Application Note, V1.0, Feb. 2010 AN2010-01 MA200E12/17_EVAL Module Adapter Board for EconoDUAL™3 IGBT Modules IFAG IMM INP TM Edition 2010-02-08 Published by Infineon Technologies AG 59568 Warstein, Germany © Infineon Technologies AG 2010. All Rights Reserved. LEGAL DISCLAIMER THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND (INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN IN THIS APPLICATION NOTE. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. AN2010-01 EconoDUAL 3 Module Adapter Board AN2010-01 Revision History: Previous Version: Page -- V1.0 Subjects (major changes since last revision) Authors: Alain Siani IFAG IMM INP TM, Uwe Jansen IFAG IMM INP TM We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [email protected] Application Note 3 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board 1 Introduction ............................................................................................................................................ 5 2 Design features ...................................................................................................................................... 6 2.1 2.2 2.3 2.4 3 Main features....................................................................................................................................... 6 Key data............................................................................................................................................... 7 Mechanical dimensions ....................................................................................................................... 7 Pin assignment .................................................................................................................................... 8 Application Note................................................................................................................................... 10 3.1 3.2 3.3 3.4 3.5 3.6 3.7 4 Functionality on board ....................................................................................................................... 10 Gate resistors .................................................................................................................................... 10 Gate signal amplifier.......................................................................................................................... 11 VCE monitoring for short circuit detection........................................................................................... 12 Active voltage clamping – boosted version ....................................................................................... 13 Maximum switching frequency .......................................................................................................... 13 Parallel operation............................................................................................................................... 16 Schematic and Layout of MA200E12/17 ............................................................................................ 16 4.1 4.2 4.3 4.4 4.5 Schematic .......................................................................................................................................... 17 Assembly drawing ............................................................................................................................. 20 Layout ................................................................................................................................................ 21 Bill of Material - MA200E12 ............................................................................................................... 22 Bill of Material - MA200E17 ............................................................................................................... 24 5 How to order Evaluation Driver Boards ............................................................................................. 25 6 References ............................................................................................................................................ 