2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO x10 QUAD FIFO or x10/x20 DUAL FIFO CONFIGURATIONS 32,768 x 10 x 4/16,384 x 20 x 2 65,536 x 10 x 4/32,768 x 20 x 2 131,072 x 10 x 4/65,536 x 20 x 2 • • • FEATURES • • • • Choose from among the following memory organizations: IDT72T54242 - 32,768 x 10 x 4/32,768 x 10 x 2 IDT72T54252 - 65,536 x 10 x 4/65,536 x 10 x 2 IDT72T54262 - 131,072 x 10 x 4/131,072 x 10 x 2 User Selectable Quad / Dual Mode - Choose between two or four independent FIFOs Quad Mode offers - Eight discrete clock domain, (four write clocks & four read clocks) - Four separate write ports, write data to four independent FIFOs - 10-bit wide write ports - Four separate read ports, read data from any of four independent FIFOs - Independent set of status flags and control signals for each FIFO Dual Mode offers - Four discrete clock domain, (two write clocks & two read clocks) - Two separate write ports, write data to two independent FIFOs - 10-bit/20-bit wide write ports - Two separate read ports, read data from any of two independent FIFOs - Independent set of status flags and control signals for each FIFO - Bus-Matching on read and write port x10/x20 - Maximum depth of each FIFO is the same as in Quad Mode • • • • • • • • • • • • • • • IDT72T54242 IDT72T54252 IDT72T54262 Up to 200MHz operating frequency or 2Gbps throughput in SDR mode Up to 100MHz operating frequency or 2Gbps throughput in DDR mode Double Data Rate, DDR is selectable, providing up to 400Mbps bandwidth per data pin User selectable Single or Double Data Rate modes on both the write port(s) and read port(s) All I/Os are LVTTL/ HSTL/ eHSTL user selectable 3.3V tolerant inputs in LVTTL mode ERCLK and EREN Echo outputs on all read ports Write enable WEN and Chip Select WCS input for each write port Read enable REN and Chip Select RCS input for each read port User Selectable IDT Standard mode (using EF and FF) or FWFT mode (using IR and OR) Programmable Almost Empty and Almost Full flags per FIFO Dedicated Serial Port for flag offset programming Power Down pin minimizes power consumption 2.5V Supply Voltage Available in a 324-pin PBGA, 1mm pitch, 19mm x 19mm IEEE 1149.1 compliant JTAG port provides boundary scan function Low Power, High Performance CMOS technology Industrial temperature range (-40°°C to +85°°C) FUNCTIONAL BLOCK DIAGRAMS Quad Mode FIFO 0 Data In WCLK0 WEN0 WCS0 D[9:0] RCLK0 REN0 RCS0 OE0 ERCLK0 EREN0 32,768 x 10 65,536 x 10 131,072 x 10 x10 x10 FIFO 1 Data In D[19:10] 32,768 x 10 65,536 x 10 131,072 x 10 x10 x10 FIFO 2 Data In D[29:20] 32,768 x 10 65,536 x 10 131,072 x 10 x10 x10 WCLK3 WEN3 32,768 x 10 65,536 x 10 131,072 x 10 x10 Q[29:20] RCLK3 REN3 RCS3 OE3 ERCLK3 EREN3 FIFO 2 FIFO 3 WCS3 Data In D[39:30] FIFO 1 Q[19:10] Data Out RCLK2 REN2 RCS2 OE2 ERCLK2 EREN2 FIFO 1 WCLK2 WEN2 WCS2 FIFO 0 Data Out RCLK1 REN1 RCS1 OE1 ERCLK1 EREN1 FIFO 0 WCLK1 WEN1 WCS1 Q[9:0] x10 Q[39:30] FIFO 2 Data Out FIFO 3 Data Out Write Port Flag Outputs FF0/IR0 PAF0 FF1/IR1 PAF1 FF2/ IR2 PAF2 FF3/IR3 PAF3 Read Port Flag Outputs FIFO 3 6158 drw01 EF0/OR0 PAE0 EF1/OR1 PAE1 EF2/OR2 PAE2 EF3/OR3 PAE3 (See next page for Dual Mode) IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. The TeraSync is a trademark of Integrated Device Technology, Inc. COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES 2005 MARCH 2005 1 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. DSC-6158/3 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES FUNCTIONAL BLOCK DIAGRAMS (CONTINUED) Dual Mode WCLK0 WEN0 WCS0 FIFO 0 Data In D[19:0] 32,768 x 10/16,384 x 20 65,536 x 10/32,768 x 20 131,072 x 10/65,536 x 20 x10 or x20 FF2/IR2 PAF2 x10 or x20 FIFO 2 Read Port Flag Outputs PAF0 x10 or x20 FIFO 0 Data Out Q[19:0] RCLK2 REN2 RCS2 OE2 ERCLK2 EREN2 32,768 x 10/16,384 x 20 65,536 x 10/32,768 x 20 131,072 x 10/65,536 x 20 Write Port Flag Outputs FF0/IR0 x10 or x20 FIFO 0 WCLK2 WEN2 WCS2 FIFO 2 Data In D[39:20] RCLK0 REN0 RCS0 OE0 ERCLK0 EREN0 Q[39:20] FIFO 2 Data Out EF0/OR0 PAE0 EF2/OR2 PAE2 6158 drw02 2 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES Table of Contents Features ......................................................................................................................................................................................................................... 1 Description ...................................................................................................................................................................................................................... 4 Pin Configuration ............................................................................................................................................................................................................. 6 Pin Descriptions ............................................................................................................................................................................................................... 7 Device Characteristics ................................................................................................................................................................................................... 11 DC Electrical Characteristics .......................................................................................................................................................................................... 12 AC Electrical Characteristics ........................................................................................................................................................................................... 14 AC Test Conditions ........................................................................................................................................................................................................ 15 Functional Description ................................................................................................................................................................................................... 17 Signal Descriptions ........................................................................................................................................................................................................ 23 JTAG Timing Specifications ............................................................................................................................................................................................ 29 List of Tables Table 1 — Device Configuration .................................................................................................................................................................................... 17 Table 2 — Default Programmable Flag Offsets ................................................................................................................................................................ 17 Table 3 — Status Flags for IDT Standard mode ............................................................................................................................................................. 20 Table 4 — Status Flags for FWFT mode ........................................................................................................................................................................ 20 Table 5 — I/O Voltage Level Associations ....................................................................................................................................................................... 21 Table 6 — TSKEW Measurement ................................................................................................................................................................................... 27 List of Figures Figure 1. Quad/Dual Block Diagram ................................................................................................................................................................................ 5 Figure 2a. AC Test Load ................................................................................................................................................................................................ 15 Figure 2b. Lumped Capacitive Load, Typical Derating ................................................................................................................................................... 15 Figure 3. Programmable Flag Offset Programming Methods ........................................................................................................................................... 18 Figure 4. Offset Registers Serial Bit Sequence ................................................................................................................................................................ 19 Figure 5. Bus-Matching in Dual mode ............................................................................................................................................................................ 22 Figure 6. Echo Read Clock and Data Output Relationship .............................................................................................................................................. 27 Figure 7. Standard JTAG Timing ................................................................................................................................................................................... 28 Figure 8. JTAG Architecture ........................................................................................................................................................................................... 29 Figure 9. TAP Controller State Diagram ......................................................................................................................................................................... 30 Figure 10. Master Reset Timing ..................................................................................................................................................................................... 33 Figure 11. Partial Reset Timing ...................................................................................................................................................................................... 34 Figure 12. Write Cycle and Full Flag Timing (Quad mode, IDT Standard mode, SDR to SDR) ....................................................................................... 35 Figure 13. Write Cycle and Full Flag Timing (Quad mode, IDT Standard mode, DDR to DDR) ....................................................................................... 36 Figure 14. Write Cycle and Full Flag Timing (Dual mode, IDT Standard mode, DDR to SDR, x10 In to x20 Out) ............................................................ 37 Figure 15. Write Cycle and Full Flag (Dual mode, IDT Standard mode, SDR to DDR, x20 In to x10 Out) ....................................................................... 38 Figure 16. Write Cycle and Output Ready Timing (Quad mode, FWFT mode, SDR to SDR) .......................................................................................... 39 Figure 17. Write Cycle and Output Ready Timing (Quad mode, FWFT mode, DDR to DDR) .......................................................................................... 40 Figure 18. Read Cycle, Output Enable and Empty Flag Timing (Quad mode, IDT Standard mode, SDR to SDR) ........................................................... 41 Figure 19. Read Cycle, Output Enable and Empty Flag Timing (Quad mode, IDT Standard mode, DDR to DDR) .......................................................... 42 Figure 20. Read Cycle and Empty Flag Timing (Dual mode, IDT Standard mode, DDR to SDR, x20 In to x10 Out) ....................................................... 43 Figure 21. Read Cycle and Empty Flag Timing (Dual mode, IDT Standard mode, SDR to DDR, x10 In to x20 Out) ....................................................... 44 Figure 22. Read Timing and Output Ready Flag (Quad mode, FWFT mode, SDR to SDR) ........................................................................................... 45 Figure 23. Read Timing and Output Ready Timing (Quad mode, FWFT mode, DDR to DDR) ........................................................................................ 46 Figure 24. Read Cycle and Read Chip Select (Quad mode, IDT Standard mode, SDR to SDR) .................................................................................... 47 Figure 25. Read Cycle and Read Chip Select Timing (Quad mode, FWFT mode, SDR to SDR) .................................................................................... 48 Figure 26. Echo Read Clock and Read Enable Operation (Quad mode, IDT Standard mode, DDR to DDR) ................................................................. 49 Figure 27. Echo RCLK and Echo Read Enable Operation (Quad mode, FWFT mode, SDR to SDR) ............................................................................. 50 Figure 28. Echo Read Clock and Read Enable Operation (Quad mode, IDT Standard mode, SDR to SDR) .................................................................. 51 Figure 29. Loading of Programmable Flag Registers (IDT Standard and FWFT modes) ................................................................................................ 52 Figure 30. Reading of Programmable Flag Registers (IDT Standard and FWFT modes) ................................................................................................ 52 Figure 32. Synchronous Programmable Almost-Empty Flag Timing (Quad mode, IDT Standard and FWFT mode, SDR to SDR) ................................... 53 Figure 31. Synchronous Programmable Almost-Full Flag Timing (Quad mode, IDT Standard and FWFT mode, SDR to SDR) ....................................... 53 Figure 33. Asynchronous Programmable Almost-Full Flag Timing (Quad mode, IDT Standard and FWFT mode, SDR to SDR) ...................................... 54 Figure 34. Asynchronous Programmable Almost-Empty Flag Timing (Quad mode, IDT Standard and FWFT mode, SDR to SDR) .................................. 54 Figure 35. Power Down Operation ................................................................................................................................................................................ 55 3 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES mode, the input clock can operate up to 200MHz. Data will transition/latch on the rising edge of the clock. In DDR mode, the input clock can operate up to 100 MHz, with data transitioning/latched on both rising and falling edges of the clock. The advantage of DDR is that it can achieve the same throughput as SDR with only half the number of bits, assuming the frequency is constant. For example, a 4Gbps throughput in SDR is 100MHz x 40 bits. In DDR mode, it is 100MHz x 20 bits, because two bits transition per clock cycle. All Read ports provide the user with a dedicated Echo Read Enable, EREN and Echo Read Clock, ERCLK output. These outputs aid in high speed applications where synchronization of the input clock and data of receiving device is critical. Otherwise known as “Source Synchronous Clocking,” the echo outputs provide tighter synchronization of the data transmitted from the FIFO and the read clock interfacing the FIFO outputs. A Master Reset input is provided and all setup and configuration pins are latched with respect to a Master Reset pulse. For example, the mode of operation, bus-matching, and data rate are selected at Master Reset. A Partial Reset is provided for each internal FIFO. When a Partial Reset is performed on a FIFO the read and write pointers of that FIFO are reset to the first memory location. The flag offset values, timing modes, and initial configurations are retained. The Quad/Dual device has the capability of operating its I/O at either 2.5V LVTTL, 1.5V HSTL or 1.8V eHSTL levels. A Voltage Reference, Vref input is provided for HSTL and eHSTL interfaces. The type of I/O is selected via the IOSEL pin. The core supply voltage of the device, VCC is always 2.5V, however the output pins have a separate supply, VDDQ which can be 2.5V, 1.8V, or 1.5V. The inputs of this device are 3.3V tolerant when VDDQ is set to 2.5V. The device also offers significant power savings, most notably achieved by the presence of a Power Down input, PD. A JTAG test port is provided. The Quad/Dual device has a fully functional Boundary Scan feature, compliant with IEEE 1149.1 Standard Test Access Port and Boundary Scan Architecture. DESCRIPTION The IDT72T54242/72T54252/72T54262 Quad/Dual TeraSync FIFO devices are ideal for many applications where data stream convergence and parallel buffering of multiple data paths are required. These applications may include communication systems such as data bandwidth aggregation, data acquisition systems and medical equipment, etc. The Quad/Dual FIFO allows the user to select either two or four individual internal FIFOs for operation. Each internal FIFO has its own discrete read and write clock, independent read and write enables, and separate status flags. The density of each FIFO is fixed. If Quad mode is selected, there will be a total of eight clock domains, four read and four write clocks. Data can be written into any of the four write ports totally independent of any other port, and can be read out of any of the four read ports corresponding to their respective write port. Each port has its own control enables and status flags and is 10 bits wide. The device functions as four separate 10-bit wide FIFOs. If Dual mode is selected, there will be a total of four clock domains, two read and two write clocks. Data can be written into any of the two write ports totally independent of any other port, and can be read out of any of the two read ports corresponding to their respective write port. Each port has its own control enables and status flags. All input and output ports have bus-matching capabilities of x10 or x20 bits wide. As typical with most IDT FIFOs, two types of data transfer are available, IDT Standard mode and First Word Fall Through (FWFT) mode. This affects the device operation and also the flag outputs. The device provides eight flag outputs per input and output port. A dedicated Serial Clock is used for programming the flag offsets. This clock is also used for reading the offset values. The serial read and write operations are performed via the SCLK, FWFT/SI, SWEN, SREN, and SDO pins. The flag offsets can also be programmed using the JTAG port. If this option is selected, the SCLK, SWEN, and SREN pins must be disabled. The Quad/Dual device offers a maximum throughput of 2Gbps per port, with selectable SDR or DDR data transfer modes for the inputs and outputs. In SDR 4 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES D0 - D39 (x10, x20, or x40) INPUT DEMUX IW[1:0] WDDR *WEN0 *WSC0 *WCLK0 *PAF0 *FF0 CFF SCLK SWEN SREN SDI SDO RDDR REN0* RSC0* RCLK0* 10 Write Control Logic Read Control Logic Write Pointer Read Pointer RAM ARRAY Status Flag Logic Status Flag Logic 8,192 x 40 16,384 x 40 32,768 x 40 Programmable Flag Control Echo Outputs FSEL[1:0] PFM HSTL I/O Control MRS PRS Reset Logic TCK TRST TMS TDI TDO JTAG Control (Boundary Scan) 10 OW[1:0] OUTPUT MUX PAE0* EF0* CEF ERCLK0* EREN0* IOSEL OE0* Q0 - Q39 (x10, x20, or x40) 6158 drw03A NOTES: 1. This block diagram only shows the architecture for FIFO 0. There are a total of four FIFOs inside this device all with the identical architecture. 