LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS Pb Lead-Free Parts LDBKDBK44243/A DATA SHEET DOC. NO : QW0905-LDBKDBK44243/A REV. : B DATE : 24 - Mar. - 2015 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBKDBK44243/A Page 1/7 Package Dimensions 3.05 4.02 3.1 3.85 DBK 25.0MIN DBK 1.5MAX ∅0.5 TYP 1 2.54TYP 1 2 Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0° -30° 30° -60° 100% 75% 50% 60° 25% 0 25% 50% 75% 100% 2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/7 PART NO. LDBKDBK44243/A Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT DBK Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 mA Power Dissipation PD 120 mW Ir 50 μA Electrostatic Discharge( * )` ESD 500 V Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Reverse Current @5V Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO MATERIAL COLOR Emitted InGaN Forward Spectral voltage halfwidth @20mA(V) △λ nm Luminous intensity @ 20mA(mcd) Viewing angle 2 θ 1/2 (deg) Typ. Max. Min. Typ. Lens Blue LDBKDBK44243/A Dominant wave length λD nm 465 30 3.5 4.0 65 120 100 465 30 3.5 4.0 65 120 100 Water Clear InGaN Blue Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/7 PART NO. LDBKDBK44243/A Brightness Code For Standard LED Lamps DBK CHIP Group A11 A12 A13 A14 A15 Luminous Intensity(mcd) at 20 mA Min. 65 90 120 160 220 Max. 90 120 160 220 300 DBK CHIP Group Wave length(nm) at 20 mA Min. Max. 0F 459 462 0E 462 465 0D 465 468 0C 468 471 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBKDBK44243/A Page 4/5 Typical Electro-Optical Characteristics Curve DBK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1 01 2.5 2.0 1.5 1.0 0.5 0.0 2.0 1.0 3.0 5.0 4.0 1 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 400 450 500 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 550 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBKDBK44243/A Page 5/7 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBKDBK44243/A Page 6/7 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. Thermal Shock Test 1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 Page 7/7 PACKING SPECIFICATION 1. 1000PCS / BAG 2. 8 BAG / INNER BOX SIZE : L X W X H 33cm X 19cm X 8cm L W H 3. 12 INNER BOXES / CARTON SIZE : L X W X H 58cm X 34cm X 34cm L W C/NO: MADE IN CHINA . NO M IT E Y : Q'T ,: W : N, , W G, S PC s kg s kg H