IDT7203 IDT7204 IDT7205 IDT7206 IDT7207 IDT7208 CMOS ASYNCHRONOUS FIFO 2,048 x 9, 4,096 x 9 8,192 x 9, 16,384 x 9 32,768 x 9 and 65,536 x 9 FEATURES: • • • • • • • • • • • • • • • • • • First-In/First-Out Dual-Port memory 2,048 x 9 organization (IDT7203) 4,096 x 9 organization (IDT7204) 8,192 x 9 organization (IDT7205) 16,384 x 9 organization (IDT7206) 32,768 x 9 organization (IDT7207) 65,636 x 9 organization (IDT7208) High-speed: 12ns access time Low power consumption — Active: 660mW (max.) — Power-down: 44mW (max.) Asynchronous and simultaneous read and write Fully expandable in both word depth and width 720x family is pin and functionally compatible from 256 x 9 to 64k x 9 Status Flags: Empty, Half-Full, Full Retransmit capability High-performance CMOS technology Military product compliant to MIL-STD-883, Class B Standard Military Drawing for #5962-88669 (IDT7203), 5962-89567 (IDT7203), and 5962-89568 (IDT7204) are listed on this function • Industrial temperature range (–40°C to +85°C) is available (plastic packages only) Green parts available, see ordering information DESCRIPTION: The IDT7203/7204/7205/7206/7207/7208 are dual-port memory buffers with internal pointers that load and empty data on a first-in/first-out basis. The device uses Full and Empty flags to prevent data overflow and underflow and expansion logic to allow for unlimited expansion capability in both word size and depth. Data is toggled in and out of the device through the use of the Write (W) and Read (R) pins. The device's 9-bit width provides a bit for a control or parity at the user’s option. It also features a Retransmit (RT) capability that allows the read pointer to be reset to its initial position when RT is pulsed LOW. A Half-Full Flag is available in the single device and width expansion modes. These FIFOs are fabricated using high-speed CMOS technology. They are designed for applications requiring asynchronous and simultaneous read/ writes in multiprocessing, rate buffering and other applications. Military grade product is manufactured in compliance with MIL-STD-883, Class B. FUNCTIONAL BLOCK DIAGRAM DATA INPUTS (D0 -D8) W WRITE CONTROL RAM ARRAY WRITE POINTER READ POINTER 2,048 x 9 4,096 x 9 8,192 x 9 16,384 x 9 32,768 x 9 65,536 x 9 THREESTATE BUFFERS R RS DATA OUTPUTS (Q 0-Q 8 ) READ CONTROL FLAG LOGIC XI EF FF EXPANSION LOGIC XO/HF IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. COMMERCIAL, MILITARY AND INDUSTRIAL TEMPERATURE RANGES 1 © 2012 Integrated Device Technology, Inc. All rights reserved. Product subject to change without notice. RESET LOGIC FL/RT 2661 drw01 JUNE 2012 DSC-2661/18 IDT7203/7204/7205/7206/7207/7208 CMOS ASYNCHRONOUS FIFO 2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9, 32,768 x 9 and 65,536 x 9 COMMERCIAL, INDUSTRIAL AND MILITARY TEMPERATURE RANGES 32 31 30 INDEX Vcc D4 D5 D6 D7 FL/RT RS EF XO/HF Q7 Q6 Q5 Q4 R D2 D1 D0 XI FF Q0 Q1 NC Q2 5 6 7 8 9 10 11 12 13 1 4 3 2 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 15 16 17 18 19 20 1 2 3 4 5 6 7 8 9 10 11 12 13 14 29 28 27 26 25 24 23 22 21 D6 D7 NC FL/RT RS EF XO/HF Q7 Q6 Q3 Q8 GND NC R Q4 Q5 W D8 D3 D2 D1 D0 XI FF Q0 Q1 Q2 Q3 Q8 GND D3 D8 W NC Vcc D4 D5 PIN CONFIGURATIONS 2661 drw02b 2661 drw02a TOP VIEW Package Type PLASTIC DIP PLASTIC THIN DIP CERDIP THIN CERDIP SOIC Reference Identifier P28-1 P28-2 D28-1 D28-3 SO28-3 Order Code P TP D TD SO TOP VIEW Device Availability All devices All except IDT7207/7208 All except IDT7208 Only for IDT7203/7204/7205 Only for IDT7204 Reference Identifier Order Code PLCC J32-1 J All devices LCC L32-1 L All except IDT7208 Package Type (1) Device Availability NOTE: 1. This package is only available in the military temperature range. RECOMMENDED DC OPERATING CONDITIONS Symbol ABSOLUTE MAXIMUM RATINGS Symbol