2. *Denotes dedicated signal for each internal FIFO inside the device. Figure 1. Quad/Dual Block Diagram 5 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES PIN CONFIGURATION A1 BALL PAD CORNER A D0 D1 D2 VREF MRS PRS0 PRS1 PRS2 VCC GND VDDQ PRS3 OE0 OE1 D3 D4 D5 GND MD FSEL0 RDDR GND VCC GND VDDQ PD TDI SCLK D6 D7 D8 D9 FSEL1 OW WDDR IW VCC GND VDDQ GND TCK TMS TRST D10 D11 D12 PFM IOSEL VCC GND GND VCC GND VDDQ VDDQ VDDQ VDDQ D13 D14 D15 GND VCC VCC VCC VCC VCC GND VDDQ VDDQ VDDQ WCLK0 D16 D17 VCC VCC GND GND GND GND GND GND GND WCLK1 D18 D19 VCC VCC GND GND GND GND GND GND WCLK2 D20 D21 VCC VCC GND GND GND GND GND WCLK3 D22 D23 VCC VCC GND GND GND GND D26 D25 D24 VCC VCC GND GND GND D29 D28 D27 VCC VCC GND GND D32 D31 D30 VCC VCC GND D35 D34 D33 VCC VCC D38 D37 D36 VCC VCC WEN2 WEN3 D39 VCC VCC WCS3 WEN0 WEN1 FF0 WCS0 WCS1 WCS2 GND GND PAE0 OE2 OE3 Q0 Q1 TDO Q2 SWEN SDO Q3 VDDQ Q6 Q5 Q4 VDDQ VDDQ Q9 Q8 Q7 GND VDDQ VDDQ Q12 Q11 Q10 GND GND VDDQ VDDQ Q15 Q14 Q13 GND GND GND VDDQ VDDQ Q18 Q17 Q16 GND GND GND GND VDDQ VDDQ EREN1 EREN0 Q19 GND GND GND GND GND VDDQ VDDQ EREN2 EREN3 Q20 GND GND GND GND GND GND VDDQ VDDQ Q21 Q22 Q23 GND GND GND GND GND GND GND VDDQ VDDQ Q24 Q25 Q26 GND GND GND GND GND GND GND GND VDDQ Q27 Q28 Q29 VCC VCC VCC GND VDDQ VDDQ VDDQ VDDQ VDDQ Q30 Q31 Q32 VCC VCC VCC GND GND VDDQ VDDQ VDDQ VDDQ VDDQ Q33 Q34 ERCLK0 PAF1 NC PAF2 VCC GND FF2 PAF3 GND RCS1 REN2 Q35 Q36 Q37 ERCLK1 PAF0 EF1 NC EF2 VCC GND PAE3 FF3 RCS3 RCS0 REN1 REN0 Q38 Q39 ERCLK2 EF0 PAE1 FF1 PAE2 VCC GND EF3 GND RCS2 REN3 RCLK3 RCLK2 RCLK1 8 9 11 12 B SREN FWFT/SI C D E F G H J K L M N VDDQ P GND R T U V 1 2 3 4 5 6 7 10 13 14 15 16 RCLK0 ERCLK3 17 18 6158 drw03B NOTE: 1. NC = No Connection. PBGA (BB324-1, order code: BB) TOP VIEW 6 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES PIN DESCRIPTIONS Symbol Name I/O Type Description D[39:0] Data Input Bus HSTL-LVTTL These are the data inputs for the device. Data is written into the part via these inputs using the respective INPUT write port clocks and enables. In Quad mode, these inputs provide four separate busses to the four separate FIFOs. D[9:0] is FIFO[0], D[19:10] is FIFO[1], D[29:20] is FIFO[2], D[39:30] is FIFO[3]. In Dual mode, these inputs provide two separate busses to the two separate FIFOs. D[19:0] is FIFO[0], D[39:20] is FIFO[2]. Any unused inputs should be tied to GND. EF0/1/2/3, OR0/1/2/3 Empty Flag 0/1/2/3 or Output Ready Flags 0/1/2/3 HSTL-LVTTL These are the Empty Flags (IDT Standard mode) or Output Ready Flag (FWFT mode) corresponding OUTPUT(1) to each of the four FIFOs on the read port. If Dual mode is selected EF1/OR1 and EF3/OR3 are not used and can be left floating. ERCLK0/1/2/3 Echo Read Clock 0/1/2/3 HSTL-LVTTL These are the echo clock outputs corresponding to each of the four FIFOs on the read port. The OUTPUT(1) echo read clock is guaranteed to transition after the slowest output data switching. If Dual mode is selected ERCLK1 and ERCLK3 are not used and can be left floating EREN0/1/2/3 Echo Read Enable 0/1/2/3 HSTL-LVTTL These are the echo read enable outputs corresponding to each of the four FIFOs on the read port. OUTPUT(1) The echo read enable is synchronous to the RCLK input and is active when a read operation has occurred and a new word has been placed onto the data output bus. If Dual mode is selected EREN1 and EREN3 are not used and can be left floating. FF0/1/2/3, IR0/1/2/3 Full Flags 0/1/2/3 or HSTL-LVTTL These are the Full Flags (IDT Standard mode) and Input Ready Flags (FWFT mode) corresponding Input Ready Flags OUTPUT(1) to each of the four FIFOs on the read port. If Dual mode is selected FF1/IR1 and FF3/IR3 are not 0/1/2/3 used and can be left floating. Flag Select HSTL-LVTTL Flag select default offset pins. During master reset, the FSEL pins are used to select one of four default INPUT PAE and PAF offsets. Both the PAE and the PAF offsets are programmed to the same value. Values are: 00 = 7; 01 = 63; 10 = 127; 11 = 1023. The offset value selected is supplied to all internal FIFOs. First Word Fall HSTL-LVTTL During Master Reset, FWFT=1 selects First Word Fall Through mode, FWFT=0 selects IDT Standard Through/ Serial INPUT mode. After Master Reset this pin is used for the Serial Data input for the programming of the PAE and Input PAF flag's offset registers. FSEL [1:0] FWFT/SI IOSEL I/O Select CMOS(2) INPUT IW Input Width CMOS(2) INPUT MD Mode CMOS(2) INPUT MRS Master Reset HSTL-LVTTL This input provides a full device reset. All set-up pins are latched based on a master reset operation. INPUT Read and write pointers will be reset to the first location memory. All flag offsets are cleared and reset to default values determined by FSEL[1:0]. OE0/1/2/3 Output Enable 0/1/2/3 HSTL-LVTTL These are the output enables corresponding to each individual FIFO on the read port. All data outputs INPUT will be placed into High Impedance if this pin is High. These inputs are asynchronous. If Dual mode is selected OE1 and OE3 are not used and should be tied to VCC. OW Output Width PAE0/1/2/3 Programmable Almost-Empty Flags 0/1/2/3 HSTL-LVTTL These are the programmable almost empty flags that can be used as an early indicator for the empty OUTPUT(1) boundary of each FIFO. The PAE flags can be set to one of four default offsets determined by the state of FSEL0 and FSEL1 during master reset. The PAE offset value can also be written and read from serially by either the JTAG port or the serial programming pins (SCLK, SI, SDO, SWEN, SREN). This flag can operate in synchronous or asynchronous mode depending on the sate of the PFM pin during master reset. If Dual mode is selected PAE1 and PAE3 are not used and can be left floating. PAF0/1/2/3 Programmable Almost-Full Flags 0/1/2/3 HSTL-LVTTL These are the programmable almost full flags that can be used as an early indicator for the full OUTPUT(1) boundary of each FIFO. The PAF flags can be set to one of four default offsets determined by the state of FSEL0 and FSEL1 during master reset. The PAF offset value can also be written and read from serially by either the JTAG port or the serial programming pins (SCLK, SI, SDO, SWEN, SREN). CMOS(2) INPUT This input determines whether the inputs will operate in LVTTL or HSTL/eHSTL mode. If IOSEL pin is HIGH, then all inputs and outputs that are designated "LVTTL or HSTL" in this section will be set to HSTL. If IOSEL is LOW then LVTTL is selected. This signal must be tied to either VCC or GND for proper operation. If Dual mode is selected , this pin is used during master reset to select the input word width bus size for the device. 0 = x10; 1 = x20. If Quad mode is selected the input word width will be x10 regardless of IW. IW must be tied to VCC or GND and cannot be left floating. This mode selection pin is used during master reset to select either Quad or Dual mode operation. A HIGH on this pin selects Quad mode, a LOW selects Dual mode. If Dual mode is selected, this pin is used during master reset to select the output word width bus size for the device. 0 = x10; 1 = x20. If Quad mode is selected the output word width will be x10 regardless of OW. OW must be tied to VCC or GND and cannot be left floating. 7 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES PIN DESCRIPTIONS (CONTINUED) Symbol Name I/O Type Description PAF0/1/2/3 (Continued) Programmable HSTL-LVTTL This flag can operate in synchronous or asynchronous mode depending on the sate of the PFM pin Almost-Full Flags0-3 OUTPUT(1) during master reset. If Dual mode is selected PAF1 and PAF3 are not used and can be left floating. PD Power Down PFM Programmable Flag Mode PRS0/1/2/3 Partial Reset HSTL-LVTTL These are the partial reset inputs for each internal FIFO. The read, write, flag pointers, and output INPUT registers will all be set to zero when partial reset is activated. During partial reset, the existing mode (IDT or FWFT), input/output bus width and rate mode, and the programmable flag settings are all retained. If Dual mode is selected, PRS1 and PRS3 are not used and should be tied to VCC. Q[39:0] Data Output Bus HSTL-LVTTL These are the Data Outputs for the device. Data is read from the part via these outputs using the OUTPUT(1) respective read port clocks and enables. In Quad mode, these outputs provide four separate busses from the four separate FIFO's. Q[9:0] is FIFO[0], Q[19:10] is FIFO[1], Q[29:20] is FIFO[2], Q[39:30] is FIFO[3]. In Dual mode these outputs provide two separate busses from the two separate FIFO's. Q[19:0] is FIFO[0] and Q[39:20] is FIFO[2]. RCLK0/1/2/3 Read Clock 0/1/2/3 HSTL-LVTTL These are the clock inputs corresponding to each of the four FIFOs on the read port. If Dual mode INPUT is selected then RCLK1 and RCLK3 are not used and should be tied to GND. In SDR mode data will be accessed on the rising edge of RCLK when REN and RCS are LOW at the rising edge of RCLK. In DDR mode data will be accessed on both rising and falling edge of RCLK when REN is LOW. RCS0/1/2/3 Read Chip Select HSTL-LVTTL These are the read chip select inputs corresponding to each of the four FIFOs on the read port. This INPUT pin provides synchronous control of the read port and high impedance control of the output data bus. RCS is only sampled on the rising edge of RCLK. During master or partial reset this input is a don’t care, if OE is LOW the data inputs will be in Low-Impedance regardless of the state of RCS. If Dual mode is selected then RCS1 and RCS3 are not used and should be tied to VCC. REN0/1/2/3 Read Enable HSTL-LVTTL These are the read enable inputs corresponding to each of the four FIFOs on the read port. In SDR, INPUT when this signal (and RCS) are LOW data will be sent from the FIFO memory to the output bus on every rising edge of RCLK. In DDR mode, data will be accessed on both rising and falling edges of RCLK. Note in DDR mode the REN and RCS are only sampled on the rising edge of RCLK. New data will always begin from the rising edge not the falling edge of RCLK. If Dual mode is selected then REN1 and REN3 are not used and should be tied to VCC. RDDR Read Port DDR SCLK Serial Clock SDO Serial Data SREN Serial Read Enable HSTL-LVTTL When SREN is brought LOW before the rising edge of SCLK, the contents of the PAE and PAF INPUT offset registers are copied to a serial shift register. While SREN is maintained LOW, on each rising edge of SCLK, one bit of data is shifted out of this serial shift register through the SDO output pin. If programming of the PAE/PAF offset registers is done via the JTAG port, this input must be tied HIGH. SWEN Serial Write Enable HSTL-LVTTL This input provides considerable power saving in HSTL/eHSTL mode. If this pin is low, the input INPUT level translators for all the data input pins, clocks and non-essential control pins are turned off. When PD is brought high, power-up sequence timing will have to be adhered to before the inputs will be recognized. It is essential that the user respect these conditions when powering down the part and powering up the part, so as to not produce runt pulses or glitches on the clocks if the clocks are free running. PD does not provide any power consumption savings when the inputs are configured for LVTTL. CMOS(2) INPUT During master reset, a HIGH on PFM selects synchronous PAE/PAF flag timing, a Low during master reset selects asynchronous PAE/PAF flag timing. This pin controls all PAE/PAF flag outputs. CMOS(2) INPUT During master reset, this pin selects the output port to operate in DDR or SDR format. If RDDR is HIGH, then a word is read on the rising and falling edge of the appropriate RCLK0, 1, 2 and 3 input. If RDDR is LOW, then a word is read only on the rising edge of the appropriate RCLK0, 1, 2 and 3 inputs. HSTL-LVTTL Serial clock for writing and reading the PAE and PAF offset registers. On the rising edge of each INPUT SCLK, when SWEN is low, one bit of data is shifted into the PAE and PAF registers. On the rising edge of each SCLK, when SREN is low, one bit of data is shifted out of the PAE and PAF offset registers. The reading of the PAE and PAF registers is non-destructive. If programming of the PAE/PAF offset registers are done via the JTAG port, this input must be tied to VCC. LVTTL OUTPUT(1) This output is used to read data from the programmable flag offset registers. It is used in conjunction with the SREN and SCLK signals. HSTL-LVTTL On each rising edge of SCLK when SWEN is LOW, data from the FWFT/SI pin is serially loaded INPUT into the PAE and PAF registers. If programming of the PAE/PAF offset registers is done via the JTAG port, this input must be tied HIGH. 8 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES PIN DESCRIPTIONS (CONTINUED) Symbol Name I/O Type Description TCK(3) JTAG Clock HSTL-LVTTL Clock input for JTAG function. One of four terminals required by IEEE Standard 1149.1-1990. Test INPUT operations of the device are synchronous to TCK. Data from TMS and TDI are sampled on the rising edge of TCK and outputs change on the falling edge of TCK. If the JTAG function is not used this signal needs to be tied to GND. TDI(3) JTAG Test Data Input HSTL-LVTTL One of four terminals required by IEEE Standard 1149.1-1990. During the JTAG boundary scan INPUT operation, test data serially loaded via the TDI on the rising edge of TCK to either the Instruction Register, ID Register and Bypass Register. An internal pull-up resistor forces TDI HIGH if left unconnected. TDO(3) JTAG Test Data Output HSTL-LVTTL One of four terminals required by IEEE Standard 1149.1-1990. During the JTAG boundary scan OUTPUT operation, test data serially loaded output via the TDO on the falling edge of TCK from either the Instruction Register, ID Register and Bypass Register. This output is high impedance except when shifting, while in SHIFT-DR and SHIFT-IR controller states. TMS(3) JTAG Mode Select HSTL-LVTTL TMS is a serial input pin. One of four terminals required by IEEE Standard 1149.1-1990. TMS directs INPUT the device through its TAP controller states. An internal pull-up resistor forces TMS HIGH if left unconnected. TRST(3) JTAG Reset HSTL-LVTTL TRST is an asynchronous reset pin for the JTAG controller. The JTAG TAP controller does not INPUT automatically reset upon power-up, thus it must be reset by either this signal or by setting TMS= HIGH for five TCK cycles. If the TAP controller is not properly reset then the FIFO outputs will always be in high-impedance. If the JTAG function is used but the user does not want to use TRST, then TRST can be tied with MRS to ensure proper FIFO operation. If the JTAG function is not used then this signal needs to be tied to GND. An internal pull-up resistor forces TRST HIGH if left unconnected. WCLK0/1/2/3 Write Clock 0/1/2/3 HSTL-LVTTL These are the clock inputs corresponding to each of the four FIFOs on the write port. If Dual mode INPUT is selected then WCLK1 and WCLK3 are not used and should be tied to GND. In SDR mode data will be written on the rising edge of WCLK when WEN and WCS are LOW at the rising edge of WCLK. In DDR mode data will be written on both rising and falling edge of WCLK when WEN and WCS are LOW at the rising edge of WCLK. WCS0/1/2/3 Write Chip Select HSTL-LVTTL These are the write chip select inputs corresponding to each of the four FIFOs on the write port. This INPUT pin can be regarded as a second write enable input, enabling/disabling write operations. WCS is only sampled on the rising edge of WCLK. If Dual mode is selected then WCS1 and WCS3 are not used and should be tied to VCC. WDDR Write Port DDR WEN0/1/2/3 Write Enable 0/1/2/3 HSTL-LVTTL These are the write enable inputs corresponding to each of the four FIFOs on the write port. In SDR, INPUT when this signal (and WCS) are LOW data on the databus will be written into the FIFO memory on every rising edge of WCLK. In DDR mode, data will be written on both rising and falling edges of WCLK. Note in DDR mode the WEN and WCS are only sampled on the rising edge of WCLK. New data will always begin writing from the rising edge, not the falling edge of WCLK. If Dual mode is selected then WEN1 and WEN3 are not used and should be tied to VCC. VCC +2.5V Supply Power These are VCC core power supply pins and must all be connected to a +2.5V supply rail. VDDQ Output Rail Voltage Power This pin should be tied to the desired voltage rail for providing to the output drivers. Nominally 1.5V or 1.8V for HSTL, 2.5V for LVTTL. GND Ground Pin Ground These ground pins are for the core device and must be connected to the GND rail. Vref Reference voltage Power This is a Voltage Reference input and must be connected to a voltage level determined in the Voltage Recommended DC Operating Conditions section. This provides the reference voltage when using HSTL class inputs. If HSTL class inputs are not being used, this pin must be connected to GND. CMOS(2) INPUT During master reset, this pin selects the input port to operate in DDR or SDR format. If WDDR is HIGH, then a word is written on the rising and falling edge of the appropriate WCLK0, 1, 2 and 3 input. If WDDR is LOW, then a word is written only on the rising edge of the appropriate WCLK0, 1, 2 and 3 inputs. NOTES: 1. All unused outputs may be left floating. 2. All CMOS pins should remain unchanged. CMOS format means that the pin is intended to be tied directly to VCC or GND and these particular pins are not tested for VIH or VIL. 3. These pins are for the JTAG port. Please refer to pages 27-31 and Figures 7-9. 