25 Part number explanation: MA 200 E12/17 12 or 17 – Suitable for 1200 V or 1700V EconoDual™ 3 Evaluationboard 200 – 20 A driver output current MA – Module Adapter board Application Note 4 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board 1 Introduction The MA200E12/17 module adapter boards, shown in Figure 1, offer reliable connection between driver and various IGBT EconoDual™ 3 modules. MA200E12/17 are dedicated to all EconoDual™ 3 module types respecitvelly in 1200V and 1700V class. Used together with 2ED300E17-SFO evaluation adapter board and 2ED300C17-S /-ST EiceDRIVER™ make the ‘Flexible driver Starter Kit’ easy to use (Fig. 2). The ‘Flexible Starter Kit’ is dedicated for easy EconoDual™ paralleling but single module operation is as well possible. In any case one 2ED300E17-SFO adapter board and one 2ED300C17-S driver is required. Number of MA200E12/17 is the same as paralleled modules. The MA200E12/17 module adapter boards are available from Infineon in small quantities. Functions and min properties of these parts are described in the datasheet chapter of this document whereas the remaining paragraphs provide information intended to enable the customer to copy, modify and qualify the design for production described in this application note. The design of the MA200E12/17 was performed with respect to the environmental conditions. The requirements for leadfree reflow soldering have been considered when components were selected. The design was tested as described in this documentation but not qualified regarding manufacturing and operation in the whole ambient temperature operating range or lifetime. The boards provided by Infineon are subjected to functional testing only. Due to their purpose evaluation boards are not subjected to the same procedures regarding Returned Material Analysis (RMA), Process Change Notification (PCN) and Product Discontinuation (PD) as regular products. See Legal Disclaimer and Warnings for further restrictions on Infineon warranty and liability. MA200E12/17 Top side Figure 1 MA200E12/17 Bottom side The EconoDual™3 Module Adapter board Application Note 5 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board Figure 2 The ‘Flexible driver Starter Kit’ for EconoDual™3 module 2 Design features Electric features of the evaluation board and mechanical dimensions including necessary interface connections are presented in following sections. There are two different versions available MA200E12 and MA200E17. Both use the same bare PCB, but components vary with type. If both types are refered to the designation MA200E12/17 is used. 2.1 Main features The MA200E12/17 module adapter board offers the following features: • • • • • • • • Dual channel IGBT driver together with 2ED300E17-SFO (detailed description in AN2007-05) and 2ED300C17-S /-ST EiceDRIVER™ Electrically and mechanically suitable for EconoDual™ 3 modules family Operating temperature (design target) minimum value -40°C Different gate resistor values for turning-on and -off are possible IGBTs are secured against temporary VCE overvoltages during turn-off (Active Clamping) Diodes for IGBT desaturation monitoring implemented (short circuit protection) All components, except connectors, are surface mounted devices (SMD) with lead free 260°C soldering profile PCB is designed to fulfil the requirements of IEC61800-5-1, pollution degree 2, overvoltage category III (creepage – 11 mm) When the MA200E12/17 is not used with 2ED300E17-SFO adapter board and 2ED300C17-S /-ST EiceDRIVER™ these following features might be useful: • Gate-emitter amplifier input resistance is larger than 45 Ω • Can be used with max. ±20V isolated power supply (due to IGBT short circuit performances a value of max. +16V is suggested) • Asymmetric power supply is also allowed e.g. -8 V and +16 V • Input PWM voltage level should be selected according to power supply voltage level (in the same range but not higher) Application Note 6 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board 2.2 Key data All values given in the table below are typical values, measured at TA = 25 °C. Table 1 General key data and characteristic values Parameter VDC – max. DC voltage supply IG – max. peak output current RGmin – minimum gate resistor value when VDC=±15V (internal module resistor RINT + external REXT) PDC/DC – max DC/DC output power per one channel1 fS – max. PWM signal frequency for channel A and B2 Top – operating temperature (design target) 3 Tsto – storage temperature (design target) 2.3 Mechanical dimensions Figure 3 The MA200E12/17 mounted on EconoDual™3 module Value ±20 ±20 1.5 Unit V A 4 60 -40…+85 -40…+85 W kHz °C °C Ω 1 Only when MA200E12/17 used together with 2ED300E17-SFO adapter board and 2ED300C17-S EiceDRIVER™ 2 Switching frequency is limited by 2ED300C17-S EiceDRIVER™ capabilities. The maximum switching frequency for every EconoDual™ module type should be calculated separately. Limitation factors are: max. DC/DC output power of 4 W per channel and max. PCB board temperature measured around gate resistors placed on separated board closed to IGBT module. For detailed information see chapter 3.6. 