INTERSIL KAD5512HP

KAD5512HP
®
Data Sheet
October 1, 2009
High Performance 12-Bit,
250/210/170/125MSPS ADC
FN6808.3
Features
The KAD5512HP is the high-performance member of the
KAD5512 family of 12-bit analog-to-digital converters.
Designed with Intersil’s proprietary FemtoCharge™
technology on a standard CMOS process, the family supports
sampling rates of up to 250MSPS. The KAD5512HP is part of
a pin-compatible portfolio of 10, 12 and 14-bit A/Ds with
sample rates ranging from 125MSPS to 500MSPS.
A serial peripheral interface (SPI) port allows for extensive
configurability, as well as fine control of various parameters
such as gain and offset.
• Pin-Compatible with the KAD5512P Family, Offering
2.2dB Higher SNR
• Programmable Gain, Offset and Skew control
• 950MHz Analog Input Bandwidth
• 60fs Clock Jitter
• Over-Range Indicator
• Selectable Clock Divider: ÷1, ÷2 or ÷4
• Clock Phase Selection
• Nap and Sleep Modes
Digital output data is presented in selectable LVDS or CMOS
formats. The KAD5512HP is available in 72- and 48-contact
QFN packages with an exposed paddle. Operating from a
1.8V supply, performance is specified over the full industrial
temperature range (-40°C to +85°C).
• Two’s Complement, Gray Code or Binary Data Format
Key Specifications
• Pb-Free (RoHS Compliant)
• SNR = 68.2dBFS for fIN = 105MHz (-1dBFS)
• DDR LVDS-Compatible or LVCMOS Outputs
• Programmable Built-in Test Patterns
• Single-Supply 1.8V Operation
Applications
• SFDR = 81.1dBc for fIN = 105MHz (-1dBFS)
• Power Amplifier Linearization
• Power Consumption
- 429/345mW @ 250/125MSPS (SDR Mode)
- 390/309mW @ 250/125MSPS (DDR Mode)
• Radar and Satellite Antenna Array Processing
• Broadband Communications
OVDD
AVDD
CLKDIV
• High-Performance Data Acquisition
• Communications Test Equipment
• WiMAX and Microwave Receivers
CLKP
CLKOUTP
CLOCK
GENERATION
CLKN
RESOLUTION
SPEED
(MSPS)
KAD5514P-25
14
250
KAD5514P-21
14
210
KAD5514P-17
14
170
ORN
KAD5514P-12
14
125
OUTFMT
KAD5512P-50
12
500
OUTMODE
KAD5512P-25,
KAD5512HP-25
12
250
KAD5512P-21,
KAD5512HP-21
12
210
KAD5512P-17,
KAD5512HP-17
12
170
KAD5512P-12,
KAD5512HP-12
12
125
KAD5510P-50
10
500
CLKOUTN
D[11:0]P
12-BIT
250 MSPS
ADC
VINN
VCM
+
–
AVSS
NAPSLP
1.25V
SPI
CONTROL
CSB
SCLK
SDIO
SDO
SHA
1
D[11:0]N
DIGITAL
ERROR
CORRECTION
ORP
LVDS/CMOS
DRIVERS
OVSS
VINP
Pin-Compatible Family
MODEL
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
FemtoCharge is a trademark of Kenet Inc. Copyright Intersil Americas Inc. 2008, 2009. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
KAD5512HP
Ordering Information
PART NUMBER
PART MARKING
SPEED
(MSPS)
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
PKG. DWG. #
KAD5512HP-25Q72 (Note 1)
KAD5512HP-25 Q72EP-I
250
-40 to +85
72 Ld QFN
L72.10x10D
KAD5512HP-21Q72 (Note 1)
KAD5512HP-21 Q72EP-I
210
-40 to +85
72 Ld QFN
L72.10x10D
KAD5512HP-17Q72 (Note 1)
KAD5512HP-17 Q72EP-I
170
-40 to +85
72 Ld QFN
L72.10x10D
KAD5512HP-12Q72 (Note 1)
KAD5512HP-12 Q72EP-I
125
-40 to +85
72 Ld QFN
L72.10x10D
KAD5512HP-25Q48 (Note 2)
KAD5512HP-25 Q48EP-I
250
-40 to +85
48 Ld QFN
L48.7x7E
KAD5512HP-21Q48 (Note 2)
KAD5512HP-21 Q48EP-I
210
-40 to +85
48 Ld QFN
L48.7x7E
KAD5512HP-17Q48 (Note 2)
KAD5512HP-17 Q48EP-I
170
-40 to +85
48 Ld QFN
L48.7x7E
KAD5512HP-12Q48 (Note 2)
KAD5512HP-12 Q48EP-I
125
-40 to +85
48 Ld QFN
L48.7x7E
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu
plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products
are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD020
2
FN6808.3
October 1, 2009
KAD5512HP
Table of Contents
Absolute Maximum Ratings ......................................... 4
Serial Peripheral Interface ........................................... 22
Thermal Information...................................................... 4
SPI Physical Interface................................................
SPI Configuration.......................................................
Device Information .....................................................
Indexed Device Configuration/Control .......................
Global Device Configuration/Control..........................
Device Test ................................................................
SPI Memory Map .......................................................
Operating Conditions.................................................... 4
Electrical Specifications ............................................... 4
Digital Specifications .................................................... 6
Timing Diagrams ........................................................... 7
Switching Specifications .............................................. 8
Pinout/Package Information......................................... 9
Pin Descriptions - 72QFN...........................................
Pinout .........................................................................
Pin Descriptions - 48QFN...........................................
Pinout .........................................................................
9
11
12
13
Typical Performance Curves ........................................ 14
Theory of Operation ...................................................... 17
Functional Description ................................................
Power-On Calibration .................................................
User-Initiated Reset....................................................
Analog Input ...............................................................
Clock Input .................................................................
Jitter............................................................................
Voltage Reference......................................................
Digital Outputs ............................................................
Over-Range Indicator .................................................
Power Dissipation.......................................................
Nap/Sleep...................................................................
Data Format ...............................................................
3
17
17
18
18
19
20
20
20
20
20
21
21
23
24
24
24
25
27
28
Equivalent Circuits ....................................................... 29
72 Pin/48 Pin Package Options ................................... 30
ADC Evaluation Platform ............................................. 31
Layout Considerations................................................. 31
Split Ground and Power Planes.................................
Clock Input Considerations ........................................
Exposed Paddle.........................................................
Bypass and Filtering ..................................................
LVDS Outputs ............................................................
LVCMOS Outputs ......................................................
Unused Inputs............................................................
31
31
31
31
31
31
31
Definitions ..................................................................... 31
Revision History ........................................................... 32
Package Outline Drawings........................................... 33
L48.7x7E.................................................................... . 33
L72.10x10D................................................................ . 34
FN6808.3
October 1, 2009
KAD5512HP
Absolute Maximum Ratings
Thermal Information
AVDD to AVSS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to 2.1V
OVDD to OVSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to 2.1V
AVSS to OVSS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 0.3V
Analog Inputs to AVSS. . . . . . . . . . . . . . . . . . -0.4V to AVDD + 0.3V
Clock Inputs to AVSS. . . . . . . . . . . . . . . . . . . -0.4V to AVDD + 0.3V
Logic Inputs to AVSS . . . . . . . . . . . . . . . . . . . -0.4V to OVDD + 0.3V
Logic Inputs to OVSS. . . . . . . . . . . . . . . . . . . -0.4V to OVDD + 0.3V
Thermal Resistance (Typical, Note 3)
θJA (°C/W)
48 Ld QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
25
72 Ld QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
3. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
Electrical Specifications All specifications apply under the following conditions unless otherwise noted: AVDD = 1.8V, OVDD = 1.8V,
TA = -40°C to +85°C (typical specifications at +25°C), AIN = -1dBFS, fSAMPLE = Maximum Conversion Rate
(per speed grade).
