my - d ™ N F C SLE 66RxxP Intelligent EEPROM with Contactless Interface compliant to ISO/IEC 14443-3 Type A and support of NFC Forum™ Type 2 Tag Operation Sh o rt P ro d u c t I n fo r m a ti o n 2011-11-16 Ch i p C a rd & S e c u r i ty Edition 2011-11-16 Published by Infineon Technologies AG 81726 Munich, Germany © 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. my-d™ NFC SLE 66RxxP Revision History - Short Product Information - my-d™ NFC Previous Release 2008-12-11 Page or Item Subjects (major changes since previous revision) 2011-11-16 All Editorial changes Updated Ordering Information and Delivery Forms Added information about NFC configuration and initialization Technical product update: pre-configured NFC memory map (INITIALIZED state) Trademarks of Infineon Technologies AG AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2010-10-26 Short Product Information 3 / 14 2011-11-16 my-d™ NFC SLE 66RxxP Features Features Intelligent EEPROM with Contactless Interface compliant to ISO/IEC 14443-3 Type A and support of NFC Forum™ Type 2 Tag Operation Contactless Interface • • • Physical interface and Anticollision compliant to ISO/IEC 14443-3 Type A – Operation frequency 13.56 MHz – Data rate up to 848 kbit/s from PICC to PCD, 106 kbit/s from PCD to PICC – Contactless transmission of data and supply energy – Anticollision logic: Several cards may be operated in the field simultaneously Unique IDentification number (7-byte double-size UID) Read / write distance up to 10 cm and more (influenced by external circuitry i.e. reader and inlay design) Up to 5120 bytes EEPROM • • • • • • Organized in up to 512 pages Each page organized in 8 bytes for data storage + 2 bytes for administrative purposes Up to 509 pages of user memory (user page size 8 byte) EEPROM programming time per page < 4 ms EEPROM endurance minimum 100,000 erase/write cycles1) Data retention minimum 10 years1) NFC Tag Operation • • • Support of NFC Forum™ - Type 2 Tag Operation Specification Up to 2048 bytes NFC memory available – organized in static or dynamic memory structure – pre-defined memory size for NFC Forum™ Type 2 Tag Operation (up to two 1 kByte sectors) Pre-configured NFC memory with empty NDEF message (INITIALIZED state) Value Counters: up to 65536 (value range from 0 to 216 - 1) • • Each page in the User Area is configurable as a Value Counter Support of Anti-Tearing Electrical characteristics • • ESD protection minimum 2 kV Ambient temperature -25°C ... +70°C (for the chip) 1) Values are temperature dependent Short Product Information 4 / 14 2011-11-16 my-d™ NFC SLE 66RxxP Ordering and packaging information 1 Ordering and packaging information Table 1-1 Ordering information Type Package1) Total / User Memory2) Total / User Pages2) Ordering code 780 / 600 bytes 78 / 75 on request 2560 / 2024 bytes (1024 bytes of NFC Memory 256 / 253 SP000953288 5120 / 4072 bytes (2048 bytes NFC Memory) 512 / 509 SLE 66R04P3) SLE 66R16P NB NiAu Bumped (sawn wafer) SLE 66R16P MCC2 P-MCC2-2-1 SLE 66R16P MCC8 P-MCC8-2-6 SLE 66R32P NB NiAu Bumped (sawn wafer) SLE 66R32P MCC2 P-MCC2-2-1 SLE 66R32P MCC8 P-MCC8-2-6 on request SP000953280 SP000953292 on request SP000953284 1) MCC is short for Module Contactless Card 2) Total memory size and page count includes the service area and the two administrative bytes per page whereas user memory size and page count is freely programmable for user data. 3) The SLE 66R04P does not support NFC Forum™ Type 2 Tag functionality. For more ordering information (wafer thickness and height of NiAu-Bump) please contact your local Infineon sales office. Pin description Figure 1-1 Pin configuration Module Contactless Card - MCC2-2-1 (top / bottom view) Figure 1-2 Pin configuration Module Contactless Card - MCC8-2-6 (top / bottom view) Short Product Information 5 / 14 2011-11-16 my-d™ NFC SLE 66RxxP Ordering and packaging information LA SLE 66RxxP my-d™ NFC LB Figure 1-3 Pad configuration die Table 1-2 Pin description and function Symbol Function LA Antenna connection LB Antenna connection Short Product Information 6 / 14 2011-11-16 my-d™ NFC SLE 66RxxP my-d™ Product Family 2 my-d™ Product Family my-d™ products are available both in plain mode with open memory access and in secure mode with memory access controlled by authentication procedures. The family of contactless memory my-d™ provides users with different memory sizes and incorporates security features to enable considerable flexibility in the application design. Flexible controls within the my-d™ devices start with plain mode operation featuring individual page locking; for more complex applications various settings in secure mode can be set for multi user / multi application configurations. In plain mode access to the memory is supported by both 4-byte block as well as 8-byte page structure. In secure mode a cryptographic algorithm