3 Max. ambient temperature strictly depends on MA200E12/17 load conditions. Application Note 7 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board 100 mm max. 12mm max. 17mm 64 mm Figure 4 Dimensions of the MA200E12/17 module adapter board 2.4 Pin assignment After the module adapter has been correctly mounted to the EconoDual™ module all external electrical control signals should be applied to connector X1 and X2 as shown on Fig. 6 and listed in Table 2. When MA200E12/17 is used together with 2ED300E17-SFO the necessary connections to module adapter are depicted in Figure 5. In this case the Sense-Signal of the 2ED300S17-S driver is used instead of the OutSignal, making the internal booster of the 2ED300C17 redundant. The control signals required for module driving should be connected to Input Interface of 2ED300E17-SFO as described in AN2007-05. In that way no additional connections between module and IGBT driver are needed. The ready to use setup is shown in Fig. 2. Application Note 8 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board X3 X7 X9 X2 1 5 VA+ COMA VASENSEA VCESATA 1 5 2ED300E17- MA200E12/17 1 VB+ COMB VBSENSEB VCESATB X4 Figure 5 X8 X10 5 5 1 X1 Cable Connections between 2ED300E17-SFO and MA200E12/17 X2 VDCA+ COMA VDCAVGEA VCESATA 5 1 MA200E12/17 VDCB+ COMB VDCBVGEB VCESATB 5 1 X1 Figure 6 MA200E12/17 Module Adapter board and external electrical connections Table 2 MA200E12/17 and the external electrical signals description Pin X2.5 X2.4 X2.3 X2.2 X2.1 X1.5 X1.4 X1.3 X1.2 X1.1 Application Note Label VDC A+ COM A VDC AVGE A VCESAT A VDC B+ COM B VDC BVGE B VCESAT B Function Insolated DC/DC positive voltage supply channel A Auxiliary emitter – channel A Isolated DC/DC negative voltage supply channel A Gate-emitter signal source – channel A Desaturation voltage monitoring output – channel A Isolated DC/DC positive voltage supply channel B Auxiliary emitter – channel B Isolated DC/DC negative voltage supply channel B Gate-emitter signal source – channel B Desaturation voltage monitoring output – channel B 9 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board 3 Application Note 3.1 Functionality on board The MA200E12/17 basically supports already existing IGBT driver in half-bridge configuration and provides additional functions separately for both channels (top and bottom IGBT): • Gate resistors • Gate signal amplifier / emitter follower - booster • VCE monitoring for short circuit detection • Active voltage clamping Picture bellow depicts the MA200E12/17 with already mentioned functions and shows their physical location. Booster Top IGBT Booster Bottom IGBT Connectors AC voltage diodes Bottom IGBT AC voltage diodes Top IGBT Gate resistors Top IGBT Gate resistors Bottom IGBT Figure 7 The MA200E12/17 with marked functions 3.2 Gate resistors MA200E12/17 is assembled and delivered as shown on Fig. 7, but without gate resistors. Proper gate resistors should be soldered by the customer. Due to variation of switching behaviour with DC-link inductance, gate driver impedance and gate driver supply voltage no definitive values for the gate resistor values can be provided without taking the complete test setup into consideration. For 1700 V IGBT modules, operation together with the 2ED300E17-SFO board and a DC-link inductance of 35 nH values given in table 3 will provide approximately the same dIC/dt as during device characterization. For 1200 V IGBT modules suitable values are to be evaluated within the individual project. The datasheet value of the gate resistor may be used as a starting point, but lower values are permissible as long as the datasheet value of dIC/dt is not exceeded and the module is able to switch without oszillations. The switching losses will also vary significantly with application parameters. For more information on these topics please refer to [1] and [2]. Application Note 10 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board The layout is intended for 2010 