CSP/µBGA Test & Burn-in Socket w/Adjustable Pressure Pad for Devices up to 27mm Square FEATURES • Aries unique universal socketing system allows the socket to be easily configured for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra lead-time. • For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA packaged devices. • Quick and easy Probe Replacement System: the complete set of probes can be removed and a new set (interposer) can be inserted quickly and easily. The old set can be returned to the factory for repair and sent back within one day. • Pressure mounting, no soldering required. • 4-point crown (other styles also available) insures scrub on solder oxides. • Signal path during test only 0.077 [1.96]. • Accommodates any package up to 27mm square. ORDERING INFORMATION • Small overall socket size/profile allows max. number of sockets per BIB and BIB’s per oven, Consult Factory while being operator friendly. • Adjustable pressure pad, with a large tolerance, allows for varying device heights as CLEANING, HANDLING, MOUNTING well as for fine-tuning pressure pad force to meet specific device requirements. & PROBE REPLACEMENT INFO GENERAL SPECIFICATIONS Need a Breakout Board? • MOLDED SOCKET COMPONENTS: UL 94V-0 PEEK and/or Ultem SPECIAL THERMAL REQUIREMENT WORKSHEET •1dB BANDWIDTH: 1GHz (0.80mm pitch) (large probe) • ESTIMATED CONTACT LIFE: 500,000 cycles • COMPRESSION SPRING PROBES: heat-treated BeCu with 30µ [0.75µ] min. Au per MIL-G-45204 over 30µ [0.75µ] min. Ni per SAE AMS QQ-N-290 • CONTACT FORCE : 6g per contact on 0.20-0.29mm pitch A detailed device drawing must be : 15g per contact on 0.30-0.35mm pitch sent to Aries to quote and design : 16g per contact on 0.40-0.45mm pitch a socket. : 25g per contact on 0.50-0.75mm pitch __________________________ : 25g per contact on 0.80mm pitch or larger See Data Sheet for... • OPERATING TEMPERATURE: -55°C [-67°F] min. to 150°C [302°F] max. CSP Sockets • ALL HARDWARE: Stainless Steel • TYPICAL BURN-IN TEMPERATURE: 150°C [302°F] max. 23016 Hybrid Socket 23021 µBGA up to 6.5mm MOUNTING CONSIDERATIONS 23017 µBGA up to 13mm • SOCKET: mounted with four #4-40 screws to either a plastic shipping plate (to be removed at time of 23018 µBGA up to 27mm socket mounting or PCB) or a tapped insulated backing plate to be used on underside of PCB for high pin count applications 23019 µBGA up to 40mm • NOTE: Sockets must be handled with care when mounting or removing sockets to/from PCB 23020 µBGA up to 55mm • TEST PCB MINIMUM DIAMETER “G” : 0.025 [0.64] (large probe 0.80mm pitch and larger) 23023 Optical Failure Analysis : 0.015 [0.38] (small probe 0.50-0.75mm pitch) : 0.012 [0.31] (small probe 0.40-0.45mm pitch) RF Sockets : 0.009 [0.23] (small probe 0.30-0.35mm pitch) 24013 RF up to 6.5mm : 0.004 [0.10] (small probe 0.20-0.20mm pitch) • TEST PCB DIAMETER SPRING PROBE PAD PLATING: 30µ [0.75µ] min. Au per MIL-G-45204 over 30µ 24008 RF up to 13mm [0.75µ] min. Ni per SEA AMS-QQ-N-290. Pad must be the same height as top surface of PCB. Please 24009 RF up to 27mm refer to the Custom Socket Drawing supplied by Aries after receipt of your order for your specific ap24009-APP w/Adj Pressure Pad plication. 24011 RF up to 40mm 24012 RF up to 55mm 24010 RF Machined Socket 23022 Kelvin Test Socket Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 WWW.ARIESELEC.COM • [email protected] 23018-APP 1 of 2 PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED Rev. 1.6 CSP/µBGA Test & Burn-in Socket w/Adjustable Pressure Pad for Devices up to 27mm Square FULL-ARRAY SHOWN AS AN EXAMPLE; YOUR SPECIFIC DEVICE PATTERN/FOOTPRINT WILL BE SUPPLIED WHEN ORDERED. ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. SPRING PROBES Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 WWW.ARIESELEC.COM • [email protected] 23018-APP 2 of 2 PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED Rev. 1.6