PMEG4010EP 1 A low VF MEGA Schottky barrier rectifier Rev. 02 — 15 April 2010 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits Average forward current: IF(AV) ≤ 1 A Reverse voltage: VR ≤ 40 V Low forward voltage High power capability due to clip-bond technology AEC-Q101 qualified Small and flat lead SMD plastic package 1.3 Applications Low voltage rectification High efficiency DC-to-DC conversion Switch Mode Power Supply (SMPS) Reverse polarity protection Low power consumption applications 1.4 Quick reference data Table 1. Quick reference data Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions IF(AV) average forward current square wave; δ = 0.5; f = 20 kHz Tamb ≤ 120 °C Tsp ≤ 145 °C [1] Min Typ Max Unit - - 1 A - - 1 A VR reverse voltage - - 40 V VF forward voltage IF = 1 A - 430 490 mV IR reverse current VR = 40 V - 10 50 μA [1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint. PMEG4010EP NXP Semiconductors 1 A low VF MEGA Schottky barrier rectifier 2. Pinning information Table 2. Pinning Pin Description 1 cathode 2 anode Simplified outline Graphic symbol [1] 1 1 2 2 sym001 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Ordering information Type number PMEG4010EP Package Name Description Version - plastic surface-mounted package; 2 leads SOD128 4. Marking Table 4. Marking codes Type number Marking code PMEG4010EP AC 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VR reverse voltage Tj = 25 °C - 40 V IF(AV) average forward current square wave; δ = 0.5; f = 20 kHz - 1 A Tamb ≤ 120 °C [1] Tsp ≤ 145 °C PMEG4010EP_2 Product data sheet IFSM non-repetitive peak forward current square wave; tp = 8 ms Ptot total power dissipation Tamb ≤ 25 °C All information provided in this document is subject to legal disclaimers. Rev. 02 — 15 April 2010 - 1 A [2] - 50 A [3][4] - 625 mW [3][5] - 1050 mW [3][1] - 2100 mW © NXP B.V. 2010. All rights reserved. 2 of 14 PMEG4010EP NXP Semiconductors 1 A low VF MEGA Schottky barrier rectifier Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Tj Conditions Min Max Unit junction temperature - 150 °C Tamb ambient temperature −55 +150 °C Tstg storage temperature −65 +150 °C [1] Device mounted on a ceramic PCB, Al2O3, standard footprint. [2] Tj = 25 °C prior to surge. [3] Reflow soldering is the only recommended soldering method. [4] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. 6. Thermal characteristics Table 6. Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient in free air Rth(j-sp) PMEG4010EP_2 Product data sheet Thermal characteristics thermal resistance from junction to solder point Min Typ Max Unit [3] - - 200 K/W [4] - - 120 K/W [5] - - 60 K/W [6] - - 12 K/W [1][2] [1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [5] Device mounted on a ceramic PCB, Al2O3, standard footprint. [6] Soldering point of cathode tab. All information provided in this document is subject to legal disclaimers. Rev. 02 — 15 April 2010 © NXP B.V. 2010. All rights reserved. 3 of 14 PMEG4010EP NXP Semiconductors 1 A low VF MEGA Schottky barrier rectifier 006aab374 103 duty cycle = Zth(j-a) (K/W) 1 102 0.5 0.25 0.75 0.33 0.2 0.1 10 0.05 0.02 1 0.01 0 10−1 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, standard footprint Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aab375 103 Zth(j-a) (K/W) duty cycle = 1 102 0.5 0.25 0.75 0.33 0.2 0.1 10 0.05 0.02 0.01 0 1 10−1 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, mounting pad for cathode 1 cm2 Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PMEG4010EP_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 15 April 2010 © NXP B.V. 2010. All rights reserved. 