KAD5512HP-25
(Note 4)
PARAMETER
SYMBOL
CONDITIONS
KAD5512HP-21
(Note 4)
KAD5512HP-17
(Note 4)
KAD5512HP-12
(Note 4)
MIN
TYP
MAX MIN
TYP
MAX MIN
TYP
MAX MIN
TYP
MAX UNITS
1.40
1.47
1.54 1.40
1.47
1.54 1.40
1.47
1.54 1.40
1.47
1.54
DC SPECIFICATIONS
Analog Input
Full-Scale Analog
Input Range
VFS
Differential
Input Resistance
RIN
Differential
500
500
500
500
Ω
Input Capacitance
CIN
Differential
2.6
2.6
2.6
2.6
pF
Full Scale Range
Temp. Drift
AVTC
Full Temp
90
90
90
90
ppm/°C
Input Offset Voltage
VOS
Gain Error
-10
±2
10
-10
±2
10
-10
±2
10
-10
±2
10
VP-P
mV
EG
±2
±2
±2
±2
%
VCM
0.535
0.535
0.535
0.535
V
Inputs Common
Mode Voltage
0.9
0.9
0.9
0.9
V
CLKP,CLKN Input
Swing
1.8
1.8
1.8
1.8
V
Common-Mode
Output Voltage
Clock Inputs
Power Requirements
1.8V Analog Supply
Voltage
AVDD
1.7
1.8
1.9
1.7
1.8
1.9
1.7
1.8
1.9
1.7
1.8
1.9
V
1.8V Digital Supply
Voltage
OVDD
1.7
1.8
1.9
1.7
1.8
1.9
1.7
1.8
1.9
1.7
1.8
1.9
V
1.8V Analog Supply
Current
IAVDD
170
180
157
166
145
153
129
137
mA
1.8V Digital Supply
Current (SDR)
(Note 5)
IOVDD
68
76
66
74
64
72
62
70
mA
3mA LVDS
4
FN6808.3
October 1, 2009
KAD5512HP
Electrical Specifications All specifications apply under the following conditions unless otherwise noted: AVDD = 1.8V, OVDD = 1.8V,
TA = -40°C to +85°C (typical specifications at +25°C), AIN = -1dBFS, fSAMPLE = Maximum Conversion Rate
(per speed grade). (Continued)
KAD5512HP-25
(Note 4)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
KAD5512HP-21
(Note 4)
MAX MIN
TYP
KAD5512HP-17
(Note 4)
MAX MIN
TYP
KAD5512HP-12
(Note 4)
MAX MIN
TYP
MAX UNITS
1.8V Digital Supply
Current (DDR)
(Note 5)
IOVDD
3mA LVDS
46
44
43
42
mA
Power Supply
Rejection Ratio
PSRR
30MHz, 200mVP-P
signal on AVDD
-36
-36
-36
-36
dB
Total Power Dissipation
Normal Mode (SDR)
PD
3mA LVDS
429
Normal Mode (DDR)
PD
3mA LVDS
390
Nap Mode
PD
Sleep Mode
PD
463
402
433
378
363
406
345
339
376
309
mW
mW
148
163
142
157
136
151
129
143
mW
CSB at logic high
2
6
2
6
2
6
2
6
mW
Nap Mode Wakeup
Time (Note 6)
Sample Clock
Running
1
1
1
1
µs
Sleep Mode Wakeup
Time (Note 6)
Sample Clock
Running
1
1
1
1
ms
AC SPECIFICATIONS
Differential
Nonlinearity
DNL
-0.75
±0.2
0.75 -0.75
±0.2
0.75 -0.75
±0.2
0.75 -0.75
±0.2
0.75
LSB
Integral Nonlinearity
INL
-2.0
±0.6
2.0
±1.1
2.0
±1.1
2.0
±1.4
2.5
LSB
Minimum Conversion
Rate (Note 7)
fS MIN
40
MSPS
Maximum
Conversion Rate
fS MAX
Signal-to-Noise Ratio
SNR
40
250
fIN = 10MHz
fIN = 105MHz
Signal-to-Noise and
Distortion
Effective Number of
Bits
SINAD
40
210
68.3
65.9
68.2
-2.0
40
170
68.8
66.4
68.7
-2.5
125
69.1
67.1
68.9
67.1
MSPS
69.3
dBFS
69.1
dBFS
fIN = 190MHz
67.8
68.3
68.6
68.7
dBFS
fIN = 364MHz
66.8
67.3
67.8
67.7
dBFS
fIN = 695MHz
64.4
64.9
65.7
65.2
dBFS
fIN = 995MHz
62.4
62.9
63.8
63.1
dBFS
fIN = 10MHz
68.2
68.7
69.0
69.2
dBFS
68.9
dBFS
fIN = 105MHz
ENOB
-2.0
65.6
68.0
66.1
68.7
66.6
68.7
66.6
fIN = 190MHz
67.5
68.0
68.2
68.4
dBFS
fIN = 364MHz
66.0
66.4
66.7
66.8
dBFS
fIN = 695MHz
59.1
59.1
60.0
59.8
dBFS
fIN = 995MHz
48.6
48.2
49.2
50.5
dBFS
fIN = 10MHz
11.0
11.1
11.2
11.2
Bits
11.1
Bits
fIN = 105MHz
10.6
11.0
10.7
11.1
10.8
11.1
10.8
fIN = 190MHz
10.9
11.0
11.0
11.1
Bits
fIN = 364MHz
10.7
10.7
10.8
10.8
Bits
fIN = 695MHz
9.5
9.5
9.7
9.6
Bits
fIN = 995MHz
7.8
7.7
7.9
8.1
Bits
5
FN6808.3
October 1, 2009
KAD5512HP
Electrical Specifications All specifications apply under the following conditions unless otherwise noted: AVDD = 1.8V, OVDD = 1.8V,
TA = -40°C to +85°C (typical specifications at +25°C), AIN = -1dBFS, fSAMPLE = Maximum Conversion Rate
(per speed grade). (Continued)
KAD5512HP-25
(Note 4)
PARAMETER
SYMBOL
Spurious-Free
Dynamic Range
Intermodulation
Distortion
SFDR
CONDITIONS
fIN = 10MHz
fIN = 105MHz
IMD
MIN
TYP
KAD5512HP-21
(Note 4)
MAX MIN
86.4
70
81.1
TYP
KAD5512HP-17
(Note 4)
MAX MIN
TYP
87.2
70
85.5
KAD5512HP-12
(Note 4)
MAX MIN
87.3
70
82.0
70
TYP
MAX UNITS
84.9
dBc
81.7
dBc
fIN = 190MHz
79.6
80.0
79.2
80.3
dBc
fIN = 364MHz
75.0
75.6
75.1
75.5
dBc
fIN = 695MHz
60.8
60.0
61.3
61.6
dBc
fIN = 995MHz
48.3
47.9
48.7
50.2
dBc
fIN = 70MHz
-89.0
-92.2
-94.6
-94.8
dBFS
fIN = 170MHz
-91.4
-86.9
-91.7
-85.7
dBFS
10-12
10-12
10-12
950
950
950
Word Error Rate
WER
10-12
Full Power Bandwidth
FPBW
950
MHz
NOTES:
4. Parameters with MIN and/or MAX limits are 100% production tested at their worst case temperature extreme (+85°C).
5. Digital Supply Current is dependent upon the capacitive loading of the digital outputs. IOVDD specifications apply for 10pF load on each digital
output.