9 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES QUAD/DUAL I/O USAGE SUMMARY SET-UP, CONFIGURATION & RESET PINS Regardless of the mode of operation, (Quad or Dual), the following inputs must be always be used. These inputs must be set-up with respect to master reset as they are latched during this time. WDDR – Write Port DDR/SDR selection RDDR – Read Port DDR/SDR selection MD – Mode Selection OW – Output width IW – Input Width FSEL[1:0] – Flag offset default values IOSEL – I/O Level Selection PFM – Programmable Flag Mode FWFT/SI – First word Fall Through or IDT Standard mode SERIAL PORT The following pins are used when user programming of the Programmable Flag offsets is required: SCLK – Serial Clock SWEN – Serial Write Enable SREN – Serial Read Enable FWFT/SI – Serial Data In SDO – Serial Data Out QUAD MODE The following inputs/ outputs should be used when Mux mode is selected by the user: DUAL MODE The following inputs/ outputs should be used when Mux mode is selected by the user: INPUTS: WCLK0, WCLK1, WCLK2, WCLK3 – Four write port clocks WEN0, WEN1, WEN2, WEN3 – Four write port enables WCS0, WCS1, WCS2, WCS3 – Four write port chip selects RCLK0, RCLK1, RCLK2, RCLK3 – Four read port clocks REN0, REN1, REN2, REN3 – Four read port enables RCS0, RCS1, RCS2, RCS3, – Four read port chip selects OE0, OE1, OE2, OE3 – Four read port output enables INPUTS: WCLK0, WCLK2 – Two write port clocks WEN0, WEN2 – Two write port enables WCS0, WCS2 – Two write port chip selects RCLK0, RCLK2 – Two read port clocks REN0, REN2 – Two read port enables RCS0, RCS2 – Two read port chip selects OE0, OE2 – Two read port output enables OUTPUTS: ERCLK0, ERCLK1, ERCLK2, ERCLK3 – Four read port echo read clocks EREN0, EREN1, EREN2, EREN3 – Four read port echo read enables EF0/OR0, EF1/OR1, EF2/OR2, EF3/OR3 – Four read port Empty/Output Ready Flags FF0/IR0, FF1/IR1, FF2/IR2, FF3/IR3 – Four write port full/ input ready flags PAE0, PAE1, PAE2, PAE3 – Four read port programmable almost empty flags PAF0, PAF1, PAF2, PAF3 – Four write port programmable almost empty flags OUTPUTS: ERCLK0, ERCLK2 – Two read port echo read clock outputs EREN0, EREN2 – Two read port echo read enable outputs EF0/OR0, EF2/OR2 – Two read port empty/output ready flags FF0/IR0, FF2/IR2 – Two write port Full/ Input Ready Flags PAE0, PAE2 – Two read port programmable almost empty flags PAF0, PAF2 – Two write port programmable almost full flags 10 MARCH 22, 2005 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 ABSOLUTE MAXIMUM RATINGS(1) Symbol Rating Com'l & Ind'l CAPACITANCE (TA = +25°C, f = 1.0MHz) Unit Symbol Parameter Conditions Max. Unit VTERM Terminal Voltage with respect to GND –0.5 to +3.6 V CIN(2,3) VIN = 0V 10(3) pF TSTG Storage Temperature –55 to +125 °C Input Capacitance COUT(1,2) 10 pF DC Output Current –50 to +50 mA Output Capacitance VOUT = 0V IOUT TJ Maximum Junction Temperature +150 °C (2) NOTES: 1. With output deselected, (OE ≥ VIH). 2. Characterized values, not currently tested. 3. CIN for Vref is 20pF. NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. Compliant with JEDEC JESD8-5. VCC terminal only. RECOMMENDED DC OPERATING CONDITIONS Symbol Typ. Max. Unit VCC VDDQ Supply voltage relative to GND Output supply voltage LVTTL eHSTL HSTL Parameter 2.375 2.375 1.7 1.4 Min. 2.5 2.5 1.8 1.5 2.625 2.625 1.9 1.6 V V V V VREF(1) Voltage reference input eHSTL HSTL 0.8 0.68 0.9 0.75 1.0 0.9 V V VIH Input high voltage LVTTL eHSTL HSTL 1.7 VREF+0.2 VREF+0.2 — — — 3.45 VDDQ+0.3 VDDQ+0.3 V V V VIL Input low voltage LVTTL eHSTL HSTL -0.3 -0.3 -0.3 — — — 0.7 VREF-0.2 VREF-0.2 V V V TA Operating temperature (Commercial) 0 — +70 °C TA Operating temperature (Industrial) -40 — +85 °C NOTES: 1. VREF is only required for HSTL or eHSTL inputs. VREF should be tied LOW for LVTTL operation. 2. GND = Ground. 11 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES DC ELECTRICAL CHARACTERISTICS (Industrial: VCC = 2.5V ± 0.125V, TA = -40°C to +85°C) Symbol Min. Max. Unit ILI Input Leakage Current Parameter –10 +10 µA ILO Output Leakage Current –10 +10 µA ICC3(2,3) JTAG Input Leakage Current — -16 mA VOH(1) Output Logic “1” Voltage, VOL Output Logic “0” Voltage, VDDQ -0.4 VDDQ -0.4 VDDQ -0.4 — — — — — — 0.4 0.4 0.4 V V V V V V ICC1(2,3,4) Active VCC Current (Quad mode) (See Note 7 for test conditions) -- LVTTL -- eHSTL -- HSTL — — — 250(7) 350(7) 350(7) mA mA mA ICC2(2,3,4) Active VCC Current (Dual mode) (See Note 8 for test conditions) -- LVTTL -- eHSTL -- HSTL — — — 180(7) 295(7) 295(7) mA mA mA IDDQ1(2,3,5) Active VDDQ Current (Quad mode) (See Note 7 for test conditions) -- LVTTL -- eHSTL -- HSTL — — — 50 40 40 mA mA mA IDDQ2(2,3,5) Active VDDQ Current (Dual mode) (See Note 8 for test conditions) -- LVTTL -- eHSTL -- HSTL — — — 35 20 20 mA mA mA ISB1(2,3,4) Standby VCC Current (Quad mode) (See Note 9 for test conditions) -- LVTTL -- eHSTL -- HSTL — — — 110(7) 240(7) 240(7) mA mA mA ISB2(2,3,4) Standby VCC Current (Dual mode) (See Note 10 for test conditions) -- LVTTL -- eHSTL -- HSTL — — — 100(7) 185(7) 185(7) mA mA mA ISB3(2,3,5) Standby VDDQ Current (Quad mode) (See Note 9 for test conditions) -- LVTTL -- eHSTL -- HSTL — — — 40 35 35 mA mA mA ISB4(2,3,5) Standby VDDQ Current (Dual mode) (See Note 10 for test conditions) -- LVTTL -- eHSTL -- HSTL — — — 30 15 15 mA mA mA IPD1(3,4) Power Down VCC Current (Quad mode) (See Note 11 for test conditions) -- LVTTL -- eHSTL -- HSTL — — — 15(7) 30(7) 30(7) mA mA mA IPD2(3,4) Power Down VCC Current (Dual mode) (See Note 12 for test conditions) -- LVTTL -- eHSTL -- HSTL — — — 15(7) 30(7) 30(7) mA mA mA IPD3(3,5) Power Down VDDQ Current (Quad mode) (See Note 11 for test conditions) -- LVTTL -- eHSTL -- HSTL — — — 0.5 0.5 0.5 mA mA mA IPD4(3,5) Power Down VDDQ Current (Dual mode) (See Note 12 for test conditions) -- LVTTL -- eHSTL -- HSTL — — — 0.2 0.2 0.2 mA mA mA IOH = –8 mA @LVTTL IOH = –8 mA @eHSTL IOH = –8 mA @HSTL IOL = 8 mA @LVTTL IOL = 8 mA @eHSTL IOL = 8 mA @HSTL NOTES: 1. Outputs are not 3.3V tolerant. 2. All WCLKs and RCLKs toggling at 20MHz. Data inputs toggling at 10MHz. 3. VCC = 2.5V, OE0-3 = HIGH. 4. Typical ICC1 calculation: for LVTTL I/O: ICC1 (Quad mode) = 11.25 x fs ICC1 (Dual mode) = 7.74 x fs for HSTL I/O: ICC1 (Quad mode) = 158 + (11.25 x fs) ICC1 (Dual mode) = 115 + (7.74 x fs) where fs = WCLK = RCLK frequency (in MHz) NOTES CONTINUED ON PAGE 13. 12 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES 5. Typical IDDQ calculation: With data outputs in High-Impedance: IDDQ (Quad mode) = 0.8 x fs IDDQ (Dual mode) = 0.3 x fs With data outputs in Low-Impedance: IDDQ (Quad mode and Dual mode) = CL x VDDQ x fs x N 2000 where fs = WCLK = RCLK frequency (in MHz). CL = capacitance load (pF), N= Number of outputs switching. 6. Total Power consumed: PT = [(VCC x ICC) + (VDDQ x IDDQ)]. 7. Maximum value tested wtih RCLK = WCLK = 20MHz at 85°C. Maximum value may differ depending on VCC and temperature. 8. WEN0-3 = REN0-3 = LOW, WCS0-3 = RCS0-3 = LOW, PD = HIGH. 9. WEN0,2 = REN0,2 = LOW, WCS0,2 = RCS0,2 = LOW, PD = HIGH. 10. WEN0-3 = REN0-3 = HIGH, WCS0-3 = RCS0-3 = HIGH, PD = HIGH. 11. WEN0,2 = REN0,2 = HIGH, WCS0,2 = RCS0,2 = HIGH, PD = HIGH. 12. WEN0-3 = REN0-3 = HIGH, WCS0-3 = RCS0-3 = HIGH, PD = LOW. 13. WEN0,2 = REN0,2 = HIGH, WCS0,2 = RCS0,2 = HIGH, PD = LOW. 13 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES AC ELECTRICAL CHARACTERISTICS(1) (Commercial: VCC = 2.5V ± 0.15V, TA = 0°C to +70°C;Industrial: VCC = 2.5V ± 0.15V, TA = -40°C to +85°C; JEDEC JESD8-A compliant) Symbol Commerical IDT72T54242L5 IDT72T54252L5 IDT72T54262L5 Min. Max. Parameter Com'l & Ind'l IDT72T54242L6-7 IDT72T54252L6-7 IDT72T54262L6-7 Min. Max. Unit fS1 Clock Cycle Frequency (WCLK & RCLK) SDR — 200 — 150 MHz fS2 Clock Cycle Frequency (WCLK & RCLK) DDR — 100 — 75 MHz tA Data Access Time 0.6 3.6 0.6 3.8 ns tCLK1 Clock Cycle Time SDR 5 — 6.7 — ns tCLK2 Clock Cycle Time DDR 10 — 13 — ns tCLKH1 Clock High Time SDR 2.3 — 2.8 — ns tCLKH2 Clock High Time DDR 4.5 — 6.0 — ns tCLKL1 Clock Low Time SDR 2.3 — 2.8 — ns tCLKL2 Clock Low Time DDR 4.5 — 6.0 — ns tDS Data Setup Time 1.5 — 2.0 — ns tDH Data Hold Time 0.5 — 0.5 — ns tENS Enable Setup Time 1.5 — 2.0 — ns tENH Enable Hold Time 0.5 — 0.5 — ns fC Clock Cycle Frequency (SCLK) — 10 — 10 MHz tASO Serial Output Data Access Time — 20 — 20 ns tSCLK Serial Clock Cycle 100 — 100 — ns tSCKH Serial Clock High 45 — 45 — ns tSCKL Serial Clock Low 45 — 45 — ns tSDS Serial Data In Setup 15 — 15 — ns tSDH Serial Data In Hold 5 — 5 — ns tSENS Serial Enable Setup 5 — 5 — ns tSENH Serial Enable Hold 5 — 5 — ns tRS(3) Reset Pulse Width 200 — 200 — ns tRSS Reset Setup Time 15 — 15 — ns tRSR Reset Recovery Time 10 — 10 — ns tRSF Reset to Flag and Output Time — 12 — 15 ns tOLZ (OE - Qn) Output Enable to Output in Low-Impedance 0.6 3.6 0.8 3.8 ns tOHZ Output Enable to Output in High-Impedance 0.6 3.6 0.8 3.8 ns tOE Output Enable to Data Output Valid 0.6 3.6 0.8 3.8 ns tRCSLZ RCLK to Active from High-Impedance — 3.6 — 3.8 ns tRCSHZ RCLK to High-Impedance — 3.6 — 3.8 ns tPDLZ Power Down to Output Low-Impedance — 19.4 — 19.6 ns tPDHZ Power Down to Output High-Impedance — 13.5 — 13.7 ns tPDL Power Down LOW — 19.4 — 19.6 ns tPDH Power Down HIGH 1 — 1 — µs tWFF Write Clock to FF or IR — 3.6 — 3.8 ns tREF Read Clock to EF or OR — 3.6 — 3.8 ns tPAFS Write Clock to Synchronous Programmable Almost-Full Flag — 3.6 — 3.8 ns tPAES Read Clock to Synchronous Programmable Almost-Empty Flag — 3.6 — 3.8 ns tPAFA Write Clock to Asynchronous Programmable Almost-Full Flag — 10 — 12 ns tPAEA Read Clock to Asynchronous Programmable Almost-Empty Flag — 10 — 12 ns tERCLK RCLK to Echo RCLK Output — 4.0 — 4.3 ns tCLKEN RCLK to Echo REN Output — 3.6 — 3.8 ns tSKEW1 SKEW time between RCLK and WCLK for EF/OR and FF/IR for SDR inputs and outputs 4 — 5 — ns tSKEW2 SKEW time between RCLK and WCLK for EF/OR and FF/IR in for DDR inputs and outputs 5 — 6 — ns tSKEW3 SKEW time between RCLK and WCLK for PAE and PAF 5 — 6 NOTES: 1. With exception to clock cycle frequency, these parameters apply to both DDR and SDR modes of operation. 2. All AC timings apply to both IDT Standard mode and FWFT mode in both Quad and Dual mode. 3. Pulse width less than the minimum value is not allowed. 4. Values guaranteed by design, not currently tested. 5. Industrial temperature range product for the 6-7ns speed grade is available as a standard device. All other speed grades available by special order. — ns 14 MARCH 22, 2005 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 HSTL 1.5V AC TEST CONDITIONS Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels AC TEST LOADS VDDQ/2 0.25 to 1.25V 0.4ns 0.75V 0.75V 50Ω Z0 = 50Ω I/O NOTES: 1. VDDQ = 1.5V. 2. VREF = 0.75V. 10pF 6158 drw04 Figure 2a. AC Test Load EXTENDED HSTL 1.8V AC TEST CONDITIONS 0.4 to 1.4V 0.4ns 0.9V 0.9V 6 ∆tCD (Typical, ns) Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels NOTES: 1. VDDQ = 1.8V. 2. VREF = 0.9V. 5 4 3 2 1 20 30 50 80 100 Capacitance (pF) 200 6158 drw04a LVTTL 2.5V AC TEST CONDITIONS Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels Figure 2b. Lumped Capacitive Load, Typical Derating GND to 2.5V 1ns 1.25V 1.25V NOTE: 1. For LVTTL, VCC = VDDQ = 2.5V. 15 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES OUTPUT ENABLE & DISABLE TIMING Output Enable Output Disable VIH OE VIL tOE & tOLZ Single Output Normally LOW Single Output Normally HIGH tOHZ VCC/2 100mV VOL VOH 100mV 100mV VCC/2 VCC/2 tOE tOHZ tOLZ Output Bus VCC/2 100mV VCC/2 VCC/2 Current data in output register NOTES: 1. REN is HIGH. 2. RCS is LOW. 6158 drw05 READ CHIP SELECT ENABLE & DISABLE TIMING VIH tENH RCS VIL tENS RCLK tRCSHZ tRCSLZ Single Output VCC Normally 2 LOW Single Output Normally VCC 2 HIGH 100mV VOL VOH 100mV 100mV tRCSLZ Output Bus VCC 2 VCC 2 100mV VCC 2 tOHZ tOLZ VCC 2 Current data in output register 6158 drw06 NOTES: 1. REN is HIGH. 2. OE is LOW. 16 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 FIFOs will function in SDR mode; if it is high then the read port will be DDR mode. This feature is described in the Signal Descriptions section. Programmable Almost Empty/Full Flags. These flags can operate in either synchronous or asynchronous timing mode. If the programmable flag input, PFM is HIGH during master reset then all programmable flags will operate in a synchronous manner, meaning the PAE flags are double buffered and updated based on the rising edge of its respective read clocks. The PAF flags are also double buffered and updated based on the rising edge of its respective write clocks. If it is LOW then all programmable flags will operate in an asynchronous manner, meaning the PAE and PAF flags are not double buffered and will update through the internal counter after a nominal delay. This feature is described in the Signal Descriptions section. Selectable Bus Width. In Dual mode, the bus width can be selected on the read and write ports using the IW and OW inputs. If IW is LOW then the write ports will be 10 bits wide, if IW is HIGH then the write ports will be 20 bits wide. If OW is LOW then the read ports will be 10 bits wide, if OW is HIGH then the read ports will be 20 bits wide. Note in Quad mode the inputs and outputs are always 10 bits wide regardless of the state of these pins. This feature is described in the Signal Descriptions section. Programmable Flag Offset Values. These offset values can be user programmed or they can be set to one of four default values during a master reset. For default programming, the state of the FSEL[1:0] inputs during master reset will determine the value. Table 2, Default Programmable offsets lists the four offset values and how to select them. For programming the offset values to a specific number, use the serial programming signals (SCLK, SWEN, SREN, FWFT/SI) to load the value into the offset register. You may also use the JTAG port on this device to load the offset value. Keep in mind that you must disable the serial programming signals if you plan to use the JTAG port for loading the offset values. To disable the serial programming signals, tie SCLK, SWEN, SREN, and FWFT/SI to VCC. A thorough explanation of the serial and JTAG programming of the flag offset values is provided in the "Serial Write and Reading of Offset Registers” section. I/O Level Selection. The I/Os can be selected for either 2.5V LVTTL levels or 1.5V HSTL / 1.8V eHSTL levels. The state of the IOSEL input will determine which I/O level will be selected. If IOSEL is HIGH then the applicable I/Os will be 1.5V HSTL or 1.8V eHSTL, depending on the voltage level applied to VDDQ and VREF. For HSTL, VDDQ and VREF = 1.5V and for eHSTL VDDQ and VREF = 1.8V. If IOSEL is LOW then the applicable I/Os will be 2.5V LVTTL. As noted in the Pin Description section, IOSEL is a CMOS input and must be tied to either VCC or GND for proper operation. FUNCTIONAL DESCRIPTION MASTER RESET & DEVICE CONFIGURATION During Master Reset the device configuration and settings are determined, this includes the following: 1. Quad or Dual mode 2. IDT Standard or First Word Fall Through (FWFT) flag timing mode 3. Single or Double Data Rates on both the Write and Read ports 4. Programmable flag mode, synchronous or asynchronous timing 5. Write and Read Port Bus Widths, x10 or x20 (in Dual mode only) 6. Default Offsets for the programmable flags, 7, 63, 127, or 1023 7. LVTTL or HSTL I/O selection The state of the configuration inputs during master reset will determine which of the above modes are selected. A master reset comprises of pulsing the MRS input pin from high to low for a period of time (tRS) with the configuration inputs held in their respective states. Table 1 summarizes the configuration modes available during master reset. They are described as follows: Quad or Dual mode. This mode is selected using the MD input. If during master reset, MD is HIGH then Quad mode is selected, if MD is LOW then Dual mode is selected. In Quad mode four independent FIFOs are available, while in Dual mode two independent FIFOs are available. IDT Standard or FWFT mode. The two available flag timing modes are selected using the FWFT/SI input. If FWFT/SI is LOW during master reset then IDT Standard mode is selected, if it is high then FWFT mode is selected. The timing modes are described later in this section. Single Data Rate (SDR) or Double Data Rate (DDR). The input/output data rates are port selectable. This is a versatile feature that allows the user to select either SDR or DDR on the write ports and/or read ports of all FIFOs using the WDDR and RDDR inputs. If WDDR is LOW during master reset then the write ports of all FIFOs will function in SDR mode; if it is high then the write ports will be DDR mode. If RDDR is LOW during master reset then the read ports of all TABLE 1 — DEVICE CONFIGURATION PINS VALUES MD 0 1 Dual mode Quad mode FWFT/SI 0 1 IDT Standard mode FWFT mode WDDR 0 1 Single Data Rate write port Double Data Rate write port RDDR 0 1 Single Data Rate read port Double Data Rate read port PFM 0 1 Asynchronous operation of PAE and PAF outputs Synchronous operation of PAE and PAF outputs IW 0 1 Write port is 10 bits wide Write port is 20 bits wide in dual mode, 10 bits wider in Dual mode OW 0 1 Read port is 10 bits wide Read port is 20 bits wide in dual mode, 10 bits wider in Dual mode FSEL[1:0] 00 01 10 11 Programmable flag registers offset value = 7 Programmable flag registers offset value = 63 Programmable flag registers offset value = 127 Programmable flag registers offset value = 1023 IOSEL 0 1 All applicable I/Os (except CMOS) are LVTTL All applicable I/Os (except CMOS) are HSTL/eHSTL COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES CONFIGURATION TABLE 2 — DEFAULT PROGRAMMABLE FLAG OFFSETS IDT72T54242 IDT72T54252 IDT72T54262 FSEL1 0 0 1 1 FSEL0 0 1 0 1 Offsets n,m 7 63 127 1023 NOTES: 1. In default programming, the offset value selected applies to all internal FIFOs. 