A8516 LED Backlight Driver for LCD Monitors and Televisions Features and Benefits Description ▪ ▪ ▪ ▪ The A8516 is a multi-output WLED/RGB driver for backlighting LCD monitors and televisions. It integrates a boost controller to drive external MOSFET, and six internal currentsinks. The boost converter operates in constant frequency (programmable) current mode control. ▪ ▪ ▪ ▪ ▪ ▪ Six integrated high current sinks Fixed frequency current mode control with integrated gate driver 300 kHz to 1 MHz adjustable Boost switching frequency Controlled startup using options of Enable, PWM signal, or battery voltage ramp Active current sharing between LED strings for ±0.6% accuracy and matching No audible MLCC noise during PWM dimming Adjustable overvoltage protection (OVP) Open or shorted LED string protection Overtemperature, cycle-by-cycle current limit, and undervoltage protection SOIC 24-pin package for easy single-side PCB manufacturing, or TSSOP 24-pin package with exposed thermal pad for better thermal performance Packages: 24-pin SOICW with internally fused pins (LB package) The LED sink current is set by an external R_ISET resistor (see chart below). More than one LED sinks can be combined together to achieve even higher current per LED string. The A8516 operates from a single supply of 8 to24 V. It provides protection against overvoltage, open or shorted LED string, and overtemperature. A dual level cycle-by-cycle current limit function provides soft start and protects against overloads. The device is provided in a 24-pin SOICW package (LB), with internally fused pins for enhanced thermal dissipation, and a 24-pin TSSOP package (LP), with an exposed thermal pad for enhanced thermal dissipation. All packages are lead (Pb) free, with 100% matte tin leadframe plating. Not to scale 24-pin TSSOP with exposed thermal pad (LP package) Typical Application Circuit VOUT VBAT 8 to 24 V L1 C1 C2 Q1 18 LEDs per string D1 RSC ROVP P P C3 C4 P LED Current versus ISET Resistor Value VREF = 1.24 V, Gain = 640 DRIVER SENSE1 SENSE2 OVP VIN VBIAS 120 110 C5 FAULT EN A8516 90 LED2 PWM R2 COMP RFSET FSET RISET R3 Cz1 LED3 80 70 60 50 LED4 ISET VREG7V Rz1 100 LED1 ILED (mA) R1 130 40 30 LED5 20 6 C6 LED6 8 10 12 14 16 18 20 RISET (kΩ) AGND AGND LGND LGND PGND P R2, R3 optional (A8516 has internal pull-down resistors) A8516, Rev. 1 Figure 1. Typical application circuit; VIN pin tied to VBAT . 22 24 26 28 30 A8516 LED Backlight Driver for LCD Monitors and Televisions Selection Guide Part Number A8516ELBTR-T A8516ELPTR-T Packing Package Contact factory for availability 4000 pieces per 13-in. reel 24-pin SOICW, with internally fused pins for enhanced thermal dissipation 24-pin TSSOP, with exposed thermal pad for enhanced thermal dissipation Absolute Maximum Ratings Characteristic Rating Unit VIN –0.3 to 34 V LED1-LED6 Pin Voltage VLEDx –0.3 to 40 V OVP Pin Input Voltage VOVP –0.3 to 50 V SENSE1 and SENSE2 Pin Input Voltage VSENx –0.3 to 1 V –0.3 to 10 V VIN Pin Input Voltage Symbol Notes VBIAS, VREG7V, and DRIVER Pins Remaining Pins Input Voltage –0.3 to 7 V –40 to 85 ºC TJ(max) 150 ºC Tstg –55 to 150 ºC Operating Ambient Temperature TA Maximum Junction Temperature Storage Temperature Range E Thermal Characteristics may require derating at maximum conditions, see application information Characteristic Package Thermal Resistance Symbol RθJA Value Unit Package LB, on 2-layer PCB, 1-in.2 2-oz copper exposed area Test Conditions* 51 ºC/W Package LB, on 4-layer PCB, based on JEDEC standard 35 ºC/W Package LP, on 4-layer PCB, based on JEDEC standard 28 ºC/W *Additional thermal information available on the Allegro website Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 2 A8516 LED Backlight Driver for LCD Monitors and Televisions Functional Block Diagram L1 D1 VIN Q1 P VIN DRIVER FSET SENSE1 RSC SENSE2 Current Mode Boost Controller OSC RFSET P ROVP P OVP Overvoltage Protection Ref COMP OCP SS CCOMP RISET Control and