package size (EIA). These resistors are required to have a suitable rating for repetitive pulse power to avoid degradation. Table 3 External gate resistor proposition for 1700V EconoDual™ 3 IGBT modules Module R_GB1, R_GB2, R_GB3, R_GT1, R_GT2, R_GT3 R_GB4, R_GB5, R_GB6, R_GT4, R_GT5, R_GT6 Resulting RGon Resulting RGoff FF150R17ME3G 20 Ω 4,7 Ω 8.2 8.2 Ω FF225R17ME3 6.8 Ω 4.7 Ω 3.8 Ω 3.8 Ω FF225R17ME4 2.2 Ω 2.2 Ω 1.5 Ω 1.5 Ω FF300R17ME3 4.7 Ω 3.3 Ω 2.7 Ω 2.7 Ω FF300R17ME4 3.3 Ω 3.3 Ω 1.1 Ω 1.1 Ω FF450R17ME3 2.2 Ω 2.2 Ω 1.5 Ω 1.5 Ω FF450R17ME4 3.3 Ω 2.2 Ω 1.83 Ω 1.83 Ω If it is intended to use different values for RGon and RGoff assembly of diodes D_T1, D_T2, D_B1, D_B2 is possible. On Figure 8 the location of these diodes is shown. Diode mounting Rgon ≠ Rgoff Top IGBT Diode mounting for Rgon ≠ Rgoff Bottom IGBT Figure 8 The MA200E12/17 location of optional diodes Deadtime has to be adjusted according to chosen modules, driver supply voltages and gate resistors. For details refer to [3]. 3.3 Gate signal amplifier When IGBT switches -on and –off the high peak of the gate current must be delivered from a driver. Usually there is no technical problem when one module is driven. When one IGBT driver is used for modules connected in parallel the driver amplifier must deliver the cumulated gate current and the length of the gate leads increases. This setup suffers from multiple drawbacks as described in [4] and [5]. Application Note 11 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board Overcoming these limitations becomes possible when the module adapter includes a dedicated gate signal amplifier (Fig. 8, Fig. 13 and Fig. 14). MA200E12/17 has the emitter follower called booster already implemented. Thanks to three pairs of complementary bipolar transistors connected in parallel the minimum gain @IG=20 A is not smaller than 301. Due to the fact that every EconoDual™ has its own module adapter the driving conditions are nearly equal to single module operation with driver directly on top of the module. Benefits provided by booster: • • Fast control of gate-emitter voltage for every EconoDual™ module Simple module paralleling 3.4 VCE monitoring for short circuit detection When the IGBT conducts a several times higher current than nominal the IGBT desaturates and the VCE voltage increases (close to DC-link voltage level). This behaviour can be practically used for short circuit detection and switching-off an IGBT. The short circuit duration time for Infineon 1200 V and 1700 V IGBT modules must not exceed 10µs. During this time the short circuit should be detected and the IGBT switched off without exciding VCES. When MA200E12/17 is used together with 2ED300E17-SFO the RSSD resistors (Soft Shut Down) must be chosen correctly in order to ensure proper short circuit protection. AN2007-05 in chapter 3.5 describes the procedure in details. Figure 9a shows three FF450R17ME4 EconoDual™ modules under short circuit operation where short circuit protection on 2ED300E17-SFO was disabled and the short circuit is turned off by the control signal. High dIC/dt during switching off creates large overvoltage spikes which are limited by active voltage clamping. Figure 9b depicts a case where the short circuit is detected by VCEsat-protection and shows how a properly selected RSSD slows down the collector current when the modules are turning off. These waveforms were aquired with a value for RSSD of 1.8 kΩ. 9a Figure 9 1 9b Switching behaviour of three paralleled FF450R17ME4 EconoDual™ modules under short circuit where system with 2ED300E17-SFO and MA200E17 was applied: short circuit protection disabled - 9a and where enabled and RSSD = 1,8kΩ − 9b Based on ZXTN2010Z and ZXTN2012Z bipolar transistors datascheets. www.zetex.com Application Note 12 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board 3.5 Active voltage clamping – boosted version Active voltage clamping is a technique which keeps temporary VCE overvoltages bellow VCES when the IGBT switches off. In a classic approach avalanche diodes are connected between auxiliary collector and gate of an IGBT module. When VCE voltage exceeds the diode breakdown voltage the diode current is shared between IGBT gate and the driver output. Due to increased gate-emitter voltage the transistor is operated in controlled active mode and the switching off process is interrupted. The dIC/dt slows down to a value which