AN99112 KGD Assembly AN99112 discusses the shipment methods, constraints regarding UV erase, plasma and radiation for die products not packaged and at risk of exposure to UV light, plasma clean or X-ray during module assembly. 1 Introduction Cypress ships a number of devices in die form. These products are referred to as Known Good Die (KGD). Cypress has offered KGD since 1990, with over 200 million sold since 1990. This application note is relevant for any die product not packaged and at risk of exposure to UV light, plasma clean, or X-ray during module assembly. In addition to KGD, Known Tested Die (KTD) and Non-Singulated Wafers are available for commercial and industrial applications. Special storage and handling conditions expected for KGD, KTD, and wafer products are outlined in Cypress application note Long Term Storage of Wafer and Die Semiconductor IC Products. This includes storage, handling, and processing issues that need to be considered. Market demand for automotive under-hood applications has driven Cypress KGD offering. These applications require sustained temperatures above 125°C. Such temperatures render plastics infeasible. Cypress offers KGD at 125°C for customers who prefer die form and can maintain temperature below 125°C. See Figure 1. Figure 1. S29CL032J (110 nm) KGD 3.3V, 32 Mb (1 Mb x 32), 62 MHz, 145°C KGD applications typically require 2.6V, 3V, 3.3V, and various densities. Cypress portfolio of KGD products are identified in Table 1. www.cypress.com Document No. 001-99112 Rev. *A 1 KGD Assembly Table 1. Devices Offering KGD Temperature AL AS S29AL016J S29AL008J S29AS016J S29AS008J CD/CL -40 to +85°C -40 to +125°C S29AL008J GL JL MS PL S29GL01GS S29GL512S S29GL256S S29GL128S S29GL256P S29GL128P S29GL064N S29GL032N S29JL064J S34MS04G2 S29PL127J S25FL116K S29CD032J S29CD016J S29CL016J S29CL032J -40 to +145°C 2 FL S25FL512S S25FL164K S25FL064P S25FL132K S25FL032P S25FL116K KGD, KTD, and Wafer Shipment Methods KGD, KTD, and wafer products are shipped using one of four methods (see Figure 2): GDP = Waffle Pack GDT = Surftape and Reel GDE = Embossed Tape and Reel GWJ = Wafer Jar Many customers prefer Surftape due to ease of assembly. Figure 3 is an example of die ejector equipment used to push and place packaged KGD or KTD in Surftape. See Packing and Packaging Handbook, for further specifications. Figure 2. KGD and KGW Shipping Methods Embossed Tape and Reel Surftape and Reel 2 2 70DTE 1600 STATES 252 800BB- QTY: 959 AM29F 905 8 OPN: DIFFUSION (P) P/N: OF RUN COUNTRY (IT) 8 OPN: (P) T000350 0106 OF 1600 RUN COUNTRY (IT) TOTAL: (Q) 1600 252 : STATES QTY: UNITED (Q) 0 LF7855 0 DIFFUSION (1P) NO: 905 P/N: NO: LOT D/C: (IT) (9D) 959 AM29F QTY: (IT) NO: T00035 0106 NO: LOT (IT) D/C: (9D) TOTAL: (Q) 1600 Lid (Q) (1P) -70DTE 800BB 1600 STATES UNITED(Q) LF78550 DIFFUSION: OF RUN COUNTRY Surftape & reel Dry Pack Bag, Evacuate & Seal Wafer Jar Dry pack bag KGD Label UNITED KGD Label 1600 (Q) (Q) T000350 0106 TOTAL: (Q) 0 1600 STATES UNITEDQTY: LF78550 DIFFUSION: NO: NO: LOT (IT) D/C: (9D) LF7855 : OF (IT) NO: 8 RUN COUNTRY T00035 0106 0 AM29F800BB 959 905 P/N: (1P) NO: 252 OPN: 1600 2 -70DTE (P) (IT) (9D) LOT D/C: Die Sale Label TOTAL: Waffle Pack Cushioning Material Die Sale Label 2 -70DTE 800BB 8 Spacer QTY: 0 : LF7855 0 DIFFUSION OF RUN COUNTRY Carrier Cover 1600 STATES UNITED (Q) 905 P/N: (1P) (IT) 252 959 AM29F OPN: (P) NO: T00035 0106 NO: LOT (IT) D/C: (9D) TOTAL: (Q) 1600 Water Bubble pack Lint-Free Paper Spacer Carrier Base Cushioning Material 1R box (32 mm - 56 mm) Container Main Body Carrier Clip (2 Req'd) Q-PACKTM Label 3684 3683 www.cypress.com Document No. 001-99112 Rev. *A 2 KGD Assembly In the following example of a die ejector system (Figure 3), die on the Surftape are dispensed with active side facing up. A push-up tool in the Surftape feeder lifts the chip from the sticky tape rails for transfer to the pick head on the assembly placement machine. Figure 3. Example of Die Ejector System 3 Constraints Regarding UV Erase, Plasma and Radiation Caution is necessary when using UV machines for curing or plasma equipment for cleaning. Most die or wafer products are only protected by a topside nitride passivation layer. KGD, KTD, and wafer products have the same constraints as SMT packages for X-Ray inspection. 