Feedback 6 LED1 ISET LED2 Reference Current PWM LED3 50 kΩ EN VREG7V Control Logic/ UVLO LDO 7V 0.1 μF VBIAS +5 V 10 kΩ 0.1 μF OVP OCP LED Select Logic 6 Open/Short LED Detect 6 LED4 LED5 TSD 5V LED6 FAULT LP Only PAD PGND AGND AGND DGND LGND LGND P Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 3 A8516 LED Backlight Driver for LCD Monitors and Televisions Pin-out Diagrams EN 1 PGND 2 24 PWM 23 FAULT 24 DGND EN 1 23 PWM PGND 2 DRIVER 3 22 LED6 DRIVER 3 22 FAULT VREG7V 4 21 LED5 VREG7V 4 21 LED6 VIN 5 20 LED4 VIN 5 20 LED5 AGND 6 19 LGND VBIAS 6 AGND 7 18 LGND NC 7 18 LGND VBIAS 8 17 LED3 OVP 8 17 LED3 OVP 9 16 LED2 SENSE2 9 16 LED2 SENSE2 10 15 LED1 SENSE1 10 15 LED1 SENSE1 11 14 COMP ISET 12 13 FSET PAD 14 COMP ISET 11 13 FSET AGND 12 Package LB 19 LED4 Package LP Terminal List Table Number Name Function LB LP 1 1 EN 2 2 PGND 3 3 DRIVER Gate driver terminal to drive external MOSFET. 4 4 VREG7V Gate driver supply from internal voltage regulator. Bypass with 0.1 to 1 μF ceramic capacitor to PGND. Device Enable. Apply logic-high signal to enable, low to shut down. Power ground for external FET gate driver. Connect directly to RSC ground and to common star ground. 5 5 VIN 6, 7 12 AGND Analog (signal) GND for the IC. Connect to common star ground. Input supply voltage for the IC. 8 6 VBIAS Bias supply voltage from internal regulator. Bypass with 0.1 to 1 μF ceramic capacitor to AGND 9 8 OVP Overvoltage Protection terminal. Connect this pin to output capacitor through a resistor ROVP to set the OVP threshold. 10 9 SENSE2 Connect to ground side of current sense resistor RSC. 11 10 SENSE1 Connect to high side of current sense resistor RSC. 12 11 ISET Sets 100% Current through LED strings; connect RISET from ISET to AGND. 13 13 FSET Sets switching frequency; connect RFSET from FSET to AGND. 14 14 COMP Compensation pin; connect CCOMP (1 μF typical) capacitor to AGND. 15,16,17 15,16,17 LED1-3 LED current sinks; connect unused LEDx pins to ground to disable. 18,19 18 LGND 20,21,22 19,20,21 LED4-6 LED current sinks; connect unused LEDx pins to ground to disable. LED current sink ground; connect to common star ground. 23 22 ¯Ā¯Ū¯L̄¯T̄ ¯ F̄ This open-drain output is pulled low when fault condition occurs; connect to external pull-up resistor. 24 23 PWM Pulse width modulation LED-current control; apply logic level PWM for dimming. – 24 DGND Digital ground for input control signals (EN and PWM); connect to common star ground. – 7 NC Not connected electrically. – PAD PAD Exposed pad. Solder to GND plane for enhanced thermal dissipation. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 4 A8516 LED Backlight Driver for LCD Monitors and Televisions ELECTRICAL CHARACTERISTICS Valid at VIN = 12 V; TA = 25°C, RFSET = 52 kΩ, RISET = 12.4 kΩ, except indicates specifications guaranteed over the full operating temperature range with TA = TJ , unless otherwise noted Characteristics Input Voltage Range Symbol Test Conditions VIN Min. Typ.1 Max. Unit 8 – 24 V Internal Bias Voltage Range VBIAS 4.75 – 5.5 V Internal Gate Driver Voltage VDRIVER VIN ≥ 10 V 6.5 – 8 V Undervoltage Lockout Threshold for VIN VUVLO VIN falling 5.7 6.5 6.8 V Undervoltage Lockout Hysteresis for VIN VUVLOHYS Supply Current2 IVIN – 0.55 – V Switching at no load – 7 – mA Shutdown, EN = VIL, TA = 25°C – 0.1 1 μA Standby, EN = VIH, PWM = VIL, soft start completed – 2 3 mA 0.8 1 1.25 MHz Boost Controller Switching Frequency fSW Minimum Switch Off-Time toff(min) Driver output – 72 – ns Minimum Switch On-Time ton(min) Driver output – 72 – ns Logic Input Levels (EN and PWM pins) Input Voltage Level Low VIL – – 0.4 V Input Voltage Level High VIH 1.5 – – V Input Leakage Current2 IIN EN = PWM = 5 V – 100 – μA Error Amplifier COMP Pin Source Current IEA(src) VCOMP = 1.5 V – 160 – μA COMP Pin Sink Current IEA(snk) VCOMP = 1.5 V – 160 – μA – 1000 – kΩ COMP Pin Pull-Down Resistance RCOMPPD ¯Ā¯Ū¯L̄¯T̄ ¯= 0 F̄ Driver Section Peak Source Current5 