Number 1 Output from circuit 2 AUX For Allegro use only 3 GND Ground 4 Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 2 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG Operating Characteristics Valid at TA = –40°C to 150°C, TJ ≤ TJ(max), over full range of AG, unless otherwise noted; typical operating parameters: VCC = 12 V and TA = 25°C Characteristic Symbol Test Conditions Min. Typ. Max. Units 4.0 – 24 V – – < VCC(min) V ELECTRICAL CHARACTERISTICS Supply Voltage VCC Undervoltage Lockout Operating; TJ < TJmax VCCUV Reverse Supply Current IRCC VCC = –18 V – – –10 mA Supply Zener Clamp Voltage1 VZ ICC = 17 mA 28 – – V Supply Zener Current2 IZ VS = 28 V – – 17 mA Output OFF – 8.5 14 mA Output ON – 8.5 14 mA – High – V – – 200 μs Supply Current ICC POWER-ON CHARACTERISTICS Power-On State SPO Power-On Time tPO Gear Speed < 100 RPM; VCC > VCC min OUTPUT STAGE Low Output Voltage VOUT(SAT) ISINK = 20 mA, Output = ON – 200 450 mV Output Current Limit IOUT(LIM) VOUT = 12 V, TJ < TJmax 25 60 90 mA Output Leakage Current IOUT(OFF) Output = OFF, VOUT = 24 V – – 10 μA Output Rise Time tr RL = 500 Ω, CL = 10 pF – 1.0 2 μs Output Fall Time tf RL = 500 Ω, CL = 10 pF – 0.6 2 μs S Reference target 60+2 0 – 12000 rpm Corresponds to switching frequency – 3 dB – 20 – kHz – 60 – % – 40 – % – 1 6 edges SWITCHPOINT CHARACTERISTICS Speed Bandwidth BW Operate Point BOP Release Point BRP % of peak-to-peak signal, AG < AGmax; BIN transitioning from LOW to HIGH % of peak-to-peak signal, AG < AGmax; BIN transitioning from HIGH to LOW CALIBRATION Initial Calibration3 CalPO Calibration Update Cal Start-up Running mode operation continuous – Continued on the next page... Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 3 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG Operating Characteristics, continued Valid at TA = –40°C to 150°C, TJ ≤ TJ(max), over full range of AG, unless otherwise noted; typical operating parameters: VCC = 12 V and TA = 25°C Characteristic Symbol Test Conditions Min. Typ. Max. Units 0.5 – 2.5 mm OPERATING CHARACTERISTICS with 60+2 reference target Operational Air Gap Relative Timing Accuracy, Sequential Mechanical Rising Edges Relative Timing Accuracy, Sequential Mechanical Falling Edges Relative Timing Accuracy, Signature Mechanical Rising Edge4 Relative Timing Accuracy, Signature Mechanical Falling Edge5 AG Measured from package branded face to target tooth ERRRR Relative to measurement taken at AG = 1.5 mm – – ±0.4 deg. ERRFF Relative to measurement taken at AG = 1.5 mm – – ±0.4 deg. ERRSIGR Relative to measurement taken at AG = 1.5 mm – – ±0.4 deg. ERRSIGF Relative to measurement taken at AG = 1.5 mm – – ±1.5 deg. Relative Repeatability, Sequential Rising and Falling Edges6 TθE 360° Repeatability, 1000 edges; peak-peak sinusoidal signal with BPEAK ≥ BIN(min) and 6° period – – 0.08 deg. Operating Signal7 BIN AG(min) < AG < AG(max) 60 – – G 1 Test condition is ICC(max) + 3 mA. 2 Upper limit is I CC(max) + 3 mA. 3 Power-on speed ≤ 200 rpm. Refer to the Device Description section for information on start-up behavior. 4 Detection accuracy of the update algorithm for the first rising mechanical edge following a signature region can be adversely affected by the magnetic bias of the signature region. Please consult with Allegro field applications engineering for aid with assessment of specific target geometries. 5 Detection accuracy of the update algorithm for the falling edge of the signature region is highly dependent upon specific target geometry. Please consult with Allegro field applications engineering for aid with assessment of specific target geometries. 6 The repeatability specification is based on statistical evaluation of a sample population. 7 Peak-to-peak magnetic flux strength required at Hall elements for complying with operational characteristics. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 4 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG Reference Target (Gear) Information REFERENCE TARGET 60+2 Symbol Test Conditions Typ. Unit 120 mm Do Outside diameter of target Face Width F Breadth of tooth, with respect to branded face 6 mm Circular Tooth Length t Length of tooth, with respect to branded face; measured at Do 3 mm tSIG Length of signature tooth, with respect to branded face; measured at Do 15 mm Circular Valley Length tv Length of valley, with respect to branded face; measured at Do 3 mm Tooth Whole Depth ht 3 mm – – Signature Region Circular Tooth Length Material Low Carbon Steel Branded Face of Package t,t S Outside Diameter Symbol Key IG Characteristics tV ØDO F ht Air Gap Signature Region Pin 4 Pin 1 Branded Face of Package Reference Target 60+2 Figure 1. Configuration with Radial-Tooth Reference Target For the generation of adequate magnetic field levels, the following recommendations should be followed in the design and specification of targets: • 2 mm < tooth width, t < 4 mm • Valley width, tv > 2 mm • Valley depth, ht > 2 mm • Tooth thickness, F ≥ 3 mm • Target material must be low carbon steel Although these parameters apply to targets of traditional geometry (radially oriented teeth with radial sensing, shown in figure 1), they also can be applied in applications using stamped targets (an aperture or rim gap punched out of the target material) and axial sensing. For stamped geometries with axial sensing, the valley depth, ht, is intrinsically infinite, so the criteria for tooth width, t, valley width, tv, tooth material thickness, F, and material specification need only be considered for reference. For example, F can now be < 3 mm. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 5 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG Characteristic Data: Electrical ICC(ON) Versus TA 14 14 13 13 Vcc = 26.5V 12 12 Vcc = 20V 11 Vcc = 12V 10 Vcc = 4V TA (°C) 11 -40 0 25 85 150 10 9 8 7 Current (mA) Current (mA) ICC(ON) Versus VCC 9 8 6 5 0 5 10 15 20 25 5 -50 30 -25 0 25 50 75 100 125 150 175 Temperature (°C) Voltage (V) ICC(OFF) Versus VCC ICC(OFF) Versus TA 14 14 13 13 Vcc = 24V 12 12 Vcc = 20V 11 Vcc = 12V 10 Vcc = 4V TA (°C) 11 -40 0 25 85 150 10 9 8 7 Current (mA) Current (mA) 26.5 20.0 12.0 4.0 7 6 VCC (V) 24.0 20.0 12.0 4.0 9 8 7 6 6 5 5 0 5 10 15 20 25 -50 30 -25 0 Voltage (V) 50 75 100 125 150 175 VOUT(SAT) Versus TA 10 400 8 350 6 VOUT (V) 2 26.5 20.0 12.0 4.0 0 -2 -4 Voltage (mV) 300 4 IOUT (mA) 25 20 15 10 5 250 200 150 100 -6 50 -8 0 -10 -50 25 Temperature (°C) IOUT(OFF) Versus TA Current (uA) VCC (V) -25 0 25 50 75 100 Temperature (°C) 125 150 175 -50 -25 0 25 50 75 100 125 150 175 Temperature (°C) Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 6 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG Characteristic Data: Relative Timing Accuracy Relative Timing Accuracy Versus Speed Relative Timing Accuracy Versus Ambient Temperature Signature Tooth Rising Edge Signature Tooth Rising Edge 0.5 mm Air Gap 0.5 mm Air Gap 1.5 1.0 1.0 TA (°C) 0.5 –40 0 25 85 150 0.0 -0.5 -1.0 -1.5 0 500 1000 1500 2000 Edge Position (°) Edge Position (°) 1.5 S (rpm) 0.5 0.0 -0.5 -1.0 -1.5 -50 2500 0 Target Speed, S (rpm) 100 150 200 Relative Timing Accuracy Versus Ambient Temperature Signature Tooth Falling Edge 0.5 mm Air Gap Signature Tooth Falling Edge 0.5 mm Air Gap 1.5 1.5 TA (°C) 0.5 –40 0 25 85 150 0.0 -0.5 Edge Position (°) 1.0 1.0 S (rpm) 50 100 500 1000 1500 2000 0.5 0.0 -0.5 -1.0 -1.0 -1.5 -50 -1.5 Target Speed, S (rpm) 50 100 150 Temperature, TA (°C) Relative Timing Accuracy Versus Speed Relative Timing Accuracy Versus Ambient Temperature 0 500 1000 1500 2000 2500 Rising Edge Following Signature Tooth 0 200 Rising Edge Following Signature Tooth 0.5 mm Air Gap 0.5 mm Air Gap 1.5 1.5 1.0 TA (°C) 0.5 –40 0 25 85 150 0.0 -0.5 -1.0 -1.5 0 500 1000 1500 2000 Target Speed, S (rpm) 2500 Edge Position (°) Edge Position (°) 50 Temperature, TA (°C) Relative Timing Accuracy Versus Speed Edge Position (°) 50 100 500 1000 1500 2000 1.0 S (rpm) 50 100 500 1000 1500 2000 0.5 0.0 -0.5 -1.0 -1.5 -50 0 50 100 150 200 Temperature, TA (°C) Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 7 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG Relative Timing Accuracy Versus Speed Relative Timing Accuracy Versus Ambient Temperature Signature Tooth Rising Edge Signature Tooth Rising Edge 2.5 mm Air Gap 2.5 mm Air Gap 1.5 1.0 1.0 TA (°C) 0.5 –40 0 25 85 150 0.0 -0.5 -1.0 -1.5 0 500 1000 1500 2000 Edge Position (°) Edge Position (°) 1.5 S (rpm) 0.5 0.0 -0.5 -1.0 -1.5 -50 2500 0 Target Speed, S (rpm) 100 150 200 Relative Timing Accuracy Versus Ambient Temperature Signature Tooth Falling Edge 2.5 mm Air Gap Signature Tooth Falling Edge 2.5 mm Air Gap 1.5 1.5 TA (°C) 0.5 –40 0 25 85 150 0.0 -0.5 Edge Position (°) 1.0 1.0 S (rpm) 50 100 500 1000 1500 2000 0.5 0.0 -0.5 -1.0 -1.0 -1.5 -50 -1.5 Target Speed, S (rpm) 50 100 150 Temperature, TA (°C) Relative Timing Accuracy Versus Speed Relative Timing Accuracy Versus Ambient Temperature 0 500 1000 1500 2000 2500 Rising Edge Following Signature Tooth 0 200 Rising Edge Following Signature Tooth 2.5 mm Air Gap 2.5 mm Air Gap 1.5 1.5 1.0 TA (°C) 0.5 –40 0 25 85 150 0.0 -0.5 -1.0 -1.5 0 500 1000 1500 2000 Target Speed, S (rpm) 2500 Edge Position (°) Edge Position (°) 50 Temperature, TA (°C) Relative Timing Accuracy Versus Speed Edge Position (°) 50 100 500 1000 1500 2000 1.0 S (rpm) 50 100 500 1000 1500 2000 0.5 0.0 -0.5 -1.0 -1.5 -50 0 50 100 150 200 Temperature, TA (°C) Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 8 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG Relative Timing Accuracy Versus Air Gap Relative Timing Accuracy Versus Air Gap Signature Tooth Rising Edge Signature Tooth Falling Edge TA = –40, 0, 25, 85, 150 (°C) S = 50, 100, 500, 1000, 1500, 2000 (rpm) Edge Position (°) 0.0 0.5 1.0 1.5 Air Gap (mm) 2.0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 3.0 0.0 0.5 1.0 1.5 2.0 Air Gap (mm) 2.5 3.0 Relative Timing Accuracy Versus Air Gap Rising Edge Following Signature Tooth TA = –40, 0, 25, 85, 150 (°C) S = 50, 100, 500, 1000, 1500, 2000 (rpm) Edge Position (°) 2.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 2.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 0 0.5 1.0 1.5 2.0 2.5 3.0 Air Gap (mm) Characteristic Data: Repeatability 360° Repeatability Versus Air Gap Sequential Tooth Falling Edge S = 1000 rpm 0.25 Repeatabilty (°) Edge Position (°) TA = –40, 0, 25, 85, 150 (°C) S = 50, 100, 500, 1000, 1500, 2000 (rpm) TA (°C) 0.20 –40 25 150 0.15 0.10 0.05 0 0 1.0 2.0 3.0 4.0 Air Gap (mm) Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 9 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG Device Description magnetic gradient created by the passing of a ferrous object. This is illustrated in figures 2 and 3. The differential output of the two elements is converted to a digital signal that is processed to provide the digital output. Package Description The ATS625LSG is a combined Hall IC and rare-earth pellet configuration that is fully optimized to provide digital detection of gear tooth edges. This device is integrally molded into a plastic body that has been optimized for size, ease of assembly, and manufacturability. High operating temperature materials are used in all aspects of construction. Switching Description After proper power is applied to the component, the chip is then capable of providing digital information that is representative of the profile of a rotating gear, as illustrated in figure 4. No additional optimization is needed and minimal processing circuitry is required. This ease of use reduces design time and incremental assembly costs for most applications. Hall Technology The ATS625 contains a single-chip differential Hall effect sensor IC, a 4-pin leadframe, a samarium cobalt pellet, and a flat ferrous pole piece. The Hall IC consists of two Hall elements spaced 2.2 mm apart, and each independently measures the Target (Gear) Element Pitch Hall Element 2 Dual-Element Hall Effect Device Hall Element 1 Hall IC Pole Piece (Concentrator) South Pole Back-biasing Rare Earth Pellet Plastic North Pole (Pin n >1 Side) 1 4 (Pin 1 Side) Figure 3. This left-to-right (pin 1 to pin 4) direction of target rotation results in a high output signal when a tooth of the target gear is centered over the face of the package. A right-to-left (pin 4 to pin 1) rotation inverts the output signal polarity. Figure 2. Device Cross Section. Relative motion of the target is detected by the dual Hall elements mounted on the Hall IC. This view is from the side opposite the pins. Target Mechanical Profile Target Magnetic Profile Branded Face of Package Rotating Target Signature Tooth B+ BIN IC Output Switch State On Off On Off On Off On Off On Off On Off On Off On Off V+ IC Output Electrical Profile Target Motion from Pin 1 to Pin 4 VOUT IC Output Electrical Profile Target Motion from Pin 4 to Pin 1 VOUT V+ Figure 4. The magnetic profile reflects the geometry of the target, allowing the device to present an accurate digital output response. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 10 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG Undervoltage Lockout When the supply voltage falls below the undervoltage lockout level, VCCUV, the device switches to the OFF state. The device remains in that state until the voltage level is restored to to the VCC operating range. Changes in the target magnetic profile have no effect until voltage is restored. This prevents false signals caused by undervoltage conditions from propagating to the output of the IC. Power Supply Protection The device contains an on-chip regulator and can operate over a wide range of supply voltage levels. For applications using an unregulated power supply, transient protection must be added externally. For applications using a regulated supply line, EMI and RFI protection may still be required. The circuit shown in figure 5 is the basic configuration required for proper device operation. Contact Allegro field applications engineering for information on the circuitry required for compliance to various EMC specifications. Internal Electronics The ATS625LSG contains a self-calibrating Hall effect IC that possesses two Hall elements, a temperature compensated amplifier and offset cancellation circuitry. The IC also contains a voltage regulator that provides supply noise rejection over the operating voltage range. The Hall transducers and the electronics are integrated on the same silicon substrate by a proprietary BiCMOS process. Changes in temperature do not greatly affect this device due to the stable amplifier design and the offset rejection circuitry. VS 1 VCC CBYPASS 0.1 μF RPU ATS625 3 AUX VOUT 2 Output GND 4 Figure 5. Power Supply Protection Typical Circuit Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 11 ATS625LSG True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC Device Operation Description Power-On State At power-on, the device is guaranteed to initialize in the OFF state, with VOUT high. First Edge Detection The device uses the first two mechanical edges to synchronize with the target features (tooth or valley) and direction of rotation of the target. The device is synchronized by the third edge. The actual behavior is affected by: target rotation direction relative to Package Pin 4 Side the package, target feature (tooth, rising edge, falling edge, or valley) that is centered on the device at power-on, and fact that the chip powers-on in the OFF state, with VOUT high, regardless of the eventual direction of target rotation. The interaction of these factors results in a number of possible power-on scenarios. These are diagrammed in figure 6. In all start-up scenarios, the correct number of output edges is provided, but the accuracy of the first two edges may be compromised. Target Motion Relative to Package Package Pin 1 Side Target Mechanical Profile Target Magnetic Profile IC Output, VOUT (Start-up over valley) (A) Target relative movement as shown in figure 3. Output signal is high over the tooth. (Start-up over rising edge) (Start-up over tooth) (Start-up over falling edge) IC start-up location Package Pin 1 Side Target Motion Relative to Package Package Pin 4 Side Target Mechanical Profile Target Magnetic Profile (B) Target relative movement opposite that shown in figure 3. Output signal is low over the tooth. IC Output, VOUT (Start-up over valley) (Start-up over rising edge) (Start-up over tooth) (Start-up over falling edge) IC start-up location Figure 6. Start-up Position And Relative Motion Effects on First Device Output Switching. Panel A shows the effects when the target is moving from pin 1 toward pin 4 of the device; VOUT goes high at the approach of a tooth. When the target is moving in the opposite direction, as in panel B, the polarity of the device output inverts; VOUT goes low at the approach of a tooth. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 12 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG AGC (Automatic Gain Control) The AGC feature is implemented by a unique patented selfcalibrating circuitry. After each power-on, the device measures the peak-to-peak magnetic signal. The gain of the circuit is then Differential Electrical Signal versus Target Rotation at Various Air Gaps, Without AGC adjusted, keeping the internal signal amplitude constant over the air gap range of the device, AG. This feature ensures that operational characteristics are isolated from the effects of changes in AG. The effect of AGC is shown in figure 7. Differential Electrical Signal versus Target Rotation at Various Air Gaps, With AGC 1000 1000 600 0.50 mm 1.00 mm 1.50 mm 2.00 mm 400 200 0 -200 -400 -600 400 200 0 -200 -400 -600 -800 -1000 -1000 3 6 9 12 15 18 21 24 Target Rotation (°) 0.50 mm 1.00 mm 1.50 mm 2.00 mm 600 -800 0 AG: 0.25 mm 800 AG: 0.25 mm Differential Signal, VPROC (mV) Differential Signal, VPROC (mV) 800 0 3 6 9 12 15 18 21 24 Target Rotation (°) Figure 7. Effect of AGC. The left panel shows the process signal, VPROC, without AGC. The right panel shows the effect with AGC. The result is a normalized VPROC, which allows optimal performance by the rest of the circuits that reference this signal. Offset Adjustment In addition to normalizing performance over varying AG, the gain control circuitry also reduces the effect of chip, magnet, and installation offsets. This is accomplished using two DACs (D to A converters) that capture the peaks and valleys of the processed signal, VPROC, and use it as a reference for the Threshold Comparator subcircuit, which controls device switching. If induced offsets bias the absolute signal up or down, AGC and the dynamic DAC behavior work to normalize and reduce the impact of the offset on device performance. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 13 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG Switchpoints Switchpoints in the ATS625 are a percentage of the amplitude of the signal, VPROC, after normalization with AGC. In operation, the actual switching levels are determined dynamically. Two DACs track the peaks of VPROC (see the Update subsection). The switching thresholds are established at 40% and 60% of the values held in the two DACs. The proximity of the thresholds near the 50% level ensures the most accurate and consistent switching, because it is where the slope of VPROC is steepest and least affected by air gap variation. ing from the previous two edges. Because variations are tracked in real time, the device has high immunity to target run-out and retains excellent accuracy and functionality in the presence of both run-out and transient mechanical events. Figure 9 shows how the device uses historical data to provide the switching threshold for a given edge. Dynamic BOP Threshold Determination The low hysteresis, 20%, provides high performance over various air gaps and immunity to false switching on noise, vibration, backlash, or other transient events. Update The ATS625 incorporates an algorithm that continuously monitors the system and updates the switching thresholds accordingly. The switchpoint for each edge is determined by the signal result- VPROC (%) 100 60 BOP 0 Device State Figure 8 graphically demonstrates the establishment of the switching threshold levels. Because the thresholds are established dynamically as a percentage of the peak-to-peak signal, the effect of a baseline shift is minimized. As a result, the effects of offsets induced by tilted or off-center installation are minimized. V+ On Off (A) Switching Threshold Levels Dynamic BRP Threshold Determination At Constant VPROC Level V+ V+ 100 60 BOP 40 BRP VPROC (%) VPROC (%) 100 0 Off On Off On Device State Device State 0 BRP 40 Off On (B) Figure 8. Switchpoint Relationship to Thresholds.The device switches when VPROC passes a threshold level, BOP or BRP , while changing in the corresponding direction: increasing for a BOP switchpoint, and decreasing for a BRP switchpoint. Figure 9. Switchpoint Determination. The two previous VPROC peaks are used to determine the next threshold level: panel A, operate point, and panel B, release point. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 14 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG IC and Target Evaluation A single curve can be derived from this map data, and be used to describe the peak-to-peak magnetic field strength versus the size of the air gap, AG. This allows determination of the minimum amount of magnetic flux density that guarantees operation of the IC, BIN, so the system designer can determine the maximum allowable AG for the IC and target system. Referring to figure 11, a BIN of 60 G corresponds to a maximum AG of approximately 2.5 mm. Magnetic Profile In order to establish the proper operating specification for a