6. See Nap/Sleep Mode description on page 21 for more detail.
7. The DLL Range setting must be changed for low speed operation. See Table 14 on page 26.
Digital Specifications
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
0
1
10
µA
-25
-12
-5
µA
INPUTS
Input Current High
(SDIO,RESETN)
IIH
VIN = 1.8V
Input Current Low
(SDIO,RESETN)
IIL
VIN = 0V
Input Voltage High (SDIO,
RESETN)
VIH
Input Voltage Low (SDIO,
RESETN)
VIL
Input Current High (OUTMODE,
NAPSLP, CLKDIV, OUTFMT)
(Note 8)
IIH
15
Input Current Low (OUTMODE,
NAPSLP, CLKDIV, OUTFMT)
IIL
-40
Input Capacitance
CDI
6
1.17
V
.63
V
25
40
µA
25
-15
µA
3
pF
FN6808.3
October 1, 2009
KAD5512HP
Digital Specifications (Continued)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
LVDS OUTPUTS
Differential Output Voltage
Output Offset Voltage
VT
3mA Mode
VOS
3mA Mode
620
950
mVP-P
965
980
mV
Output Rise Time
tR
500
ps
Output Fall Time
tF
500
ps
OVDD - 0.1
V
CMOS OUTPUTS
Voltage Output High
VOH
IOH = -500µA
Voltage Output Low
VOL
IOL = 1mA
OVDD - 0.3
0.1
0.3
V
Output Rise Time
tR
1.8
ns
Output Fall Time
tF
1.4
ns
Timing Diagrams
SAMPLE N
SAMPLE N
INP
INP
INN
INN
tA
tA
CLKN
CLKP
tCPD
CLKN
CLKP
LATENCY = L CYCLES
tCPD
CLKOUTN
CLKOUTP
CLKOUTN
CLKOUTP
tDC
tDC
tPD
D[10/8/6/4/2/0]P
ODD BITS EVEN BITS ODD BITS EVEN BITS ODD BITS EVEN BITS
N-L
N-L
N-L + 1
N-L + 1
N-L + 2
N-L + 2
D[10/8/6/4/2/0]N
LATENCY = L CYCLES
EVEN BITS
N
tPD
D[11/0]P
D[11/0]N
DATA
N-L
FIGURE 1A. DDR
DATA
N-L + 1
DATA
N
FIGURE 1B. SDR
FIGURE 1. LVDS TIMING DIAGRAMS (See “Digital Outputs” on page 20
SAMPLE N
SAMPLE N
INP
INP
INN
INN
tA
tA
CLKN
CLKP
CLKN
CLKP
tCPD
LATENCY = L CYCLES
tCPD
CLKOUT
CLKOUT
tDC
tDC
tPD
D[10/8/6/4/2/0]
LATENCY = L CYCLES
ODD BITS
N-L
EVEN BITS ODD BITS
N-L
N-L + 1
EVEN BITS ODD BITS EVEN BITS
N-L + 1
N-L + 2
N-L + 2
FIGURE 2A. DDR
EVEN BITS
N
tPD
D[11/0]
DATA
N-L
DATA
N-L + 1
DATA
N
FIGURE 2B. SDR
FIGURE 2. CMOS TIMING DIAGRAM (See “Digital Outputs” on page 20
7
FN6808.3
October 1, 2009
KAD5512HP
Switching Specifications
PARAMETER
CONDITION
SYMBOL
MIN
TYP
MAX
UNITS
ADC OUTPUT
Aperture Delay
tA
375
ps
RMS Aperture Jitter
jA
60
fs
Output Clock to Data Propagation Delay,
LVDS Mode
(Note 9)
Output Clock to Data Propagation Delay,
CMOS Mode
(Note 9)
DDR Rising Edge
tDC
-260
-50
120
ps
DDR Falling Edge
tDC
-160
10
230
ps
SDR Falling Edge
tDC
-260
-40
230
ps
DDR Rising Edge
tDC
-220
-10
200
ps
DDR Falling Edge
tDC
-310
-90
110
ps
SDR Falling Edge
tDC
-310
-50
200
ps
Latency (Pipeline Delay)
Overvoltage Recovery
L
8.5
cycles
tOVR
1
cycles
SPI INTERFACE (Notes 10, 11)
SCLK Period
Write Operation
t
CLK
16
cycles
(Note 10)
Read Operation
tCLK
66
cycles
SCLK Duty Cycle (tHI/tCLK or tLO/tCLK)
Read or Write
CSB↓ to SCLK↑ Setup Time
Read or Write
tS
1
cycles
CSB↑ after SCLK↑ Hold Time
Read or Write
tH
3
cycles
Data Valid to SCLK↑ Setup Time
Write
tDSW
1
cycles
Data Valid after SCLK↑ Hold Time
Write
tDHW
3
cycles
Data Valid after SCLK↓ Time
Read
tDVR
Data Invalid after SCLK↑ Time
Read
tDHR
3
cycles
Sleep Mode CSB↓ to SCLK↑ Setup Time
(Note 12)
Read or Write in Sleep Mode
tS
150
µs
25
50
75
16.5
%
cycles
NOTES:
8. The Tri-Level Inputs internal switching thresholds are approximately 0.43V and 1.34V. It is advised to float the inputs, tie to ground or AVDD
depending on desired function.
9. The input clock to output clock delay is a function of sample rate, using the output clock to latch the data simplifies data capture for most
applications. Contact factory for more info if needed.
10. SPI Interface timing is directly proportional to the ADC sample period (tS). Values above reflect multiples of a 4ns sample period, and must be
scaled proportionally for lower sample rates.
11. The SPI may operate asynchronously with respect to the ADC sample clock
12. The CSB setup time increases in sleep mode due to the reduced power state, CSB setup time in Nap mode is equal to normal mode CSB setup
time (4ns min).
8
FN6808.3
October 1, 2009
KAD5512HP
Pinout/Package Information
Pin Descriptions - 72QFN
LVDS [LVCMOS] FUNCTION
SDR MODE
PIN NUMBER
LVDS [LVCMOS] NAME
1, 6, 12, 19, 24, 71
AVDD
1.8V Analog Supply
2-5, 13, 14, 17, 18, 28-31
DNC
Do Not Connect
7, 8, 11, 72
AVSS
Analog Ground
9, 10
VINN, VINP
15
VCM
16
CLKDIV
20, 21
CLKP, CLKN
Clock Input True, Complement
22
OUTMODE
Output Mode (LVDS, LVCMOS)
23
NAPSLP
Power Control (Nap, Sleep modes)
25
RESETN
Power On Reset (Active Low, see “User-Initiated
Reset” on page 18)
26, 45, 55, 65
OVSS
Output Ground
27, 36, 56
OVDD
1.8V Output Supply
32
D0N
[NC]
LVDS Bit 0 (LSB) Output Complement
[NC in LVCMOS]
DDR Logical Bits 1, 0 (LVDS)
33
D0P
[D0]
LVDS Bit 0 (LSB) Output True
[LVCMOS Bit 0]
DDR Logical Bits 1, 0 (LVDS
or CMOS)
34
D1N
[NC]
LVDS Bit 1 Output Complement
[NC in LVCMOS]
NC in DDR
35
D1P
[D1]
LVDS Bit 1 Output True
[LVCMOS Bit 1]
NC in DDR
37
D2N
[NC]
LVDS Bit 2 Output Complement
[NC in LVCMOS]
DDR Logical Bits 3,2 (LVDS)
38
D2P
[D2]
LVDS Bit 2 Output True
[LVCMOS Bit 2]
DDR Logical Bits 3,2 (LVDS
or CMOS)
39
D3N
[NC]
LVDS Bit 3 Output Complement
[NC in LVCMOS]
NC in DDR
40
D3P
[D3]
LVDS Bit 3 Output True
[LVCMOS Bit 3]
NC in DDR
41
D4N
[NC]
LVDS Bit 4 Output Complement
[NC in LVCMOS]
DDR Logical Bits 5,4 (LVDS)
42
D4P
[D4]
LVDS Bit 4 Output True
[LVCMOS Bit 4]
DDR Logical Bits 5,4 (LVDS
or CMOS)
43
D5N
[NC]
LVDS Bit 5 Output Complement
[NC in LVCMOS]
NC in DDR
44
D5P
[D5]
LVDS Bit 5 Output True
[LVCMOS Bit 5]
NC in DDR
9
DDR MODE COMMENTS
Analog Input Negative, Positive
Common Mode Output
Clock Divider Control
FN6808.3
October 1, 2009
KAD5512HP
Pin Descriptions - 72QFN (Continued)
LVDS [LVCMOS] FUNCTION
SDR MODE
PIN NUMBER
LVDS [LVCMOS] NAME
DDR MODE COMMENTS
46
RLVDS
47
CLKOUTN
[NC]
LVDS Clock Output Complement
[NC in LVCMOS]
48
CLKOUTP
[CLKOUT]
LVDS Clock Output True
[LVCMOS CLKOUT]
49
D6N
[NC]
LVDS Bit 6 Output Complement
[NC in LVCMOS]
DDR Logical Bits 7,6 (LVDS)
50
D6P
[D6]
LVDS Bit 6 Output True
[LVCMOS Bit 6]
DDR Logical Bits 7,6 (LVDS
or CMOS)
51
D7N
[NC]
LVDS Bit 7 Output Complement
[NC in LVCMOS]
NC in DDR
52
D7P
[D7]
LVDS Bit 7 Output True
[LVCMOS Bit 7]
NC in DDR
53
D8N
[NC]
LVDS Bit 8 Output Complement
[NC in LVCMOS]
DDR Logical Bits 9, 8 (LVDS)
54
D8P
[D8]
LVDS Bit 8 Output True
[LVCMOS Bit 8]
DDR Logical Bits 9, 8 (LVDS
or CMOS)
57
D9N
[NC]
LVDS Bit 9 Output Complement
[NC in LVCMOS]
NC in DDR
58
D9P
[D9]
LVDS Bit 9 Output True
[LVCMOS Bit 9]
NC in DDR
59
D10N
[NC]
LVDS Bit 10 Output Complement
[NC in LVCMOS]
DDR Logical Bits 11, 10
(LVDS)
60
D10P
[D10]
LVDS Bit 10 Output True
[LVCMOS Bit 10]
DDR Logical Bits 11, 10
(LVDS or CMOS)
61
D11N
[NC]
LVDS Bit 11 Output Complement
[NC in LVCMOS]
NC in DDR
62
D11P
[D11]