Ipk(src) Measured at VDRIVER = 0 V – 2 – A Peak Sink Current5 Ipk(snk) Measured at VDRIVER = VREG7V – 2 – A High Side Gate Drive On Resistance RDS(on)H Measured at VDRIVER = VREG7V / 2 – 4 – Ω Low Side Gate Drive On Resistance RDS(on)L Measured at VDRIVER = VREG7V / 2 – 3 – Ω VSEN VSENSE1 – VSENSE2 80 95 110 mV LEDx Pin Regulation Voltage VLEDx ILED = 80 mA – 1.0 – V ISET to ILEDx Current Gain AISET ISET = 100 μA – 640 – A/A ISET Pin Voltage VISET – 1.235 – V ISET 41 – 190 μA Sense Overcurrent Threshold Voltage LED Current Sinks ISET Allowable Current Range2 Continued on the next page… Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 5 A8516 LED Backlight Driver for LCD Monitors and Televisions ELECTRICAL CHARACTERISTICS (continued) Valid at VIN = 12 V; TA = 25°C, RFSET = 52 kΩ, RISET = 12.4 kΩ, except indicates specifications guaranteed over the full operating temperature range with TA = TJ , unless otherwise noted Characteristics Symbol Test Conditions Min. Typ.1 Max. Unit % LED Current Sinks (continued) LEDx Accuracy3 ErrILEDX LED1 through LED6 = 1.0 V, at 100% Current –3 ±0.6 3 Matching4 ΔILEDX LED1 through LED6 = 1.0 V, ISET = 100 μA –3 ±0.6 3 % VLEDx = 12 V, EN = 0 – 48 – μA LEDx LEDx Switch Leakage Current2 ISL LEDx Bleeder Resistor to GND RLEDX PWM = Low, VLEDx = 10 V – 250 – kΩ Soft Start Sense Threshold Voltage VSENS Sense voltage for boost switch current sensing – 28.5 – mV Soft Start LEDx Current Limit Relative to LED 100% Current ILED(SS) Current through enabled LEDx pins during soft start – 8 – % Soft Start Protection Features Thermal Shutdown Threshold TTSD TJ rising – 165 – °C Short Circuit Detect Voltage VSC Measured on any LEDx pin – 25 – V 18.0 19.5 21.0 V – 0.1 – μA Output Overvoltage Threshold VOVP ROVP = 0 OVP Pin Leakage Current2 IOVPLK VOVP = 22 V, EN = VIL, or PWM=VIL Overvoltage Protection Sense Current2 IOVPH 183 200 217 μA ¯Ā¯Ū¯L̄¯T̄ ¯ Pin Output Leakage2 F̄ IFLT V=5V – – 1 μA ¯Ā¯Ū¯L̄¯T̄ ¯ Pin Output Voltage F̄ VOL I = 500 μA – – 0.4 V 1Typical specifications are at TA = 25ºC. 2For input and output current specifications, negative current is defined as coming out of the node or pin (sourcing), positive current is defined as going into the node or pin (sinking). 3LED accuracy is defined as (I SET × 640 – ILED(av)) / (ISET × 640), ILED(av) measured as the average of ILED1 through ILED6. Refer to characterization chart for variation over temperature range. 4LED current matching is defined as (I LEDx – ILED(av)) / ILED(av), with ILED(av) as defined in footnote 3. Refer to characterization chart for variation over temperature range. 5Guaranteed by design and characterization. Variation of Total LED Current versus Ambient Temperature Normalized Total ILED(av) (%) 100% Current = 64 mA per channel at 25°C 101.0 100.5 100.0 99.5 99.0 98.5 98.0 -60 -40 -20 0 20 40 60 Temperature, TA (°C) 80 100 Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 6 A8516 LED Backlight Driver for LCD Monitors and Televisions Efficiency versus Battery Voltage for Various LED Configurations Efficiency versus Battery Voltage for Various LED Configurations FET = IRFR120N, VIN = 12 V, fSW = 500 kHz L = 22 μH, Load = W92050C LEDs at 112 mA per string FET = FQB17N08L, VIN = 12 V, fSW = 500 kHz L = 22 μH, Load = W92050C LEDs at 112 mA per string 95 95 94 94 93 93 92 92 91 91 90 90 Efficiency (%) Efficiency (%) Characteristic Performance 89 88 87 86 3 strings 18 LEDs per string VOUT ≈ 60 V, POUT ≈ 20.2 W 85 83 82 86 3 strings 18 LEDs per string VOUT ≈ 60 V, POUT ≈ 20.2 W 2 strings 18 LEDs per string VOUT ≈ 60 V, POUT ≈ 13.4 W 3 strings 14 LEDs per string VOUT ≈ 47 V, POUT ≈ 15.8 W 83 82 2 strings 14 LEDs per string VOUT ≈ 47 V, POUT ≈ 10.5 W 81 80 10 87 84 2 strings 14 LEDs per string VOUT ≈ 47 V, POUT ≈ 10.5 W 81 88 85 2 strings 18 LEDs per string VOUT ≈ 60 V, POUT ≈ 13.4 W 3 strings 14 LEDs per string VOUT ≈ 47 V, POUT ≈ 15.8 W 84 89 80 11 12 13 14 15 16 17 18 19 20 21 22 23 10 11 12 13 14 