KGD Assembly_AN

AN99112
KGD Assembly
AN99112 discusses the shipment methods, constraints regarding UV erase, plasma and radiation for die products not
packaged and at risk of exposure to UV light, plasma clean or X-ray during module assembly.
1
Introduction
Cypress ships a number of devices in die form. These products are referred to as Known Good Die (KGD).
Cypress has offered KGD since 1990, with over 200 million sold since 1990. This application note is relevant for
any die product not packaged and at risk of exposure to UV light, plasma clean, or X-ray during module assembly.
In addition to KGD, Known Tested Die (KTD) and Non-Singulated Wafers are available for commercial and
industrial applications. Special storage and handling conditions expected for KGD, KTD, and wafer products are
outlined in Cypress application note Long Term Storage of Wafer and Die Semiconductor IC Products. This
includes storage, handling, and processing issues that need to be considered.
Market demand for automotive under-hood applications has driven Cypress KGD offering. These applications
require sustained temperatures above 125°C. Such temperatures render plastics infeasible. Cypress offers KGD
at 125°C for customers who prefer die form and can maintain temperature below 125°C. See Figure 1.
Figure 1. S29CL032J (110 nm) KGD 3.3V, 32 Mb (1 Mb x 32), 62 MHz, 145°C
KGD applications typically require 2.6V, 3V, 3.3V, and various densities. Cypress portfolio of KGD products are
identified in Table 1.
www.cypress.com
Document No. 001-99112 Rev. *A
1
KGD Assembly
Table 1. Devices Offering KGD
Temperature
AL
AS
S29AL016J
S29AL008J
S29AS016J
S29AS008J
CD/CL
-40 to +85°C
-40 to +125°C
S29AL008J
GL
JL
MS
PL
S29GL01GS
S29GL512S
S29GL256S
S29GL128S
S29GL256P
S29GL128P
S29GL064N
S29GL032N
S29JL064J
S34MS04G2
S29PL127J
S25FL116K
S29CD032J
S29CD016J
S29CL016J
S29CL032J
-40 to +145°C
2
FL
S25FL512S
S25FL164K
S25FL064P
S25FL132K
S25FL032P
S25FL116K
KGD, KTD, and Wafer Shipment Methods
KGD, KTD, and wafer products are shipped using one of four methods (see Figure 2):

