lrgb9553-s26-tr1.pdf

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SURFACE MOUNT LED TAPE AND REEL
Pb
Lead-Free Parts
LRGB9553/S26/TR1
DATA SHEET
DOC. NO : QW0905-LRGB9553/S26/TR1
REV.
: A
DATE
: 13 - Jun. - 2012
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/13
PART NO. LRGB9553/S26/TR1
Features:
1. Top view white LED.
2. white SMT package.
3. Leadframe package with individual 4 pin.
4.Wide viewing angle.
5.Soldering methods:IR reflow soldering.
6.Feature of the device:more light due to higher optical efficiency;extremely
wide viewing angle;ideal for backlighting and coupling in light guide.
Descriptions:
The LRGB9553 SMD has wide viewing angle and optimized light coupling
by inter reflector,The low current requirement makes this device ideal for
portable equipment or any other application where power is at a premium.
Applications:
1. LCD back light.
2. Mobile phones.
3. Indicators.
4. Switch lights.
5. Lighting.
Device Selection Guide:
PART NO
LRGB9553/S26/TR1
MATERIAL
COLOR
Emitted
AlGaInP
Red
InGaN/GaN
Green
InGaN/GaN
Blue
Lens
Water Clear
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Page 2/13
PART NO. LRGB9553/S26/TR1
Package Dimensions
3.5
1.9
3
0.8
2
0.7±0.05
0.8
0.7±0.05
2.7
4
2.2
1
0.7±0.05
Soldering Terminal
4
+
3.2
0.8
0.8
0.7±0.05
R G B
1
0.8
2
3
Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
4.9
1.6
1.6
0.85
0.65
0.85
Note : The tolerances unless mentioned is ±0.1mm Unit=mm.
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Page 3/13
PART NO. LRGB9553/S26/TR1
Absolute Maximum Ratings at Ta=25℃
Ratings
Parameter
Symbol
DUR
DGM
DBK
UNIT
Forward Current
IF
50
30
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
90
100
100
mA
Power Dissipation
PD
120
120
120
mW
Reverse Current @5V
Ir
10
50
50
μA
Electrostatic Discharge
ESD
2000
500
500
V
Operating Temperature
Topr
- 20 ~ + 80
℃
Storage Temperature
Tstg
- 30 ~ + 100
℃
Typical Electrical & Optical Characteristics (Ta=25℃)
Items
Symbol
DUR
Luminous Intensity
Iv
DGM
DBK
DUR
Dominant Wavelength
λD
DGM
DBK
DUR
Spectral Line Half-Width
△λ
DGM
DBK
DUR
Forward Voltage
VF
DGM
DBK
DUR
Viewing Angle
2θ 1/2 DGM
DBK
Min.
320
320
125
----------
Typ.
500
700
250
625
525
470
-------------------
---------1.7
2.8
2.8
----------
20
36
30
---------120
120
120
---------2.6
3.6
3.6
----------
Max. UNIT
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2.The luminous intensity data did not including ±15% testing tolerance.
CONDITION
mcd
IF=20mA
nm
IF=20mA
nm
IF=20mA
V
IF=20mA
deg
IF=20mA
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Page 4/13
PART NO. LRGB9553/S26/TR1
Luminous Intensity Classification
BIN CODE
HRF
T
U
V-1
BIN CODE
DGM
T
U
V-1
BIN CODE
DBK
R
S
T
Iv(mcd) at 20mA
Min.
Max.
320
500
800
500
800
1000
Iv(mcd) at 20mA
Min.
Max.
320
500
800
500
800
1000
Iv(mcd) at 20mA
Min.
Max.