4 of 14 PMEG4010EP NXP Semiconductors 1 A low VF MEGA Schottky barrier rectifier 006aab376 103 Zth(j-a) (K/W) duty cycle = 102 1 0.5 0.25 10 0.1 0.02 0.75 0.33 0.2 0.05 0.01 0 1 10−1 10−3 10−2 10−1 1 102 10 103 tp (s) Ceramic PCB, Al2O3, standard footprint Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 7. Characteristics Table 7. Characteristics Tj = 25 °C unless otherwise specified. PMEG4010EP_2 Product data sheet Symbol Parameter Conditions Min Typ Max Unit VF forward voltage IF = 0.1 A - 310 360 mV IF = 1 A - 430 490 mV IR reverse current VR = 10 V - 3 13 μA VR = 40 V - 10 50 μA Cd diode capacitance f = 1 MHz VR = 1 V - 130 - pF VR = 10 V - 50 - pF All information provided in this document is subject to legal disclaimers. Rev. 02 — 15 April 2010 © NXP B.V. 2010. All rights reserved. 5 of 14 PMEG4010EP NXP Semiconductors 1 A low VF MEGA Schottky barrier rectifier 006aab377 10 IF (A) 006aab378 10−2 IR (A) 10−3 (1) 10−4 (2) 1 (1) (2) 10−1 (3) (4) 10−5 (5) 10−6 10−2 (3) 10−7 10−3 10−8 10−4 (4) 10−9 0 0.2 0.4 0.6 0.8 1 0 10 VF (V) 20 30 40 VR (V) (1) Tj = 150 °C (1) Tj = 125 °C (2) Tj = 125 °C (2) Tj = 85 °C (3) Tj = 85 °C (3) Tj = 25 °C (4) Tj = 25 °C (4) Tj = −40 °C (5) Tj = −40 °C Fig 4. Forward current as a function of forward voltage; typical values Fig 5. Reverse current as a function of reverse voltage; typical values 006aab379 250 Cd (pF) 200 150 100 50 0 0 10 20 30 40 VR (V) f = 1 MHz; Tamb = 25 °C Fig 6. Diode capacitance as a function of reverse voltage; typical values PMEG4010EP_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 15 April 2010 © NXP B.V. 2010. All rights reserved. 6 of 14 PMEG4010EP NXP Semiconductors 1 A low VF MEGA Schottky barrier rectifier 006aab380 0.6 006aab381 0.3 (4) PF(AV) (W) PR(AV) (W) (3) 0.4 0.2 (2) (1) (2) (1) (3) 0.2 0.1 (4) 0 0 0 0.4 0.8 1.2 1.6 0 10 20 30 IF(AV) (A) Tj = 150 °C Tj = 125 °C (1) δ = 0.1 (1) δ = 1 (2) δ = 0.2 (2) δ = 0.9 (3) δ = 0.5 (3) δ = 0.8 (4) δ = 1 (4) δ = 0.5 Fig 7. Average forward power dissipation as a function of average forward current; typical values 006aab382 1.6 (1) IF(AV) (A) Fig 8. Average reverse power dissipation as a function of reverse voltage; typical values 006aab383 1.6 (1) IF(AV) (A) 1.2 1.2 (2) (2) 0.8 0.8 (3) (3) (4) (4) 0.4 0.4 0 0 0 25 50 75 100 125 150 175 Tamb (°C) 0 25 50 Tj = 150 °C 125 150 175 Tamb (°C) (1) δ = 1; DC (2) δ = 0.5; f = 20 kHz (2) δ = 0.5; f = 20 kHz (3) δ = 0.2; f = 20 kHz (3) δ = 0.2; f = 20 kHz (4) δ = 0.1; f = 20 kHz (4) δ = 0.1; f = 20 kHz Average forward current as a function of ambient temperature; typical values Product data sheet 100 Tj = 150 °C (1) δ = 1; DC PMEG4010EP_2 75 FR4 PCB, mounting pad for cathode 1 cm2 FR4 PCB, standard footprint Fig 9. 40 VR (V) Fig 10. Average forward current as a function of ambient temperature; typical values All information provided in this document is subject to legal disclaimers. Rev. 02 — 15 April 2010 © NXP B.V. 2010. All rights reserved. 