LVDS Bit 11 Output True
[LVCMOS Bit 11]
NC in DDR
63
ORN
[NC]
LVDS Over Range Complement
[NC in LVCMOS]
64
ORP
[OR]
LVDS Over Range True
[LVCMOS Over Range]
66
SDO
SPI Serial Data Output (4.7kΩ pull-up to OVDD is
required)
67
CSB
SPI Chip Select (active low)
68
SCLK
SPI Clock
69
SDIO
SPI Serial Data Input/Output
70
OUTFMT
Exposed Paddle
AVSS
LVDS Bias Resistor (connect to OVSS with a 10kΩ,
1% resistor)
Output Data Format (Two’s Comp., Gray Code, Offset
Binary)
Analog Ground
NOTE: LVCMOS Output Mode Functionality is shown in brackets (NC = No Connection), SDR is the default state at
power-up for the 72pin package
10
FN6808.3
October 1, 2009
KAD5512HP
Pinout
AVSS
AVDD
OUTFMT
SDIO
SCLK
CSB
SDO
OVSS
ORP
ORN
D11P
D11N
D10P
D10N
D9P
D9N
OVDD
OVSS
KAD5512HP
(72 LD QFN)
TOP VIEW
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
AVDD
1
54 D8P
DNC
2
53 D8N
DNC
3
52 D7P
DNC
4
51 D7N
DNC
5
50 D6P
AVDD
6
49 D6N
AVSS
7
48 CLKOUTP
AVSS
8
47 CLKOUTN
VINN
9
46 RLVDS
VINP
10
45 OVSS
AVSS
11
44 D5P
AVDD
12
43 D5N
DNC
13
42 D4P
DNC
14
41 D4N
VCM
15
40 D3P
CLKDIV
16
39 D3N
DNC
17
DNC
18
38 D2P
Connect Thermal Pad to AVSS
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
CLKN
OUTMODE
NAPSLP
AVDD
RESETN
OVSS
OVDD
DNC
DNC
DNC
DNC
D0N
D0P
D1N
D1P
OVDD
AVDD
19
CLKP
37 D2N
11
FN6808.3
October 1, 2009
KAD5512HP
Pin Descriptions - 48QFN
PIN NUMBER
LVDS [LVCMOS] NAME
1, 9, 13, 17, 47
AVDD
1.8V Analog Supply
2-4, 11, 21, 22
DNC
Do Not Connect
5, 8, 12, 48
AVSS
Analog Ground
6, 7
VINN, VINP
10
VCM
14, 15
CLKP, CLKN
16
NAPSLP
Power Control (Nap, Sleep modes)
18
RESETN
Power On Reset (Active Low, see “User-Initiated Reset” on page 18)
19, 29, 42
OVSS
Output Ground
20, 37
OVDD
1.8V Output Supply
23
D0N
[NC]
LVDS DDR Logical Bits 1, 0 Output Complement
[NC in LVCMOS]
24
D0P
[D0]
LVDS DDR Logical Bits 1, 0 Output True
[CMOS DDR Logical Bits 1, 0 in LVCMOS]
25
D1N
[NC]
LVDS DDR Logical Bits 3, 2 Output Complement
[NC in LVCMOS]
26
D1P
[D1]
LVDS DDR Logical Bits 3, 2 Output True
[CMOS DDR Logical Bits 3, 2 in LVCMOS]
27
D2N
[NC]
LVDS DDR Logical Bits 5, 4 Output Complement
[NC in LVCMOS]
28
D2P
[D2]
LVDS DDR Logical Bits 5, 4 Output True
[CMOS DDR Logical Bits 5, 4 in LVCMOS]
30
RLVDS
31
CLKOUTN
[NC]
LVDS Clock Output Complement
[NC in LVCMOS]
32
CLKOUTP
[CLKOUT]
LVDS Clock Output True
[LVCMOS CLKOUT]
33
D3N
[NC]
LVDS DDR Logical Bits 7, 6 Output Complement
[NC in LVCMOS]
34
D3P
[D3]
LVDS DDR Logical Bits 7, 6 Output True
[CMOS DDR Logical Bits 7, 6 in LVCMOS]
35
D4N
[NC]
LVDS DDR Logical Bits 9, 8 Output Complement
[NC in LVCMOS]
36
D4P
[D4]
LVDS DDR Logical Bits 9, 8 Output True
[CMOS DDR Logical Bits 9, 8 in LVCMOS]
38
D5N
[NC]
LVDS DDR Logical Bits 11, 10 Output Complement
[NC in LVCMOS]
39
D5P
[D5]
LVDS DDR Logical Bits 11, 10 Output True
[CMOS DDR Logical Bits 11, 10 in LVCMOS]
40
ORN
[NC]
LVDS Over Range Complement
[NC in LVCMOS]
41
ORP
[OR]
LVDS Over Range True
[LVCMOS Over Range]
12
LVDS [LVCMOS] FUNCTION
Analog Input Negative, Positive
Common Mode Output
Clock Input True, Complement
LVDS Bias Resistor (connect to OVSS with a 10kΩ, 1% resistor)
FN6808.3
October 1, 2009
KAD5512HP
Pin Descriptions - 48QFN (Continued)
PIN NUMBER
LVDS [LVCMOS] NAME
LVDS [LVCMOS] FUNCTION
43
SDO
SPI Serial Data Output (4.7kΩ pull-up to OVDD is required)
44
CSB
SPI Chip Select (active low)
45
SCLK
SPI Clock
46
SDIO
SPI Serial Data Input/Output
Exposed Paddle
AVSS
Analog Ground
NOTE: LVCMOS Output Mode Functionality is shown in brackets (NC = No Connection)
Pinout
AVSS
AVDD
SDIO
SCLK
CSB
SDO
OVSS
ORP
ORN
D5P
D5N
OVDD
KAD5512HP
(48 LD QFN)
TOP VIEW
48
47
46
45
44
43
42
41
40
39
38
37
AVDD
1
36 D4P
DNC
2
35 D4N
DNC
3
34 D3P
DNC
4
33 D3N
AVSS
5
32 CLKOUTP
VINN
6
31 CLKOUTN
VINP
7
30 RLVDS
AVSS
8
29 OVSS
AVDD
9
28 D2P
VCM
10
27 D2N
DNC
11
AVSS
12
13
Connect Thermal Pad to AVSS
26 D1P
13
14
15
16
17
18
19
20
21
22
23
24
AVDD
CLKP
CLKN
NAPSLP
AVDD
RESETN
OVSS
OVDD
DNC
DNC
D0N
D0P
25 D1N
FN6808.3
October 1, 2009
KAD5512HP
Typical Performance Curves
All Typical Performance Characteristics apply under the following conditions unless otherwise
noted: AVDD = OVDD = 1.8V, TA = +25°C, AIN = -1dBFS, fIN = 105MHz, fSAMPLE = Maximum
Conversion Rate (per speed grade).
-50
HD2 AND HD3 MAGNITUDE (dBc)
SNR (dBFS) AND SFDR (dBc)
90
SFDR @ 250MSPS
85
80
SFDR @ 125MSPS
75
SNR @ 125MSPS
70
65
60
SNR @ 250MSPS
55
50
0M
200M
400M
600M
800M
HD3 @ 250MSPS
-55
HD3 @ 125MSPS
-60
-65
-70
-75
-80
HD2 @ 250MSPS
-85
HD2 @ 125MSPS
-90
-95
-100
0M
1G
200M
INPUT FREQUENCY (Hz)
-20
90
-30
SNR AND SFDR
HD2 AND HD3 MAGNITUDE
100
SFDRFS (dBFS)
70
60
SNRFS (dBFS)
50
SFDR (dBc)
40
SNR (dBc)
30
20
-60
-20
-10
0
HD3 (dBFS)
-60
-50
-40
-30
-20
INPUT AMPLITUDE (dBFS)
FIGURE 6. HD2 AND HD3 vs AIN
FIGURE 5. SNR AND SFDR vs AIN
95
-60
HD2 AND HD3 MAGNITUDE (dBc)
SNR (dBFS) AND SFDR (dBc)
0
-90
-100
INPUT AMPLITUDE (dBFS)
90
SFDR
85
80
75
SNR
70
65
60
40
-10
HD2 (dBFS)
-80
-110
-30
HD3 (dBc)
-70
-120
-40
HD2 (dBc)
-50
0
-50
1G
-40
10
-60
800M
FIGURE 4. HD2 AND HD3 vs fIN
FIGURE 3. SNR AND SFDR vs fIN
80
400M
600M
INPUT FREQUENCY (Hz)
70
100
130
160
190
220
SAMPLE RATE (MSPS)
FIGURE 7. SNR AND SFDR vs fSAMPLE
14
250
-70
HD3
-80
-90
HD2
-100
-110
-120
40
70
100
130
160
190
220
250
SAMPLE RATE (MSPS)
FIGURE 8. HD2 AND HD3 vs fSAMPLE
FN6808.3
October 1, 2009
KAD5512HP
Typical Performance Curves
All Typical Performance Characteristics apply under the following conditions unless otherwise
noted: AVDD = OVDD = 1.8V, TA = +25°C, AIN = -1dBFS, fIN = 105MHz, fSAMPLE = Maximum
Conversion Rate (per speed grade). (Continued)
450
0.5
0.4
0.3
SDR
350
0.2
DNL (LSBs)
TOTAL POWER (mW)
400
DDR
300
250
0.1
0.0
-0.1
-0.2
200
-0.3
150
-0.4
100
40
70
100
130
160
190
220
-0.5
250
0
512
1024
1536
SAMPLE RATE (MSPS)
1.0
SNR (dBFS) AND SFDR (dBc)
0.6
0.4
INL (LSBs)
3072
3584
4096
90
0.8
0.2
0.0
-0.2
-0.4
-0.6
-0.8
0
512
1024
1536
2048
2560
3072
3584
85
SFDR
80
75
70
SNR
65
60
55
50
300
4096
400
CODE
FIGURE 11. INTEGRAL NONLINEARITY
0
800
Ain = -1.0 dBFS
SNR = 68.2 dBFS
SFDR = 91.9 dBc
SINAD = 68.2 dBFS
-20
AMPLITUDE (dBFS)
600000
450000
300000
150000
0
2050
500
600
700
INPUT COMMON MODE (mV)
FIGURE 12. SNR AND SFDR vs VCM
750000
NUMBER OF HITS
2560
FIGURE 10. DIFFERENTIAL NONLINEARITY
FIGURE 9. POWER vs fSAMPLE IN 3mA LVDS MODE
-1.0
2048
CODE
-40
-60
-80
-100
-120
2051
2052
2053
CODE
2054
FIGURE 13. NOISE HISTOGRAM
15
2055
2056
0M
20M
40M
60M
80M
FREQUENCY (Hz)
100M
120M
FIGURE 14. SINGLE-TONE SPECTRUM @ 10MHz
FN6808.3
October 1, 2009
KAD5512HP
Typical Performance Curves
All Typical Performance Characteristics apply under the following conditions unless otherwise
noted: AVDD = OVDD = 1.8V, TA = +25°C, AIN = -1dBFS, fIN = 105MHz, fSAMPLE = Maximum