results with limited VCE overshoot. Avalanche diodes conduct high peak current during time periode in which VCE overvoltage is limited. Overvoltage protection of the MA200E12/17 is based on active clamping as described above, but the clamping diodes are not only connected directly to the IGBTs gate but also to the input of the amplifier located on the MA200E12/17. Therefore the major amount of current for recharging the gate is derived from the gate driver power supply instead of via the clamping diodes. This provides more consistent clamping voltage due to operating the clamping diodes at smaller current and furthermore enables the clamping circuit to be designed independend from choice of external gate resistor. Finally the same circuit for 1200V and 1700V modules employing different diode types has been realized. Active Clamping is intended as a means of overvoltage protection in case of an overcurrent and short-circuit turn-off. If Active Clamping operates repetitively, e.g. because of extraordinary high DC-link stray inductance or excessive DC-link voltage a significant increase in switching loss might damage the module. 3.6 Maximum switching frequency The IGBT switching frequency is limited by the available DC/DC power and by PCB temperature. According to theory the power losses generated in gate resistors are a function of gate charge, voltage step at the driver output and switching frequency. The energy is dissipated mainly through the PCB and increases the temperature around the gate resistors. When the available power of the DC/DC converter is not reached, the limiting factor for the IGBT’s switching frequency is the absolute maximum temperature for the FR4 material. The temperature limit is105 °C and shall not be exceeded. Generally the power losses generated in the gate resistors can be calculated according to following formula (1): Pdis = P ( REXT ) + P( RINT ) = ∆Vout ⋅ f s ⋅ QG (1) where: Pdis – dissipated power, ∆Vout – voltage step at the driver output fs – switching frequency, QG – IGBT gate charge (for the given gate voltage range) The losses are shared between the internal – P(RINT) and the external - P(REXT) gate resistors. Due to the PCB temperature criteria maximum switching frequency for a given ambient and baseplate temperature can be calculated using P(REXT) and thermal resistance. Based on experimentally determined board temperature dependencies TPCB ~ P(REXT) (Fig. 10) it is possible to determine the maximum switching frequency for various modules. As can be concluded from Figure 10, the board can dissipate approximately 1.5 W per channel from the external gate resistors soldered to PCB when Ta=25 °C and Tbaseplate=125 °C. This value is relatively small compared to 4W available driver power1. Based on this assumption the Table 4 shows maximum switching frequencies for MA200E12/17 and EconoDual™ modules. It has to be clearly pointed out that these maximum switching frequencies will differ when ambient and module baseplate temperatures are changed. 1 When MA300Exx used together with 2ED300E17-SFO Application Note 13 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board Please note also, that for these calculations datasheet value of external gate resistor has been used instead of proposed value from table 3. Board Temperature vs External Gate Resistor Losses @ Tbaseplate=125°C 110 105 Max. boardtemperatur 105°C (FR4) 100 95 90 T [°C] 85 Board Temp 80 75 70 65 60 0 0,2 0,4 0,6 0,8 PRg_ext [W] 1 1,2 1,4 1,6 1,8 1,5 W Figure 10 PCB temperature vs gate resistor power losses Table 4 Calculated max. IGBT switching frequencies for 2ED300E17-SFO with MA200E12/17 and single EconoDualTM module Module REXT/Ω RINT/Ω fS@Ta=25°C and Tbaseplate=125°C limited by RG power limited by DC/DC power FF150R17ME3G 9.1 3.2 33 kHz 65 kHz FF225R17ME3 6.2 2.8 25 kHz 47 kHz FF225R17ME4 3.3 2.8 32 kHz 47 kHz FF300R17ME3 4.7 2.5 18 kHz 32 kHz FF300R17ME4 3.3 2.5 24 kHz 36 kHz FF450R17ME3 3.3 1,7 12 kHz 21 kHz FF450R17ME4 3.3 1.7 13 kHz 24 kHz In order to calculate allowed power losses P(REXT) when baseplate and ambient temperatures differ from the example shown abow the formula (2) can be used. P (REXT ) = W (105°C − Tbaseplate ) Application Note K 56 W K K (105°C − Tambient ) °C + °C K 43 W 14 (2) V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board Finally, the suggested IGBT maximum switching frequency for given Tbaseplate and Tambient