based on a 64-bit key is available. Mutual authentication, message authentication codes (MAC) and customized access conditions protect the memory against unauthorized access. The functional architecture, meaning the memory organization and authentication of my-d™ products is the same for both my-d™ proximity (ISO/IEC 14443) and my-d™ vicinity (ISO/IEC 18000-3 mode 1 or ISO/IEC 15693). This eases the system design and allows simple adaptation between applications. Configurable Value Counters featuring anti-tearing functionality are suitable for value token applications, such as limited use transportation tickets. Architectural interoperability of all my-d™ products enables an easy migration from simple to more demanding applications. In addition, the my-d™ light (ISO/IEC 18000-3 mode 1 or ISO/IEC 15693) is part of the my-d™ family. Its optimized command set and memory expands the range of applications to cost sensitive segments. 2.1 my-d™ NFC The my-d™ NFC products are members of the my-d™ family. Once designed-in a migration to different memory sizes can be done easily. my-d™ NFC products are designed especially for the increasing NFC market demanding smart memories. Infineon's my-d™ NFC family convinces with fast communication speed and high robustness. Furthermore, the SLE 66RxxP family can be operated as NFC Forum™ Type 2 Tag. Up to 2 kBytes of memory can be arranged in a dynamic memory structure for NFC applications. my-d™ NFC products also feature configurable Value Counters which support anti-tearing protection. my-d™ NFC products are suited for a broad range of applications like smart posters, ringtones, data logging, public transport, event ticketing, access control or consumer good information. Short Product Information 7 / 14 2011-11-16 my-d™ NFC SLE 66RxxP my-d™ Product Family 2.2 Application Segments my-d™ products are optimized for personal and object identification. Please find in the following table some dedicated examples Table 2-1 my-d™ family product overview Product Application my-d™ move - SLE 66R01P Public Transport, Smart Posters, NFC Device Pairing my-d™ move NFC - SLE 66R01PN Public Transport, Smart Posters, NFC Device Pairing, NFC INITIALIZED state my-d™ move lean - SLE 66R01L Public Transport, Smart Posters, NFC Device Pairing my-d™ NFC - SLE 66RxxP Smart Posters and Maps, NFC Device Pairing, Loyalty Schemes, Consumer Good Information, Healthcare Monitoring my-d™ proximity 2 - SLE 66RxxS Access Control, Entertainment, Public Transport, Customer Loyalty Schemes, Micro Payment my-d™ proximity enhanced - SLE 55RxxE Access Control, Gaming, Entertainment, Customer Loyalty Schemes my-d™ light - SRF 55V01P Libraries, Laundry, Factory Automation, Media Management, Event Ticketing, Leisure Park Access my-d™ vicinity plain - SRF 55VxxP Factory Automation, Healthcare, Ticketing, Access Control my-d™ vicinity plain HC - SRF 55VxxP HC Ticketing, Brand Protection, Loyalty Schemes, Ski passes my-d™ vicinity secure - SRF 55VxxS Ticketing, Brand protection, Loyalty Schemes, Access Control Short Product Information 8 / 14 2011-11-16 my-d™ NFC SLE 66RxxP my-d™ NFC - SLE 66RxxP 3 my-d™ NFC - SLE 66RxxP The my-d™ NFC products are based on the ISO/IEC 14443 Type A standard for contactless proximity cards. The my-d™ NFC family features both my-d™ commands and NFC Forum™ Type 2 Tag commands. The products are targeting particular high memory applications such as Smart Posters and Maps, Loyalty Schemes, Healthcare Monitoring as well as NFC Device Pairing applications. They are fulfilling the requirements of state of the art contactless memory ICs with respect to compatibility to the ISO/IEC 14443 standard part 1-3, operating range and command as well as feature set. Furthermore, the SLE 66RxxP family can be operated as NFC Forum™ Type 2 Tag. 3.1 Circuit Description The my-d™ NFC is made up of an EEPROM memory unit, an analog interface for contactless energy and data transmission and a control unit. LA POWER Analog Contactless Interface CLOCK Memory Unit Operational Mode Power Circuit Antenna Rectifier Clock Extractor DATA Parallel Power On Reset Voltage Regulator Serial IO Command Anticollision LB Memory Access Control Unit Figure 3-1 Block Diagram of the my-d™ NFC • • • • Analog Contactless Interface – The Analog Contactless Interface comprises the voltage rectifier, voltage regulator and system clock to supply the IC with appropriate power. Additionally the data stream is modulated and demodulated. Operational mode – The access to the memory depends on the actual configuration of the my-d™ NFC. Memory Unit – The Memory Unit consists of up to 5120 bytes memory organized in up to 512 pages each of 8 user and two administration bytes. Control Unit – The Control Unit decodes and executes all commands. Additionally the control unit is responsible for the correct anticollision