2. To program different offset values for each FIFO, serial programming must be used. 3. n is the offset value for PAE, m is the offset value for PAF. 17 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 SERIAL WRITING AND READING OF OFFSET REGISTERS The offset registers can be loaded with a default value or they can be user programmed with a specific value. One of four default values are loaded based on the state of the FSEL[1:0] inputs. The flag offset values can be programmed either through the dedicated serial programming port or the JTAG port. The dedicated serial port can be used to load or read the contents of the offset registers. The offset registers are programmed and read sequentially through a series of shift registers. Each bit in the serial input will shift through the offset registers and program each FIFOs offset registers. The serial read and write operations are performed by the dedicated SCLK, FWFT/SI, SWEN , SREN and SDO pins. The total number of bits required per device are listed in Figure 3, Programmable Flag Offset Programming Methods. These bits account for all four PAE/PAF offset registers in the device. To write to the offset registers, set the serial write enable signal active (LOW), and on each rising edge of SCLK one bit from the FWFT/SI pin is serially shifted into the flag offset register chain. Once the complete number of bits has been programmed into all four registers, the programming sequence is complete. The programming sequence is listed in Figure 3. To read the values from the offset registers, set the serial read enable active (LOW). Then on each rising edge of SCLK, one bit is shifted out to the serial data output. The serial read enable must be kept LOW throughout the entire read operation. To stop reading the offset register, disable the serial read enable (HIGH). There is a setup time for reading JTAG Programming Serial Programming Instruction Code COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES the offset registers, as the offset register data for each FIFO is temporarily stored in a scan chain. When data has been completely read out of the offset registers, any additional read operations to the offset register will result in zeros as the output data. Reading and writing the offset registers can also be accomplished using the JTAG port. To write to the offset registers using JTAG, set the instructional register to the offset write command (Hex Value = 0x0008). The JTAG port will load data into each of the offset registers in a similar fashion as the serial programming described above. To read the values from the offset registers, set the instructional register to the offset read command (Hex Value = 0x0007). The TDO of the JTAG port will output data in a similar fashion as the serial programming described above. The number of bits required to load the offset registers is dependent on the size of the device selected and the width of the I/Os selected. Each offset register requires 15 bits, 16 bits or 17 bits for the IDT72T54242/72T54252/72T54262 devices respectively. So a total of 120 bits, 128 bits or 136 bits will need to be loaded into each offset register chain for the IDT72T54242/72T54252/72T54262 devices respectively. If Dual mode is selected, only two of the four offset register will need to be programmed (PAE/PAF2, PAE/PAF0). Therefore, the total number of bits required will be half of its Quad mode operation. See Figure 4, Offset Register Serial Bit Sequence for a mapping of the serial bits to each offset registers. IDT Part Number Quad Mode Dual Mode Dual Mode(4) (IW/OW = x10) (IW/OW = x20) SWEN SREN 0008 (Hex) 0 1 IDT72T54242 IDT72T54252 IDT72T54262 120 128 136 60 64 68 56 60 64 0007 (Hex) 1 0 IDT72T54242 IDT72T54252 IDT72T54262 120 128 136 60 64 68 56 60 64 6158 drw07 PROGRAMMING INSTRUCTIONS: JTAG Programming 1. Load JTAG Instruction code in "JTAG Timing Specifications" section. 2. Use rising edge of TCK to clock in the required bits from the TD2 input or to clock out from the TDO output pin. Serial Programming 1. Set SWEN and SREN as shown above. 2. If reading, SREN LOW will clock data out of the SDO pin on every rising TCK edge. If writing, SWEN LOW will clock in data from the FWFT/SI pin. NOTES: 1. The programming methods apply to both IDT Standard mode and FWFT mode. 2. The number of bits indicated are for all four PAE/PAF offset registers. 3. SWEN = 0, and SREN = 0 simultaneously are not allowed. 4. In Dual mode (IW/OW = x10), the total number of bits required will be half since only two FIFOs are active. 5. Parallel programming is not available. Figure 3. Programmable Flag Offset Programming Methods 18 MARCH 22, 2005 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 TIMING MODES: IDT STANDARD vs FIRST WORD FALL THROUGH (FWFT) MODE The IDT72T54242/72T54252/72T54262 support two different timing modes of operation: IDT Standard mode and First Word Fall Through (FWFT) mode. The selection of which mode will be used is determined during master reset, by the state of the FWFT input. During master reset, if the FWFT pin is LOW, then IDT Standard mode will be selected. This mode uses the Empty Flag (EF) to indicate whether or not there are any words present in the FIFO. It also uses the Full Flag (FF) to indicate whether or not the FIFO has any free space for writing. In IDT Standard mode, every word read from the FIFO, including the first, must be requested using the Read Enable (REN), Read Chip Select (RCS), and RCLK. If the FWFT pin is HIGH during master reset, then FWFT mode will be selected. This mode uses Output Ready (OR) to indicate whether or not there is valid data at the data outputs. It also uses Input Ready (IR) to indicate whether or not the FIFO has any free space for writing. In the FWFT mode, the first word written to an empty FIFO goes directly to output bus after three RCLK rising edges. Applying REN = LOW is not necessary, although having RCS = 0 at the previous rising RCLK is necessary to keep the output from being in highimpedance. However, subsequent words must be accessed using Read Enable (REN), Read Chip Select (RCS), and RCLK. Various signals in both inputs and outputs operate differently depending on which timing mode is in effect. The timing mode selected affects all internal FIFOs and are not programmed individually. settings for these values are listed in Table 2. This parameter is also user programmable as described in the Serial Writing and Reading of Offset Registers section. Continuing to write data into the FIFO without performing read operations will cause the Programmable Almost-Full flag (PAF) to go LOW. Again, if no reads are performed, the PAF will go LOW after (32,768-m) writes for the IDT72T54242, (65,536-m) writes for the IDT72T54252, and (131,072-m) writes for the IDT72T54262. In x20 dual mode, PAF will go LOW after (16,384-m) writes for the IDT72T54242, (32,768-m) writes for the IDT72T54252, and (65,536-m) writes for the IDT72T54262. The offset “m” is the full offset value. The default setting for these values are listed in Table 3, Status Flags for IDT Standard Mode. This parameter is also user programmable. See the section on Serial Writing and Reading of Offset Registers for details. When the FIFO is full, the Full Flag (FF) will go LOW, inhibiting further write operations. If no reads are performed after a reset, FF will go LOW after D writes to the FIFO, where D = 32,768 writes for the IDT72T54242, 65,536 writes for the IDT72T54252, and 131,072 writes for the IDT72T54262. In x20 dual mode, FF will go LOW after 16,384 writes for the IDT72T54242, 32,768 writes for the IDT72T54252, and 65,536 writes for the IDT72T54262. If the FIFO is full, the first read operation will cause FF to go HIGH. Subsequent read operations will cause PAF to go HIGH at the conditions described in Table 3, Status Flags for IDT Standard Mode. If further read operations occur without write operations, PAE will go LOW when there are n words in the FIFO, where n is the empty offset value. Continuing read operations will cause the FIFO to become empty. When the last word has been read from the FIFO, the EF will go LOW inhibiting further read operations. REN is ignored when the FIFO is empty, but RCS will continue to determine whether or not the output is in highimpedance. When configured in IDT Standard mode, the EF and FF outputs are double register-buffered outputs. IDT Standard mode is available when the device is configured in either Single Data Rate or Double Data Rate mode. Relevant timing diagrams for IDT Standard mode can be found in Figure 10, 11, 12, 13, 14, 15, 16, 17, 18 and 23. IDT STANDARD MODE In this mode, the status flags FF, PAF, PAE, and EF operate in the manner outlined in Table 3, Status Flags for IDT Standard Mode. To write data into the FIFO, Write Enable (WEN), and Write Chip Select (WCS) must be LOW. Data presented to the DATA IN lines will be clocked into the FIFO on subsequent transitions of the Write Clock (WCLK). After the first write is performed, the Empty Flag (EF) will go HIGH. Subsequent writes will continue to fill up the FIFO. The Programmable Almost-Empty flag (PAE) will go HIGH after n + 1 words have been loaded into the FIFO, where "n" is the empty offset value. The default IDT72T54242 Quad mode Serial Bits IDT72T54252 Quad mode IDT72T54262 Quad mode IDT72T54242 Dual mode IW/OW = x20 IDT72T54242 Dual mode IW/OW = x10 or IDT72T54252 IW/OW = x20 IDT72T54252 Dual mode IW/OW = x10 or IDT72T54262 IW/OW = x20 IDT72T54262 Dual mode IW/OW = x10 Offset Register 1 - 15 1 - 16 1 - 17 PAE3 (1) 16 - 30 17 - 32 18 - 34 PAF3 (1) 31 - 45 33 - 48 35 - 51 1 - 14 1 - 15 1 - 16 1 - 17 PAE2 46 - 60 49 - 64 52 - 68 15 - 28 16 - 30 17 - 32 18 - 34 PAF2 61 - 75 65 - 80 69 - 85 PAE1 (1) 76 - 90 81 - 96 86 - 102 PAF1 (1) 91 - 105 97 - 112 103 - 119 29 - 42 31 - 45 33 - 48 35 - 51 PAE0 106 - 120 113 - 128 120 - 136 43 - 56 46 - 60 49 - 64 52 - 68 PAF0 NOTES: 1. These registers are not used in Dual mode. They are not programmed or read in the serial chain. 2. In all modes, the higher numbered bit is the MSB. For example, in the IDT72T54242 in Quad mode, the first bit is the LSB for PAE3. 6158 drw08 Figure 4. Offset Registers Serial Bit Sequence 19 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 FIRST WORD FALL THROUGH MODE (FWFT) In this mode, the status flags OR, IR, PAE, and PAF operate in the manner outlined in Table 4, Status Flags for FWFT Mode. To write data into to the FIFO, WEN, and WCS must be LOW. Data presented to the DATA IN lines will be clocked into the FIFO on subsequent transitions of WCLK. After the first write is performed, the Output Ready (OR) flag will go LOW. Subsequent writes will continue to fill up the FIFO. PAE will go HIGH after n + 2 words have been loaded into the FIFO, where n is the empty offset value. The default setting for these values are listed in Table 4, Status Flags for FWFT Mode. This parameter is also user programmable as described in the Serial Writing and Reading of Offset Registers section. Continuing to write data into the FIFO without performing read operations will cause the Programmable Almost-Full flag (PAF) to go LOW. Again, if no reads are performed, the PAF will go LOW after (32,769-m) writes for the IDT72T54242, (65,537-m) writes for the IDT72T54252, and (131,073-m) writes for the IDT72T54262. In x20 dual mode, PAF will go LOW after (16,385-m) writes for the IDT72T54242, (32,769-m) writes for the IDT72T54252, and (65,537-m) writes for the IDT72T54262. The offset “m” is the full offset value. The default setting for these values are listed in Table 4, Status Flags for FWFT Mode. This parameter is also user programmable. See the section on serial writing and reading of offset registers for details. COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES When the FIFO is full, the Input Ready (IR) will go LOW, inhibiting further write operations. If no reads are performed after a reset, IR will go LOW after D writes to the FIFO, where D = 32,769 writes for the IDT72T54242, 65,537 writes for the IDT72T54252, and 131,073 writes for the IDT72T54262. In x20 dual mode, FF will go LOW after 16,385 writes for the IDT72T54242, 32,769 writes for the IDT72T54252, and 65,537 writes for the IDT72T54262. If the FIFO is full, the first read operation will cause IR to go HIGH. Subsequent read operations will cause PAF to go HIGH at the conditions described in Table 4, Status Flags for FWFT Mode. If further read operations occur without write operations, PAE will go LOW when there are n words in the FIFO, where n is the empty offset value. Continuing read operations will cause the FIFO to become empty. When the last word has been read from the FIFO, the OR will go HIGH inhibiting further read operations. REN is ignored when the FIFO is empty, but RCS will continue to determine whether or not the output is in highimpedance. When configured in FWFT mode, the OR flag output is triple register-buffered and the IR flag output is double register-buffered. Relevant timing diagrams for FWFT mode can be found in Figure 19, 20, 21, 22 and 24. TABLE 3 — STATUS FLAGS FOR IDT STANDARD MODE IDT72T54242 Dual mode IW/OW = x20 Number of Words in FIFO 0 IDT72T54242 Quad mode or Dual mode IW/OW = x10 or IDT72T54252 Dual mode IW/OW = x20 IDT72T54262 IDT72T54252 Quad mode or Dual mode Quad mode or Dual mode IW/OW = x10 IW/OW = x10 or IDT72T54262 Dual mode IW/OW = x20 0 0 1 to n 1 to n 1 to n 16,384 - (m) to 16,383 32,768 - (m) to 32,767 65,536 - (m) to 65,535 16,384 32,768 65,536 0 1 to n 131,072 - (m) to 131,071 131,072 FF PAF PAE EF H H L L H H L H H L H H L L H H NOTE: 1. See Table 2 for values for n, m. Values n,m may be different for each FIFO. TABLE 4 — STATUS FLAGS FOR FWFT MODE IDT72T54242 Dual mode IW/OW = x20 Number of Words in FIFO 0 1 to n+1 16,385 - (m) to 16,384 16,385 IDT72T54242 Quad mode or Dual mode IW/OW = x10 or IDT72T54252 Dual mode IW/OW = x20 IDT72T54262 IDT72T54252 Quad mode or Dual mode Quad mode or Dual mode IW/OW = x10 IW/OW = x10 or IDT72T54262 Dual mode IW/OW = x20 0 0 1 to n+1 1 to n+1 32,769 - (m) to 32,768 65,537 - (m) to 65,536 65,537 32,769 0 1 to n+1 131,073 - (m) to 131,072 131,073 IR PAF PAE OR L H L H L H L L L L H L H L H L 6158 drw09 NOTE: 1. See Table 2 for values for n, m. Values n,m may be different for each FIFO. 20 MARCH 22, 2005 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 SELECTABLE MODES This device is capable of operating in two different modes: Quad mode or Dual mode. In the Quad mode there are four independent FIFOs available, with the input and output bus widths set to 10 bits wide for each FIFO. A total of eight independent clock inputs are available– four RCLKs and four WCLKs. Each FIFO has independent read and write controls, output enable controls, as well as individual status flags EF/OR, FF/IR, PAE, and PAF. Also available are echo outputs ERCLK and EREN for each individual FIFO to aid high-speed operation where synchronizing data is critical. In the Dual mode there are two independent FIFOs available, with the input and output bus widths each selectable between x10 or x20. Bus-matching is available in this mode, allowing for more flexibility. A total of four independent clock inputs are available, two RCLKs and two WCLKs. Each FIFO has independent read and write controls– output enable controls, as well as individual status flags EF/OR, FF/IR, PAE, and PAF. Also available are echo outputs ERCLK and EREN for each individual FIFO to aid high-speed operation where synchronizing data is critical. are not associated with this feature. Note that all “Static Pins” must be tied to VCC or GND. These pins are LVTTL only and are purely device configuration pins. Note the IOSEL pin should be tied HIGH or LOW and cannot toggle before and after master reset. BUS MATCHING In the Dual mode operation, the write and read port have bus-matching capability such that the input and output busses can each be either 10 bits or 20 bits wide. The bus width of both the input and output port is determined during master reset using the input (IW) and output (OW) widths setup pins. The selected port width is applied to both FIFO ports, such that both FIFOs will be configured for either x10 or x20 bus widths. When writing or reading data from a FIFO the number of memory locations available to be read will depend on the bus width selected and the density of the device. If the write/read ports are 10 bits wide, this provides the user with a FIFO depth of 32,768 x 10 for the IDT72T54242, 65,536 x 10 for the IDT72T54252, or 131,072 x 10 for the IDT72T54262. If the write/read ports are 20 bits wide, this provides the user with a FIFO depth of 16,384 x 20 for the IDT72T54242, 32,768 x 20 for the IDT72T54252, or 65,536 x 20 for the IDT72T54262. The FIFO depths will always have a fixed density of 327,680 bits for the IDT72T54242, 655,360 bits for the IDT72T54252 and 1,310,072 bits for the IDT72T54262 regardless of bus-width configuration on the write/read port. When the device is operating in double data rate, the word is twice as large as in single data rate since one word consists of both the rising and falling edge of clock. Therefore in DDR, the FIFO depths will be half of what it is mentioned above. For instance, if the write/read port is 10 bits wide, the depth of each FIFO is 16,384 x 10 for the IDT72T54242, 32,768 x 10 for the IDT72T54252, or 65,536 x 10 for the IDT72T54262. See Figure 5, Bus-Matching in Dual mode for more information. HSTL/LVTTL I/O The inputs and outputs of this device can be configured for either LVTTL or HSTL/eHSTL operation. If the IOSEL pin is HIGH during master reset, then all applicable LVTTL or HSTL signals will be configured for HSTL/eHSTL operating voltage levels. To select between HSTL or eHSTL VREF must be driven to 1.5V or 1.8V respectively. Typically a logic HIGH in HSTL would be VREF + 0.2V and a logic LOW would be VREF – 0.2V. If the IOSEL pin is LOW during master reset, then all applicable LVTTL or HSTL signals will be configured for LVTTL operating voltage levels. In this configuration VREF must be set to GND. Table 5 illustrates which pins are and TABLE 5 — I/O VOLTAGE LEVEL ASSOCIATIONS LVTTL/HSTL/eHSTL SELECT Write Port D[39:0] WCLK0/1/2/3 WEN0/1/2/3 WCS0/1/2/3 FF/IR0/1/2/3 PAF0/1/2/3 Read Port Q[39:0] RCLK0/1/2/3 REN0/1/2/3 RCS0/1/2/3 EF/OR0/1/2/3 OE0/1/2/3 PAE0/1/2/3 ERCLK0/1/2/3 EREN0/1/2/3 JTAG Signal Pins TCK TRST TMS TDI TDO FSEL[1:0] PD MRS PRS0/1/2/3 FWFT/SI STATIC CMOS SIGNALS Serial Clock Port SCLK SREN SWEN FWFT/SI SDO Static Pins IOSEL IW OW MD PFM RDDR WDDR NOTE: 1. In Dual mode, not all available signals will be used. Signals with a designation of 1 and 3 are not used. 21 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 INPUT PORT BUS-WIDTH x20 OUTPUT PORT BUS-WIDTH x20 IW OW H H INPUT PORT BUS-WIDTH x20 OUTPUT PORT BUS-WIDTH x10 IW OW H L D39-D30 D29-D20 D19-D10 D9-D0 D C B A FIFO 2 FIFO 2 FIFO 0 FIFO 0 D39-D30 D29-D20 D19-D10 D9-D0 D C B A FIFO 2 FIFO 2 FIFO 0 FIFO 0 D39-D30 D29-D20 D19-D10 C FIFO 0 FIFO 0 D39-D30 D29-D20 D19-D10 D9-D0 FIFO 2 FIFO 0 (b) x20 INPUT to x10 OUTPUT D29-D20 2nd Read from FIFO 0 and FIFO 2 B D19-D10 FIFO 0 D9-D0 1st Write to FIFO 0 and FIFO 2 A FIFO 2 FIFO 2 FIFO 0 FIFO 0 D39-D30 D29-D20 D19-D10 D9-D0 D L 1st Read from FIFO 0 and FIFO 2 A B L D9-D0 FIFO 2 D39-D30 OW Read from FIFO 0 and FIFO 2 FIFO 2 FIFO 2 IW Write to FIFO 0 and FIFO 2 (a) x20 INPUT to x20 OUTPUT D INPUT PORT