V TERM Rating Terminal Voltage with Respect to GND Com'l & Ind'l –0.5 to +7.0 Military –0.5 to +7.0 Unit Parameter Min. Typ. Max. Unit VCC Supply Voltage Commercial/Industrial/Military 4.5 5.0 5.5 V GND Supply Voltage 0 0 0 V Input High Voltage Commercial/Industrial 2.0 — — V Input High Voltage Military 2.2 — — V V V IH(1) VIH(1) IL(2) TSTG Storage Temperature –55 to + 125 –65 to +155 °C V Input Low Voltage Commercial/Industrial/Military — — 0.8 V I OUT DC Output +Current –50 to +50 –50 to +50 mA TA Operating Temperature Commercial 0 — 70 °C TA Operating Temperature Industrial –40 — 85 °C TA Operating Temperature Military –55 — 125 °C NOTE: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. NOTES: 1. For RT/RS/XI input, VIH = 2.6V (commercial). For RT/RS/XI input, VIH = 2.6V (military). 2. 1.5V undershoots are allowed for 10ns once per cycle. 2 IDT7203/7204/7205/7206/7207/7208 CMOS ASYNCHRONOUS FIFO 2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9, 32,768 x 9 and 65,536 x 9 COMMERCIAL, INDUSTRIAL AND MILITARY TEMPERATURE RANGES DC ELECTRICAL CHARACTERISTICS (Commercial: VCC = 5V ± 10%, TA = 0°C to +70°C; Industrial: VCC = 5V ± 10%, TA = –40°C to +85°C; Military: VCC = 5V ± 10%, TA = –55°C to +125°C) IDT7203(1) IDT7204(1) Commercial and Industrial tA = 12, 15, 20, 25, 35, 50 ns Symbol Typ. Max. Min. Max. Unit Input Leakage Current (Any Input) –1 — 1 –1 — 1 μA Output Leakage Current –10 — 10 –10 — 10 μA VOH Output Logic “1” Voltage IOH = –2mA 2.4 — — 2.4 — — V VOL Output Logic “0” Voltage IOL = 8mA — — 0.4 — — 0.4 V ICC1(8,9,10) Active Power Supply Current — — 120 — — 150 mA ICC2(8,10,11) Standby Current (R=W=RS=FL/RT=VIH) — — 12 — — 25 mA Power Down Current — — 2 — — 4 mA ILI(6) ILO (7) ICC3 (8,10,12) Parameter Min. IDT7203 IDT7204 Military(3) tA = 20, 30, 40 ns Typ. IDT7205 IDT7206(2,4) IDT7207(2,4) IDT7208(2,5) Commercial and Industrial tA = 12, 15, 20, 25, 35, 50 ns IDT7205 IDT7206 IDT7207 (1) Symbol ILI (6) ILO (7) VOH VOL ICC1 (8,9,10) ICC2(8,10,11) ICC3 (8,10,12) Parameter Military tA = 20, 30 ns Min. Typ. Max. Min. Typ. Max. Unit Input Leakage Current (Any Input) –1 — 1 –1 — 1 μA Output Leakage Current –10 — 10 –10 — 10 μA Output Logic “1” Voltage IOH = –2mA 2.4 — — 2.4 — — V Output Logic “0” Voltage IOL = 8mA — — 0.4 — — 0.4 V Active Power Supply Current — — 120 — — 150 mA Standby Current (RS=FL/RT=VIH) — — 12 — — 25 mA Power Down Current — — 8 — — 12 mA NOTES: 1. Industrial temperature range product for 15ns and 25ns speed grades are available as a standard device. 2. Industrial temperature range product for 25ns speed grade only is available as a standard device. All other speed grades are available by special order. 3. Military temperature range product for the 40ns is only available for 7203. 4. Commercial temperature range product for the 12ns not available. 5. Commercial temperature range product for the 12ns, 15ns and 50ns not available. 6. Measurements with 0.4 ≤ VIN ≤ VCC. 7. R ≥ VIH, 0.4 ≤ VOUT ≤ VCC. 8. Tested with outputs open (IOUT = 0). 9. R and W toggle at 20 MHz and data inputs switch at 10 MHz. 10. ICC measurements are made with outputs open. 11. All Inputs = VCC - 0.2V or GND + 0.2V, except R and W, which toggle at 20MHz. 12. All Inputs = VCC - 0.2V or GND + 0.2V, except R and W = VCC -0.2V. 5V AC TEST CONDITIONS Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels Output Load GND to 3.0V 5ns 1.5V 1.5V See Figure 1 CAPACITANCE (1) Symbol 1.1KΩ D.U.T. 680Ω 30pF* (TA = +25°C, f = 1.0 MHz) Parameter Condition Max. Unit (1) CIN Input Capacitance VIN = 0V 10 pF COUT(1,2) Output Capacitance VOUT = 0V 10 pF 2661 drw03 or equivalent circuit NOTES: 1. This parameter is sampled and not 100% tested. 2. With output deselected. Figure 1. Output Load *Includes jig and scope capacitances. 