Conversion Rate (per speed grade). (Continued)
0
Ain = -1.0dBFS
SNR = 68.0dBFS
-20 SFDR = 82.6dBc
SINAD = 67.8dBFS
-20
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
0
-40
-60
-80
Ain = -1.0dBFS
SNR = 67.3dBFS
SFDR = 77.2dBc
SINAD = 66.8dBFS
-40
-60
-80
-100
-100
-120
0M
20M
40M
60M
80M
100M
-120
120M
0M
20M
40M
0
120M
-40
-60
-80
Ain = -1.0dBFS
SNR = 59.9dBFS
SFDR = 47.0dBc
SINAD = 47.4dBFS
-20
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
100M
0
Ain = -1.0dBFS
SNR = 64.5dBFS
SFDR = 69.2dBc
SINAD = 63.4dBFS
-20
-100
-40
-60
-80
-100
-120
0M
20M
40M
60M
80M
FREQUENCY (Hz)
100M
-120
0M
120M
FIGURE 17. SINGLE-TONE SPECTRUM @ 495MHz
0
IMD = -89.0dBFS
AMPLITUDE (dBFS)
-20
-40
-60
-80
20M
40M
60M
80M
FREQUENCY (Hz)
100M
120M
FIGURE 18. SINGLE-TONE SPECTRUM @ 995MHz
0
AMPLITUDE (dBFS)
80M
FIGURE 16. SINGLE-TONE SPECTRUM @ 190MHz
FIGURE 15. SINGLE-TONE SPECTRUM @ 105MHz
IMD = -91.4dBFS
-20
-40
-60
-80
-100
-100
-120
60M
FREQUENCY (Hz)
FREQUENCY (Hz)
0M
20M
40M
60M
80M
FREQUENCY (Hz)
100M
FIGURE 19. TWO-TONE SPECTRUM @ 70MHz
16
120M
-120
0M
20M
40M
60M
80M
FREQUENCY (Hz)
100M
120M
FIGURE 20. TWO-TONE SPECTRUM @ 170MHz
FN6808.3
October 1, 2009
KAD5512HP
Theory of Operation
Functional Description
The KAD5512HP is based upon a 12-bit, 250MSPS A/D
converter core that utilizes a pipelined successive
approximation architecture (Figure 21). The input voltage is
captured by a Sample-Hold Amplifier (SHA) and converted
to a unit of charge. Proprietary charge-domain techniques
are used to successively compare the input to a series of
reference charges. Decisions made during the successive
approximation operations determine the digital code for each
input value. The converter pipeline requires six samples to
produce a result. Digital error correction is also applied,
resulting in a total latency of eight and one half clock cycles.
This is evident to the user as a time lag between the start of
a conversion and the data being available on the digital
outputs.
The KAD5512HP family offers 2.5dB improvement in SNR
over the KAD5512P by simultaneously sampling the input
signal with two ADC cores in parallel and summing the digital
result. Since the input signal is correlated between the two
cores and noise is not, an increase in SNR is achieved. As a
result of this architecture, indexed SPI operations must be
executed on each core in series. Refer to “Indexed Device
Configuration/Control” on page 24 for more details.
Power-On Calibration
ramps and initiates the calibration when the analog and
digital supply voltages are above a threshold. The following
conditions must be adhered to for the power-on calibration to
execute successfully:
• A frequency-stable conversion clock must be applied to
the CLKP/CLKN pins
• DNC pins (especially 3, 4 and 18) must not be pulled up or
down
• SDO (pin 66) must be high
• RESETN (pin 25) must begin low
• SPI communications must not be attempted
A user-initiated reset can subsequently be invoked in the
event that the previous conditions cannot be met at
power-up.
The SDO pin requires an external 4.7kΩ pull-up to OVDD. If
the SDO pin is pulled low externally during power-up,
calibration will not be executed properly.
After the power supply has stabilized the internal POR
releases RESETN and an internal pull-up pulls it high, which
starts the calibration sequence. If a subsequent
user-initiated reset is required, the RESETN pin should be
connected to an open-drain driver with a drive strength of
less than 0.5mA.
The ADC performs a self-calibration at start-up. An internal
power-on-reset (POR) circuit detects the supply voltage
CLOCK
GENERATION
INP
SHA
2.5-BIT
FLASH
6-STAGE
1.5-BIT/STAGE
3-STAGE
1-BIT/STAGE
3-BIT
FLASH
INN
1.25V
+
–
DIGITAL
ERROR
CORRECTION
LVDS/LVCMOS
OUTPUTS
FIGURE 21. ADC CORE BLOCK DIAGRAM
17
FN6808.3
October 1, 2009
KAD5512HP
While RESETN is low, the output clock (CLKOUTP/CLKOUTN)
is set low. Normal operation of the output clock resumes at the
next input clock edge (CLKP/CLKN) after RESETN is
de-asserted. At 250MSPS the nominal calibration time is
200ms, while the maximum calibration time is 550ms.
CLKN
CLKP
+25°C, and +85°C. Each plot shows the variation of
SNR/SFDR across temperature after a single calibration at
-40°C, +25°C and +85°C. Best performance is typically
achieved by calibration at the operating conditions as stated
earlier but it can be seen that performance drift with
temperature is not a very strong function of the temperature
at which the calibration is performed. Full-rated performance
will be achieved after power-up calibration regardless of the
operating conditions.
3
SNR CHANGE (dBfs)
The calibration sequence is initiated on the rising edge of
RESETN, as shown in Figure 22. The over-range output
(OR) is set high once RESETN is pulled low, and remains in
that state until calibration is complete. The OR output returns
to normal operation at that time, so it is important that the
analog input be within the converter’s full-scale range to
observe the transition. If the input is in an over-range
condition the OR pin will stay high, and it will not be possible
to detect the end of the calibration cycle.
CAL DONE AT
+85°C
2
1
0
-1
-2
CALIBRATION
TIME
-3
-4
-40
RESETN
CAL DONE AT
+25°C
CAL DONE AT
-40°C
-15
10
35
60
85
TEMPERATURE (°C)
CALIBRATION
BEGINS
FIGURE 23. SNR PERFORMANCE vs TEMPERATURE
ORP
CALIBRATION
COMPLETE
15
FIGURE 22. CALIBRATION TIMING
User-Initiated Reset
Recalibration of the ADC can be initiated at any time by
driving the RESETN pin low for a minimum of one clock
cycle. An open-drain driver with a drive strength of less than
0.5mA is recommended, RESETN has an internal high
impedance pull-up to OVDD. As is the case during power-on
reset, the SDO, RESETN and DNC pins must be in the
proper state for the calibration to successfully execute.
The performance of the KAD5512HP changes with
variations in temperature, supply voltage or sample rate. The
extent of these changes may necessitate recalibration,
depending on system performance requirements. Best
performance will be achieved by recalibrating the ADC under
the environmental conditions at which it will operate.
SFDR CHANGE (dBc)
CLKOUTP
10
CAL DONE AT
-40°C
5
0
-5
CAL DONE AT
+85°C
-10
-15
-40
-15
10
35
TEMPERATURE (°C)
CAL DONE AT
+25°C
60
85
FIGURE 24. SFDR PERFORMANCE vs TEMPERATURE
Analog Input
A single fully differential input (VINP/VINN) connects to the
sample and hold amplifier (SHA) of each unit ADC. The ideal
A supply voltage variation of <100mV will generally result in
an SNR change of less than 0.5dBFS and SFDR change of
less than 3dBc.