7 of 14 PMEG4010EP NXP Semiconductors 1 A low VF MEGA Schottky barrier rectifier 006aab384 1.6 (1) IF(AV) (A) 006aab385 1.6 (1) IF(AV) (A) 1.2 1.2 (2) (2) 0.8 0.8 (3) (3) (4) (4) 0.4 0.4 0 0 0 25 50 75 100 125 150 175 Tamb (°C) 0 25 50 75 100 125 150 175 Tsp (°C) Tj = 150 °C Ceramic PCB, Al2O3, standard footprint Tj = 150 °C (1) δ = 1; DC (1) δ = 1; DC (2) δ = 0.5; f = 20 kHz (2) δ = 0.5; f = 20 kHz (3) δ = 0.2; f = 20 kHz (3) δ = 0.2; f = 20 kHz (4) δ = 0.1; f = 20 kHz (4) δ = 0.1; f = 20 kHz Fig 11. Average forward current as a function of ambient temperature; typical values PMEG4010EP_2 Product data sheet Fig 12. Average forward current as a function of solder point temperature; typical values All information provided in this document is subject to legal disclaimers. Rev. 02 — 15 April 2010 © NXP B.V. 2010. All rights reserved. 8 of 14 PMEG4010EP NXP Semiconductors 1 A low VF MEGA Schottky barrier rectifier 8. Test information P t2 duty cycle δ = t1 t2 t1 t 006aaa812 Fig 13. Duty cycle definition The current ratings for the typical waveforms as shown in Figure 9, 10, 11 and 12 are calculated according to the equations: I F ( AV ) = I M × δ with IM defined as peak current, I RMS = I F ( AV ) at DC, and I RMS = I M × δ with IRMS defined as RMS current. 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline 2.7 2.3 1.1 0.9 0.6 0.3 1 5.0 4.4 4.0 3.6 2 1.9 1.6 Dimensions in mm 0.22 0.10 07-09-12 Fig 14. Package outline SOD128 PMEG4010EP_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 15 April 2010 © NXP B.V. 2010. All rights reserved. 9 of 14 PMEG4010EP NXP Semiconductors 1 A low VF MEGA Schottky barrier rectifier 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 PMEG4010EP [1] SOD128 4 mm pitch, 12 mm tape and reel -115 For further information and the availability of packing methods, see Section 14. 11. Soldering 6.2 4.4 4.2 solder lands solder resist 1.9 2.1 (2×) (2×) 3.4 2.5 solder paste occupied area Dimensions in mm 1.2 (2×) 1.4 (2×) sod128_fr Reflow soldering is the only recommended soldering method. Fig 15. Reflow soldering footprint SOD128 PMEG4010EP_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 15 April 2010 © NXP B.V. 2010. All rights reserved. 10 of 14 PMEG4010EP NXP Semiconductors 1 A low VF MEGA Schottky barrier rectifier 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PMEG4010EP_2 20100415 Product data sheet - PMEG4010EP_1 Modifications: PMEG4010EP_1 PMEG4010EP_2 Product data sheet • • Table 5 “Limiting values”: IFSM maximum value amended Section 13 “Legal information”: updated 20081209 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 02 — 15 April 2010 - © NXP B.V. 2010. All rights reserved. 11 of 14 PMEG4010EP NXP Semiconductors 1 A low VF MEGA Schottky barrier rectifier 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or PMEG4010EP_2 Product data sheet malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. 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Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. All information provided in this document is subject to legal disclaimers. Rev. 02 — 15 April 2010 © NXP B.V. 2010. All rights reserved. 12 of 14 PMEG4010EP NXP Semiconductors 1 A low VF MEGA Schottky barrier rectifier 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PMEG4010EP_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 15 April 2010 © NXP B.V. 2010. All rights reserved. 13 of 14 PMEG4010EP NXP Semiconductors 1 A low VF MEGA Schottky barrier rectifier 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Packing information . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 15 April 2010 Document identifier: PMEG4010EP_2