3 IDT7203/7204/7205/7206/7207/7208 CMOS ASYNCHRONOUS FIFO 2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9, 32,768 x 9 and 65,536 x 9 COMMERCIAL, INDUSTRIAL AND MILITARY TEMPERATURE RANGES AC ELECTRICAL CHARACTERISTICS(1) (Commercial: VCC = 5V ± 10%, TA = 0°C to +70°C; Industrial: VCC = 5V ± 10%, TA = –40°C to +85°C; Military: VCC = 5V ± 10%, TA = –55°C to +125°C) Commercial IDT7203L12 IDT7204L12 IDT7205L12 Symbol fS tRC tA tRR tRPW tRLZ tWLZ tDV tRHZ tWC tWPW tWR tDS tDH tRSC tRS tRSS tRTR tRTC tRT tRTS tRTR tEFL tHFH, tFFH tRTF tREF tRFF tRPE tWEF tWFF tWHF tRHF tWPF tXOL tXOH tXI tXIR tXIS Parameters Shift Frequency Read Cycle Time Access Time Read Recovery Time Read Pulse Width(4) Read LOW to Data Bus LOW(5) Write HIGH to Data Bus Low-Z(5,6) Data Valid from Read HIGH Read HIGH to Data Bus High-Z(5) Write Cycle Time Write Pulse Width(4) Write Recovery Time Data Set-up Time Data Hold Time Reset Cycle Time Reset Pulse Width(4) Reset Set-up Time(5) Reset Recovery Time Retransmit Cycle Time Retransmit Pulse Width(4) Retransmit Set-up Time(5) Retransmit Recovery Time Reset to EF LOW Reset to HF and FF HIGH Retransmit LOW to Flags Valid Read LOW to EF LOW Read HIGH to FF HIGH Read Pulse Width after EF HIGH Write HIGH to EF HIGH Write LOW to FF LOW Write LOW to HF Flag LOW Read HIGH to HF Flag HIGH Write Pulse Width after FF HIGH Read/Write LOW to XO LOW Read/Write HIGH to XO HIGH XI Pulse Width(4) XI Recovery Time XI Set-up Time Min. — 20 — 8 12 3 3 5 — 20 12 8 9 0 20 12 12 8 20 12 12 8 — — — — — 12 — — — — 12 — — 12 8 8 Max. 50 — 12 — — — — — 12 — — — — — — — — — — — — — 12 17 20 12 14 — 12 14 17 17 — 12 12 — — — Com'l & Ind'l IDT7203L15(2) IDT7204L15(2) IDT7205L15(2) IDT7206L15 IDT7207L15 Min. — 25 — 10 15 5 5 5 — 25 15 10 11 0 25 15 15 10 25 15 15 10 — — — — — 15 — — — — 15 — — 15 10 10 Max. 40 — 15 — — — — — 15 — — — — — — — — — — — — — 25 25 25 15 15 — 15 15 25 25 — 15 15 — — — Com'l & Military IDT7203L20 IDT7204L20 IDT7205L20 IDT7206L20 IDT7207L20 Min. — 30 — 10 20 5 5 5 — 30 20 10 12 0 30 20 20 10 30 20 20 10 — — — — — 20 — — — — 20 — — 20 10 10 Max. 33.3 — 20 — — — — — 15 — — — — — — — — — — — — — 30 30 30 20 20 — 20 20 30 30 — 20 20 — — — Commercial IDT7208L20 Min. — 30 — 10 20 5 5 5 — 30 20 10 12 0 30 20 20 10 30 20 20 10 — — — — — 20 — — — — 20 — — 20 10 10 Max. 33.3 — 20 — — — — — 15 — — — — — — — — — — — — — 30 30 30 20 20 — 20 20 30 30 — 20 20 — — — Com'l & Ind'l IDT7203L25(2) IDT7204L25(2) IDT7205L25(2) IDT7206L25(3) IDT7207L25(3) IDT7208L25(3) Min. — 35 — 10 25 5 5 5 — 35 25 10 15 0 35 25 25 10 35 25 25 10 — — — — — 25 — — — — 25 — — 25 10 10 NOTES: 1. Timings referenced as in AC Test Conditions. 2. Industrial temperature range product for 15ns and 25ns speed grades are available as a standard device. 3. Industrial temperature range product for 25ns speed grade only is available as a standard device. All other speed grades are available by special order. 4. Pulse widths less than minimum are not allowed. 5. Values guaranteed by design, not currently tested. 6. Only applies to read data flow-through mode. 4 Max. 28.5 — 25 — — — — — 18 — — — — — — — — — — — — — 35 35 35 25 25 — 25 25 35 35 — 25 25 — — — Unit MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns IDT7203/7204/7205/7206/7207/7208 CMOS ASYNCHRONOUS FIFO 2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9, 32,768 x 9 and 65,536 x 9 COMMERCIAL, INDUSTRIAL AND MILITARY TEMPERATURE RANGES AC ELECTRICAL CHARACTERISTICS(1) (CONTINUED) (Commercial: VCC = 5V ± 10%, TA = 0°C to +70°C; Industrial: VCC = 5V ± 10%, TA = –40°C to +85°C; Military: VCC = 5V ± 10%, TA = –55°C to +125°C) Military IDT7203L30 IDT7204L30 IDT7205L30 IDT7206L30 IDT7207L30 Symbol fS tRC tA tRR tRPW tRLZ tWLZ tDV tRHZ tWC tWPW tWR tDS tDH tRSC tRS tRSS tRTR tRTC tRT tRTS tRTR