BUS-WIDTH x10 OUTPUT PORT BUS-WIDTH x10 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES 2nd Write to FIFO 0 and FIFO 2 C FIFO 2 FIFO 2 FIFO 0 FIFO 0 D39-D30 D29-D20 D19-D10 D9-D0 B 1st Read from FIFO 0 and FIFO 2 A FIFO 2 FIFO 2 FIFO 0 FIFO 0 D39-D30 D29-D20 D19-D10 D9-D0 D FIFO 2 FIFO 2 2nd Read from FIFO 0 and FIFO 2 C FIFO 0 FIFO 0 (c) x10 INPUT to x10 OUTPUT INPUT PORT BUS-WIDTH x10 OUTPUT PORT BUS-WIDTH x20 IW OW L H D39-D30 D29-D20 D19-D10 D9-D0 D B C A FIFO 2 FIFO 2 FIFO 0 FIFO 0 Read from FIFO 0 and FIFO 2 (d) x10 INPUT to x20 OUTPUT 6158 drw10 Figure 5. Bus-Matching in Dual mode 22 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES FIRST WORD FALL THROUGH/SERIAL IN (FWFT/SI) This is a dual purpose pin. During master reset, the state of the FWFT/SI input determines whether the device will operate in IDT Standard mode or First Word Fall Through (FWFT) mode. If FWFT/SI is LOW before the falling edge of master reset, then IDT Standard mode will be selected. This mode uses the Empty Flag (EF) to indicate whether or not there are any words present in the FIFOs’ memory. It also uses the Full Flag (FF) to indicate whether or not the FIFOs’ memory has any free space for writing. In IDT Standard mode, every word read from the FIFOs, including the first, must be requested using the Read Enable (REN), Read Chip Select (RCS) and RCLK. If FWFT/SI is HIGH before the falling edge of master reset, then FWFT mode will be selected. This mode uses Output Ready (OR) to indicate whether or not there is valid data in the output register. It also uses Input Ready (IR) to indicate whether or not the FIFO's memory has any free space for writing. In other words, they are the inverse of the empty and full flags. In the FWFT mode, the first word written to an empty FIFO goes directly to data outputs after three RCLK rising edges, provided that the first RCLK meets the tSKEW parameter. There may be a one RCLK cycle delay if tSKEW is not met. REN and RCS do not need to be enabled. Subsequent words must be accessed using the REN, RCS, and RCLK. The state of the FWFT/SI input must be kept at the present state for the minimum of the reset recovery time (tRSR) after master reset. After this time, the FWFT/ SI acts as a serial input for loading PAE and PAF offsets into the programmable offset registers. The serial input is used in conjunction with SCLK, SWEN, SREN, and SDO to access the offset registers. Serial programming using the FWFT/ SI pin functions the same way in both IDT Standard and FWFT modes. SIGNAL DESCRIPTIONS INPUTS: DATA INPUT BUS (D[39:0]) The data input busses are 10 bits wide in Quad mode and 20 or 10-bits wide in Dual mode. In Quad mode, D[9:0] are data inputs for FIFO0, D[19:10] are for FIFO1, D[29:20] are for FIFO2, and D[39:30] are for FIFO3. In Dual mode, D[19:0] are data inputs for FIFO0 and D[39:20] are for FIFO2 for the 20-bit wide data bus. D[9:0] are data inputs for FIFO0 and D[29:20] are data inputs for FIFO2 for the 10-bit wide data bus. MASTER RESET (MRS) There is a single master reset available for all internal FIFOs in this device. A master reset is initiated whenever the MRS input is taken to a LOW state. This operation sets the internal read and write pointers of all FIFOs to the first location in memory. The programmable almost empty flag will go LOW and the almost full flags will go HIGH. If FWFT/SI signal is LOW during master reset then IDT Standard mode is selected. This mode utilizes the empty and full status flags from the EF/OR and FF/IR dual-purpose pin. During master reset, all empty flags will be set to LOW and all full flags will be set to HIGH. If FWFT/SI signal is HIGH during master reset, then the First Word Fall Through mode is selected. This mode utilizes the input read and output ready status flags from the EF/OR and FF/IR dual-purpose pin. During master reset, all input ready flags will be set to LOW and all output ready flags will be set to HIGH. All device configuration pins such as MD, OW, IW, WDDR, RDDR, IOSEL, PFM, FSEL[1:0] and FWFT/SI need to be defined before the master reset cycle. During a master reset the output registers are initialized to all zeros. If the output enables are LOW during master reset, then the output bus will be LOW. If the output enable(s) are HIGH during master reset, then the output bus will be in high-impedance. RCS has no affect on the data outputs during master reset. If the output width OW is configured to x10 in Dual mode, then the unused outputs Q[19:10] and Q[39:30] will be in high-impedance. A master reset is required after power up before a write operation to any FIFO can take place. Master reset is an asynchronous signal and thus the read and write clocks can be freerunning or idle during master reset. See Figure 10, Master Reset Timing, for the associated timing diagram. WRITE CLOCK (WCLK0/1/2/3) There are a possible total of four write clocks (or two in Dual mode) available in this device depending on the mode selected, each corresponding to the individual FIFOs in memory. A write can be initiated on the rising (or falling) edge of the WCLK input. If the write double data rate (WDDR) mode pin is tied HIGH, data will be written on both the rising and falling edge of WCLK0/1/2/3, provided that WEN0/1/2/3 and WCS0/1/2/3 are enabled on the rising edge of WCLK 0/ 1/2/3. If WDDR is tied LOW, data will be written only on the rising edge of WCLK0/ 1/2/3 provided that WEN0/1/2/3 and WCS 0/1/2/3 are enabled. Each write clock is completely independent from the others. Data setup and hold times must be met with respect to the LOW-to-HIGH (and HIGH-to-LOW in DDR) transition of the write clock. It is permissible to stop the write clocks, for asynchronous operations. Note that while the write clocks are idle, the FF0/1/2/3 and PAF0/1/2/3 flags will not be updated unless the port is operating in asynchronous timing mode (PFM=0). The write clocks can be independent or coincident with one another. In Dual mode, the unused clocks (WCLK1 and WCLK3) should be tied to GND. PARTIAL RESET (PRS0/1/2/3) A partial reset is a means by which the user can reset both the read and write pointers of each individual FIFO inside the device without changing the FIFO's configuration. There are four dedicated partial reset signals (two in Dual mode) that each correspond to an individual FIFO. There are no restrictions as to when partial reset can be performed in either operating modes. During partial reset, the internal read and write pointers are set to the first location in memory, PAE goes LOW and PAF goes HIGH. Whichever timing mode was active at the time of Partial Reset will remain active after Partial Reset. If IDT Standard Mode is active, then FF will go HIGH and EF will go LOW. If the First Word Fall Through mode is active, then OR will go HIGH and IR will go LOW. Following Partial Reset, all values held in the offset registers remain unchanged. The output registers are initialized to all zeros. All other configurations set up during master reset remain unchanged. PRS is an asynchronous signal. See Figure 11, Partial Reset Timing, for the associated timing diagram. WRITE ENABLE (WEN0/1/2/3) There are a total of four write enables (or two in Dual mode) available in this device depending on the mode selected, one for each individual FIFO. When the write enable input is LOW on the rising edge of WCLK in single data rate mode, data is loaded on the rising edge of every WCLK cycle, provided the device is not full and the write chip select (WCS) is enabled. The setup and hold times are referenced with respect to the rising edge of WCLK only. When the write enable input is LOW on the rising edge of WCLK in double data rate, data is loaded into any of the FIFOs on the rising and falling edge of every WCLK cycle, provided the device is not full and the write chip select (WCS) is enabled on the 23 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 rising edge of WCLK. In this mode, the data setup and hold times are referenced with respect to the rising and falling edge of WCLK. Note that WEN and WCS are sampled only on the rising edge of WCLK in either data rates. Data is stored in the FIFOs’ memory sequentially and independently of any ongoing read operation. When the write enables or write chip selects are HIGH, no new data is written into the corresponding FIFO on each WCLK cycle. Each write enable operates independently of the others. In Dual mode, the unused write enables (WEN1 and WEN3) should be tied to VCC. WRITE CHIP SELECT (WCS0/1/2/3) There are a total of four write chip selects (or two in Dual mode) available in this device depending on the mode selected, one for each individual FIFO. The write chip selects disables all data bus inputs if it is held HIGH. To perform normal write operations, the write chip select must be enabled, (held LOW). The four write chip selects are completely independent of one another. When the write chip select is LOW on the rising edge of WCLK in single data rate mode, data is loaded on the rising edge of every WCLK cycle, provided the device is not full and the write enable (WEN) of the corresponding FIFO is LOW. When the write chip select is LOW on the rising edge of WCLK in double data rate mode, data is loaded into any of the FIFOs on the rising and falling edge of every WCLK cycle, provided the device is not full and the write enable (WEN) of the corresponding FIFO is LOW on the rising clock edge. When the write chip select is HIGH on the rising edge of WCLK in single data rate mode, the write port is disabled and no words are written into the FIFO memory, on the rising edge of WCLK, even if WEN is LOW. If the write chip select is HIGH on the rising edge of WCLK in double data rate mode, the write port is disabled and no words are written into the FIFO memory on the rising or falling edge of WCLK, even if WEN is LOW. Note that WCS is sampled on the rising edge of WCLK only in either data rate. In Dual mode, the unused write chip selects (WCS1 and WCS3) should be tied to VCC. WRITE DOUBLE DATA RATE (WDDR) When the write double data rate (WDDR) pin is HIGH, the write port will be set to double data rate mode. In this mode, all write operations are based on the rising and falling edge of the write clocks, provided that write enables and write chip selects are LOW for the rising clock edges. In double data rate the write enable signals are sampled with respect to the rising edge of write clock only, and a word will be written to both the rising and falling edge of write clock regardless of whether or not write enable is active on the falling edge of write clock. When WDDR is LOW, the write port will be set to single data rate mode. In this mode, all write operations are based on only the rising edge of the write clocks, provided that write enables and write chip selects are LOW during the rising edge of write clock. This pin should be tied HIGH or LOW and cannot toggle. READ CLOCK (RCLK0/1/2/3) There are a total of four read clocks (or two in Dual mode) available in this device depending on the mode selected, each corresponding to the individual FIFOs in memory. A read can be initiated on the rising (or falling) edge of the RCLK input. If the read double data rate (RDDR) mode pin is tied HIGH, data will be read on both the rising and falling edge of RCLK0/1/2/3, provided that REN0/1/2/3 and RCS0/1/2/3 are enabled on the rising edge of RCLK0/1/2/ 3. If RDDR is tied LOW, data will be read only on the rising edge of RCLK0/1/ 2/3 provided that REN0/1/2/3 and RCS0/1/2/3 are enabled. Each read clock is completely independent from the others. There is an associated data access time (tA) for the data to be read out of the FIFOs. It is permissible to stop the read clocks. Note that while the read clocks COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES are idle, the EF/0/1/2/3 and PAE0/1/2/3 flags will not be updated unless the part is operating in asynchronous timing mode (PFM=0). The write and read clocks can be independent or coincident. In Dual mode, the unused clocks (RCLK1 and RCLK3) should be tied to GND. READ ENABLE (REN0/1/2/3) There are a total of four read enables (or two in Dual mode) available in this device depending on the mode selected, one for each individual FIFOs . When the read enable input is LOW on the rising edge of RCLK in single data rate mode, data will be read on the rising edge of every RCLK cycle, provided the device is not empty and the read chip select (RCS) is enabled. The associated data access time (tA) is referenced with respect to the rising edge of RCLK. When the read enable input is LOW on the rising edge of WCLK in double data rate mode, data will be read on the rising and falling edge of every RCLK cycle, provided the device is not empty and RCS is enabled. In this mode, the data access times are referenced with respect to the rising and falling edges of RCLK. Note that REN, and RCS are sampled only on the rising edge of RCLK in either data rate. Data read from the FIFO's memory sequentially and independently of any ongoing write operation. When the read enables or read chip selects are HIGH, no new data is read on each RCLK cycle. Each read enable operates independently of the others. To prevent reading from an empty FIFO in the IDT Standard mode, the empty flag of each FIFO will go LOW with respect to RCLK, when the total number of words in the FIFO has been read, thus inhibiting further read operations. Upon the completion of a valid write cycle, the empty flag will go HIGH with respect to RCLK two cycles later, thus allowing another read to occur similarly, for FWFT mode, the output ready flag of each FIFO will go HIGH with respect to RCLK when the total number of words in the FIFO has been read out. In Dual mode, the unused read enables (REN1 and REN3) should be tied to VCC. READ CHIP SELECT (RCS0/1/2/3) There are a total of four read chip selects (or two in Dual mode) available in this device, each corresponding to an individual FIFO. The read chip select inputs provide synchronous control of the read port. When the read chip select is held LOW, the next rising edge of the corresponding RCLK will enable the output bus. When the read chip select goes HIGH, the next rising edge of RCLK will send the output bus into high-impedance and prevent that RCLK from initiating a read, regardless of the state of REN. During a master or partial reset the read chip select input has no effect on the output bus– output enable is the only input that provides high-impedance control of the output bus. If output enable is LOW, the data outputs will be active regardless of read chip select until the first rising edge of RCLK after a reset is complete. Afterwards if read chip select is HIGH the data outputs will go to high-impedance. Each read chip select is completely independent of the others. The read chip select inputs do not affect the updating of the flags. For example, when the first word is written to any/all empty FIFOs, the empty flags will still go from LOW to HIGH based on a rising edge of the RCLK, regardless of the state of the read chip select inputs. Also, when operating the FIFO in FWFT mode the first word written to any/all empty FIFOs will still be clocked through to the output bus on the third rising edge of RCLK, regardless of the state of read chip select inputs, assuming that the tSKEW parameter is met. For this reason the user should pay extra attention to the read chip selects when a data word is written to any/all empty FIFOs in FWFT mode. If the read chip select inputs are HIGH when an empty FIFO is written into, the first word will fall through to the output register but will not be available on the outputs because they are in highimpedance. The user must enable read chip select on the rising edge of RCLK while disabling REN to access this first word. In Dual mode, the unused read 24 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 chip selects (RCS1 and RCS3) should be tied to VCC. Refer to Figures 23 and 24, Read Cycle and Read Chip Select for the associated timing diagrams. COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES • • • • All data outputs become inactive and enter high-impedance state. All flag outputs will maintain their current states before power down. All programmable flag offsets maintain their values. All echo clocks and enables will become inactive and enter highimpedance state. • The serial programming and JTAG port will become inactive and enter high-impedance state. • All setup and configuration CMOS static inputs are not affected, as these pins are tied to a known value and do not toggle during operation. All internal counters, registers, and flags will remain unchanged and maintain their current state prior to power down. Clock inputs can be continuous and freerunning during power down, but will have no affect on the part. However, it is recommended that the clock inputs be low when the power down is active. To exit power down state and resume normal operations, disable the power down signal by bringing it HIGH. There must be a minimum of 1µs waiting period before read and write operations can resume. The device will continue from where it had stopped and no form of reset is required after exiting power down state. The power down feature does not provide any power savings when the inputs are configured for LVTTL operation. However, it will reduce the current for I/Os that are not tied directly to VCC or GND. See Figure 35, Power Down Operation, for the associated timing diagram. READ DOUBLE DATA RATE (RDDR) When the read double data rate (RDDR) pin tied HIGH, the read port will be set to double data rate mode. In this mode, all read operations are based on the rising and falling edge of the read clocks, provided that read enables and read chip selects are LOW. In double data rate the read enable signals are sampled with respect to the rising edge of read clock only, and a word will be read from both the rising and falling edge of read clock regardless of whether or not read enable and read chip select are active on the falling edge of read clock. When RDDR is tied LOW, the read port will be set to single data rate mode. In this mode, all read operations are based on only the rising edge of the read clocks, provided that read enables and read chip selects are LOW during the rising edge of read clock. This pin should be tied HIGH or LOW and cannot toggle before or after master reset. OUTPUT ENABLE (OE0/1/2/3) There are total of four asynchronous output enables (two in Dual mode) available in this device, each corresponding to