125
200
320
200
320
500
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Page 5/13
PART NO. LRGB9553/S26/TR1
Typical Electro-Optical Characteristics Curve
DUR CHIP
Fig.2 Relative Light Output Power vs. Forward Current
140
120
120
100
100
LOP(%)
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
80
60
40
80
60
40
20
20
0.0
0
0.0
0.5
1.0
1.5
2.0
0.0
3.0
2.5
20
40
100 120
140
Forward Current(mA)
Forward Voltage(V)
Fig.4 Relative Intensity vs. Temperature
Fig.3 Forward Voltage vs. Temperature
0
1.2
Relative Intensity@20mA
Normalize @20℃
Forward Voltage@20mA
Normalize @20℃
80
60
-0.05
-0.1
-0.15
-2.0
20
30
40
50
60
70
80
90
1.0
0.8
0.6
0.4
0.2
0.0
20
30
40
50
60
70
80
90
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.6 Directive Radiation
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0°
-30°
0.5
30°
-60°
0.0
100% 75% 50%
500
550
600
Wavelength (nm)
650
700
60°
25%
0
25% 50% 75% 100%
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Page 6/13
PART NO. LRGB9553/S26/TR1
Typical Electro-Optical Characteristics Curve
DGM CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
1000
Forward Current(mA)
Forward Voltage(V)
Fig.4 Relative Intensity vs. Temperature
Fig.3 Forward Voltage vs. Temperature
1.2
3.0
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
100
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
100
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
Relative Intensity@20mA
1.0
0°
-30°
0.5
30°
-60°
0.0
100% 75% 50%
450
500
550
Wavelength (nm)
600
60°
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. LRGB9553/S26/TR1
Page 7/13
Typical Electro-Optical Characteristics Curve
DBK CHIP
Fig.2 Relative Intensity vs. Forward Current
3.0
1000
Relative Intensity
Normalize @20mA
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
100
10
1
01
2.5
2.0
1.5
1.0
0.5
0.0
1.0
2.0
3.0
4.0
5.0
1
10
1.2
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
1.0
Relative Intensity@20mA
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
0°
-30°
30°
-60°
0.5
0.0
100% 75% 50%
400
450
500
Wavelength (nm)
550
60°
25%
0
25% 50% 75% 100%
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Page 8/13
PART NO. LRGB9553/S26/TR1
Carrier Type Dimensions
4.0
2.0
4.0
2.24
ψ1.55
1.75
5.5
12.0±0.3
9.3
4.06
3.12
Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm.
‧ Packing Specifications
0.2
0.8
0.6
Aluminum Moist-Proof bag
Label
0.8
0.6
0.2
0.4
0.4
Label
Part No.
Description
Quantity/Reel
LRGB9553/S26/TR1
12.0mm tape,7"reel
1500 PCS
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Page 9/13
PART NO. LRGB9553/S26/TR1
Label Explanation
LIGITEK ELECTRONICS CO., LTD.
Pb
BIN : Luminous Intensity
PART :
LRGB9553/S26/TR1/A
LOT :
GS1-070142
QTY(PCS):
1500
VF:2.8-3.6
BIN/HUE :
R/T/U
VF:2.8-3.6
VF:1.5-2.4
VF : Forward Voltage
Reel Dimensions
0.2
0.4
0.8
0.8
0.6
0.2
0.4
0.6
2.0±0.5
ψ13.5±1.0
178±1.5
60.0±1.0
13.0±1.0
16.0±1.0
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LRGB9553/S26/TR1
Page 10/13
Box Explanation
1. 4 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm
L
W
H
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Page 11/13
PART NO. LRGB9553/S26/TR1
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 320℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260 ℃
245±5℃ within 5 sec
120 ~ 150℃
Preheat
120 ~ 180 sec
3 PB-Free Reflow Solder
1~5°C/sec
1~5°C/sec
Preheat
180~200°C
260°C MaX. 10sec.Max
6°C/sec
Above 220°C
60 sec.Max.
120 sec.Max.
Note:
1.Reflow soldering should not be done more than two times.
2.When soldering,do not put stress on the LEDs during heating.
3.After soldering,do not warp the circuit board.
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Page 12/13
PART NO. LRGB9553/S26/TR1
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%,
they should be treated at 60 ℃±5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd
current should not be allowed to change by more than 40% of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
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Page 13/13
PART NO. LRGB9553/S26/TR1
Reliability Test:
(1)Test items and results
Test Item
Classification
Test Condition
Sample
Size
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
3.t=1000 hrs
22
High Temperature
Storage Test
1.Ta=105 ℃± 5℃
2.t=500 hrs
22
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs
22
High Temperature
High Humidity
Storage Test
1.IR-Reflow In-Board, 2 Times
2.Ta=85℃± 5℃
3.RH=90 %~95%
4.t=500hrs±2hrs
22
Thermal Shock Test
1.IR-Reflow In-Board,2 times
2.Ta=105 ℃±5℃&
-40℃± 5℃
(30min) (30min)
3.total 100 cycles
22
1.T.Sol=260 ℃±5℃
2.Dwell Time= 10Max.
22
1.105℃ ~ 25℃ ~ - 40℃
30mins 15mins 30mins
2.100 Cyeles
22
Endurance
Test
Environmental
Test
Reflow Soldering Test
Temperature
Cycling
(2)Criteria for judging the damage
Item
Symbol Test Conditions
Criteria for Judgement
Min.
Max.
Forward Voltage
Vf
If=20mA
-
U.S.L x1.2
Reverse Current
Ir
Vr=5V
-
U.S.L x2.0
Luminous Intensity
Iv
If=20mA
L.S.L x 0.5
-
Note:
1.U.S.L.:Upper Standard Level.
2.L.S.L.:Lower Standard Level.