tEFL tHFH, tFFH tRTF tREF tRFF tRPE tWEF tWFF tWHF tRHF tWPF tXOL tXOH tXI tXIR tXIS Parameters Shift Frequency Read Cycle Time Access Time Read Recovery Time Read Pulse Width(2) Read LOW to Data Bus LOW(3) Write HIGH to Data Bus Low-Z(3,4) Data Valid from Read HIGH Read HIGH to Data Bus High-Z(3) Write Cycle Time Write Pulse Width(2) Write Recovery Time Data Set-up Time Data Hold Time Reset Cycle Time Reset Pulse Width(2) Reset Set-up Time(3) Reset Recovery Time Retransmit Cycle Time Retransmit Pulse Width(2) Retransmit Set-up Time(3) Retransmit Recovery Time Reset to EF LOW Reset to HF and FF HIGH Retransmit LOW to Flags Valid Read LOW to EF LOW Read HIGH to FF HIGH Read Pulse Width after EF HIGH Write HIGH to EF HIGH Write LOW to FF LOW Write LOW to HF Flag LOW Read HIGH to HF Flag HIGH Write Pulse Width after FF HIGH Read/Write LOW to XO LOW Read/Write HIGH to XO HIGH XI Pulse Width(2) XI Recovery Time XI Set-up Time Min. — 40 — 10 30 5 5 5 — 40 30 10 18 0 40 30 30 10 40 30 30 10 — — — — — 30 — — — — 30 — — 30 10 10 Max. 25 — 30 — — — — — 20 — — — — — — — — — — — — — 40 40 40 30 30 — 30 30 40 40 — 30 30 — — — Commercial IDT7203L35 IDT7204L35 IDT7205L35 IDT7206L35 IDT7207L35 IDT7208L35 Min. — 45 — 10 35 5 10 5 — 45 35 10 18 0 45 35 35 10 45 35 35 10 — — — — — 35 — — — — 35 — — 35 10 15 NOTES: 1. Timings referenced as in AC Test Conditions. 2. Pulse widths less than minimum are not allowed. 3. Values guaranteed by design, not currently tested. 4. Only applies to read data flow-through mode. 5 Max. 22.22 — 35 — — — — — 20 — — — — — — — — — — — — — 45 45 45 30 30 — 30 30 45 45 — 35 35 — — — Military IDT7203L40 Min. — 50 — 10 40 5 10 5 — 50 40 10 20 0 50 40 40 10 50 40 40 10 — — — — — 40 — — — — 40 — — 40 10 15 Max. 20 — 40 — — — — — 25 — — — — — — — — — — — — — 50 50 50 35 35 — 35 35 50 50 — 40 40 — — — Commercial IDT7203L50 IDT7204L50 IDT7205L50 IDT7206L50 IDT7207L50 Min. — 65 — 15 50 10 15 5 — 65 50 15 30 5 65 50 50 15 65 50 50 15 — — — — — 50 — — — — 50 — — 50 10 15 Max. 15 — 50 — — — — — 30 — — — — — — — — — — — — — 65 65 65 45 45 — 45 45 65 65 — 50 50 — — — Unit MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns IDT7203/7204/7205/7206/7207/7208 CMOS ASYNCHRONOUS FIFO 2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9, 32,768 x 9 and 65,536 x 9 SIGNAL DESCRIPTIONS COMMERCIAL, INDUSTRIAL AND MILITARY TEMPERATURE RANGES loaded (see Operating Modes). The Single Device Mode is initiated by grounding the Expansion In (XI). The IDT7203/7204/7205/7206/7207/7208 can be made to retransmit data when the Retransmit Enable Control (RT) input is pulsed LOW. A retransmit operation will set the internal read pointer to the first location and will not affect the write pointer. The status of the Flags will change depending on the relative locations of the read and write pointers. Read Enable (R) and Write Enable (W) must be in the HIGH state during retransmit. This feature is useful when less than 2,048/ 4,096/8,192/16,384/32,768/65,536 writes are performed between resets. The retransmit feature is not compatible with the Depth Expansion Mode. INPUTS: DATA IN (D0–D8) — Data inputs for 9-bit wide data. CONTROLS: RESET ( RS ) — Reset is accomplished whenever the Reset (RS) input is taken to a LOW state. During reset, both internal read and write pointers are set to the first location. A reset is required after power-up before a write operation can take place. Both the Read Enable (R) and Write Enable (W) inputs must be in the HIGH state during the window shown in Figure 2 (i.e. tRSS before the rising edge of RS) and should not change until tRSR after the rising edge of RS. EXPANSION IN ( XI ) — This input is a dual-purpose pin. Expansion In (XI) is grounded to indicate an operation in the single device mode. Expansion In (XI) is connected to Expansion Out (XO) of the previous device in the Depth Expansion or Daisy-Chain Mode. OUTPUTS: WRITE ENABLE ( W ) — A write cycle is initiated on the falling edge of this input if the Full Flag (FF) is not set. Data set-up and hold times must be adheredto, with respect to the rising edge of the Write Enable (W). Data is stored in the RAM array sequentially and independently of any on-going read operation. After half of the memory is filled, and at the falling edge of the next write operation, the Half-Full Flag (HF) will be set to LOW, and will remain set until the difference between the write pointer and read pointer is less-than or equal to one-half of the total memory of the device. The Half-Full Flag (HF) is then reset by the rising edge of the read operation. To prevent data overflow, the Full Flag (FF) will go LOW on the falling edge of the last write signal, which inhibits further write operations. Upon the completion of a valid read operation, the Full Flag (FF) will go HIGH after tRFF, allowing a new valid write to begin. When the FIFO is full, the internal write pointer is blocked from W, so external changes in W will not affect the FIFO when it is full. FULL FLAG ( FF ) — The Full Flag (FF) will go LOW, inhibiting further write operations, when the device is full. If the read pointer is not moved after Reset (RS), the Full Flag (FF) will go LOW after 2,048/4,096/8,192/16,384/32,768/65,536 writes. EMPTY FLAG ( EF ) — The Empty Flag (EF) will go LOW, inhibiting further read operations, when the read pointer is equal to the write pointer, indicating that the device is empty. EXPANSION OUT/HALF-FULL FLAG ( XO/HF ) — This is a dual-purpose output. In the single device mode, when Expansion In (XI) is grounded, this output acts as an indication of a half-full memory. After half of the memory is filled, and at the falling edge of the next write operation, the Half-Full Flag (HF) will be set to LOW and will remain set until the difference between the write pointer and read pointer is less than or equal to one half of the total memory of the device. The Half-Full Flag (HF) is then reset by the rising edge of the read operation. In the Depth Expansion Mode, Expansion In (XI) is connected to Expansion Out (XO) of the previous device. This output acts as a signal to the next device in the Daisy Chain by providing a pulse to the next device when the previous device reaches the last location of memory. There will be an XO pulse when the Write pointer reaches the last location of memory, and an additional XO pulse when the Read pointer reaches the last location of memory. READ ENABLE ( R ) — A read cycle is initiated on the falling edge of the Read Enable (R), provided the Empty Flag (EF) is not set. The data is accessed on a First-In/First-Out basis, independent of any ongoing write operations. After Read Enable (R) goes HIGH, the Data Outputs (Q0 through Q8) will return to a highimpedance condition until the next Read operation. When all the data has been read from the FIFO, the Empty Flag (EF) will go LOW, allowing the “final” read cycle but inhibiting further read operations, with the data outputs remaining in a highimpedance state. Once a valid write operation has been accomplished, the Empty Flag (EF) will go HIGH after tWEF and a valid Read can then begin. When the FIFO is empty, the internal read pointer is blocked from R so external changes will not affect the FIFO when it is empty. DATA OUTPUTS (Q0-Q8) — Q0-Q8 are data outputs for 9-bit wide data. These outputs are in a high-impedance condition whenever Read (R) is in a HIGH state. FIRST LOAD/RETRANSMIT ( FL/RT ) — This is a dual-purpose input. In the Depth Expansion Mode, this pin is grounded to indicate that it is the first device 6 