an individual FIFO in memory. When the output enable inputs are LOW, the output bus of each individual FIFO becomes active and drives the data currently in the output register. When the output enable inputs are HIGH, the output bus of each individual FIFO goes into high-impedance. During master or partial reset the output enable is the only input that can place the output data bus into high-impedance. During reset the read chip select input has no effect on the output data bus. Each output enable input is completely independent from the others. In Dual mode, the unused output enables (OE1 and OE3) should be tied to VCC. SERIAL CLOCK (SCLK) The serial clock is used to load and read data in the programmable offset registers. Data from the serial input signal (FWFT/SI) can be loaded into the offset registers on the rising edge of SCLK provided that the serial write enable (SWEN) signal is LOW. Data can be read from the offset registers via the serial data output (SDO) signal on the rising edge of SCLK provided that SREN is LOW. The serial clock can operate at a maximum frequency of 10MHz. I/O SELECT (IOSEL) The inputs and outputs of this device can be configured for either LVTTL or HSTL/eHSTL operation. If the IOSEL pin is HIGH during master reset, then all applicable LVTTL or HSTL signals will be configured for HSTL/eHSTL operating voltage levels. To select between HSTL or eHSTL VREF must be driven to 1.5V or 1.8V respectively. If the IOSEL pin is LOW during master reset, then all applicable LVTTL or HSTL programmable pins will be configured for LVTTL operating voltage levels. In this configuration VREF should be set to GND. This pin should be tied HIGH or LOW and cannot toggle before or after master reset. Please refer to table 5 for a list of LVTTL/HSTL/eHSTL programmable pins. SERIAL WRITE ENABLE (SWEN) The serial write enable input is an enable used for serial programming of the programmable offset registers. It is used in conjunction with the serial input (FWFT/SI) and serial clock (SCLK) when programming the offset registers. When the serial write enable is LOW, data at the serial input is loaded into the offset register, one bit for each LOW-to-HIGH transition of SCLK. When serial write enable is HIGH, the offset registers retain the previous settings and no offsets are loaded. Serial write enable functions the same way in both Standard IDT and FWFT modes. See Figure 29, Loading of Programmable Flag Registers, for the timing diagram. SERIAL READ ENABLE (SREN) The serial read enable input is an enable used for reading the value of the programmable offset registers. It is used in conjunction with the serial data output (SDO) and serial clock (SCLK) when reading the offset registers. When the serial read enable is LOW, data at the serial data output can be read from the offset register, one bit for each LOW-to-HIGH transition of SCLK. When serial read enable is HIGH, the reading of the offset registers will stop. Whenever serial read enable (SREN) is activated (LOW) values in the offset registers are copied directly into a serial scan out register. SREN must be kept LOW in order to read the entire contents of the scan out register. If at any point SREN is toggled HIGH, another copy function from the offset register to the serial scan out register will occur the next time SREN is enabled (LOW). Serial read enable functions the same way in both IDT Standard and FWFT modes. See Figure 30, Reading of Programmable Flag Registers, for the timing diagram. POWER DOWN (PD) This device has a power down feature intended for reducing power consumption for HSTL/eHSTL configured inputs when the device is idle for a long period of time. By entering the power down state certain inputs can be disabled, thereby significantly reducing the power consumption of the part. All WEN and REN signals must be disabled for a minimum of four WCLK and RCLK cycles before activating the power down signal. The power down signal is asynchronous and needs to be held LOW throughout the desired power down time. During power down, the following conditions for the inputs/outputs signals are: • All data in FIFO(s) memory are retained. • All data inputs become inactive. • All write and read pointers maintain their last value before power down. • All enables, chip selects, and clock input pins become inactive. 25 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 OUTPUTS: DATA OUTPUT BUS (Q[39:0]) The data output busses are 10 bits wide in Quad mode and 20 or 10-bits wide in Dual mode. In Quad mode, Q[9:0] are data outputs for FIFO0, Q[19:10] are for FIFO1, Q[29:20] are for FIFO2, and Q[39:30] are for FIFO3. In Dual mode, Q[19:0] are data outputs for FIFO0 and Q[39:20] are for FIFO2 for the 20-bit wide data bus. Q[9:0] are data outputs for FIFO0 and Q[29:20] are data outputs for FIFO2 for the 10-bit wide data bus. EMPTY/OUTPUT READY FLAG (EF/0/1/2/3) There are four empty/output ready flags (two in Dual mode) available in this device, each corresponding to the individual FIFOs in memory. This is a dualpurpose pin whose function is determined based on the state of the FWFT/SI pin during master reset. In the IDT Standard mode, the empty flags are selected. When an individual FIFO is empty, its empty flag will go LOW, inhibiting further read operations from that FIFO. When the empty flag is HIGH, the individual FIFO is not empty and valid read operations can be performed. See Figure 18, Read Cycle, Output Enable and Empty Flag Timing, for the relevant timing information. Also see Table 3, Status Flags for IDT Standard Mode for the truth table of the empty flags. In FWFT mode, the output ready flags are selected. Output ready flags (OR) go LOW at the same time that the first word written to an empty FIFO appears on the outputs, which is a minimum of two read clock cycles provided the RCLK and WCLK meets the tSKEW parameter (See Table 6 - TSKEW Measurement). OR stays LOW after the RCLK LOW-to- HIGH transitions that shifts the last word from the FIFO memory to the outputs. OR goes HIGH when another read operation is performed, indicating the last word was read. The previous data stays at the outputs, further data reads are inhibited until OR goes LOW again and a new word appears on the bus. See Figure 22, Read Timing and Output Ready Flag , for the relevant timing information. Also see Table 4, Status Flags for FWFT Mode for the truth table of the empty flags. To prevent reading in the FWFT mode, the output ready flag of each FIFO will go HIGH with respect to RCLK, when the total number of words has been read out of the FIFO, thus inhibiting further read operations. Upon the completion of a valid write cycle, the output ready flag will go LOW with respect to RCLK three cycles later, thus indicating another read has occurred. The empty/output ready flags are synchronous and updated on the rising edge of RCLK. In IDT Standard mode, the flags are double register-buffered outputs. In FWFT mode, the flags are triple register-buffered outputs. Each empty flag operates independently of the others and always indicates the respective FIFO’s status. FULL/INPUT READY FLAG (FF/IR/0/1/2/3) There are four full/input ready flags (two in Dual mode) available in this device, each corresponding to the individual FIFOs in memory. This is a dualpurpose pin whose function is determined based on the state of the FWFT/SI pin during master reset. In the IDT Standard mode, the full flags are selected. When an individual FIFO is full, its full flags will go LOW after the rising edge of WCLK that wrote the last word, thus inhibiting further write operations to the FIFO. When the full flag is HIGH, the individual FIFO is not full and valid write operations can be performed. See Figure 11, Write Cycle and Full Flag Timing for the associated timing diagram. Also see Table 4, Status Flags for FWFT Mode for the truth table of the full flags. In FWFT mode, the input ready flags are selected. Input ready flags go LOW when there is adequate memory space in the FIFOs for writing in data. The input ready flags go HIGH after the rising edge of WCLK that wrote the last word, when there are no free spaces available for writing in data. See Figure 16, Write Cycle COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES and Output Ready Timing , for the associated timing information. Also see Table 4, Status Flags for FWFT Mode for the truth table of the full flags. The input ready status not only measures the contents of the FIFOs memory, but also counts the presence of a word in the output register. Thus, in FWFT mode, the total number of writes necessary to make IR LOW is one greater than needed to assert FF in IDT Standard mode. FF/IR is synchronous and updated on the rising edge of WCLK. FF/IR are double register-buffered outputs. Each flag operates independently of the others. To prevent data overflow in the IDT Standard mode, the full flag of each FIFO will go LOW with respect to WCLK, when the maximum number of words has been written into the FIFO, thus inhibiting further write operations. Upon the completion of a valid read cycle, the full flag will go HIGH with respect to WCLK two cycles later, thus allowing another write to occur. To prevent data overflow in the FWFT mode, the input ready flag of each FIFO will go HIGH with respect to WCLK, when the maximum number of words has been written into the FIFO, thus inhibiting further write operations. Upon the completion of a valid read cycle, the input ready flag will go LOW with respect to WCLK two cycles later, thus allowing another write to occur. PROGRAMMABLE ALMOST EMPTY FLAG (PAE0/1/2/3) There are four programmable almost empty flags (two in Dual mode) available in this device, each corresponding to an individual FIFO in memory. The programmable almost empty flag is an additional status flag that notifies the user when the FIFO memory is near empty. The user may utilize this feature as an early indicator as to when the FIFO will become empty. In IDT Standard mode, PAE will go LOW when there are n words or less in the FIFO. In FWFT mode, the PAE will go LOW when there are n-1 words or less in the FIFO. The offset “n” is the empty offset value. The default setting for this value is stated in Table 2. There are four internal FIFOs hence four PAE offset values, (n0, n1, n2, and n3). There are two timing modes available for the PAE flags, selectable by the state of the Programmable Flag Mode (PFM) pin. If PFM is tied HIGH, then synchronous timing mode is selected. If PFM is tied LOW, then asynchronous timing mode is selected. In synchronous configuration, the PAE flag is updated on the rising edge of RCLK. In asynchronous PAE configuration, the PAE flag is asserted LOW on the LOW-to-HIGH transitions of the Read Clock (RCLK). PAE is reset to HIGH on the LOW-to-HIGH transitions of the Write Clock (WCLK). See Figures 31 and 33, Synchronous and Asynchronous Programmable Almost-Empty Flag Timing, for the relevant timing information. Each programmable almost empty flag operates independently of the others. PROGRAMMABLE ALMOST FULL FLAG (PAF0/1/2/3) There are four programmable almost full flags (two in Dual mode) available in this device, each corresponding to the individual FIFOs in memory. The programmable almost full flag is an additional status flag that notifies the user when the FIFO memory is nearly full. The user may utilize this feature as an early indicator as to when the FIFO will not be able to accept any more data and thus prevent data from being dropped. In IDT Standard mode, if no reads are performed after master reset, PAF will go LOW after (D-m) (D meaning the density of the particular device) words are written to the FIFO. In FWFT mode, PAF will go LOW after (D+1-m) words are written to the FIFO. The offset “m” is the full offset value. The default setting for this value is stated in Table 2. There are four internal FIFOs hence four PAF offset values, (m0, m1, m2, and m3). There are two timing modes available for the PAF flags, selectable by the state of the Programmable Flag Mode (PFM) pin. If PFM is tied HIGH, then synchronous timing mode is selected. If PFM is tied LOW, then asynchronous timing mode is selected. In synchronous configuration, the PAF flag is updated on the rising edge of WCLK. In asynchronous PAF configuration, the PAF flag 26 MARCH 22, 2005 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 is asserted LOW on the LOW-to-HIGH transitions of the Write Clock (WCLK). PAF is reset to HIGH on the LOW-to-HIGH transitions of the Read Clock (RCLK). See Figure 31 and 33, Synchronous and Asynchronous Programmable Almost-Full Flag Timing (IDT Standard and FWFT mode), for the relevant timing information. Each programmable almost full flag operates independently of the others. TABLE 6 — TSKEW MEASUREMENT Data Port Status Flags Configuration DDR Input EF/OR to DDR Output FF/IR ECHO READ CLOCK (ERCLK0/1/2/3) There are four echo read clock outputs (two in Dual mode) available in this device, each corresponding to their respective input read clocks in the FIFO. The echo read clock is a free-running clock output, that will always follow the RCLK input regardless of the read enables and read chip selects. The ERCLK output follows the RCLK input with an associated delay. This delay provides the user with a more effective read clock source when reading data from the output bus. This is especially helpful at high speeds when variables within the device may cause changes in the data access times. These variations in access time may be caused by ambient temperature, supply voltage, or device characteristics. Any variations effecting the data access time will also have a corresponding effect on the echo read clock output produced by the FIFO, therefore the echo read clock output level transitions should always be at the same position in time relative to the data outputs. Note, that echo read clock is guaranteed by design to be slower than the slowest data outputs. Refer to Figure 6, Echo Read Clock and Data Output Relationship, Figures 25, 26, and 27 Echo Read Clock and Read Enable Operation for timing information. Each echo read clock output operate independently of the others and transitions with respect to the data outputs of its FIFO. PAE PAF DDR Input to SDR Output EF/OR FF/IR PAE PAF SDR Input to DDR Output EF/OR FF/IR PAE PAF SDR Input to SDR Output RCLK EF/OR FF/IR tERCLK PAE ERCLK tA PAF tD TSKEW Measurement Negative Edge WCLK to Positive Edge RCLK Negative Edge RCLK to Positive Edge WCLK Negative Edge WCLK to Positive Edge RCLK Negative Edge RCLK to Positive Edge WCLK Negative Edge WCLK to Positive Edge RCLK Positive Edge RCLK to Positive Edge WCLK Negative Edge WCLK to Positive Edge RCLK Positive Edge RCLK to Positive Edge WCLK Datasheet Parameter tSKEW2 tSKEW2 tSKEW3 tSKEW3 tSKEW2 tSKEW1 tSKEW3 tSKEW3 Positive Edge WCLK to Positive Edge RCLK Negative Edge RCLK to Positive Edge WCLK Positive Edge WCLK to Positive Edge RCLK Negative Edge RCLK to Positive Edge WCLK tSKEW1 Positive Edge WCLK to Positive Edge RCLK Positive Edge RCLK to Positive Edge WCLK Positive Edge WCLK to Positive Edge RCLK Positive Edge RCLK to Positive Edge WCLK tSKEW1 tSKEW2 tSKEW3 tSKEW3 tSKEW1 tSKEW3 tSKEW3 QSLOWEST(3) 6158 drw11 NOTES: 1. REN is LOW. 2. tERCLK > tA, guaranteed by design. 3. Qslowest is the data output with the slowest access time, tA. 4. Time, tD is greater than zero, guaranteed by design. Figure 6. Echo Read Clock and Data Output Relationship 27 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES tTCK t1 t2 TCK TDI/ TMS tDS tDH tDO TDO TDO tDOH t4 TRST 6158 drw12 t3 Notes to diagram: t1 = tTCKLOW t2 = tTCKHIGH t3 = tRST (reset pulse width) t4 = tRSR (reset recovery) Figure 7. Standard JTAG Timing JTAG AC ELECTRICAL CHARACTERISTICS SYSTEM INTERFACE PARAMETERS (vcc = 2.5V ± 5%; Tcase = 0°C to +85°C) IDT72T54242 IDT72T54252 IDT72T54262 Test Conditions Parameter Symbol Data Output tDO(1) - 20 ns Data Output Hold tDOH(1) 0 - ns Data Input tDS tDH 10 10 - ns trise=3ns tfall=3ns Min. Parameter Max. Units Symbol Test Conditions Min. Max. Units JTAG Clock Input Period tTCK - 100 - ns JTAG Clock HIGH tTCKHIGH - 40 - ns JTAG Clock Low tTCKLOW - 40 - ns JTAG Reset tRST - 50 - ns JTAG Reset Recovery tRSR - 50 - ns NOTE: 1. 50pf loading on external output signals. 28 MARCH 22, 2005 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 The Standard JTAG interface consists of five basic elements: Test Access Port (TAP) TAP controller Instruction Register (IR) Data Register Port (DR) Bypass Register (BYR) JTAG TIMING SPECIFICATIONS (IEEE 1149.1 COMPLIANT) The JTAG test port in this device is fully compliant with the IEEE Standard Test Access Port (IEEE 1149.1) specifications. Five additional pins (TDI, TDO, TMS, TCK and TRST) are provided to support the JTAG boundary scan interface. Note that IDT provides appropriate Boundary Scan Description Language program files for these devices. • • • • • The following sections provide a brief description of each element. For a complete description refer to the IEEE Standard Test Access Port Specification (IEEE Std. 1149.1-1990). The Figure below shows the standard Boundary-Scan Architecture All inputs Eg: Dins, Clks (BSDL file describes the chain order) In Pad Incell Outcell Out Pad Core Logic In Pad All outputs Incell Outcell Out Pad TDI ID Bypass Instruction Register TMS TCK TRST TAP TDO Instruction Select Enable 6158 drw13 Figure 8. JTAG Architecture TEST ACCESS PORT (TAP) The TAP interface is a general-purpose port that provides access to the internal JTAG state machine. It consists of four input ports (TCLK, TMS, TDI, TRST) and one output port (TDO). 29 THE TAP CONTROLLER The TAP controller is a synchronous finite state machine that responds to TMS and TCLK signals to generate clock and control signals to the Instruction and Data Registers for capture and updating of data passed through the TDI serial input. MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 1 Input is TMS COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES Test-Logic Reset 0 0 Run-Test/ Idle 1 SelectDR-Scan 1 SelectIR-Scan 1 0 1 0 Capture-IR 1 Capture-DR 0 0 0 Shift-DR 1 EXit1-DR 1 1 0 1 Exit2-IR 0 1 1 Update-IR Update-DR 1 0 Pause-IR 1 Exit2-DR 1 Exit1-IR 0 0 Pause-DR 0 0 Shift-IR 0 1 0 6158 drw14 NOTES: 1. Five consecutive TCK cycles with TMS = 1 will reset the TAP. 2. TAP controller does not automatically reset upon power-up. The user must provide a reset to the TAP controller (either by TRST or TMS). 