for MA200E12/17 used together with 2ED300E17-SFO is given by formula (3), when ∆Vout = 30V fs P ( REXT ) ⋅ ( RINT + REXT ) = 30 ⋅ k ⋅ REXT ⋅ Qq Hz µC (3) where k=1.2 – tolerance factor When modules are in parallel the driving power increases accordingly to number of paralleled modules and their switching frequency. The maximum switching frequency in this case is determined not only by PCB temperature but also by available driving power (4W when used with 2ED300E17-SFO). Table 5 shows switching frequencies where two modules are in parallel and Table 6 when three are in parallel. Both limitation factors are considered Table 5 Calculated max. IGBT switching frequencies for 2ED300E17-SFO with MA200E12/17 and two EconoDualTM modules in parallel Module REXT/Ω RINT/Ω fS@Ta=25°C and Tbaseplate=125°C limited by RG power limited by DC/DC power FF150R17ME3G 9.1 3.2 33 kHz 32 kHz FF225R17ME3 6.2 2.8 25 kHz 23 kHz FF225R17ME4 3.3 2.8 32 kHz 23 kHz FF300R17ME3 4.7 2.5 19 kHz 16 kHz FF300R17ME4 3.3 2.5 24 kHz 18 kHz FF450R17ME3 3.3 1.7 12 kHz 10 kHz FF450R17ME4 3.3 1.7 13 kHz 12 kHz Table 6 Calculated max. IGBT switching frequencies for 2ED300E17-SFO with MA200E12/17 and three EconoDualTM modules in parallel Module REXT/Ω RINT/Ω fS@Ta=25°C and Tbaseplate=125°C limited by RG power limited by DC/DC power FF150R17ME3G 9.1 3.2 33 kHz 21 kHz FF225R17ME3 6.2 2.8 25 kHz 15 kHz FF225R17ME4 3.3 2.8 32 kHz 15 kHz FF300R17ME3 4.7 2.5 19 kHz 10 kHz FF300R17ME4 3.3 2.5 24 kHz 12 kHz FF450R17ME3 3.3 1.7 12 kHz 7 kHz FF450R17ME4 3.3 1.7 13 kHz 8 kHz Application Note 15 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board 3.7 Parallel operation The Flexible Starter Kit consisting of one 2ED300E17-SFO, one 2ED300E17-S /-STdriver board and MA200E12/17 module adapter board can be used for driving one EconoDual™ module as shown in Fig. 2. The driver system can be easily adapted for paralleling of modules (maximum three EconoDual™ modules). In that case all EconoDual™ modules should have dedicated MA200E12/17 board connected to 2ED300E17-SFO adapter board as shown in Figure 12. It must be noticed that RSSD resistor in every case should be selected accordingly to AN2007-05 chapter 3.5. Module 1 MA200E12/1 Connector Module 2 2ED300E17- Connector Connector MA200E12/1 Module 3 MA200E12/1 Figure 11 Connections between MA200E12/17 and 2ED300E17-SFO when three EconoDual™ modules are used in parallel 4 Schematic and Layout of MA200E12/17 To meet the individual customer requirement and make the evaluation board simple for further development or modification, all necessary technical data like schematic, layout and components are included in this chapter. Application Note 16 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board 4.1 Schematic Figure 12 The MA200E12/17 – top channel Application Note 17 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board Figure 13 The MA200E12/17 – bottom channel Application Note 18 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board Figure 14 The MA200E12/17 – top and Bottom IGBT Figure 15 The MA200E12/17 – external connectors Application Note 19 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board 4.2 Assembly drawing Basic circuit and layout for MA200E12 and MA200E17 are the same. The only difference is the type of transil diode used for Active Clamping. See bill of material for details. Gate resistors should be assembled accordingly to hints given in Table 3. Figure 16 The MA200E12/17 – assembly drawing Application Note 20 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board 4.3 Layout Figure 17 The MA200E12/17 – Top layer Application Note 21 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board Figure 18 The MA200E12/17 – Bottom layer 4.4 Bill of Material - MA200E12 The bill of material not only includes a part list, but also assembly notes. The tolerances for resistors should be less or equal ±1 %, for capacitors of the type C0G less or equal ±5 % and for capacitors of the type X7R less or equal ±10 %. Table 7 Bill of Material for MA200E12 adapter board Type Value / Type Package QTY Name Part resistor 4µ7 C1206 24 resistor 12R R0805 6 resistor 1k R0805 2 C_BCB1, C_BCB2, C_BCB3, C_BCB4, C_BCB5, C_BCB6, C_BCB7, C_BCB8, C_BCB9, C_BCB10, C_BCB11, C_BCB12, C_BCT1, C_BCT2, C_BCT3, C_BCT4, C_BCT5, C_BCT6, C_BCT7, C_BCT8, C_BCT9, C_BCT10, C_BCT11, C_BCT12 R_B1, RB_2, RB_3, RT_1, RT_2, RT_3 R_DB, RD_T resistor 1R