GSDC209C 209-Bump BGA (14 mm x 22 mm) Daisy Chain Package Description This mechanical daisy chain test vehicle is designed to represent the 209-Bump BGA package. It is used for second level interconnect assembly test and continuity verification. Package Dimensions—209-Bump BGA (Package C) 14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array Ø0.10 M C Ø0.30 M C A B A1 CORNER 2 3 4 5 6 7 11 8 10 Ø0.50~0.70 (209x) 9 8 7 6 5 9 10 11 22.0 1.0 1.0 A B C D E F G H J K L M N P R T U V W 1.0 B 4 3 2 1 A B C D E F G H J K L M N P R T U V W 18.0 1 TOP VIEW BOTTOM VIEW 1.0 10.0 A 14.0 0.15 C 0.20(4x) SEATING PLANE 0.40~0.60 1.70 MAX. C Rev: 1.02 12/2005 1/3 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2004, GSI Technology GSDC209C 209 BGA Interconnection Diagram 1 2 3 4 5 6 7 8 9 10 11 A B C D E F G H J K L M N P R T U V W Rev: 1.02 12/2005 2/3 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2004, GSI Technology GSDC209C Ordering Information 209-Bump BGA (14 mm x 22 mm) Daisy Chain Package GSDC209C Package Designator Ball Count Daisy Chain GSI Technology 209-Bump BGA (14 mm x 22 mm) Daisy Chain Package RoHS-compliant Option GSDC209GC Package Designator RoHS-compliance designator Ball Count Daisy Chain GSI Technology Rev: 1.02 12/2005 3/3 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2004, GSI Technology