15 VBAT (V) 16 17 18 19 20 21 22 23 VBAT (V) Efficiency of the boost converter stage is affected by the selection of power MOSFET, switching frequency, input/output voltages, and output power. The external MOSFET used for the above chart is the IRFR120N, which has a relatively high RDS(on) = 0.21 Ω. This causes higher conduction loss, especially at lower input voltage. The power MOSFET is replaced with FQB17N08L, which has a lower RDS(on) = 0.115 Ω. This results in less conduction loss at lower input voltage, however, the switching loss becomes more significant at higher input voltage. Switching Frequency versus FSET Resistor Value fSW (MHz) = 52 / RFSET (kΩ) 1100 1000 fSW (kHz) 900 800 700 600 500 400 300 50 60 70 80 90 100 110 RFSET (kΩ) 120 130 140 150 Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 7 A8516 LED Backlight Driver for LCD Monitors and Televisions Normal Startup Power Sequences VBAT = 12 V, Load = 6 strings, 16 LEDs each string, 56 mA per string, Output capacitors = 2 × 2.2 μF ceramic The A8516 can startup with any combination of input and power sequences, as shown in waveforms below: VOUT C3,C4 C2 ILED Symbol Parameter Units/Division C1 C2 C3 C4 t VEN VPWM VOUT Total ILED time 10 V 10 V 10 V 100 mA 2 ms Normal startup with EN = Low-toHigh transition (PWM = High) VPWM VEN C1 t VOUT C3,C4 Symbol Parameter Units/Division C1 C2 C3 C4 t VEN VPWM VOUT Total ILED time 10 V 10 V 10 V 100 mA 2 ms Normal startup with PWM = Low-toHigh transition (EN = High) ILED VPWM C2 VEN C1 t VOUT C3,C4 C2 Symbol Parameter Units/Division C1 C2 C3 C4 t VEN VPWM VOUT Total ILED time 10 V 10 V 10 V 100 mA 2 ms Normal startup with PWM signal toggling at 500 Hz, 50% duty cycle ILED VPWM VEN C1 t ILED C2 VPWM C1 VEN Parameter Units/Division C1 C2 C3 C4 t VEN VPWM VOUT Total ILED time 10 V 10 V 10 V 100 mA 2 ms Normal startup with battery voltage ramping up from 2 to 12 V (EN= PWM = High) VOUT C3,C4 Symbol t Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 8 A8516 LED Backlight Driver for LCD Monitors and Televisions Typical PWM Operation Waveforms VBAT = 12 V, Load = 6 strings, 16 LEDs each string, 56 mA per string, Output capacitors = 2 × 2.2 μF ceramic VOUT Symbol Parameter Units/Division C1 C2 –* C4 t VEN VPWM VOUT Total ILED time 10 V 10 V 1V 100 mA 2 ms *Offset = 46 V C2 PWM dimming at 200 Hz 10% duty cycle; Output voltage ripple approximately 0.8 V (out of 50 V) VPWM VEN C1 t VOUT C4 C2 Symbol Parameter Units/Division C1 C2 –* C4 t VEN VPWM VOUT ILED time 10 V 10 V 1V 100 mA 50 μs *Offset = 46 V ILED PWM dimming at 5 kHz 10% duty cycle VPWM VEN C1 t Ratio of LED Current versus PWM Duty Cycle Ratio of LED Current versus PWM Frequency PWM frequency = 200 Hz PWM duty cycle = 10% 100 100 Ratio of LED Current (%) Ratio of LED Current (%) 90 10 1 80 70 60 50 Compensated pulse width 40 Uncompensated pulse width 30 20 10 0.1 0 0.1 1 PWM Duty Cycle (%) 10 100 0.1 1 PWM Frequency (kHz) 10 To improve the accuracy of PWM dimming at very high frequency and/or very low duty cycle, it is necessary to compensate the PWM pulse width, as described in Application Information section. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 9 A8516 LED Backlight Driver for LCD Monitors and Televisions Normal Operation and Fault Conditions VBAT = 12 V, Load = 6 strings, 18 LEDs each string, 56 mA per string, Output capacitors = 2 × 2.2 μF ceramic, ROVP = 249 kΩ (OVP at 69 V) VOUT C4 C2,C3 Symbol Parameter Units/Division C1 C2 C3 C4 t VEN VLEDx VOUT Total ILED time 10 V 10 V 10 V 100 mA 2 ms Normal startup with VBAT = 12 V, (VOUT ≈ 58 V when cold) ILED VLEDx VEN C1 t OVP tripped C2,C3 C1 Parameter Units/Division C1 C2 C3 C4 t VEN VLEDx VOUT Total ILED time 10 V 10 V 10 V 100 mA 2 ms Startup with one LED string open; (OVP tripped at ≈ 69 V. Open string removed from regulation. Remaining strings operate normally.) VOUT C4 Symbol ILED VLEDx VEN t OVP tripped VOUT ILED C1 Parameter Units/Division C1 C2 C3 C4 t VEN