Series 351000 SSOP-to-DIP RoHS/WEEE-Compliant Adapter FEATURES • RoHS/WEEE-Compliant • Allows the use of 0.65mm pitch surface mount ICs in thru-hole designs. • Ideal for prototyping and testing/evaluating SSOP ICs. • Adapter can be cut to smaller sizes by end user. • Consult factory for Panelized Form or for mounting of consigned ICs. GENERAL SPECIFICATIONS • ADAPTER BODY: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides • PADS: finished with ENIG (Immersion Au over Electroless Ni) • PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M • PIN PLATING: 10µ [0.25µ] min. Au per MIL-G-45204 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290 • CURRENT RATING: 1 amp • OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS • SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. • Will plug into standard IC socket CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ORDERING INFORMATION 16-351000-11RC 16-351000-11RC-P for Panelized Version ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED “A” # OF PINS PER ROW x 0.100 [2.54] “B” (# OF PINS PER ROW -1) x 0.100 [2.54] “C” (# OF PADS PER ROW -1) x 0.0256 [0.65] CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 WWW.ARIESELEC.COM • [email protected] PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED 18036RC Rev. AA