particular IC and target system, a systematic evaluation of the magnetic circuit should be performed. The first step is the generation of a magnetic map of the target. By using a calibrated device, a magnetic profile of the system is made. Figure 10 is a magnetic map of the 60+2 reference target. Magnetic Map, Reference Target 60+2 with ATS625 300 250 Differential Flux Density, BIN (G) 200 AG (mm) 150 100 0.75 50 1.00 0 1.50 -50 -100 2.00 -150 2.50 -200 3.00 -250 -300 -350 -400 0 30 60 90 120 150 180 Target Rotation (°) Peak-Peak Differential Flux Density, BIN (G) Air Gap Versus Magnetic Field, Reference Target 60+2 with ATS625 800 700 600 500 400 300 200 100 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 AG (mm) Figure 10. Magnetic Data for the Reference Target 60+2 with ATS625. In the top panel, the Signature Region appears in the center of the plot. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 15 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG Accuracy While the update algorithm will allow the device to adapt to typical air gap variations, major changes in air gap can adversely affect switching performance. When characterizing IC performance over a significant air gap range, be sure to re-power the device at each test at different air gaps. This ensures that self-calibration occurs for each installation condition. See the Operating Characteristics table and the charts in the Characteristic Data: Relative Timing Accuracy section for performance information. Repeatability Repeatability measurement methodology has been formulated to minimize the effect of test system jitter on device measurements. By triggering the measurement instrument, such as an oscilloscope, close to the desired output edge, the speed variations that occur within a single revolution of the target are effectively nullified. Because the trigger event occurs a very short time before the measured event, little opportunity is given for measurement system jitter to impact the time-based measurements. After the data is taken on the oscilloscope, statistical analysis of the distribution is made to quantify variability and capability. Although complete repeatability results can be found in the Characteristic Data: Repeatability section, figure 11 shows the correlation between magnetic signal strength and repeatability. Because an direct relationship exists between magnetic signal strength and repeatability, optimum repeatability performance can be attained through minimizing the operating air gap and optimizing the target design. Target Mechanical Profile Oscilloscope triggers at n events after low-resolution pulse Low Resolution Encoder Next high-resolution encoder pulse (at target edge) High Resolution Encoder IC Output Electrical Profile (target movement from pin 1 to pin 4) Oscilloscope trace of 1000 sweeps for the same output edge Statistical distribution of 1000 sweeps X Figure 11. Repeatability Measurement Methodology Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 16 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG Power Derating THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information Characteristic Symbol Test Conditions* Minimum-K PCB (single layer, single-sided, with copper limited to solder pads) Low-K PCB (single-layer, single-sided with copper limited to solder pads and 3.57 in.2 (23.03 cm2) of copper area each side) RθJA Package Thermal Resistance Value Units 126 ºC/W 84 ºC/W *Additional information is available on the Allegro Web site. Power Derating Curve TJ(max) = 165ºC 30 VCC(max) Maximum Allowable VCC (V) 25 20 Low-K PCB (RQJA = 84 ºC/W) 15 Minimum-K PCB (RQJA = 126 ºC/W) 10 5 VCC(min) 0 20 40 60 80 100 120 140 160 180 Power Dissipation, PD (m W) Power Dissipation Versus Ambient for Sample PCBs 1900 1800 1700 1600 1500 1400 1300 1200 1100 1000 900 800 700 600 500 400 300 200 100 0 Lo (R w- K θJ A = PC Mi n 84 B (R imu ºC mθJ A = KP /W 12 ) 6 º CB C/ W) 20 40 60 80 100 120 140 Temperature, TA (°C) 160 180 Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 17 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG The device must be operated below the maximum junction temperature of the device, TJ(max). Under certain combinations of peak conditions, reliable operation may require derating supplied power or improving the heat dissipation properties of the