VLEDx VOUT Total ILED time 10 V 10 V 10 V 100 mA 2 ms Startup with all LED strings connected, then one LED string becomes open; (OVP tripped at ≈ 69 V. Open string removed from regulation. Remaining strings operate normally) C4 C2,C3 Symbol VLEDx VEN t VOUT C4 C2,C3 LED shortdetect tripped ILED VLEDx VFAULT Symbol Parameter Units/Division C1 C2 C3 C4 t VFAULT VLEDx VOUT Total ILED time 10 V 10 V 10 V 100 mA 2 ms OVP setpoint too high for the application. Startup with one string open; voltage at LEDx pin exceeded Short-Detect threshold (25 V) before OVP could be tripped. IC shuts down. C1 t Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 10 A8516 LED Backlight Driver for LCD Monitors and Televisions Functional Description Overview The A8516 is a multi-output WLED/RGB controller for backlighting medium-size displays. It has an integrated gate driver for driving an external N-channel boost MOSFET. The gate driver voltage is regulated at 7 V, which allows a wide selection of power MOSFET (in contrast to being limited to logic-level MOSFETs when using a 5 V gate driver). The boost controller operates in fixed-frequency current-mode control. The switching frequency can be set in the range from 300 kHz to 1 MHz, by an external resistor, RFSET , connected between FSET and ground. The external MOSFET switch is protected by pulse-by-pulse current limiting. The current limit is independent of duty cycle, and is set using an external sense resistor, RSC. LED Current Setting The maximum LED current can be set, at up to 130 mA/channel, through the ISET pin. Connect a resistor, RISET , between this pin and ground to set the reference current level, ISET . The value of ISET (mA) is determined by: ISET = 1.235 / RISET (kΩ) . (1) The resulting current is multiplied internally with a gain of 640 and mirrored on all enabled LEDx pins: ILED = ISET × 640 . (2) This sets the maximum current through each LEDx, referred as the 100% Current. The LEDx current can be reduced from the 100% Current value by applying an external PWM signal on the PWM pin. Conversely, we can calculate RISET according to the LED current required: RISET = ( 1.235 / ILED ) × 640 . (3) In steady-state operation, the maximum average LED current that can be handled by the IC depends on its thermal budget. That is, maximum power dissipation and acceptable temperature rise. The thermal budget is affected by various parameters, such as PCB size, copper plane around IC, LED Vf mismatch, selection of power components (MOSFET, inductor and diode), maximum board temperature, and so on. Boost Switching Frequency Setting Connect an external resistor between the FSET pin and GND, to set boost switching frequency, fSW . The value of fSW (MHz) is determined by: fSW = 52 / RFSET , (4) where fSW is in MHz and RFSET is in kΩ. The typical range of RFSET is approximately 51 to 174 kΩ, which corresponds to 1 MHz to 300 kHz. Enable The IC turns on when a high signal is applied on the EN pin, and turns off when this pin is pulled low. The LED current sinks are turned on when both the EN and the PWM inputs are high. Channel Selection The A8516 can be used to drive 1 to 6 LED channels. During startup, the IC detects LED sink pins which are shorted to ground, and disables the corresponding LED channel. Therefore, any unused LED pins must be connected to ground, otherwise the IC will go into overvoltage protection fault during startup. LED pins can be paralleled together for higher current. For example for a 3 parallel string configuration, connect LED1-2, LED3-4, and LED5-6 together to deliver up to twice the current per LED. PWM Dimming The A8516 has a very wide range for PWM signal input. It can accept a PWM signal from 100 Hz to 5 kHz. When a PWM high signal is applied, the LEDx pins sink 100% Current. When the PWM signal is low, the LED sinks turn off. Referring to figure 13, there is a ramp-up delay between when the PWM signal is applied and when the