In situations where the sample rate is not constant, best
results will be obtained if the device is calibrated at the
highest sample rate. Reducing the sample rate by less than
80MSPS will typically result in an SNR change of less than
0.5dBFS and an SFDR change of less than 3dBc.
Figures 23 and 24 show the effect of temperature on SNR
and SFDR performance with calibration performed at -40°C,
18
FN6808.3
October 1, 2009
KAD5512HP
full-scale input voltage is 1.45V, centered at the VCM voltage
of 0.535V as shown in Figure 25.
transformer and low shunt resistance are recommended for
optimal performance.
Ω
348O
1.8
Ω
69.8O
1.4
1.0
Ω
25O
Ω
100O
INN
INP
0.725V
VCM
0.6
CM
VCM
25O
Ω
Ω
69.8O
Ω
49.9O
0.2
Ω
348O
Best performance is obtained when the analog inputs are
driven differentially. The common-mode output voltage,
VCM, should be used to properly bias the inputs as shown in
Figures 26 through 28. An RF transformer will give the best
noise and distortion performance for wideband and/or high
intermediate frequency (IF) inputs. Two different transformer
input schemes are shown in Figures 26 and 27.
ADT1-1WT
1000pF
0.1µF
FIGURE 28. DIFFERENTIAL AMPLIFIER INPUT
FIGURE 25. ANALOG INPUT RANGE
ADT1-1WT
KAD5512HP
Ω
100O
0.22µF
0.535V
217O
Ω
KAD5512HP
VCM
0.1µF
A differential amplifier, as shown in Figure 28, can be used in
applications that require DC-coupling. In this configuration
the amplifier will typically dominate the achievable SNR and
distortion performance.
Clock Input
The clock input circuit is a differential pair (see Figure 42).
Driving these inputs with a high level (up to 1.8VP-P on each
input) sine or square wave will provide the lowest jitter
performance. A transformer with 4:1 impedance ratio will
provide increased drive levels.
The recommended drive circuit is shown in Figure 29. A duty
range of 40% to 60% is acceptable. The clock can be driven
single-ended, but this will reduce the edge rate and may
impact SNR performance. The clock inputs are internally
self-biased to AVDD/2 to facilitate AC-coupling.
Ω
1kO
FIGURE 26. TRANSFORMER INPUT FOR GENERAL
PURPOSE APPLICATIONS
Ω
1kO
AVDD
200pF
TC4-1W
ADTL1-12
ADTL1-12
1000pF
200pF
0.1µF
1000pF
CLKP
Ω
200O
KAD5512HP
1000pF
VCM
CLKN
200pF
FIGURE 27. TRANSMISSION-LINE TRANSFORMER INPUT
FOR HIGH IF APPLICATIONS
This dual transformer scheme is used to improve commonmode rejection, which keeps the common-mode level of the
input matched to VCM. The value of the shunt resistor
should be determined based on the desired load impedance.
The differential input resistance of the KAD5512HP is 500Ω.
The SHA design uses a switched capacitor input stage (see
Figure 41), which creates current spikes when the sampling
capacitance is reconnected to the input voltage. This causes
a disturbance at the input which must settle before the next
sampling point. Lower source impedance will result in faster
settling and improved performance. Therefore a 1:1
19
FIGURE 29. RECOMMENDED CLOCK DRIVE
A selectable 2x frequency divider is provided in series with
the clock input. The divider can be used in the 2x mode with
a sample clock equal to twice the desired sample rate. This
allows the use of the Phase Slip feature, which enables
synchronization of multiple ADCs.
TABLE 1. CLKDIV PIN SETTINGS
CLKDIV PIN
DIVIDE RATIO
AVSS
2
Float
1
AVDD
4
FN6808.3
October 1, 2009
KAD5512HP
The clock divider can also be controlled through the SPI
port, which overrides the CLKDIV pin setting. Details on this
are contained in “Serial Peripheral Interface” on page 22.
A delay-locked loop (DLL) generates internal clock signals
for various stages within the charge pipeline. If the frequency
of the input clock changes, the DLL may take up to 52µs to
regain lock at 250MSPS. The lock time is inversely
proportional to the sample rate.
The DLL has two ranges of operation, slow and fast. The
slow range can be used for sample rates between 40MSPS
and 100MSPS, while the default fast range can be used from
80MSPS to the maximum specified sample rate.
Jitter
In a sampled data system, clock jitter directly impacts the
achievable SNR performance. The theoretical relationship
between clock jitter (tJ) and SNR is shown in Equation 1 and
is illustrated in Figure 30.
1
SNR = 20 log 10 ⎛ --------------------⎞
⎝ 2πf t ⎠
(EQ. 1)
IN J
Output data is available as a parallel bus in
LVDS-compatible or CMOS modes. Additionally, the data
can be presented in either double data rate (DDR) or single
data rate (SDR) formats. The even numbered data output
pins are active in DDR mode in the 72 pin package option.
When CLKOUT is low the MSB and all odd logical bits are
output, while on the high phase the LSB and all even logical
bits are presented (this is true in both the 72 pin and 48 pin
package options). Figures 1 and 2 show the timing
relationships for LVDS/CMOS and DDR/SDR modes.
The 48 Ld QFN package option contains six LVDS data
output pin pairs, and therefore can only support DDR mode.
Additionally, the drive current for LVDS mode can be set to a
nominal 3mA or a power-saving 2mA. The lower current
setting can be used in designs where the receiver is in close
physical proximity to the ADC. The applicability of this setting
is dependent upon the PCB layout, therefore the user should
experiment to determine if performance degradation is
observed.
The output mode and LVDS drive current are selected via
the OUTMODE pin as shown in Table 2.
100
95
tj = 0.1ps
90
14 BITS
85
SNR (dB)
Digital Outputs
80
tj = 1ps
75
12 BITS
70
tj = 10ps
65
60
10 BITS
TABLE 2. OUTMODE PIN SETTINGS
OUTMODE PIN
MODE
AVSS
LVCMOS
Float
LVDS, 3mA
AVDD
LVDS, 2mA
tj = 100ps
55
50
1M
10M
100M
INPUT FREQUENCY (Hz)
1G
FIGURE 30. SNR vs CLOCK JITTER
The output mode can also be controlled through the SPI
port, which overrides the OUTMODE pin setting. Details on
this are contained in “Serial Peripheral Interface” on
page 22.
This relationship shows the SNR that would be achieved if
clock jitter were the only non-ideal factor. In reality,
achievable SNR is limited by internal factors such as
linearity, aperture jitter and thermal noise. Internal aperture
jitter is the uncertainty in the sampling instant shown in
Figure 1 on page 7. The internal aperture jitter combines
with the input clock jitter in a root-sum-square fashion, since
they are not statistically correlated, and this determines the
total jitter in the system. The total jitter, combined with other
noise sources, then determines the achievable SNR.
An external resistor creates the bias for the LVDS drivers. A
10kΩ, 1% resistor must be connected from the RLVDS pin to
OVSS.
Voltage Reference
Power Dissipation
A temperature compensated voltage reference provides the
reference charges used in the successive approximation
operations. The full-scale range of each A/D is proportional
to the reference voltage. The voltage reference is internally
bypassed and is not accessible to the user.
The power dissipated by the KAD5512HP is primarily
dependent on the sample rate and the output modes: LVDS
vs CMOS and DDR vs SDR. There is a static bias in the
analog supply, while the remaining power dissipation is
linearly related to the sample rate. The output supply
dissipation changes to a lesser degree in LVDS mode, but is
more strongly related to the clock frequency in CMOS mode.
20
Over-Range Indicator
The over-range (OR) bit is asserted when the output code
reaches positive full-scale (e.g. 0xFFF in offset binary
mode). The output code does not wrap around during an
over-range condition. The OR bit is updated at the sample
rate.
FN6808.3
October 1, 2009
KAD5512HP
Nap/Sleep
Data Format
Portions of the device may be shut down to save power during
times when operation of the ADC is not required. Two power
saving modes are available: Nap, and Sleep. Nap mode
reduces power dissipation to less than 163mW and recovers
to normal operation in approximately 1µs. Sleep mode
reduces power dissipation to less than 6mW but requires
approximately 1ms to recover from a sleep command.
Output data can be presented in three formats: two’s
complement, Gray code and offset binary. The data format is
selected via the OUTFMT pin as shown in Table 4.
Wake-up time from sleep mode is dependent on the state of
CSB; in a typical application CSB would be held high during
sleep, requiring a user to wait 150µs max after CSB is
asserted (brought low) prior to writing ‘001x’ to SPI
Register 25. The device would be fully powered up, in
normal mode 1ms after this command is written.