4 UV Equipment Could Cause Erase Use only a 15 W sec/cm2 dosage to completely UV erase the contents of a KGD, KTD, or wafer. Obtain this dosage by exposure to an ultraviolet lamp wavelength of 2537 with intensity of 12,000 µW/cm2 for 15 to 20 minutes. The EPROM should be directly under and 1 inch from the source. Flash and EPROM are subject to the same guidelines. Below is a generic list of UV erasers that use the standard wavelength of 2537 Å. Using the lowest Wattage of 32 µW/cm2 at 1 meter, a conversion for intensity at 1 in is computed by the following equation: I1 * D12= I2 * D22, where D1 is 1 m or 100 cm and D2 is 1 in or 2.54 cm. (EQ 1) I 2 = I 1 * D 2 1 / D 2 (EQ 2) 2 So, I 2 = ((32 µW/cm2) * (100 cm) 2 ) / (2.54 cm) 2 = 49,600 µW/cm2. (EQ 3) So, I 2 = ((32 µW/cm2) * (100 cm) 2) / (2.54 cm) 2 = 49,600 µW/cm2. (EQ 4) This result is greater than four times the intensity needed to UV erase. Cypress flash is fully erased at these intensities and wavelengths. More importantly, partial erasure and loss of chip functionality and/or any stored data could occur at significantly lower, as low as 10% of the above exposure doses and higher (up to 4000A) UV light wavelengths. Therefore, care should be taken to protect flash KGD, KTD, or wafers from exposure to UV radiation. Table 2. UV Radiation Rates Ultraviolet Output Lamp Number Lamp (Watts) Approximate Lamp Current (425 mA) UV1 10 425 3.1 32 UV2 16 425 5.3 55 www.cypress.com Total (Watts) Microwatts @ 1 meter (Note 1) Document No. 001-99112 Rev. *A (Note 2) 3 KGD Assembly Table 2. UV Radiation Rates Ultraviolet Output Lamp Number Lamp (Watts) Approximate Lamp Current (425 mA) UV3 17 425 5.8 59 UV4 25 425 8.5 82 UV5 32 425 11.2 101 Total (Watts) Microwatts @ 1 meter (Note 1) (Note 2) Notes: 1. Ultraviolet output at 254 nanometers. 2. Microwatts per square centimeter at one meter from lamp. 5 Plasma Equipment Plasma equipment used to clean modules during assembly also poses an erasure risk to flash KGD, KTD, or wafers. Some of the gas mixtures and times (Table 3) used by Cypress for routine package assembly are known to erase KGD, KTD, or wafer reference cells. Cypress corrects this erasure during after-assembly test. If plasma clean is necessary during customer KGD, KTD, or wafer assembly, equipment parameters must be relaxed. Cypress has conducted a small sample of experiments to verify that exposures of less than 20 seconds minimize impact to KGD, KTD, or wafer reference cells. Parameters are listed in Table 4. Table 3. Cypress Inc. Plasma Clean Parameters Plasma Clean Before WireBond Power (W) Time (sec) Oxygen (SCCM) Argon (SCCM) Pressure (mT) 450 295 1 2 90 400 500 1 2 80 Time (sec) Oxygen (SCCM) Argon (SCCM) Pressure (mT) Plasma Clean Before Mold Power (W) 415 450 6 10 115 390 190 3 5 95 Table 4. Cypress Recommendations for 20 Sec Exposure 6 Power (W) Time (sec) Oxygen (SCCM) Argon (SCCM) Pressure (mT) 200 20 8 8 240 100 20 17 17 240 Erasure Risk X-Ray equipment used to inspect modules and/or boards during assembly also poses an erasure risk. Cypress application note, Impact of X-Ray Inspection on Cypress Flash Memory addresses this issue. The publication emphasizes the importance of keeping X-ray dosage limits at 10 rads or less. 7 Conclusion This application note will be updated with further guidance as study of these issues progress. Given the sensitivity of die to UV, plasma, or Radiation, however, extreme care should be taken to avoid damaging the die. For further information on these issues, refer to the following: Larry Gilg, Challenges in Bare Die Mounting. Die Products Consortium, Austin, Texas; Raymond A. Pearson, Crack Initiation at Underfill/Passivation Interfaces. Lehigh University, October 2002. www.cypress.com Document No. 001-99112 Rev. *A 4 KGD Assembly Document History Page Document Title: AN99112 - KGD Assembly Document Number: 001-99112 Rev. ECN No. Orig. of Change ** – – *A 4929367 MSWI www.cypress.com Submission Date Description of Change 10/14/2005 to Initial version 03/28/2014 Removed the confidential mark. Updated entire application note 10/27/2015 Updated in Cypress template Document No. 001-99112 Rev. *A 5 KGD Assembly Worldwide Sales and Design Support Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturers’ representatives, and distributors. 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The inclusion of Cypress' product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. www.cypress.com Document No. 001-99112 Rev. *A 6