3. TAP controller must be reset before normal FIFO operations can begin. Figure 9. TAP Controller State Diagram Refer to the IEEE Standard Test Access Port Specification (IEEE Std. 1149.1) for the full state diagram All state transitions within the TAP controller occur at the rising edge of the TCLK pulse. The TMS signal level (0 or 1) determines the state progression that occurs on each TCLK rising edge. The TAP controller takes precedence over the FIFO memory and must be reset after power up of the device. See TRST description for more details on TAP controller reset. Test-Logic-Reset All test logic is disabled in this controller state enabling the normal operation of the IC. The TAP controller state machine is designed in such a way that, no matter what the initial state of the controller is, the Test-Logic-Reset state can be entered by holding TMS at high and pulsing TCK five times. This is the reason why the Test Reset (TRST) pin is optional. Run-Test-Idle In this controller state, the test logic in the IC is active only if certain instructions are present. For example, if an instruction activates the self test, then it will be executed when the controller enters this state. The test logic in the IC is idles otherwise. Select-DR-Scan This is a controller state where the decision to enter the Data Path or the Select-IR-Scan state is made. Select-IR-Scan This is a controller state where the decision to enter the Instruction Path is made. The Controller can return to the Test-Logic-Reset state other wise. Capture-IR In this controller state, the shift register bank in the Instruction Register parallel loads a pattern of fixed values on the rising edge of TCK. The last two significant bits are always required to be “01”. Shift-IR In this controller state, the instruction register gets connected between TDI and TDO, and the captured pattern gets shifted on each rising edge of TCK. The instruction available on the TDI pin is also shifted in to the instruction register. Exit1-IR This is a controller state where a decision to enter either the PauseIR state or Update-IR state is made. Pause-IR This state is provided in order to allow the shifting of instruction register to be temporarily halted. Exit2-DR This is a controller state where a decision to enter either the ShiftIR state or Update-IR state is made. Update-IR In this controller state, the instruction in the instruction register is latched in to the latch bank of the Instruction Register on every falling edge of TCK. This instruction also becomes the current instruction once it is latched. Capture-DR In this controller state, the data is parallel loaded in to the data registers selected by the current instruction on the rising edge of TCK. Shift-DR, Exit1-DR, Pause-DR, Exit2-DR and Update-DR These controller states are similar to the Shift-IR, Exit1-IR, Pause-IR, Exit2-IR and Update-IR states in the Instruction path. 30 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 THE INSTRUCTION REGISTER JTAG INSTRUCTION REGISTER The Instruction register allows instruction to be serially input into the device when the TAP controller is in the Shift-IR state. The instruction is decoded to perform the following: • Select test data registers that may operate while the instruction is current. The other test data registers should not interfere with chip operation and the selected data register. • Define the serial test data register path that is used to shift data between TDI and TDO during data register scanning. The Instruction Register is a 4 bit field (i.e. IR3, IR2, IR1, IR0) to decode 16 different possible instructions. Instructions are decoded as follows. The Instruction register allows an instruction to be shifted in serially into the processor at the rising edge of TCLK. The Instruction is used to select the test to be performed, or the test data register to be accessed, or both. The instruction shifted into the register is latched at the completion of the shifting process when the TAP controller is at UpdateIR state. The instruction register must contain 4 bit instruction register-based cells which can hold instruction data. These mandatory cells are located nearest the serial outputs they are the least significant bits. TEST DATA REGISTER The Test Data register contains three test data registers: the Test Bypass register, the Boundary Scan register and Device ID register. These registers are connected in parallel between a common serial input and a common serial data output. The following sections provide a brief description of each element. For a complete description, refer to the IEEE Standard Test Access Port Specification (IEEE Std. 1149.1-1990). Hex Value 0000 0001 0002 0003 0004 0007 0008 000F Test Bypass Register The register is used to allow test data to flow through the device from TDI to TDO. It contains a single stage shift register for a minimum length in serial path. When the bypass register is selected by an instruction, the shift register stage is set to a logic zero on the rising edge of TCLK when the TAP controller is in the Capture-DR state. The operation of the bypass register should not have any effect on the operation of the device in response to the BYPASS instruction. Instruction Function EXTEST SAMPLE/PRELOAD IDCODE CLAMP HI-IMPEDANCE OFFSET READ OFFSET WRITE BYPASS Private Test external pins Select boundary scan register Selects chip identification register Fix the output chains to scan chain values Puts all outputs in high-impedance state Read PAE/PAF offset register values Write PAE/PAF offset register values Select bypass register Several combinations are private (for IDT internal use). Do not use codes other than those identified above. JTAG Instruction Register Decoding The following sections provide a brief description of each instruction. For a complete description refer to the IEEE Standard Test Access Port Specification (IEEE Std. 1149.1-1990). The Boundary-Scan Register The Boundary Scan Register allows serial data TDI be loaded in to or read out of the processor input/output ports. The Boundary Scan Register is a part of the IEEE 1149.1-1990 Standard JTAG Implementation. EXTEST The required EXTEST instruction places the IC into an external boundarytest mode and selects the boundary-scan register to be connected between TDI and TDO. During this instruction, the boundary-scan register is accessed to drive test data off-chip via the boundary outputs and receive test data off-chip via the boundary inputs. As such, the EXTEST instruction is the workhorse of IEEE. Std 1149.1, providing for probe-less testing of solder-joint opens/shorts and of logic cluster function. The Device Identification Register The Device Identification Register is a Read Only 32-bit register used to specify the manufacturer, part number and version of the processor to be determined through the TAP in response to the IDCODE instruction. IDT JEDEC ID number is 0xB3. This translates to 0x33 when the parity is dropped in the 11-bit Manufacturer ID field. For the IDT72T54242/72T54252/72T54262, the Part Number field contains the following values: Device IDT72T54242 IDT72T54252 IDT72T54262 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES SAMPLE/PRELOAD The required SAMPLE/PRELOAD instruction allows the IC to remain in a normal functional mode and selects the boundary-scan register to be connected between TDI and TDO. During this instruction, the boundary-scan register can be accessed via a date scan operation, to take a sample of the functional data entering and leaving the IC. This instruction is also used to preload test data into the boundary-scan register before loading an EXTEST instruction. Part# Field 4C5 (hex) 4C6 (hex) 4C7 (hex) IDCODE The optional IDCODE instruction allows the IC to remain in its functional mode and selects the optional device identification register to be connected between TDI and TDO. The device identification register is a 32-bit shift register containing information regarding the IC manufacturer, device type, and version code. Accessing the device identification register does not interfere with the operation of the IC. Also, access to the device identification register should be immediately available, via a TAP data-scan operation, after power-up of the IC or after the TAP has been reset using the optional TRST pin or by otherwise moving to the Test-Logic-Reset state. 31(MSB) 28 27 12 11 1 0(LSB) Version (4 bits) Part Number (16-bit) Manufacturer ID (11-bit) 0X0 00B3 (hex) 1 IDT72T54242/252/262 JTAG Device Identification Register 31 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 CLAMP The optional CLAMP instruction sets the outputs of an IC to logic levels determined by the contents of the boundary-scan register and selects the onebit bypass register to be connected between TDI and TDO. Before loading this instruction, the contents of the boundary-scan register can be preset with the SAMPLE/PRELOAD instruction. During this instruction, data can be shifted through the bypass register from TDI to TDO without affecting the condition of the outputs. HIGH-IMPEDANCE The optional High-Impedance instruction sets all outputs (including two-state as well as three-state types) of an IC to a disabled (high-impedance) state and selects the one-bit bypass register to be connected between TDI and TDO. During this instruction, data can be shifted through the bypass register from TDI to TDO without affecting the condition of the IC outputs. COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES OFFSET READ This instruction is an alternative to serial reading the offset registers for the PAE/PAF flags. When reading the offset registers through this instruction, the dedicated serial programming signals must be disabled. OFFSET WRITE This instruction is an alternative to serial programming the offset registers for the PAE/PAF flags. When writing the offset registers through this instruction, the dedicated serial programming signals must be disabled. BYPASS The required BYPASS instruction allows the IC to remain in a normal functional mode and selects the one-bit bypass register to be connected between TDI and TDO. The BYPASS instruction allows serial data to be transferred through the IC from TDI to TDO without affecting the operation of the IC. 32 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES tRS MRS tRSS tRSR tRSS tRSR WEN0/1/2/3(6) REN0/1/2/3(6) SWEN, SREN tRSS (3) MD HIGH = Quad mode LOW = Dual mode tRSS OW(3), IW(3) tRSS PFM(3) HIGH = Synchronous PAE/PAF Timing LOW = Asynchronous PAE/PAF Timing tRSS RDDR(3), WDDR(3) HIGH = Read/Write Double Data Rate LOW = Read/Write Single Data Rate tRSS (3) FWFT/SI HIGH = FWFT Mode LOW = IDT Standard Mode tRSS (3) IOSEL HIGH = HSTL I/Os LOW = LVTTL I/Os tRSS FSEL[1:0](3) tRSF EF/OR(6) 0/1/2/3 If FWFT = HIGH, OR = HIGH If FWFT = LOW, EF = LOW tRSF FF/IR(6) 0/1/2/3 If FWFT = LOW, FF = HIGH If FWFT = HIGH, IR = LOW tRSF PAF(6) 0/1/2/3 tRSF PAE(6) 0/1/2/3 tRSF OE = HIGH Q[39:0](7) OE = LOW 6158 drw15 NOTES: 1. OE can be toggled during master reset. During master reset, the high-impedance control of the Qn data outputs are provided by OE only. 2. RCLK(s), WCLK(s) and SCLK(s) can be free running or idle. 3. The state of these pins are latched when the master reset pulse is LOW. 4. JTAG flag should not toggle during master reset. 5. RCS and WCS can be HIGH or LOW until the first rising edge of RCLK after master reset is complete. 6. If Dual mode is selected, only the signals designated with a "0" or "2" are used. 7. If Dual mode is selected, outputs Q[19:10] and Q[39:30] are not used if outputs are configured to x10. Figure 10 . Master Reset Timing 33 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES tRS PRS tRSS tRSR tRSS tRSR WEN REN SWEN, SREN tRSF If FWFT = HIGH, OR = HIGH If FWFT = LOW, EF = LOW EF/OR tRSF If FWFT = LOW, EF = HIGH If FWFT = HIGH, IR = LOW FF/IR tRSF PAF tRSF PAE tRSF OE = HIGH Q[39:0](3) OE = LOW 6158 drw16 NOTES: 1. This timing diagram shows the partial reset timing for a single FIFO. Each PRS is independent of the others. 2. During partial reset the high-impedance control of the Qn data outputs are provided by OE only, RCS can be HIGH or LOW until the first rising edge of RCLK after master reset. 3. If Dual mode is selected, outputs Q[19:10] and Q[39:30] are not used if outputs are configured to x10. Figure 11. Partial Reset Timing 34 MARCH 22, 2005 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 WCLK0 1 (2) tCLK tCLKL tCLKH NO WRITE 2 tSKEW1 tDS D[9:0] NO WRITE 1 (2) tSKEW1 tDH 2 WX+1 WX tWFF tDH tDS tWFF tWFF tWFF FF0 WEN0 RCLK0 tENS tENS tENH tENH REN0 tENS RCS0 tA tA Q[9:0] DATA READ NEXT DATA READ 6158 drw17 tRCSLZ NOTES: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibits the same behavior. 2. tSKEW1 is the minimum time between a rising RCLK0 edge and a rising WCLK0 edge to guarantee that FF0 will go HIGH (after one WCLK0 cycle plus tWFF). If the time between the rising edge of the RCLK0 and the rising edge of the WCLK0 is less than tSKEW1, then the FF0 deassertion may be delayed one extra WCLK0 cycle. (See Table 6 - TSKEW measurement). 3. OE0 = LOW, and WCS0 = LOW. 4. WCLK0 must be free running for FF0 to update. 5. MD 1 IW D/C OW D/C WDDR 0 RDDR 0 FWFT/SI 0 Figure 12. Write Cycle and Full Flag Timing (Quad mode, IDT Standard mode, SDR to SDR) 35 MARCH 22, 2005 Data in Output Register tENS tA tENH tA Word 0 tSKEW2(2) 1 2 tWFF Word 1 Wx tDS tCLKL Wx+1 tDH tCLK tDS tWFF tDH tCLKH tENS tA tENH tA Word 2 tSKEW2(2) 1 NO WRITE 2 Word 3 tWFF Wx+2 tWFF Wx+3 6158 drw18 36 5. MD 1 IW D/C OW D/C WDDR 1 RDDR 1 Figure 13. Write Cycle and Full Flag Timing (Quad mode, IDT Standard mode, DDR to DDR) FWFT/SI 0 NOTES: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibits the same behavior. 2. tSKEW2 is the minimum time between a falling RCLK0 edge and a rising WCLK0 edge to guarantee that FF0 will go HIGH (after one WCLK0 cycle plus tWFF). If the time between the falling edge of the RCLK0 and the rising edge of WCLK0 is less than tSKEW2, then FF0 deassertion may be delayed one extra WCLK0 cycle. (See Table 6 - TSKEW measurement). 3. OE0 = LOW, WCS0 = LOW, and RCS0 = LOW. 4. WCLK0 must be free running for FF0 to update. Q[9:0] REN0 RCLK0 WEN0 FF0 D[9:0] WCLK0 NO WRITE IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES MARCH 22, 2005 37 tRCSLZ tENS tENS tSKEW1(2) tENH tA 1 tWFF 2 tDS Wx Word 0 Wx+1 tDS tWFF tDH tCLK tDH tCLKL tENS tSKEW1(2) tENH tA 1 NO WRITE tWFF 2 tDH Wx+3 tDS tWFF Wx+2 Word 1 tDS 6158 drw19 tDH 3. MD 0 IW 0 OW 1 WDDR 1 FWFT/SI 0 Figure 14. Write Cycle and Full Flag Timing (Dual mode, IDT Standard mode, DDR to SDR, x10 In to x20 Out) RDDR 0 NOTES: 1. The timing diagram shown is for FIFO0. FIFO 2 exhibit the same behavior. 2. tSKEW1 is the minimum time between a rising RCLK0 edge and a rising WCLK0 edge to guarantee that FF0 will go HIGH (after one WCLK0 cycle plus tWFF). If the time between the rising edge of the RCLK0 and the rising edge of the WCLK0 is less than tSKEW1, then the FF0 deassertion may be delayed one extra WCLK cycle. (See Table 6 - TSKEW measurement). 4. OE0 = LOW, and WCS0 = LOW. 5. WCLK0 must be free running for FF0 to update. Q[19:0] RCS0 REN0 RCLK0 WEN0 FF0 D[9:0] WCLK0 NO WRITE tCLKH IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES MARCH 22, 2005 tRCSLZ tENS tENS tENH tA tA Word 0 tSKEW2(2) 1 NO WRITE tWFF 2 tDS Word 1 Wx tDH tCLK tDS tCLKH tWFF Wx+1 tDH tENS tENH tA tA Word 2 tSKEW2(2) NO WRITE 1 Word 3 tWFF 2 tENS tDS tDH tRCSHZ Wx+2 tDH tWFF Wx+3 tDS 6158 drw20 38 5. MD 0 IW 1 OW 0 WDDR 0 FWFT/SI 0 Figure 15. Write Cycle and Full Flag (Dual mode, IDT Standard mode, SDR to DDR, x20 In to x10 Out) RDDR 1 NOTES: 1. The timing diagram shown is for FIFO0. FIFO 2 exhibit the same behavior. 2. tSKEW2 is the minimum time between a falling RCLK0 edge and a rising WCLK0 edge to guarantee that FF0 will go HIGH (after one WCLK0 cycle plus tWFF). If the time between the falling edge of the RCLK0 and the rising edge of WCLK0 is less than tSKEW2, then FF0 deassertion may be delayed one extra WCLK0 cycle. (See Table 6 - TSKEW measurement). 3. OE0 = LOW, WCS0 = LOW, and RCS0 = LOW. 4. WCLK0 must be free running for FF0 to update. Q[9:0] RCS0 REN0 RCLK0 WEN0 FF0 D[19:0] WCLK0 tCLKH IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES MARCH 22, 2005 39 tENS W1 (2) 1 tENS tSKEW1 W2 tDH 2 tRCSLZ W3 PREVIOUS DATA IN OUTPUT REGISTER tDS tENS 3 tREF tA W4 tDS W[n0 +2] 1 tPAES tSKEW3 (3) W[n0+3] 2 W[n0+4] W1 W[D-m0-2] tDS W[D-m0-1] W[D-m0] 1 tPAFS W[D-m0+1] W[D-m0+2] W[D-1] WD 6158 drw21 tWFF tENH 8. MD 1 IW D/C OW D/C WDDR 0 RDDR 0 FWFT/SI 1 Figure 16. Write Cycle and Output Ready Timing (Quad mode, FWFT mode, SDR to SDR) PFM 1 NOTES: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibits the same behavior. 2. tSKEW1 is the minimum time between a rising WCLK0 edge and a rising RCLK0 edge to guarantee that OR0 will go LOW after two RCLK0 cycles plus tREF. If the time between the rising edge of WCLK0 and the rising edge of RCLK0 is less than tSKEW1, then OR0 assertion may be delayed one extra RCLK0 cycle. (See Table 6 - TSKEW measurement). 3. tSKEW3 is the minimum time between a rising WCLK0 edge and a rising RCLK0 edge to guarantee that PAE0 will go HIGH after one RCLK0 cycle plus tPAES. If the time between the rising edge of WCLK0 and the rising edge of RCLK0 is less than tSKEW3, then the PAE0 deassertion may be delayed one extra RCLK0 cycle. (See Table 6 - TSKEW measurement). 4. n0 = PAE0 offset, m0 = PAF0 offset and D = maximum FIFO depth. 5. OE0 = LOW, and WCS0 = LOW. 6. First data word latency = tSKEW1 + 2*TRCLK + tREF. 7. WCLK0 must be free running for OR0 to update. IR0 PAF0 PAE0 OR0 Q[9:0] REN0 RCS0 RCLK0 D[9:0] WEN0 WCLK0 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES MARCH 22, 2005 tENS tENH tDH tDS W2 1 tSKEW2(2) tDH Previous Data In Output Register W1 tDS 2 tA 3 tREF tENS W3 tDS tA tDS W1 tENH tDH tDH W4 W2 tENS tA tENH tREF W3 tA W4 6158 drw22 40 6. MD 1 IW D/C OW D/C WDDR 1 RDDR 1 Figure 17. Write Cycle and Output Ready Timing (Quad mode, FWFT mode, DDR to DDR) FWFT/SI 1 NOTES: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibits the same behavior. 2. tSKEW2 is the minimum time between a falling WCLK0 edge and a rising RCLK0 edge to guarantee that OR0 will go LOW after two RCLK0 cycle plus tREF. If the time between the falling edge of WCLK0 and the rising edge of RCLK0 is less than tSKEW2, then OR0 assertion may be delayed one extra RCLK0 cycle. (See Table 6 - TSKEW measurement). 