Wake-up from Sleep Mode Sequence (CSB high)
• Pull CSB Low
• Wait 150us
• Write ‘001x’ to Register 25
• Wait 1ms until ADC fully powered on
In an application where CSB was kept low in sleep mode, the
150µs CSB setup time is not required as the SPI registers are
powered on when CSB is low, the chip power dissipation
increases by ~ 15mW in this case. The 1ms wake-up time
after the write of a ‘001x’ to register 25 still applies. It is
generally recommended to keep CSB high in sleep mode to
avoid any unintentional SPI activity on the ADC.
All digital outputs (Data, CLKOUT and OR) are placed in a
high impedance state during Nap or Sleep. The input clock
should remain running and at a fixed frequency during Nap
or Sleep, and CSB should be high. Recovery time from Nap
mode will increase if the clock is stopped, since the internal
DLL can take up to 52µs to regain lock at 250MSPS.
By default after the device is powered on, the operational
state is controlled by the NAPSLP pin as shown in Table 3.
TABLE 4. OUTFMT PIN SETTINGS
OUTFMT PIN
MODE
AVSS
Offset Binary
Float
Two’s Complement
AVDD
Gray Code
The data format can also be controlled through the SPI port,
which overrides the OUTFMT pin setting. Details on this are
contained in “Serial Peripheral Interface” on page 22.
Offset binary coding maps the most negative input voltage to
code 0x000 (all zeros) and the most positive input to 0xFFF
(all ones). Two’s complement coding simply complements
the MSB of the offset binary representation.
When calculating Gray code, the MSB is unchanged. The
remaining bits are computed as the XOR of the current bit
position and the next most significant bit. Figure 31 shows
this operation.
BINARY
11
10
9
••••
1
0
••••
GRAY CODE
11
10
9
••••
1
0
FIGURE 31. BINARY TO GRAY CODE CONVERSION
Converting back to offset binary from Gray code must be
done recursively, using the result of each bit for the next
lower bit as shown in Figure 32.
TABLE 3. NAPSLP PIN SETTINGS
NAPSLP PIN
MODE
AVSS
Normal
Float
Sleep
AVDD
Nap
The power-down mode can also be controlled through the
SPI port, which overrides the NAPSLP pin setting. Details on
this are contained in “Serial Peripheral Interface” on
page 22. This is an indexed function when controlled from
the SPI, but a global function when driven from the pin.
21
FN6808.3
October 1, 2009
KAD5512HP
GRAY CODE
11
10
••••
9
1
Serial Peripheral Interface
0
A serial peripheral interface (SPI) bus is used to facilitate
configuration of the device and to optimize performance. The
SPI bus consists of chip select (CSB), serial clock (SCLK)
serial data input (SDI) and serial data input/output (SDIO).
The maximum SCLK rate is equal to the ADC sample rate
(fSAMPLE) divided by 16 for write operations and fSAMPLE
divided by 66 for reads. At fSAMPLE = 250MHz, maximum
SCLK is 15.63MHz for writing and 3.79MHz for read
operations. There is no minimum SCLK rate.
••••
The following sections describe various registers that are
used to configure the SPI or adjust performance or functional
parameters. Many registers in the available address space
(0x00 to 0xFF) are not defined in this document. Additionally,
within a defined register there may be certain bits or bit
combinations that are reserved. Undefined registers and
undefined values within defined registers are reserved and
should not be selected. Setting any reserved register or value
may produce indeterminate results.
••••
BINARY
11
10
••••
9
1
0
FIGURE 32. GRAY CODE TO BINARY CONVERSION
Mapping of the input voltage to the various data formats is
shown in Table 5.
TABLE 5. INPUT VOLTAGE TO OUTPUT CODE MAPPING
INPUT
TWO’S
VOLTAGE OFFSET BINARY COMPLEMENT
GRAY CODE
–Full Scale 000 00 000 00 00 100 00 000 00 00 000 00 000 00 00
–Full Scale 000 00 000 00 01 100 00 000 00 01 000 00 000 00 01
+ 1LSB
Mid–Scale 100 00 000 00 00 000 00 000 00 00 110 00 000 00 00
+Full Scale
– 1LSB
111 11 111 11 10
011 11 111 11 10 100 00 000 00 01
+Full Scale
111 11 111 11 11
011 11 111 111 1 100 00 000 00 00
CSB
SCLK
SDIO
R/W
W1
W0
A12
A11
A10
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
FIGURE 33. MSB-FIRST ADDRESSING
CSB
SCLK
SDIO
A0
A1
A2
A11
A12
W0
W1
R/W
D0
D1
D2
D3
D4
D5
D6
D7
FIGURE 34. LSB-FIRST ADDRESSING
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FN6808.3
October 1, 2009
KAD5512HP
tDSW
CSB
tDHW
tS
tCLK
tHI
tH
tLO
SCLK
SDIO
R/W
W1
W0
A12
A11
A10
A9
A8
A7
D5
D4
D3
D2
D1
D0
SPI WRITE
FIGURE 35. SPI WRITE
tDSW
CSB
tDHW
tS
tCLK
tHI
tH
tDHR
tDVR
tLO
SCLK
WRITING A READ COMMAND
SDIO
R/W
W1
W0
A12
A11
A10
A9
A2
READING DATA (3 WIRE MODE)
A1
A0
D7
D6
SDO
D3
D2
D1 D0
(4 WIRE MODE)
D7
D3
D2
D1 D0
SPI READ
FIGURE 36. SPI READ
CSB STALLING
CSB
SCLK
SDIO
INSTRUCTION/ADDRESS
DATA WORD 1
DATA WORD 2
FIGURE 37. 2-BYTE TRANSFER
LAST LEGAL
CSB STALLING
CSB
SCLK
SDIO
INSTRUCTION/ADDRESS
DATA WORD 1
DATA WORD N
FIGURE 38. N-BYTE TRANSFER
SPI Physical Interface
The serial clock pin (SCLK) provides synchronization for the
data transfer. By default, all data is presented on the serial
data input/output (SDIO) pin in three-wire mode. The state of
the SDIO pin is set automatically in the communication
23
protocol (described in the following). A dedicated serial data
output pin (SDO) can be activated by setting 0x00[7] high to
allow operation in four-wire mode.
The SPI port operates in a half duplex master/slave
configuration, with the KAD5512HP functioning as a slave.
FN6808.3
October 1, 2009
KAD5512HP
Multiple slave devices can interface to a single master in
three-wire mode only, since the SDO output of an
unaddressed device is asserted in four wire mode.
The chip-select bar (CSB) pin determines when a slave
device is being addressed. Multiple slave devices can be
written to concurrently, but only one slave device can be
read from at a given time (again, only in three-wire mode). If
multiple slave devices are selected for reading at the same
time, the results will be indeterminate.
The communication protocol begins with an
instruction/address phase. The first rising SCLK edge
following a high-to-low transition on CSB determines the
beginning of the two-byte instruction/address command;
SCLK must be static low before the CSB transition. Data can
be presented in MSB-first order or LSB-first order. The
default is MSB-first, but this can be changed by setting
0x00[6] high. Figures 33 and 34 show the appropriate bit
ordering for the MSB-first and LSB-first modes, respectively.
In MSB-first mode the address is incremented for multi-byte
transfers, while in LSB-first mode it’s decremented.
In the default mode the MSB is R/W, which determines if the
data is to be read (active high) or written. The next two bits,
W1 and W0, determine the number of data bytes to be read
or written (see Table 6). The lower 13 bits contain the first
address for the data transfer. This relationship is illustrated in
Figure 35, and timing values are given in “Switching
Specifications” on page 8.
After the instruction/address bytes have been read, the
appropriate number of data bytes are written to or read from
the ADC (based on the R/W bit status). The data transfer will
continue as long as CSB remains low and SCLK is active.
Stalling of the CSB pin is allowed at any byte boundary
(instruction/address or data) if the number of bytes being
transferred is three or less. For transfers of four bytes or
more, CSB is allowed stall in the middle of the
instruction/address bytes or before the first data byte. If CSB
transitions to a high state after that point the state machine
will reset and terminate the data transfer.
TABLE 6. BYTE TRANSFER SELECTION
[W1:W0]
BYTES TRANSFERRED
00
1
01
2
10
3
11
4 or more
Figures 37 and 38 illustrate the timing relationships for
2-byte and N-byte transfers, respectively. The operation for a
3-byte transfer can be inferred from these diagrams.
SPI Configuration
ADDRESS 0X00: CHIP_PORT_CONFIG
Bit ordering and SPI reset are controlled by this register. Bit
order can be selected as MSB to LSB (MSB first) or LSB to
MSB (LSB first) to accommodate various microcontrollers.
Bit 7 SDO Active
Bit 6 LSB First
Setting this bit high configures the SPI to interpret serial
data as arriving in LSB to MSB order.
