LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS Pb Lead-Free Parts L8UG31040-B01-PF/TBS-X DATA SHEET DOC. NO : QW0905- L8UG31040-B01-PF/TBS-X REV. : A DATE : 07 -Apr. - 2016 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/7 PART NO.L8UG31040-B01-PF/TBS-X Package Dimensions P2 H2 W2 H1 L W0 W1 W3 D - P1 + F P T 3.62 3.86 L8UG31040/A-PF-B01 2.92 5.3 2.95 1.5MIN 25.0MIN 0.5 1.0MIN 2.54TYP + - Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.L8UG31040-B01-PF/TBS-X Page 2/7 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol UNIT 8UG Forward Current IF 25 mA Peak Forward Current Duty 1/10@10KHz IFP 75 mA Power Dissipation PD 65 mW Reverse Current @5V Ir 10 μA Electrostatic Discharge ESD 2000 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL AlGaInP L8UG31040-B01-PF/TBS-X Emitted Lens Green Green Diffused Luminous Viewing Dominant Spectral Forward intensity angle wave halfwidth voltage length △λ nm @20mA(V) @20mA(mcd) 2θ 1/2 λD nm (deg) Min. Typ. Max. Min. Max. 574 20 1.7 2.1 2.6 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 120 550 30 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/7 PART NO. L8UG31040-B01-PF/TBS-X Brightness Code For Standard LED Lamps UG CHIP Group A13 A14 A15 A16 A17 A18 Luminous Intensity(mcd) at 20 mA Min. 120 160 220 300 350 450 Max. 160 220 300 350 450 550 Color Code UG CHIP Group Wave length(nm) at 20 mA Min. Max. 6 566 568 7 568 570 8 570 572 9 572 574 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L8UG31040-B01-PF/TBS-X Page 4/7 •Dimension Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Minimum Maximum mm inch mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 2.3 0.09 3.0 0.12 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 TBS-1 17.5 0.69 18.5 0.73 TBS-2 21.5 0.85 22.5 0.89 TBS-3 25.5 1.0 26.5 1.04 TBS-5 22.5 0.89 23.5 0.93 TBS-6 19.9 0.78 20.9 0.82 24.0 0.94 25.0 0.98 TBS-8 24.5 0.96 25.5 1.0 TBS-9 19.0 0.75 20.0 0.79 TBS-10 18.4 0.72 19.4 0.76 TBS-11 21.0 0.83 22.0 0.87 TBS-12 20.5 0.81 21.5 0.85 TBS-13 18.0 0.71 19.0 0.75 ------- ------- 36 1.42 11 0.43 TBS-7 Feed Hole To Bottom Of Component H1 Feed Hole To Overall Component Height ------- H2 Lead Length After Component Height ------- L Feed Hole Pitch ------- P 12.4 0.49 13 0.51 Lead Location ------- P1 4.4 0.17 5.8 0.23 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19 0.75 W0 REMARK:TBS=Tape And Box Straight Leads • Dimensions Symbol Information • Package Dimensions Specification Description Symbol minimum maxmum mm inch mm inch Overall Length L 330 13.0 340 13.4 Overall Width W 265 10.4 275 10.8 Overall Thickness H 50 1.97 60 2.4 Quantity/Box 2500PCS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/7 PART NO. L8UG31040-B01-PF/TBS-X Typical Electro-Optical Characteristics Curve 8UG CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 2.0 Relative Intensity Normalize @20mA Forward Current(mA) 60 50 40 30 20 10 0 1.0 0 0 0.5 1.0 1.5 2.0 2.5 1.0 3.0 10 Fig.4 Relative Intensity vs. Temperature Relative Intensity @20mA Normalize @25℃ Forward Voltage@20mA Normaliz @25℃ Fig.3 Forward Voltage vs. Temperature 1.2 1.1 1.0 0.9 0.8 0 20 40 60 1000 Forward Current(mA) Forward Voltage(V) -20 100 80 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Directivity Radiation Relative Intensity @20mA 0° 1.0 -30° 30° -60° 0.5 60° 0 500 550 600 Wavelength (nm) 650 100% 75% 50% 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/7 PART NO.L8UG31040-B01-PF/TBS-X Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 400° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:265°C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 265° C5sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.L8UG31040-B01-PF/TBS-X Page 7/7 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11