LOW PROFILE QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC FPT-120P-M21 120-pin plastic LQFP Lead pitch 0.50 mm Package width × package length 16.0 × 16.0 mm Lead shape Gullwing Sealing method Plastic mold M ounting height 1.70 mm MAX Weight 0.88 g Code (Reference) P-LFQFP120-16×16-0.50 (FPT-120P-M21) 120-pin plastic LQFP (FPT-120P-M21) Note 1) * : These dimensions do not include resin protrusion. Resin protrusion is +0.25(.010) MAX(each side). Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. 18.00±0.20(.709±.008)SQ +0.40 * 16.00 –0.10 .630 +.016 –.004 SQ 90 61 91 60 0.08(.003) Details of "A" part +0.20 1.50 –0.10 +.008 (Mounting height) .059 –.004 INDEX 0~8˚ 120 LEAD No. 1 30 0.50(.020) C "A" 31 2002 FUJITSU LIMITED F120033S-c-4-4 0.22±0.05 (.009±.002) 0.08(.003) M 0.145 .006 +0.05 –0.03 +.002 –.001 0.60±0.15 (.024±.006) 0.10±0.05 (.004±.002) (Stand off) 0.25(.010) Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 0212