current reaches the 90% level. To improve current dimming linearity for PWM pulse widths less than 100 μs, increase the applied PWM pulse-width by 3 to 5 μs to compensate for this delay. PWM tD ILED Figure 13. Propagation delay from the PWM signal rising edge to ILEDx reaching the 90% level Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 11 A8516 LED Backlight Driver for LCD Monitors and Televisions Startup Sequence When EN is pulled high, the IC enters soft start. The IC first tries to determine which LEDx pins are being used, by raising the LEDx pin voltage with a small current. After a duration of 512 switching cycles, the LEDx pin voltage is checked. Any LEDx channel with a drain voltage smaller then 100 mV is removed from the control loop. This is the reason why unused LEDx pins should be connected to GND, After the first PWM positive trigger, the boost current is limited to 30% of normal value and all active LEDx pins sink 1/12 of Calculate the value for ROVP (Ω) as follows: ROVP = (VOVP – 19.5) / 200 μA , (5) where VOVP is the required OVP level in V. For single-IC operation, select ROVP such that its OVP setpoint is approximately 10 V above the LED operating voltage at cold. For example, given the pin regulation voltage, VLEDx of 1.4 V (typ.), if LED VF = 3.4 V (max.) and there are 15 LEDs in series, then the operating voltage is approximately: VOUT = 3.4 V × 15 + 1.4 V = 52.4 V . the set current until output voltage reaches sufficient regulation In this case, select OVP at about 60 V, which gives ROVP = 200 kΩ. level. When the device comes out of soft start, boost current and Open LED Protection During normal operation, if any enabled LED string opens, voltage on the corresponding LEDx pin goes to zero. The boost loop operates in open loop till the OVP level is reached. The A8516 identifies the open LED string when overvoltage is detected. Open strings are then removed from the regulation loop. Afterwards, the boost controller operates in normal manner, and the output voltage is regulated to drive the remaining strings. If the open LED string is reconnected, it will sink current up to the programmed current level. the LEDx pin currents are set to normal operating level. Within a few cycles, the output capacitor charges to the voltage required to supply full LEDx current. After output voltage, VOUT , reaches the required level, LEDx current toggles between 0% and 100% with each PWM command signal. In case of a heavy overload on VOUT at startup, the device will stay in soft start mode indefinitely, as the output voltage cannot rise to the LED regulation level. LED Short Detect Any LEDx pins that have a voltage exceeding the Short Circuit Detect Voltage, VSC , cause the device to shut down and this condition is latched. This faults occurs when multiple LEDs short. In case only a few LEDs short, the IC will continue to work as long as power dissipation in the IC is limited. Overvoltage Protection The A8516 has an adjustable overvoltage protection feature to protect the power components (external MOSFET, output diode and capacitors) against output overvoltage. The overvoltage level can be set, from 19.5 V to a higher voltage, with an external resistor, ROVP . When the current though the OVP pin exceeds 200 μA, internal OVP comparator goes high and the device shuts down. The OVP fault disables all LEDx strings that are below regulation, thus preventing them from controlling the boost output voltage. Note: Open strings are removed from boost regulation, but not disabled. This keeps the string in operation if LEDs open for only a short length of time, or reach OVP level on a transient event. The disconnected string can be restored to normal mode by reenabling the IC. It can also be restored to normal operation if the fault is removed from the corresponding LEDx pin, but an OVP event occurs on any other LEDx pin. Overcurrent Protection The IC provides pulse-by-pulse current limiting for the boost MOSFET. The current limit level, ISC (A), can be set by selecting the external resistor, RSC (Ω): RSC = 0.095 / ISC . (6) If the boost output voltage is unable to reach the regulation target even when the switch is operating at maximum current limit, the boost control loop will force the compensating capacitor, CCOMP , to rise in voltage until it reaches the overcurrent fault level (3.4 V approximately). The overcurrent fault forces the device into soft start. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 12 A8516 LED Backlight Driver for LCD Monitors and Televisions Thermal Shutdown (TSD) The IC shuts down when junction temperature exceeds 165°C. It will recover automatically when the junction temperature falls below 125°C approximately. VIN Undervoltage Lockout (UVLO) The device is shut down when input voltage, VIN , falls below VUVLO. Any existing latched fault is cleared. VIN Operating Range Considerations When VIN is above VUVLO and below 10 V, the IC will operate correctly, but its gate driver voltage may not reach the regulation target of 7 V. This may cause excessive switching and conduction loss if the external MOSFET is not fully enhanced. During normal operation, the IC draws approximately 10 to 15 mA from the VIN pin, depending on switching frequency and the external MOSFET. At VIN = 12 V, this translates into 120 to 180 mW of power consumption, most of it dissipated in internal linear regulators. This power increases proportionally with input voltage. Therefore it is highly recommended to keep VIN between 10 and 24 V during normal operation. If the input battery voltage must be higher than 24 V, a better solution is to power the VIN pin separately using a 12 V supply. Doing this reduces the heat dissipation of the IC, and improves the overall system efficiency. Fault Mode Fault State AutoRestart Description Yes Fault occurs when output voltage exceeds the OVP setpoint voltage. Used to prevent the output voltage from damaging the power components. Yes Fault occurs when the current through the external MOSFET increases such that the voltage across the SENSE1 and SENSE2 pins exceeds 95 mV typical. The MOSFET switch is turned off on a cycle-per-cycle basis. Overcurrent Protection Yes Multiple pulse-by-pulse current limits will cause the COMP pin voltage to rise. After a time period determined by the COMP pin current and the COMP capacitor, the COMP voltage will exceed the overcurrent detect threshold, forcing a fault. System may hiccup if the total current requirement is too high. Overtemperature Protection Yes Fault occurs when the die temperature exceeds the over-temperature threshold, 165°C typical. LED Short Protection No Fault occurs when the LED pin voltage exceeds VSC , 25 V typical. VIN UVLO No Fault occurs when VIN drops below VUVLO, 6.5 V typical. This fault resets all latched faults. Overvoltage Protection Pulseby-Pulse Current Limit Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 13 A8516 LED Backlight Driver for LCD Monitors and Televisions Application Information PCB Layout Guidelines As with any switching power supply, care should be taken in laying out the board. A switching power supply has sources of high dv/dt and high di/dt which can cause malfunction. All general norms should be followed for board layout. Refer to figure 1 for a typical application schematic. The A8516 evaluation board provides a useful model for designing application circuit layouts. The following guidelines should be observed: • Place bypass capacitors physically close to their respective pins (VIN, VBIAS, and VREG7V). • Place the resistors RFSET and RISET, and the compensation components (Rz and Cz) close to the FSET, ISET, and COMP pins, respectively. Connect the other ends to the common star ground. • A8516 has 50 kΩ internal pull-down resistors on the EN and PWM pins to keep these pins low while driving through tri-state state (for example, shutdown). Add