M1206 6 R_B+, R_B-, R_T+,R_T-, Application Note 22 Recommanded Manufacturer Murata Assembly yes no special yes no special yes no special yes V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board R_B_GND, R_T_GND resistor 27R resistor 2k2 R0805 1 R_BC1, R_BC2, R_BC3, R_TC1, R_TC2, R_TC3 R_T no special yes Semiconductor BAT165 SOD323 4 D1, D2, D_CB, D_CT Infineon yes Semiconductor ES1D DO214AC 8 Vishay yes Semiconductor 1.5SMC440 A SMC 4 Vishay yes Semiconductor 1.5SMC188 A SMC 2 D_B1, D_B2, D_BB, D_BB1, D_BT, D_BT1, D_T1, D_T2 D1.1C, D1.2C, D2.1C, D2.2C D1.3C, D2.3C Vishay yes Semiconductor STTH112U SOD6 2 D_DB, D_DT STM yes resistor variable R1206 2 R_BB, R_BT no special yes resistor variable R2010 12 special pulse resistor no Semiconductor ZXTN2010Z SOT89 6 Zetex yes Semiconductor ZXTP2012Z SOT89 6 Zetex yes S02P 1 R_GB1, R_GB2, R_GB3, R_GB4, R_GB5, R_GB6,R_GT1, R_GT2, R_GT3, R_GT4, R_GT5, R_GT6 T_PB1, T_PB2, T_PB3, T_PT1, T_PT2, T_PT3, T_NB1, T_NB2, T_NB3, T_NT1, T_NT2, T_NT3, X3 Molex yes 6410-5A 2 X1, X2 Molex yes connector connector 6410-5A R0805 6 no special yes *Pulse power rated types Application Note 23 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board 4.5 Bill of Material - MA200E17 The bill of material not only includes a part list, but also assembly notes. The tolerances for resistors should be less or equal ±1 %, for capacitors of the type C0G less or equal ±5 % and for capacitors of the type X7R less or equal ±10 %. Table 8 Bill of Material for MA200E17 adapter board Type Value / Type Package QTY resistor 4µ7 C1206 24 resistor 12R R0805 6 resistor 1k R0805 2 resistor 1R M1206 6 resistor 27R R0805 6 resistor 2k2 Semiconductor BAT165 Semiconductor ES1D Semiconductor Name Part C_BCB1, C_BCB2, C_BCB3, C_BCB4, C_BCB5, C_BCB6, C_BCB7, C_BCB8, C_BCB9, C_BCB10, C_BCB11, C_BCB12, C_BCT1, C_BCT2, C_BCT3, C_BCT4, C_BCT5, C_BCT6, C_BCT7, C_BCT8, C_BCT9, C_BCT10, C_BCT11, C_BCT12 R_B1, RB_2, RB_3, RT_1, RT_2, RT_3 R_DB, RD_T R_B+, R_B-, R_T+,R_T-, R_B_GND, R_T_GND R_BC1, R_BC2, R_BC3, R_TC1, R_TC2, R_TC3 R_T R0805 1 SOD323 4 DO214AC 8 1.5SMC510 A SMC 4 Semiconductor 1.5SMC440 A SMC 2 D1, D2, D_CB, D_CT D_B1, D_B2, D_BB, D_BB1, D_BT, D_BT1, D_T1, D_T2 D1.1C, D1.2C, D2.1C, D2.2C D1.3C, D2.3C Semiconductor STTH112U SOD6 2 D_DB, D_DT resistor variable R1206 2 resistor variable R2010 12 Semiconductor ZXTN2010Z SOT89 6 Semiconductor ZXTP2012Z SOT89 6 S02P 1 R_BB, R_BT R_GB1, R_GB2, R_GB3, R_GB4, R_GB5, R_GB6, R_GT1, R_GT2, R_GT3, R_GT4, R_GT5, R_GT6 T_PB1, T_PB2, T_PB3, T_PT1, T_PT2, T_PT3, T_NB1, T_NB2, T_NB3, T_NT1, T_NT2, T_NT3, X3 6410-5A 2 X1, X2 connector connector 6410-5A Recommanded Manufacturer Assembly Murata yes no special yes no special yes no special yes no special yes no special yes Infineon yes Vishay yes Vishay yes Vishay yes STM yes no special yes special pulse resistor no Zetex yes Zetex yes Molex yes Molex yes *Pulse power rated types Application Note 24 V1.0, AN2010-01 AN2010-01 EconoDUAL 3 Module Adapter Board 5 How to order Evaluation Driver Boards Every Evaluation Driver Board has its own IFX order number and can be ordered via your Infineon Sales Partner. Information can also be found at the Infineons Web Page: www.infineon.com CAD-data for the board decribed here are available on request. The use of this data is subjected to the disclaimer given in this AN. Please contact: [email protected] IFX order number for MA200E12: 34084 IFX order number for MA200E17: 34083 IFX order number for 2ED300E17-SFO: 30272 IFX order number for 2ED300C17-S: 29831 IFX order number for 2ED300C17-ST: 29832 6 References [1] Infineon Technologies AG: AN2008-02, 2ED100E12-F2 - 6ED100E12-F2 - Evaluation Driver Board for EconoDUAL™3 and EconoPACK+™ modules, V1.2, August 2009 [2] Bäßler, M.; Ciliox A.; Kanschat P.: On the loss – softness trade-off: Are different chip versions needed for softness improvement? PCIM Europe 2009, Nuremberg, May 2009 [3] Infineon Technologies AG: AN2007-04, How to calculate and to minimize the dead time requirement for IGBTs properly, V1.0, May 2007 [4] Luniewski, P.; Jansen U.; Hornkamp M.: Dynamic voltage rise control –the most efficient way to control turn-off switching behaviour of IGBT transistors, Pelincec 2005, Warsaw, October 2005 [5] Luniewski, P.; Jansen. U.: Benefits of system oriented IGBT module design for high power inverters, EPE 2007, Aalborg, September 2007 Application Note 25 V1.0, AN2010-01