application. This section presents a procedure for correlating factors affecting operating TJ. (Thermal data is also available on the Allegro MicroSystems Web site.) The Package Thermal Resistance, RJA, is a figure of merit summarizing the ability of the application and the device to dissipate heat from the junction (die), through all paths to the ambient air. Its primary component is the Effective Thermal Conductivity, K, of the printed circuit board, including adjacent devices and traces. Radiation from the die through the device case, RJC, is relatively small component of RJA. Ambient air temperature, TA, and air motion are significant external factors, damped by overmolding. The effect of varying power levels (Power Dissipation, PD), can be estimated. The following formulas represent the fundamental relationships used to estimate TJ, at PD. PD = VIN × IIN Observe the worst-case ratings for the device, specifically: RJA = 126°C/W, TJ(max) = 165°C, VCC(max) = 26.5 V, and ICC(max) = 8 mA. Note that ICC(max) at TA = 150°C is lower than the ICC(max) at TA = 25°C given in the Operating Characteristics table. Calculate the maximum allowable power level, PD(max). First, invert equation 3: Tmax = TJ(max) – TA = 165 °C – 150 °C = 15 °C This provides the allowable increase to TJ resulting from internal power dissipation. Then, invert equation 2: PD(max) = Tmax ÷ RJA = 15°C ÷ 126 °C/W = 119 mW Finally, invert equation 1 with respect to voltage: VCC(est) = PD(max) ÷ ICC(max) = 119 mW ÷ 8 mA = 14.9 V (1) The result indicates that, at TA, the application and device can dissipate adequate amounts of heat at voltages ≤VCC(est). (3) Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reliable operation between VCC(est) and VCC(max) requires enhanced RJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and VCC(max) is reliable under these conditions. T = PD × RJA (2) TJ = TA + ΔT Example: Reliability for VCC at TA = 150°C, package SG, using minimum-K PCB. For example, given common conditions such as: TA= 25°C, VIN = 12 V, IIN = 4 mA, and RJA = 140 °C/W, then: PD = VIN × IIN = 12 V × 4 mA = 48 mW T = PD × RJA = 48 mW × 140 °C/W = 7°C TJ = TA + T = 25°C + 7°C = 32°C A worst-case estimate, PD(max), represents the maximum allowable power level, without exceeding TJ(max), at a selected RJA and TA. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 18 ATS625LSG True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC Device Evaluation: EMC Characterization Only Test Name* Reference Specification ESD – Human Body Model AEC-Q100-002 ESD – Machine Model AEC-Q100-003 Conducted Transients ISO 7637-1 Direct RF Injection ISO 11452-7 Bulk Current Injection ISO 11452-4 TEM Cell ISO 11452-3 *Please contact Allegro MicroSystems for EMC performance Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 19 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG Package SG, 4-Pin SIP 5.50±0.05 F 1.10 1.10 F E B 8.00±0.05 LLLLLLL NNN 5.80±0.05 E1 E2 YYWW Branded Face 1.70±0.10 D 4.70±0.10 1 2 3 4 = Supplier emblem L = Lot identifier N = Last three numbers of device part number Y = Last two digits of year of manufacture W = Week of manufacture A 0.60±0.10 Standard Branding Reference View 0.71±0.05 For Reference Only, not for tooling use (reference DWG-9002) Dimensions in millimeters A Dambar removal protrusion (16X) +0.06 0.38 –0.04 B Metallic protrusion, electrically connected to pin 4 and substrate (both sides) C Thermoplastic Molded Lead Bar for alignment during shipment 24.65±0.10 D Branding scale and appearance at supplier discretion 0.40±0.10 15.30±0.10 E Active Area Depth, 0.43 mm F Hall elements (E1, E2), not to scale 1.0 REF A 1.60±0.10 C 1.27±0.10 0.71±0.10 0.71±0.10 5.50±0.10 Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 20 True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor IC ATS625LSG Revision History Revision Revision Date Rev. 5 June 27, 2011 Description of Revision Update IOUT Copyright ©2005-2011, Allegro MicroSystems, Inc. Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the failure of that life support device or system, or to affect the safety or effectiveness of that device or system. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. For the latest version of this document, visit our website: www.allegromicro.com Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 21