3. OE0 = LOW, RCS0 = LOW, and WCS0 = LOW. 4. First data word latency = tSKEW2 + 2*TRCLK + tREF. 5. WCLK0 must be free running for OR0 to update. Q[9:0] REN0 RCLK0 OR0 WEN0 D[9:0] WCLK0 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES MARCH 22, 2005 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 tCLK tCLKH RCLK0 1 tENS tCLKL 2 tENH tENS tENH REN0 tENS tENH NO OPERATION NO OPERATION tREF tREF tREF EF0 tA tA Q[9:0] WX-1 tOLZ tOHZ tOE OE0 WX-1 tA WX WX+1 tOE (2) tSKEW1 WCLK0 tENH tENS tENS tENH WEN0 tENS tENH WCS0 D[9:0] tDS tDH tDS tDH WX+1 WX 6158 drw23 NOTES: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibits the same behavior. 2. tSKEW1 is the minimum time between a rising WCLK0 edge and a rising RCLK0 edge to guarantee that EF0 will go HIGH (after one RCLK0 cycle plus tREF). If the time between the rising edge of WCLK0 and the rising edge of RCLK0 is less than tSKEW1, then EF0 deassertion may be delayed one extra RCLK0 cycle. (See Table 6 - TSKEW measurement).. 3. First data word latency = tSKEW1 + 1*TRCLK + tREF. 4. RCS0 = LOW. 5. RCLK0 must be free running for EF0 to update. 6. MD 1 IW D/C OW D/C WDDR 0 RDDR 0 FWFT/SI 0 Figure 18. Read Cycle, Output Enable and Empty Flag Timing (Quad mode, IDT Standard mode, SDR to SDR) 41 MARCH 22, 2005 42 tOLZ tOE tA tREF Wn-1 tA tDH Wn+2 tDS tENH tWCSH tDH Wn+1 tDS tWCSS tENS Wn tSKEW2 (2) tOHZ 1 tOLZ 2 tREF tCLKH tCLK Wn tCLKL tA tREF Wn+1 tA Wn+2 NO Read 5198 drw24 6. MD 1 IW D/C OW D/C WDDR 1 FWFT/SI 0 Figure 19. Read Cycle, Output Enable and Empty Flag Timing (Quad mode, IDT Standard mode, DDR to DDR) RDDR 1 NOTES: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibits the same behavior. 2. tSKEW2 is the minimum time between a falling WCLK0 edge and a rising RCLK0 edge to guarantee that EF0 will go HIGH (after one RCLK0 cycle plus tREF). If the time between the falling edge of WCLK0 and the rising edge of RCLK0 is less than tSKEW2, then EF0 deassertion may be delayed one extra RCLK0 cycle. (See Table 6 - TSKEW measurement) 3. REN0 = LOW, and RCS0 = LOW. 4. First data word latency = tSKEW2 + 1*TRCLK + tREF. 5. RCLK0 must be free running for EF0 to update. D[9:0] WCS0 WEN0 WCLK0 OE0 Q[9:0] EF0 RCLK0 NO Read IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES MARCH 22, 2005 tDS tENS tENS W0 - W1 tDH W2 - W3 tDS tENH tENH tDH Previous Data in Ouput Register tSKEW2(2) 1 tREF 2 tENS tA W0 tA tCLK W1 tCLKL tA W2 tA tREF W3 6158 drw25 43 6. MD 0 IW 1 OW 0 WDDR 1 FWFT/SI 0 Figure 20. Read Cycle and Empty Flag Timing (Dual mode, IDT Standard mode, DDR to SDR, x20 In to x10 Out) RDDR 0 NOTES: 1. The timing diagram shown is for FIFO0. FIFO 2 exhibits the same behavior. 2. tSKEW2 is the minimum time between a falling WCLK0 edge and a rising RCLK0 edge to guarantee that EF0 will go HIGH (after one RCLK0 cycle plus tREF). If the time between the falling edge of WCLK0 and the rising edge of RCLK0 is less than tSKEW2, then EF0 deassertion may be delayed one extra RCLK0 cycle. (See Table 6 - TSKEW measurement). 3. REN0 = LOW, and RCS0 = LOW. 4. First data word latency = tSKEW1 + 1*TRCLK + tREF. 5. RCLK0 must be free running for EF0 to update. D[19:0] WCS0 WEN0 WCLK0 Q[9:0] EF0 REN0 RCLK0 tCLKH IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES MARCH 22, 2005 44 tDS W0 tDH Previous Data tENS tA tA tDS W1 Last Word tREF tENH tDH tDS W2 tDH tDS W3 tDH tENH Last 20-bit Word tSKEW1(2) 1 2 tREF tCLKH tCLKL tENS tCLK tA tREF tENH tA W0-W1 6158 drw26 W2-W3 6. MD 0 IW 0 OW 1 WDDR 0 FWFT/SI 0 Figure 21. Read Cycle and Empty Flag Timing (Dual mode, IDT Standard mode, SDR to DDR, x10 In to x20 Out) RDDR 1 NOTES: 1. The timing diagram shown is for FIFO0. FIFO 2 exhibits the same behavior. 2. tSKEW1 is the minimum time between a rising WCLK0 edge and a rising RCLK0 edge to guarantee that EF0 will go HIGH (after one RCLK0 cycle plus tREF). If the time between the rising edge of WCLK0 and the rising edge of RCLK0 is less than tSKEW1, then EF0 deassertion may be delayed one extra RCLK0 cycle. (See Table 6 - TSKEW measurement). 3. OE0 = LOW, RCS0 = LOW, and WCS0 = LOW. 4. First data word latency = tSKEW1 + 1*TRCLK + tREF. 5. RCLK0 must be free running for EF0 to update. D[9:0] WEN0 WCLK0 Q[19:0] EF0 REN0 RCLK0 NO Read IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES MARCH 22, 2005 45 tDS tENS W1 tOHZ WD tENS tWFF tDH tENH W1 tOE tA W2 1 (2) tSKEW1 tA 2 tWFF W3 Wm0+2 (3) tSKEW3 W[m0+3] tA tPAFS W[m0+4] W[D-n0-1] tA W[D-n0] 1 tPAES W[D-n0+1] W[D-n0+2] W[D-1] tA tENS WD 6158 drw27 tREF 7. MD 1 IW D/C OW D/C WDDR 0 RDDR 0 PFM 1 Figure 22. Read Timing and Output Ready Flag (Quad mode, FWFT mode, SDR to SDR) FWFT/SI 1 NOTES: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibit the same behavior. 2. tSKEW1 is the minimum time between a rising WCLK0 edge and a rising RCLK0 edge to guarantee that OR0 will go LOW after two RCLK0 cycles plus tREF. If the time between the rising edge of WCLK0 and the rising edge of RCLK0 is less than tSKEW1, then OR0 assertion may be delayed one extra RCLK0 cycle. 3. tSKEW3 is the minimum time between a rising WCLK0 edge and a rising RCLK0 edge to guarantee that PAE0 will go HIGH after one RCLK0 cycle plus tPAES. If the time between the rising edge of WCLK0 and the rising edge of RCLK0 is less than tSKEW3, then the PAE0 deassertion may be delayed one extra RCLK0 cycle. 4. OE0 = LOW, and WCS = LOW. 5. n0 = PAE0 offset, m0 = PAF0 offset and D = maximum FIFO depth. 6. First data word latency = tSKEW1 + 2*TRCLK + tREF. IR0 PAF0 PAE0 OR0 Q[9:0] OE0 REN0 RCLK0 D[9:0] WEN0 WCLK0 tCLK tCLKH tCLKL IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES MARCH 22, 2005 W7 tA W8 tA tREF W10 tDS tENS tHS W11 W12 tSKEW2 W13 1 W9 W14 W15 2 W16 tREF W17 tA 3 W18 W10 tENS tCLKL tA tCLK tA W19 W11 tA W20 W12 tA tWFF W21 W13 tA W14 tA W15 tA W16 6158 drw28 W17 46 5. MD 1 IW D/C OW D/C WDDR 1 RDDR 1 Figure 23. Read Timing and Output Ready Timing (Quad mode, FWFT mode, DDR to DDR) FWFT/SI 1 NOTES: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibit the same behavior. 2. tSKEW2 is the minimum time between a falling WCLK0 edge and a rising RCLK0 edge to guarantee that OR0 will go LOW after two RCLK0 cycles plus tREF. If the time between the falling edge of WCLK0 and the rising edge of RCLK0 is less than tSKEW2, then OR0 assertion may be delayed one extra RCLK0 cycle. (See Table 6 - TSKEW measurement). 3. OE0 = LOW. 4. RCLK0 must be free running for OR0 to update. IR0 D[9:0] WEN0 WCLK0 OR0 Q[9:0] REN0 RCLK0 tCLKH IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES MARCH 22, 2005 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 tCLK tCLKH tCLKL 2 1 RCLK0 tENS REN0 tENS tENS tENH tENH RCS0 tREF tREF EF0 tRCSHZ tA tRCSLZ tRCSLZ tRCSHZ tA LAST DATA-1 Q[9:0] LAST DATA tSKEW1(2) WCLK0 tENS tENH WEN0 tDS D[9:0] tDH Dx 6158 drw29 NOTES: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibit the same behavior. 2. tSKEW1 is the minimum time between a rising WCLK0 edge and a rising RCLK0 edge to guarantee that EF0 will go HIGH (after one RCLK0 cycle plus tREF). If the time between the rising edge of WCLK0 and the rising edge of RCLK0 is less than tSKEW1, then EF0 deassertion may be delayed one extra RCLK0 cycle. 3. First data word latency = tSKEW1 + 1*TRCLK + tREF. 4. OE0 = LOW. 5. RCLK0 must be free running for EF0 to update. 6. MD 1 IW D/C OW D/C WDDR 0 RDDR 0 FWFT/SI 0 Figure 24. Read Cycle and Read Chip Select (Quad mode, IDT Standard mode, SDR to SDR) 47 MARCH 22, 2005 48 tDS tENS W1 tENS WD tRCSHZ tENH tENS tWFF tDH tENH W2 tRCSLZ 1 (2) tSKEW1 tA 2 tWFF W3 Wm+2 (3) tSKEW3 W[m+3] tA tPAFS W[m+4] W[D-n-1] tA W[D-n] 1 tPAES W[D-n+1] W[D-n+2] W[D-1] tA tENS WD 6158 drw30 tREF 7. MD 1 IW D/C OW D/C WDDR 0 RDDR 0 FWFT/SI 1 Figure 25. Read Cycle and Read Chip Select Timing (Quad mode, FWFT mode, SDR to SDR) PFM 1 NOTES: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibit the same behavior. 2. tSKEW1 is the minimum time between a rising RCLK0 edge and a rising WCLK0 edge to guarantee that IR0 will go LOW after one WCLK0 cycle plus tWFF. If the time between the rising edge of RCLK0 and the rising edge of WCLK0 is less than tSKEW1, then the IR0 assertion may be delayed one extra WCLK0 cycle. 3. tSKEW3 is the minimum time between a rising RCLK0 edge and a rising WCLK0 edge to guarantee that PAF0 will go HIGH after one WCLK0 cycle plus tPAFS. If the time between the rising edge of RCLK0 and the rising edge of WCLK0 is less than tSKEW3, then the PAF0 deassertion may be delayed one extra WCLK0 cycle. 4. n0 = PAE0 Offset, m0 = PAF0 offset and D = maximum FIFO depth. 5. OE = LOW. 6. RCLK0 must be free running for EF0 to update. IR0 PAF0 PAE0 OR0 Q[9:0] RCS0 REN0 RCLK0 D[9:0] WEN0 WCLK0 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES MARCH 22, 2005 tOLZ tENS WD-10 tA tCLKEN tERCLK WD-9 tA WD-8 tA tENH WD-7 tA tENS WD-6 tOLZ tCLKEN tENH tOLZ tCLKEN tENS WD-6 tA WD-5 tA WD-4 tA tENH WD-3 tA tENS tENS WD-2 tCLKEN tENH tA tREF tCLKEN tA WD-1 Last Word WD tCLKEN NO Read 49 5. MD 1 IW D/C OW D/C WDDR 1 FWFT/SI 0 Figure 26. Echo Read Clock and Read Enable Operation (Quad mode, IDT Standard mode, DDR to DDR) RDDR 1 NOTES: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibit the same behavior. 2. The EREN0 output is LOW if RCS0 and REN0 are LOW on the rising RCLK0 edge provided that the FIFO is not empty. If the FIFO is empty, EREN0 will go HIGH to indicate that there is no new word available. 3. The EREN0 output is synchronous to RCLK0. 4. OE0 = LOW. Q[9:0] EF0 EREN0 RCS0 REN0 ERCLK0 RCLK0 NO Read 6158 drw29 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES WCLK0 tENS tENH WEN0 tDS tDH Wn+1 D[9:0] tDS tDH tDS Wn+2 tDH Wn+3 tSKEW1 1 RCLK0 a 2 b e d c h g f i tERCLK ERCLK0 tENS REN0 tENH tENS RCS0 tCLKEN tCLKEN tCLKEN tCLKEN EREN0 tRCSLZ Q[9:0] HIGH-Z tA tA Wn+1 Wn+2 Wn+3 tREF tREF OR0 tA tA O/P Reg. Wn Last Word Wn+1 tA Wn+2 Wn+3 6158 drw32 NOTE: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibit the same behavior. 2. The O/P Register is the internal output register. Its contents are available on the Qn output bus only when RCS0 and OE0 are both active, LOW, that is the bus is not in HighImpedance state. 3. OE0 is LOW. Cycle: a&b. At this point the FIFO is empty, OR0 is HIGH. RCS0 and REN0 are both disabled, the output bus is High-Impedance. c. Word Wn+1 falls through to the output register, OR0 goes active, LOW. RCS0 is HIGH, therefore the Qn outputs are High-Impedance. EREN0 goes LOW to indicate that a new word has been placed on the output register. d. EREN0 goes HIGH, no new word has been placed on the output register on this cycle. e. No Operation. f. RCS0 is LOW on this cycle, therefore the Qn outputs go to Low-Impedance and the contents of the output register (Wn+1) are made available. NOTE: In FWFT mode is important to take RCS0 active LOW at least one cycle ahead of REN0, this ensures the word (Wn+1) currently in the output register is made available for at least one cycle. g. REN0 goes active LOW, this reads out the second word, Wn+2. EREN0 goes active LOW to indicate a new word has been placed into the output register. h. Word Wn+3 is read out, EREN0 remains active, LOW indicating a new word has been read out. NOTE: Wn+3 is the last word in the FIFO. i. This is the next enabled read after the last word, Wn+3 has been read out. OR0 flag goes HIGH and EREN0 goes HIGH to indicate that there is no new word available. 4. OE0 is LOW, WDDR = LOW, and RDDR = LOW. Figure 27. Echo RCLK and Echo Read Enable Operation (Quad mode, FWFT mode, SDR to SDR) 50 MARCH 22, 2005 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 RCLK0 tERCLK ERCLK0 tENS tENH REN0 tENS RCS0 tCLKEN tCLKEN tCLKEN EREN0 tREF EF0 tA tOLZ tA tA Q[9:0] tA tA WD-1 WD Last Word 6158 drw33 NOTES: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibit the same behavior. 2. The EREN0 output is LOW if RCS0 and REN0 are LOW on the rising RCLK0 edge provided that the FIFO is not empty. If the FIFO is empty, EREN0 will go HIGH to indicate that there is no new word available. 3. The EREN0 output is synchronous to RCLK0. 4. OE0 = LOW. 5. MD 1 IW D/C OW D/C WDDR 0 RDDR 0 FWFT/SI 0 Figure 28. Echo Read Clock and Read Enable Operation (Quad mode, IDT Standard mode, SDR to SDR) 51 MARCH 22, 2005 tSDS tSENS tSCLK tSCKL BIT 1 EMPTY OFFSET 3 (1) BIT X BIT 1 52 tSENS tSCLK tSCKL tSOA tSEN H BIT 0 EMPTY OFFSET 3 BIT X (1) BIT 1 EMPTY OFFSET 0 (1) BIT X BIT 0 FULL OFFSET 3 (1) BIT X BIT 0 EMPTY OFFSET 0 Figure 30. Reading of Programmable Flag Registers (IDT Standard and FWFT modes) NOTES: 1. See Table 2 - Default Programming Flag Offsets for the values of x. 2. See Figure 3 - Offset Register Serial Bit Sequence for data sequence information. SO SREN SCLK tSCKH FULL OFFSET 3 (1) BIT X Figure 29. Loading of Programmable Flag Registers (IDT Standard and FWFT modes) NOTES: 1. See Table 2 - Default Programming Flag Offsets for the values of x. 2. See Figure 4 - Offset Register Serial Bit Sequence for data sequence information. SI SWEN SCLK tSCKH (1) BIT X BIT 1 BIT 0 FULL OFFSET 0 tSDH FULL OFFSET 0 tSOA tENH (1) BIT X tSENH 6158 drw35 (1) BIT X 6158 drw34 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES MARCH 22, 2005 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 tCLKL tCLKL WCLK0 1 2 1 tENS 2 tENH WEN0 tPAFS PAF0 tPAFS (2) D-(m0+1) words (2) in FIFO D - m0 words in FIFO (2) D - (m0 +1) words in FIFO (4) tSKEW3 RCLK0 tENH tENS REN0 6158 drw36 NOTES: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibit the same behavior. 2. m0 = PAF0 offset . 2. D = maximum FIFO depth. For density of FIFO with bus-matching, refer to the bus-matching section on page 19. 4. tSKEW3 is the minimum time between a rising RCLK0 edge and a rising WCLK0 edge to guarantee that PAF0 will go HIGH (after one WCLK0 cycle plus tPAFS). If the time between the rising edge of RCLK0 and the rising edge of WCLK0 is less than tSKEW2, then the PAF0 deassertion time may be delayed one extra WCLK0 cycle. 5. PAF0 is asserted and updated on the rising edge of WCLK0 only. 6. RCS0 = LOW, and WCS0 = LOW. 7. MD 1 IW D/C OW D/C WDDR 0 RDDR 0 PFM 1 Figure 31. Synchronous Programmable Almost-Full Flag Timing (Quad mode, IDT Standard and FWFT mode, SDR to SDR) tCLKH tCLKL WCLK0 tENS tENH WEN0 (3) (3) n0 words in FIFO , (4) n0 + 1 words in FIFO PAE0 (5) tSKEW3 RCLK0 n0 words in FIFO , (4) n0 + 1 words in FIFO (3) n0 + 1 words in FIFO , (4) n0 + 2 words in FIFO tPAES 1 2 tPAES 1 tENS REN0 2 tENH 6158 drw37 NOTES: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibit the same behavior. 2. n0 = PAE0 offset. 3. For IDT Standard mode 4. For FWFT mode. 5. tSKEW3 is the minimum time between a rising WCLK0 edge and a rising RCLK0 edge to guarantee that PAE0 will go HIGH (after one RCLK0 cycle plus tPAES). If the time between the rising edge of WCLK0 and the rising edge of RCLK0 is less than tSKEW3, then the PAE0 deassertion may be delayed one extra RCLK0 cycle. 6. PAE0 is asserted and updated on the rising edge of RCLK0 only. 7. RCS0 = LOW, and WCS0 = LOW. 8. MD 1 IW D/C OW D/C WDDR 0 RDDR 0 PFM 1 Figure 32. Synchronous Programmable Almost-Empty Flag Timing (Quad mode, IDT Standard and FWFT mode, SDR to SDR) 53 MARCH 22, 2005 IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 tCLKH COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES tCLKL WCLK0 tENS tENH WEN0 tPAFA D - m0 words in FIFO D - (m0 + 1) words in FIFO PAF0 D - (m0 + 1) words in FIFO tPAFA RCLK0 tENS REN0 6158 drw38 NOTES: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibit the same behavior. 2. m0 = PAF0 offset. 3. D = maximum FIFO depth. For density of FIFO with bus-matching, refer to the bus-matching section on page 19. 4. PAF0 is asserted to LOW on WCLK0 transition and reset to HIGH on RCLK0 transition. 5. RCS0 = LOW, and WCS0 = LOW. 6. MD 1 IW D/C OW D/C WDDR 0 RDDR 0 PFM 0 Figure 33. Asynchronous Programmable Almost-Full Flag Timing (Quad mode, IDT Standard and FWFT mode, SDR to SDR) tCLKH tCLKL WCLK0 tENS tENH WEN0 tPAEA n0 words in FIFO(3), n0 + 1 words in FIFO(4) PAE0 n0 + 1 words in FIFO(3), n 0+ 2 words in FIFO(4) n0 words in FIFO(3), n0 + 1 words in FIFO(4) tPAEA RCLK0 tENS REN0 6158 drw39 NOTES: 1. The timing diagram shown is for FIFO0. FIFO1-3 exhibit the same behavior. 2. n0 = PAE0 offset. 3. For IDT Standard Mode. 4. For FWFT Mode. 5. PAE0 is asserted LOW on RCLK0 transition and reset to HIGH on WCLK0 transition. 6. RCS0 = LOW, and WCS0 = LOW. 7. MD 1 IW D/C OW D/C WDDR 0 RDDR 0 PFM 0 Figure 34. Asynchronous Programmable Almost-Empty Flag Timing (Quad mode, IDT Standard and FWFT mode, SDR to SDR) 54 MARCH 22, 2005 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT72T54242/72T54252/72T54262 2.5V QUAD/DUAL TeraSync™ DDR/SDR FIFO 32K x 10 x 4/16K x 20 x 2, 64K x 10 x 4/32K x 20 x 2 and 128K x 10 x 4/64K x 20 x 2 WCLK WEN tDH tDS D[39:0] WD10 tDS tDH tDS WD11 WD12 tDH tDS WD13 1ns (1) 1 RCLK 2 3 4 REN tA Q[39:0] WD1 tA WD2 tPDHZ(7) tA WD3 tPDLZ(2) Hi-Z WD4 tA WDH WDS tPDH(2) tPDH(2) tPDL PD tERCLK Hi-Z ERCLK tEREN tEREN Hi-Z EREN 6158 drw40 NOTES: 1. All read and write operations must have ceased a minimum of 4 WCLK and 4 RCLK cycles before power down is asserted. REN and WEN must be held HIGH during this interval. 2. When the PD input becomes deasserted, there will be a 1µs waiting period before read and write operations can resume. All input and output signals will also resume after this time period. 3. Setup and configuration static inputs are not affected during power down. 4. Serial programming and JTAG programming port are inactive during power down. 5. RCS = 0, WCS = 0 and OE = 0. These signals can toggle during and after power down. 6. All flags remain active and maintain their current states. 7. During power down, all outputs will be in high-impedance. Figure 35. Power Down Operation 55 MARCH 22, 2005 ORDERING INFORMATION IDT XXXXX X XX X Device Type Power Speed Package X Process / Temperature Range BLANK I(1) Commercial (0°C to +70°C) Industrial (-40°C to +85°C) BB Plastic Ball Grid Array (PBGA, BB324-1) 5 6-7 Commercial Only Commercial and Industrial L Low Power 72T54242 72T54252 72T54262 32,768 x 10 x 4/32,768 x 10 x 2 2.5V Quad/Dual TeraSyncTM DDR/SDR FIFO 65,536 x 10 x 4/65,536 x 10 x 2 2.5V Quad/Dual TeraSyncTM DDR/SDR FIFO 131,072 x 10 x 4/131,072 x 10 x 2 2.5V Quad/Dual TeraSyncTM DDR/SDR FIFO Clock Cycle Time (tCLK) Speed in Nanoseconds 6158 drw41 NOTE: 1. Industrial temperature range product for the 6-7 speed grade is available as a standard device. All other speed grades available by special order. DATASHEET DOCUMENT HISTORY 12/01/2003 03/22/2005 pgs. 1, 6, 13, 27, and 30. pgs. 1, 4, 7, 12-15 and 56. CORPORATE HEADQUARTERS 6024 Silver Creek Valley Road San Jose, CA 95138 for SALES: 800-345-7015 or 408-284-8200 fax: 408-284-2775 www.idt.com 56 for Tech Support: 408-360-1753 email: [email protected]