LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TRIPLE COLOR LED LAMPS Pb Lead-Free Parts LRGB31492 DATA SHEET DOC. NO : QW0905- LRGB31492 REV. : A DATE : 28-Aug.- 2015 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/5 PART NO. LRGB31492 Package Dimensions 2.55 7.8 4.1 2.8 2.6 0.6 18.0min 0.5TYP 3-2.54TYP 1 2 3 4 1.CATHODE RED 2.COMMON ANODE 3.CATHODEGREEN 4.CATHODE BLUE Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB31492 Page 2/5 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT Red Green Blue Forward Current IF 30 30 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 100 100 mA Power Dissipation PD 120 120 120 mW ESD 2000 500 V Reverse Current @5V Ir 10 50 μA Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Electrostatic Discharge( * ) Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Spectral halfwidth △λnm Forward voltage @5mA(V) Luminous Viewing intensity angle @5mA(mcd) 2θ 1/2 (deg) Min. Typ. Max. Min. Max. Min. Max. 620 625 20 1.8 ---- 2.4 500 1200 90 In/GaN Green White Diffused 525 530 36 2.6 ---- 3.4 1000 2300 90 In/GaN Blue 460 465 30 2.8 ---- 3.6 200 90 Emitted AIGaInP LRGB31492 Dominant wave length λDnm Red Lens Note : 1.The forward voltage data did not including ±0.05V testing tolerance. 2. The luminous intensity data did not including ±10% testing tolerance. 3. The doninant wavelength data did not including ±2nm testing tolerance. 600 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/5 PART NO. LRGB31492 Typical Electro-Optical Characteristics Forward Current vs.Forward Voltage 1.8 2.0 2.2 2.4 3.6 2.0 4.0 6.0 8.0 Maximum Forward Current vs. Ambient Temperature 2.8 3.0 3.3 3.4 2.0 3.6 Lighting Angle 4.0 6.0 8.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5 PART NO. LRGB31492 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB31492 Page 5/5 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11