lwk3133-x.pdf

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
ROUND TYPE LED LAMPS
Pb
Lead-Free Parts
LWK3133-X
DATA SHEET
DOC. NO :
QW0905-LWK3133-X
REV.
:
A
DATE
:
07 - Jul. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/7
PART NO. LWK3133-X
Package Dimensions
4.75
7.65
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
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PART NO. LWK3133-X
Page 2/7
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
WK
Forward Current
IF
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
100
mA
Power Dissipation
PD
120
mW
Ir
50
μA
Electrostatic Discharge( * )
ESD
150
V
Operating Temperature
Topr
-20~ +80
℃
Storage Temperature
Tstg
-30~ +100
℃
Reverse Current @5V
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* glove
is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
LWK3133-X
COLOR
MATERIAL
InGaN/GaN
Color
Temperature
(° K)
Forward
Luminous
Viewing
voltage
intensity
angle
@20mA(V) @20mA(mcd) 2 θ 1/2
(deg)
Emitted
Lens
Min.
Max.
Typ. Max. Min. Typ.
White
Water Clear
2600
7100
3.5
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ± 15% testing tolerance.
4.0 1800 2700
30
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PART NO. LWK3133-X
Page 3/7
Model Designation System
JIS9112
Classification
Symbol
Tep( °K)
Daylight
D
5700 ~ 7100
Day White
N
4600 ~ 5400
White
W
3900 ~ 4500
Warm White
WW
3200 ~ 3700
Incandescent White
L
2600 ~ 3150
IEC : International Electrotechnical Commission
JIS : Japanese Industrial Standards
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LWK3133-X
Page 4/7
Correspondence table of Color Temperature - 1931 CIE(Reference)
Color
Temperature
Kelvin(° K)
Color
Temperature
1931 CIE
1931 CIE
X
Y
Kelvin(°K)
X
Y
1000
0.653
0.344
4100
0.376
0.374
1200
1400
0.625
0.599
4200
4300
0.372
0.368
0.371
0.369
1500
1600
0.588
0.573
0.367
0.386
0.393
4400
4500
0.364
0.361
0.366
0.364
1700
1800
1900
0.561
0.549
0.404
0.408
0.357
0.351
0.361
0.356
2000
0.538
0.527
0.411
0.413
4600
4800
4900
5000
0.348
0.345
0.354
0.352
2100
2200
0.516
0.506
0.415
0.415
5200
5400
0.34
0.335
0.347
0.343
0.339
0.399
2300
0.496
0.415
2400
0.486
0.415
5600
5800
0.33
0.326
2500
2600
0.477
0.468
0.414
0.412
6000
6500
0.322
0.314
0.332
0.354
2700
2800
2900
0.46
0.452
0.444
0.411
0.409
0.407
7000
7500
8000
0.306
0.3
0.317
0.31
3000
3100
0.437
0.43
0.404
0.402
8500
9000
0.295
0.291
0.287
0.305
0.3
0.296
3200
0.423
0.42
0.399
0.398
9300
10000
0.285
0.281
0.293
0.288
0.417
0.411
0.396
0.394
15000
0.264
0.267
3600
0.405
0.409
0.391
0.388
3700
3800
0.395
0.39
0.385
0.382
3900
4000
0.385
0.381
0.38
0.377
3250
3300
3400
3500
0.335
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PART NO. LWK3133-X
Page 5/7
Typical Electro-Optical Characteristics Curve
WK CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1
01
2.5
2.0
1.5
1.0
0.5
0.0
1.0
2.0
3.0
4.0
5.0
1
10
Fig.4 Relative Intensity vs. Temperature
1.2
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
SPECTRAL RADIANCE
100
Intensity
80
60
40
20
0
600
Wavelength (nm)
700
2.5
2.0
1.5
1.0
0.5
0.0
-20
0
20
40
60
80
Ambient Temperature( ℃)
Fig.5 Luminous Spectrum(Ta=25 ℃)
500
3.0
-40
Ambient Temperature( ℃)
400
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
800
100
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PART NO. LWK3133-X
Page 6/7
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350° C Max
Soldering Time:3 Seconds Max(One Time)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5° C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
150
Time(sec)
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Property of Ligitek Only
Page 7/7
PART NO. LWK3133-X
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
Thermal Shock Test
1.Ta=105 ℃±5 ℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11