IDT7203/7204/7205/7206/7207/7208 CMOS ASYNCHRONOUS FIFO 2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9, 32,768 x 9 and 65,536 x 9 COMMERCIAL, INDUSTRIAL AND MILITARY TEMPERATURE RANGES tRSC tRS RS tRSS tRSR W tRSS R tEFL EF tHFH, tFFH HF, FF 2661 drw04 NOTE: 1. W and R = VIH around the rising edge of RS. Figure 2. Reset tRC tRPW tRR tA tA R tDV tRLZ Q0-Q8 tRHZ DATA OUT VALID DATA OUT VALID tWC W tWR tWPW tDS D0-D8 tDH DATA IN VALID DATA IN VALID 2661 drw05 Figure 3. Asynchronous Write and Read Operation LAST WRITE IGNORED WRITE FIRST READ R W tRFF tWFF FF 2661 drw06 Figure 4. Full Flag Timing From Last Write to First Read 7 IDT7203/7204/7205/7206/7207/7208 CMOS ASYNCHRONOUS FIFO 2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9, 32,768 x 9 and 65,536 x 9 LAST READ W IGNORED READ COMMERCIAL, INDUSTRIAL AND MILITARY TEMPERATURE RANGES FIRST WRITE R tWEF tREF EF tA DATA OUT VALID 2661 drw07 Figure 5. Empty Flag Timing From Last Read to First Write RT tRTC tRT tRTR tRTS W,R tRTF HF, EF, FF FLAG VALID 2661 drw08 NOTE: 1. EF, FF and HF may change status during Retransmit, but flags will be valid at tRTC. Figure 6. Retransmit W tWEF EF tRPE R 2661 drw09 Figure 7. Minimum Timing for an Empty Flag Coincident Read Pulse. R tRFF FF tWPF W 2661 drw10 Figure 8. Minimum Timing for a Full Flag Coincident Write Pulse. 8 IDT7203/7204/7205/7206/7207/7208 CMOS ASYNCHRONOUS FIFO 2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9, 32,768 x 9 and 65,536 x 9 COMMERCIAL, INDUSTRIAL AND MILITARY TEMPERATURE RANGES W R tWHF HF tRHF HALF-FULL OR LESS HALF-FULL OR LESS MORE THAN HALF-FULL 2661 drw11 Figure 9. Half-Full Flag Timing W WRITE TO LAST PHYSICAL LOCATION READ FROM LAST PHYSICAL LOCATION R tXOL tXOL tXOH tXOH XO 2661 drw12 Figure 10. Expansion Out tXI tXIR XI tXIS W WRITE TO FIRST PHYSICAL LOCATION tXIS READ FROM FIRST PHYSICAL LOCATION R 2661 drw13 Figure 11. Expansion In OPERATING MODES: 7204/7205/7206/7207/7208s. These devices operate in the Depth Expansion mode when the following conditions are met: Care must be taken to assure that the appropriate flag is monitored by each system (i.e. FF is monitored on the device where W is used; EF is monitored on the device where R is used). For additional information on the IDT7203/7204/ 7205/7206/7207, refer to Tech Note 8: Operating FIFOs on Full and Empty Boundary Conditions and Tech Note 6: Designing with FIFOs. Single Device Mode A single IDT7203/7204/7205/7206/7207/7208 may be used when the application requirements are for 2,048/4,096/8,192/16,384/32,768/65,536 words or less. These FIFOs are in a Single Device Configuration when the Expansion In (XI) control input is grounded (see Figure 12). Depth Expansion These FIFOs can easily be adapted to applications when the requirements are for greater than 2,048/4,096/8,192/16,384/32,768/65,536 words. Figure 14 demonstrates Depth Expansion using three IDT7203/7204/7205/ 7206/7207/7208s. Any depth can be attained by adding additional IDT7203/ 1. The first device must be designated by grounding the First Load (FL) control input. 2. All other devices must have FL in the HIGH state. 3. The Expansion Out (XO) pin of each device must be tied to the Expansion In (XI) pin of the next device. See Figure 14. 4. External logic is needed to generate a composite Full Flag (FF) and Empty Flag (EF). This requires the ORing of all EFs and ORing of all FFs (i.e. all must be set to generate the correct composite FF or EF). See Figure 14. 5. The Retransmit (RT) function and Half-Full Flag (HF) are not available in the Depth Expansion Mode. For additional information on the IDT7203/7204/7205/7206/7207, refer to Tech Note 9: Cascading FIFOs or FIFO Modules. 