GDP = Waffle Pack

GDT = Surftape and Reel

GDE = Embossed Tape and Reel

GWJ = Wafer Jar
Many customers prefer Surftape due to ease of assembly. Figure 3 is an example of die ejector equipment used
to push and place packaged KGD or KTD in Surftape. See Packing and Packaging Handbook, for further
specifications.
Figure 2. KGD and KGW Shipping Methods
Embossed
Tape and Reel
Surftape and Reel
2
2
70DTE
1600
STATES
252
800BB-
QTY:
959
AM29F
905
8
OPN:
DIFFUSION
(P)
P/N:
OF
RUN
COUNTRY
(IT)
8
OPN:
(P)
T000350
0106
OF
1600
RUN
COUNTRY
(IT)
TOTAL:
(Q)
1600
252
:
STATES
QTY:
UNITED
(Q)
0
LF7855
0
DIFFUSION
(1P)
NO:
905
P/N:
NO:
LOT
D/C:
(IT)
(9D)
959
AM29F
QTY:
(IT)
NO:
T00035
0106
NO:
LOT
(IT) D/C:
(9D)
TOTAL:
(Q)
1600
Lid
(Q)
(1P)
-70DTE
800BB
1600
STATES
UNITED(Q)
LF78550
DIFFUSION:
OF
RUN
COUNTRY
Surftape
& reel
Dry Pack Bag,
Evacuate & Seal
Wafer Jar
Dry pack bag
KGD
Label
UNITED
KGD
Label
1600
(Q)
(Q)
T000350
0106
TOTAL:
(Q)
0
1600
STATES
UNITEDQTY:
LF78550
DIFFUSION:
NO:
NO:
LOT
(IT) D/C:
(9D)
LF7855
:
OF
(IT)
NO:
8
RUN
COUNTRY
T00035
0106
0
AM29F800BB
959
905
P/N:
(1P)
NO:
252
OPN:
1600
2
-70DTE
(P)
(IT)
(9D) LOT
D/C:
Die Sale
Label
TOTAL:
Waffle Pack
Cushioning
Material
Die Sale
Label
2
-70DTE
800BB
8
Spacer
QTY:
0
:
LF7855
0
DIFFUSION
OF
RUN
COUNTRY
Carrier
Cover
1600
STATES
UNITED
(Q)
905
P/N:
(1P)
(IT)
252
959
AM29F
OPN:
(P)
NO:
T00035
0106
NO:
LOT
(IT) D/C:
(9D)
TOTAL:
(Q)
1600
Water
Bubble
pack
Lint-Free
Paper
Spacer
Carrier
Base
Cushioning
Material
1R box
(32 mm - 56 mm)
Container
Main Body
Carrier Clip
(2 Req'd)
Q-PACKTM Label
3684
3683
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Document No. 001-99112 Rev. *A
2
KGD Assembly
In the following example of a die ejector system (Figure 3), die on the Surftape are dispensed with active side
facing up. A push-up tool in the Surftape feeder lifts the chip from the sticky tape rails for transfer to the pick head
on the assembly placement machine.
Figure 3. Example of Die Ejector System
3
Constraints Regarding UV Erase, Plasma and Radiation
Caution is necessary when using UV machines for curing or plasma equipment for cleaning. Most die or wafer
products are only protected by a topside nitride passivation layer. KGD, KTD, and wafer products have the same
constraints as SMT packages for X-Ray inspection.
4
UV Equipment Could Cause Erase
Use only a 15 W sec/cm2 dosage to completely UV erase the contents of a KGD, KTD, or wafer. Obtain this
dosage by exposure to an ultraviolet lamp wavelength of 2537 with intensity of 12,000 µW/cm2 for 15 to 20
minutes. The EPROM should be directly under and 1 inch from the source. Flash and EPROM are subject to the
same guidelines.
Below is a generic list of UV erasers that use the standard wavelength of 2537 Å. Using the lowest Wattage of 32
µW/cm2 at 1 meter, a conversion for intensity at 1 in is computed by the following equation:
I1 * D12= I2 * D22, where D1 is 1 m or 100 cm and D2 is 1 in or 2.54 cm. (EQ 1)
I
2
= I
1
* D
2
1
/ D
2
(EQ 2)
2
So,
I
2
= ((32 µW/cm2) * (100 cm)
2
) / (2.54 cm)
2
= 49,600 µW/cm2. (EQ 3)
So,
I
2
= ((32 µW/cm2) * (100 cm) 2) / (2.54 cm)
2
= 49,600 µW/cm2. (EQ 4)
This result is greater than four times the intensity needed to UV erase. Cypress flash is fully erased at these
intensities and wavelengths. More importantly, partial erasure and loss of chip functionality and/or any stored data
could occur at significantly lower, as low as 10% of the above exposure doses and higher (up to 4000A) UV light
wavelengths. Therefore, care should be taken to protect flash KGD, KTD, or wafers from exposure to UV
radiation.
Table 2. UV Radiation Rates
Ultraviolet Output
Lamp Number
Lamp (Watts)
Approximate
Lamp Current
(425 mA)
UV1
10
425
3.1
32
UV2
16
425
5.3
55
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Total (Watts)
Microwatts @ 1 meter
(Note 1)
Document No. 001-99112 Rev. *A
(Note 2)
3
KGD Assembly
Table 2. UV Radiation Rates
Ultraviolet Output
Lamp Number
Lamp (Watts)
Approximate
Lamp Current
(425 mA)
UV3
17
425
5.8
59
UV4
25
425
8.5
82
UV5
32
425
11.2
101
Total (Watts)
Microwatts @ 1 meter
(Note 1)
(Note 2)
Notes:
1. Ultraviolet output at 254 nanometers.
2. Microwatts per square centimeter at one meter from lamp.
5
Plasma Equipment
Plasma equipment used to clean modules during assembly also poses an erasure risk to flash KGD, KTD, or
wafers. Some of the gas mixtures and times (Table 3) used by Cypress for routine package assembly are known
to erase KGD, KTD, or wafer reference cells.
Cypress corrects this erasure during after-assembly test. If plasma clean is necessary during customer KGD,
KTD, or wafer assembly, equipment parameters must be relaxed. Cypress has conducted a small sample of
experiments to verify that exposures of less than 20 seconds minimize impact to KGD, KTD, or wafer reference
cells. Parameters are listed in Table 4.
Table 3. Cypress Inc. Plasma Clean Parameters
Plasma Clean Before WireBond
Power (W)
Time (sec)
Oxygen (SCCM)
Argon (SCCM)
Pressure (mT)
450
295
1
2
90
400
500
1
2
80
Time (sec)
Oxygen (SCCM)
Argon (SCCM)
Pressure (mT)
Plasma Clean Before Mold
Power (W)
415
450
6
10
115
390
190
3
5
95
Table 4. Cypress Recommendations for 20 Sec Exposure
6
Power (W)
Time (sec)
Oxygen (SCCM)
Argon (SCCM)
Pressure (mT)
200
20
8
8
240
100
20
17
17
240
Erasure Risk
X-Ray equipment used to inspect modules and/or boards during assembly also poses an erasure risk. Cypress
application note, Impact of X-Ray Inspection on Cypress Flash Memory addresses this issue. The publication
emphasizes the importance of keeping X-ray dosage limits at 10 rads or less.
7
Conclusion
This application note will be updated with further guidance as study of these issues progress. Given the sensitivity
of die to UV, plasma, or Radiation, however, extreme care should be taken to avoid damaging the die.
For further information on these issues, refer to the following:

Larry Gilg, Challenges in Bare Die Mounting. Die Products Consortium, Austin, Texas;

Raymond A. Pearson, Crack Initiation at Underfill/Passivation Interfaces. Lehigh University, October 2002.
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Document No. 001-99112 Rev. *A
4
KGD Assembly
Document History Page
Document Title: AN99112 - KGD Assembly
Document Number: 001-99112
Rev.
ECN No.
Orig. of
Change
**
–
–
*A
4929367
MSWI
www.cypress.com
Submission
Date
Description of Change
10/14/2005 to Initial version
03/28/2014 Removed the confidential mark.
Updated entire application note
10/27/2015
Updated in Cypress template
Document No. 001-99112 Rev. *A
5
KGD Assembly
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Document No. 001-99112 Rev. *A
6