flow. Short Product Information 9 / 14 2011-11-16 my-d™ NFC SLE 66RxxP my-d™ NFC - SLE 66RxxP 3.2 Memory Principle The memory is organized in 3 areas: • • • User Area Service Area Administration Area Unique serial number (UID) SI AC page (plain) SI AC page (plain) SI AC page (plain) SI AC User Area page (plain) Administration Area Service Area SI AC Figure 3-2 my-d™ Memory Organization The Service Area stores the 7-byte UID, manufacturer data and configuration data. This information is programmed at manufacturing of the chip and cannot be changed. The User Area stores User Data in up to 509 pages. The whole NFC memory portion is mapped into the User Area. The Administration Area stores two bytes of information about page administration (SI - Sector Index and AC Access Condition). The Access Condition and Sector Index byte are corruption protected. Short Product Information 10 / 14 2011-11-16 my-d™ NFC SLE 66RxxP my-d™ NFC - SLE 66RxxP 3.3 Memory Principle for a NFC Forum™ Type 2 Tag Some parts of the my-d™ NFC memory are configured to be accessible with NFC Forum™ Type 2 Tag commands. Static or a dynamic memory structures are configurable. The principle of the memory structure is shown in Figure 3-3. UID / Internal UID / Internal Internal / LOCK Capability Container Data Data . . . . . Data Figure 3-3 NFC Memory Organization The block size in the NFC memory organization is 4 bytes. These blocks are accessible with NFC Forum™ Type 2 Tag commands as well as with my-d™ commands. The my-d™ NFC are delivered with pre-configured NFC memory; the Capability Container bytes are programmed and the data area holds an empty NDEF message; this represents the NFC Forum™ Type 2 Tag INITIALIZED state within the tag life cycle. With this pre-configuration the my-d™ NFC can be immediately used in NFC infrastructures. For further details regarding the NFC initialization of my-d™ NFC please refer to the Data Book and the Application Note “How to operate my-d™ devices in NFC Forum™ Type 2 Tag infrastructures” available at Chip Card & Security [email protected]. Attention: This pre-configuration can be over-written to any value. Initial shipments of the my-d™ NFC devices have been delivered without this configuration. Short Product Information 11 / 14 2011-11-16 my-d™ NFC SLE 66RxxP my-d™ NFC - SLE 66RxxP 3.4 System Overview The system consists of a host system, one or more my-d™ NFC or other ISO/IEC 14443-3 compliant cards and an ISO/IEC 14443-3 compatible contactless reader with an antenna. Alternatively, since the my-d™ NFC is configured to hold a NFC Forum™ Type 2 Tag memory structure, a NFC Forum™ Device in card reader/writer mode can be used to operate the chip. Host System µC Analog Circuitry Data Antenna SLE 66RxxP my-d™ NFC PICC Energy Identification Terminal (PCD) or NFC Forum™ Device Clock Figure 3-4 my-d™ NFC System Short Product Information 12 / 14 2011-11-16 my-d™ NFC SLE 66RxxP my-d™ NFC - SLE 66RxxP 3.5 Product Versions To identify the different types of my-d™ NFC contactless memories special chip type information is coded into the manufacturer page (Service Area, page 0002H, byte 00H). The table below briefly describes the values of this byte for the different chip versions. Table 3-1 Chip information for different product variants Sales Code Chip Information Byte1) SLE 66R04P2) 11xx 0010B SLE 66R16P 11xx 0100B SLE 66R32P 11xx 0101B 1) Bit [5:3] should not be evaluated as their value may be changed for future revisions. 2) The SLE 66R04P does not support NFC Forum™ Type 2 Tag functionality. In addition to the chip type information, the manufacturer ID and a chip family identifier are coded into the 7-byte UID (Service Area, page 0000H) as described in Table 3-2. The chip family identifier can be used to determine the basic command set for the chip. Table 3-2 Manufacturer ID and Chip Family Identifier UID field Value Description uid0 05H Manufacturer ID according to ISO/IEC 7816-6/AM1 uid1 x0H The higher nibble of uid1 is the chip family identifier coded as: 1H ... my-d™ command set 2H ... my-d™ command set and NFC Forum™ Type 2 Tag commands The lower nibble is RFU and set to 0H. The lower nibble shall not be checked for chip family determination. 3.6 Supported Standards Following standards are supported: • • ISO/IEC 14443 Type A (Parts 1, 2 and 3) tested according to ISO/IEC 10373-6 (PICC Test and Validation) Support of NFC Forum™ Type 2 Tag Operation 3.7 Command Set The my-d™ NFC chip is compliant to the ISO/IEC 14443-3 Type A standard. A set of standard ISO commands is implemented to operate the chip. Additional to the ISO/IEC 14443 commands, NFC Forum™ Type 2 Tag commands and a my-d™ specific command set is implemented. This facilitates the access to the on-chip integrated memory. Short Product Information 13 / 14 2011-11-16 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG 14