9 IDT7203/7204/7205/7206/7207/7208 CMOS ASYNCHRONOUS FIFO 2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9, 32,768 x 9 and 65,536 x 9 USAGE MODES: FIFO permits a reading of a single word after writing one word of data into an empty FIFO. The data is enabled on the bus in (tWEF + tA) ns after the rising edge of W, called the first write edge, and it remains on the bus until the R line is raised from LOW-to-HIGH, after which the bus would go into a three-state mode after tRHZ ns. The EF line would have a pulse showing temporary deassertion and then would be asserted. In the write flow-through mode (Figure 18), the FIFO permits the writing of a single word of data immediately after reading one word of data from a full FIFO. The R line causes the FF to be deasserted but the W line being LOW causes it to be asserted again in anticipation of a new data word. On the rising edge of W, the new word is loaded in the FIFO. The W line must be toggled when FF is not asserted to write new data in the FIFO and to increment the write pointer. Width Expansion Word width may be increased simply by connecting the corresponding input control signals of multiple devices. Status flags (EF, FF and HF) can be detected from any one device. Figure 13 demonstrates an 18-bit word width by using two IDT7203/7204/7205/7206/7207/7208s. Any word width can be attained by adding additional IDT7203/7204/7205/7206/7207/7208s (Figure 13). Bidirectional Operation Applications which require data buffering between two systems (each system capable of Read and Write operations) can be achieved by pairing IDT7203/7204/7205/7206/7207/7208s as shown in Figure 16. Both Depth Expansion and Width Expansion may be used in this mode. Compound Expansion The two expansion techniques described above can be applied together in a straightforward manner to achieve large FIFO arrays (see Figure 15). Data Flow-Through Two types of flow-through modes are permitted, a read flow-through and write flow-through mode. For the read flow-through mode (Figure 17), the (HALF-FULL FLAG) WRITE (W) (HF) IDT 7203 7204 7205 7206 7207 7208 9 DATA IN (D) FULL FLAG (FF) RESET (RS) COMMERCIAL, INDUSTRIAL AND MILITARY TEMPERATURE RANGES READ (R) 9 DATA OUT (Q) EMPTY FLAG (EF) RETRANSMIT (RT) EXPANSION IN (XI) 2661 drw14 Figure 12. Block Diagram of 2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9, 32,768 x 9, 65,536 x 9 FIFO Used in Single Device Mode HF 18 HF 9 9 DATA IN (D) WRITE (W) FULL FLAG (FF) RESET (RS) IDT 7203 7204 7205 7206 7207 7208 IDT 7203 7204 7205 7206 7207 7208 9 XI READ (R) EMPTY FLAG (EF) RETRANSMIT (RT) 9 XI 18 DATA NOTE: 1. Flag detection is accomplished by monitoring the FF, EF and HF signals on either (any) device used in the width expansion configuration. Do not connect any output signals together. OUT (Q) 2661 drw15 Figure 13. Block Diagram of 2,048 x 18, 4,096 x 18, 8,192 x 18, 16,384 x 18, 32,768 x 18, 65,536 x 18 FIFO Memory Used in Width Expansion Mode 10 IDT7203/7204/7205/7206/7207/7208 CMOS ASYNCHRONOUS FIFO 2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9, 32,768 x 9 and 65,536 x 9 COMMERCIAL, INDUSTRIAL AND MILITARY TEMPERATURE RANGES TRUTH TABLES TABLE 1 – RESET AND RETRANSMIT SINGLE DEVICE CONFIGURATION/WIDTH EXPANSION MODE Mode RS Inputs FL/RT XI 0 1 1 X 0 1 0 0 0 Reset Retransmit Read/Write Read Pointer Internal Status Write Pointer Location Zero Location Zero Increment(1) EF Location Zero Unchanged Increment(1) Outputs FF 0 X X HF 1 X X 1 X X NOTE: 1. Pointer will Increment if flag is HIGH. TABLE 2 – RESET AND FIRST LOAD DEPTH EXPANSION/COMPOUND EXPANSION MODE Mode Reset First Device Reset All Other Devices Read/Write RS Inputs FL/RT XI Read Pointer 0 0 1 0 1 X (1) (1) (1) Location Zero Location Zero X Internal Status Write Pointer Outputs Location Zero Location Zero X EF FF 0 0 X 1 1 X NOTES: 1. XI is connected to XO of previous device. See Figure 14. 