external resistors R2 and R3 between the EN and PWM pins and ground, for added noise immunity. Connect these resistors close to the pins and return to the common star ground. • Route analog ground, digital signal ground, LED ground (LGND pin), and power ground (PGND pin) separately. Connect all these grounds at the common ground plane under the A8516, serving as a star ground. • Sense voltage across RSC with smaller length traces. Place the SENSE1 and SENSE2 traces as close to each other as possible to minimize noise pickup. Connect the SENSE2 trace to the negative end of the resistor and do not connect it to power ground plane. • Place the input capacitors (C1, C2), inductor (L1), boost diode (D1), MOSFET (Q1), and output capacitors (C3, C4) so that they form the smallest loop practical. Avoid long traces for these paths. • Provide a substantial copper plane near MOSFET Q1 and the IC, to provide good thermal conduction. When using multi-layer PCB, make sure there are sufficient numbers of thermal vias underneath and around the IC's exposed pads. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 14 A8516 LED Backlight Driver for LCD Monitors and Televisions VOUT VBAT 24 to 48 V L1 C1 Q1 C2 36 LEDs per string D1 RSC ROVP P P C3 C4 P DRIVER SENSE1 SENSE2 OVP VIN VREG7V VBIAS VIN 12 V R1 C5 C6 A8516 FAULT LED1 EN LED2 PWM R2 RFSET RISET R3 COMP LED3 FSET LED4 ISET Rz1 LED5 Cz1 LED6 AGND AGND LGND LGND PGND P R2, R3 optional (A8516 has internal pull-down resistors) Figure 14. Typical high-voltage application circuit; VIN pin separate from VBAT. VOUT VBAT 12 to 48 V L1 C1 C2 Q1 18 LEDs per string D1 RSC ROVP P P C3 C4 P DRIVER SENSE1 SENSE2 OVP VIN VBIAS VIN 12 V R1 C5 FAULT EN A8516 LED1 LED2 PWM R2 COMP RFSET FSET RISET R3 Cz1 LED4 ISET VREG7V Rz1 LED3 C6 LED5 LED6 AGND AGND LGND LGND PGND P R2, R3 optional (A8516 has internal pull-down resistors) Figure 15. Typical medium-voltage application circuit driving high-current (up to 240 mA) LED strings. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 15 A8516 LED Backlight Driver for LCD Monitors and Televisions Package LB 24-Pin SOICW with Internally Fused Pins 15.40 ±0.20 8° 0° 24 24 0.33 0.20 7.50 ±0.10 2.20 10.30 ±0.33 9.60 A 1.40 REF 1 2 1.27 0.40 Branded Face 24X SEATING PLANE 0.10 C 0.51 0.31 1.27 BSC 1 2 0.65 1.27 0.25 BSC SEATING PLANE GAUGE PLANE C B PCB Layout Reference View 2.65 MAX 0.30 0.10 Pins 6, 7, 18, and 19 internally fused for enhanced thermal dissipation For Reference Only; not for tooling use (reference MS-013AD) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Reference pad layout (reference IPC SOIC127P1030X265-24M) All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 16 A8516 LED Backlight Driver for LCD Monitors and Televisions Package LP 24-Pin TSSOP with Exposed Thermal Pad 7.80±0.10 24 0.65 0.45 8º 0º 0.20 0.09 B 3 NOM 4.40±0.10 3.00 6.40±0.20 6.10 0.60 ±0.15 A 1 2 1.00 REF 4.32 NOM 0.25 BSC 24X SEATING PLANE 0.10 C 0.30 0.19 0.65 BSC SEATING PLANE GAUGE PLANE C 1.65 4.32 C PCB Layout Reference View For Reference Only; not for tooling use (reference MO-153 ADT) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown 1.20 MAX 0.15 0.00 A Terminal #1 mark area B Exposed thermal pad (bottom surface); dimensions may vary with device C Reference land pattern layout (reference IPC7351 TSOP65P640X120-25M); all pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances; when mounting on a multilayer PCB, thermal vias at the exposed thermal pad land can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5) Copyright ©2010-2013, Allegro MicroSystems, LLC Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the failure of that life support device or system, or to affect the safety or effectiveness of that device or system. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. For the latest version of this document, visit our website: www.allegromicro.com Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 17