2. RS = Reset Input, FL/RT = First Load/Retransmit, EF = Empty Flag Output, FF = Full Flag Output, XI = Expansion Input, HF = Half-Full Flag Output XO W D FF 9 9 IDT 7203 7204 7205 7206 7207 7208 R EF 9 FL Q VCC XI XO FF FULL 9 IDT 7203 7204 7205 7206 7207 7208 EF EMPTY FL XI XO FF 9 RS IDT 7203 7204 7205 7206 7207 7208 EF FL XI 2661 drw16 Figure 14. Block Diagram of 6,144 x 9, 12,288 x 9, 24,576 x 9, 49,152 x 9, 98,304 x 9, 196,608 x 9 FIFO Memory (Depth Expansion) 11 IDT7203/7204/7205/7206/7207/7208 CMOS ASYNCHRONOUS FIFO 2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9, 32,768 x 9 and 65,536 x 9 Q0-Q8 Q9-Q17 Q(N-8)-QN Q0-Q8 Q9-Q17 Q(N-8)-QN IDT7203 IDT7204 IDT7205 IDT7206 IDT7207 IDT7208 DEPTH EXPANSION BLOCK R, W, RS COMMERCIAL, INDUSTRIAL AND MILITARY TEMPERATURE RANGES IDT7203 IDT7204 IDT7205 IDT7206 IDT7207 IDT7208 DEPTH EXPANSION BLOCK D0-D8 IDT7203 IDT7204 IDT7205 IDT7206 IDT7207 IDT7208 DEPTH EXPANSION BLOCK D9-D17 D(N-8)-DN D0-DN D9-DN D18-DN D(N-8)-DN NOTES: 1. For depth expansion block see section on Depth Expansion and Figure 14. 2. For Flag detection see section on Width Expansion and Figure 13.. Figure 15. Compound FIFO Expansion WA FFA IDT 7203 7204 IDT 7205 7201A 7206 7207 7208 RB EFB HFB QB 0-8 DA 0-8 SYSTEM A SYSTEM B QA 0-8 RA HFA EFA IDT 7203 7204 7205 7206 7207 7208 DB 0-8 WB FFB Figure 16. Bidirectional FIFO Operation 12 2661 drw18 2661 drw17 IDT7203/7204/7205/7206/7207/7208 CMOS ASYNCHRONOUS FIFO 2,048 x 9, 4,096 x 9, 8,192 x 9, 16,384 x 9, 32,768 x 9 and 65,536 x 9 COMMERCIAL, INDUSTRIAL AND MILITARY TEMPERATURE RANGES DATA IN W tRPE R EF tWLZ tWEF tA tREF DATA OUT DATA OUT VALID 2661 drw19 Figure 17. Read Data Flow-Through Mode R tWPF W tRFF FF tDH tWFF DATA IN DATA tA DATA OUT IN VALID tDS DATA OUT VALID Figure 18. Write Data Flow-Through Mode 13 2661 drw20 ORDERING INFORMATION XXXX X Device Type Power XX X Speed Package X X X Process/ Temperature Range Blank 8 Tube or Tray Tape and Reel Blank I(1) B Commercial (0°C to +70°C) Industrial (−40° to +85°C) Military (−55°C to +125°C) Compliant to MIL-STD-883, Class B (4) G Green P(5) TP D TD J L(2) SO Plastic DIP P28-1 Plastic Thin DIP P28-2 CERDIP D28-1 Thin CERDIP D28-3 Plastic Leaded Chip Carrier PLCC J32-1 Leadless Chip Carrier LCC L32-1 Small Outline IC SOIC SO28-3 12 15 20(3) 25(3) 30 35(3) 40 50 Commercial 7203/04/05 Only Commercial and (Industrial only 7203/04/05) Commercial and Military Commercial and Industrial Military Only Commercial Only Military 7203 Only Commercial Only L Low Power 7203 ⎯ 7204 ⎯ 7205 ⎯ 7206 ⎯ 7207 ⎯ 7208(3) 2,048 x9 FIFO 4,096 x 9 FIFO 8,192 x 9 FIFO 16,384 x 9 FIFO 32,768 x 9 FIFO 65,536 x 9 FIFO (all except 7207/7208) (all except 7208) (only for 7203/7204/7205) (all except 7208) (only 7204) Access Time (tA) Speed in Nanoseconds 2661 drw21 NOTES: 1. Industrial temperature range product for 15ns and 25ns speed grades are available as a standard device for IDT7203/7204/7205, and 25ns speed grade only is available as a standard device for IDT7206/7207/7208. All other speed grades are available by special order. 2. The LCC is only available in the military temperature range. 3. The IDT7208 is only available in commercial speed grades of 20, 25 and 35 ns. 4. Green parts are available. For specific speeds and packages contact your local sales office. 5. For "P", Plastic Dip, when ordering green package, the suffix is "PDG". DATA SHEET HISTORY 05/10/2001 05/30/2001 04/03/2006 10/22/2008 04/22/2010 06/29/2012 pgs. pg. pgs. pg. pgs. pgs. 2, 3, 4, 5, 11 and 14. 2. 1 and 14. 14. 3, 4 and 14. 1 and 14. CORPORATE HEADQUARTERS 6024 Silver Creek Valley Road San Jose, CA 95138 for SALES: 800-345-7015 or 408-284-8200 fax: 408-284-2775 www.idt.com 14 for Tech Support: 408-360-1753 email: [email protected]