Bit 5 Soft Reset
Setting this bit high resets all SPI registers to default
values.
Bit 4 Reserved
This bit should always be set high.
Bits 3:0 These bits should always mirror bits 4:7 to avoid
ambiguity in bit ordering.
ADDRESS 0X02: BURST_END
If a series of sequential registers are to be set, burst mode
can improve throughput by eliminating redundant
addressing. In 3-wire SPI mode the burst is ended by pulling
the CSB pin high. If the device is operated in 2-wire mode
the CSB pin is not available. In that case, setting the
burst_end address determines the end of the transfer.
During a write operation, the user must be cautious to
transmit the correct number of bytes based on the starting
and ending addresses.
Bits 7:0 Burst End Address
This register value determines the ending address of the
burst data.
Device Information
ADDRESS 0X08: CHIP_ID
ADDRESS 0X09: CHIP_VERSION
The generic die identifier and a revision number,
respectively, can be read from these two registers.
Indexed Device Configuration/Control
ADDRESS 0X10: DEVICE_INDEX_A
A common SPI map, which can accommodate
single-channel or multi-channel devices, is used for all
Intersil ADC products. Certain configuration commands
(identified as Indexed in the SPI map) can be executed on a
per-converter basis. This register determines which
converter is being addressed for an Indexed command. It is
important to note that only a single converter can be
addressed at a time.
This register defaults to 00h, indicating that no ADC is
addressed. Error code ‘AD’ is returned if any indexed
24
FN6808.3
October 1, 2009
KAD5512HP
register is read from without properly setting
device_index_A.
TABLE 9. MEDIUM AND FINE GAIN ADJUSTMENTS
ADDRESS 0X20: OFFSET_COARSE
PARAMETER
ADDRESS 0X21: OFFSET_FINE
The input offset of each ADC core can be adjusted in fine
and coarse steps. Both adjustments are made via an 8-bit
word as detailed in Table 7.
The default value of each register will be the result of the
self-calibration after initial power-up. If a register is to be
incremented or decremented, the user should first read the
register value then write the incremented or decremented
value back to the same register.
TABLE 7. OFFSET ADJUSTMENTS
PARAMETER
0x20[7:0]
COARSE OFFSET
0x21[7:0]
FINE OFFSET
0x23[7:0]
MEDIUM GAIN
0x24[7:0]
FINE GAIN
Steps
256
256
–Full Scale (0x00)
-2%
-0.20%
Mid–Scale (0x80)
0.00%
0.00%
+Full Scale (0xFF)
+2%
+0.2%
Nominal Step Size
0.016%
0.0016%
ADDRESS 0X25: MODES
Two distinct reduced power modes can be selected. By
default, the tri-level NAPSLP pin can select normal
operation, nap or sleep modes (refer to “Nap/Sleep” on
page 21). This functionality can be overridden and controlled
through the SPI. This is an indexed function when controlled
from the SPI, but a global function when driven from the pin.
This register is not changed by a Soft Reset.
Steps
255
255
–Full Scale (0x00)
-133LSB (-47mV)
-5LSB (-1.75mV)
Mid–Scale (0x80)
0.0LSB (0.0mV)
0.0LSB
+Full Scale (0xFF)
+133LSB (+47mV)
+5LSB (+1.75mV)
VALUE
0x25[2:0]
POWER-DOWN MODE
Nominal Step Size
1.04LSB (0.37mV)
0.04LSB (0.014mV)
000
Pin Control
001
Normal Operation
010
Nap Mode
100
Sleep Mode
TABLE 10. POWER-DOWN CONTROL
ADDRESS 0X22: GAIN_COARSE
ADDRESS 0X23: GAIN_MEDIUM
ADDRESS 0X24: GAIN_FINE
Gain of the ADC core can be adjusted in coarse, medium
and fine steps. Coarse gain is a 4-bit adjustment while
medium and fine are 8-bit. Multiple Coarse Gain Bits can be
set for a total adjustment range of ± 4.2%. (‘0011’ =~ -4.2%
and ‘1100’ =~ +4.2%) It is recommended to use one of the
coarse gain settings (-4.2%, -2.8%, -1.4%, 0, 1.4%, 2.8%,
4.2%) and fine-tune the gain using the registers at 23h and
24h.
The default value of each register will be the result of the
self-calibration after initial power-up. If a register is to be
incremented or decremented, the user should first read the
register value then write the incremented or decremented
value back to the same register.
TABLE 8. COARSE GAIN ADJUSTMENT
0x22[3:0]
NOMINAL COARSE GAIN ADJUST
(%)
Bit3
+2.8
Bit2
+1.4
Bit1
-2.8
Bit0
-1.4
Global Device Configuration/Control
ADDRESS 0X71: PHASE_SLIP
When using the clock divider, it’s not possible to determine
the synchronization of the incoming and divided clock
phases. This is particularly important when multiple ADCs
are used in a time-interleaved system. The phase slip
feature allows the rising edge of the divided clock to be
advanced by one input clock cycle when in CLK/4 mode, as
shown in Figure 39. Execution of a phase_slip command is
accomplished by first writing a ‘0’ to bit 0 at address 71h
followed by writing a ‘1’ to Bit 0 at address 71h (32 sclk
cycles).
CLK = CLKP – CLKN
CLK
1.00ns
CLK÷4
4.00ns
CLK÷4
SLIP ONCE
CLK÷4
SLIP TWICE
FIGURE 39. PHASE SLIP: CLK÷4 MODE, fCLOCK = 1000MHz
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October 1, 2009
KAD5512HP
ADDRESS 0X72: CLOCK_DIVIDE
ADDRESS 0X74: OUTPUT_MODE_B
The KAD5512HP has a selectable clock divider that can be
set to divide by four, two or one (no division). By default, the
tri-level CLKDIV pin selects the divisor (refer to “Clock Input
Considerations” on page 31). This functionality can be
overridden and controlled through the SPI, as shown in
Table 11. This register is not changed by a Soft Reset.
ADDRESS 0X75: CONFIG_STATUS
TABLE 11. CLOCK DIVIDER SELECTION
VALUE
0x72[2:0]
CLOCK DIVIDER
000
Pin Control
001
Divide by 1
010
Divide by 2
100
Divide by 4
ADDRESS 0X73: OUTPUT_MODE_A
The output_mode_A register controls the physical output
format of the data, as well as the logical coding. The
KAD5512HP can present output data in two physical
formats: LVDS or LVCMOS. Additionally, the drive strength
in LVDS mode can be set high (3mA) or low (2mA). By
default, the tri-level OUTMODE pin selects the mode and
drive level (refer to “Digital Outputs” on page 20). This
functionality can be overridden and controlled through the
SPI, as shown in Table 12.
Data can be coded in three possible formats: two’s
complement, Gray code or offset binary. By default, the
tri-level OUTFMT pin selects the data format (refer to “Data
Format” on page 21). This functionality can be overridden
and controlled through the SPI, as shown in Table 13.
This register is not changed by a Soft Reset.
TABLE 12. OUTPUT MODE CONTROL
VALUE
0x93[7:5]
OUTPUT MODE
000
Pin Control
001
LVDS 2mA
010
LVDS 3mA
100
LVCMOS
Bit 6 DLL Range
This bit sets the DLL operating range to fast (default) or
slow.
Bit 4 DDR Enable
Setting this bit enables Double Data-Rate mode.
Internal clock signals are generated by a delay-locked loop
(DLL), which has a finite operating range. Table 14 shows
the allowable sample rate ranges for the slow and fast
settings.
TABLE 14. DLL RANGES
DLL RANGE
MIN
MAX
UNIT
Slow
40
100
MSPS
Fast
80
fS MAX
MSPS
The output_mode_B and config_status registers are used in
conjunction to enable DDR mode and select the frequency
range of the DLL clock generator. The method of setting
these options is different from the other registers.
READ
OUTPUT_MODE_B
0x74
READ
CONFIG_STATUS
0x75
WRITE TO
0x74
DESIRED
VALUE
FIGURE 40. SETTING OUTPUT_MODE_B REGISTER
The procedure for setting output_mode_B is shown in
Figure 40. Read the contents of output_mode_B and
config_status and XOR them. Then XOR this result with the
desired value for output_mode_B and write that XOR result
to the register.
TABLE 13. OUTPUT FORMAT CONTROL
VALUE
0x93[2:0]
OUTPUT FORMAT
000
Pin Control
001
Two’s Complement
010
Gray Code
100
Offset Binary
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FN6808.3
October 1, 2009
KAD5512HP
Device Test
TABLE 15. OUTPUT TEST MODES
The KAD5512HP can produce preset or user defined
patterns on the digital outputs to facilitate in-situ testing. A
static word can be placed on the output bus, or two different
words can alternate. In the alternate mode, the values
defined as Word 1 and Word 2 (as shown in Table 15) are
set on the output bus on alternating clock phases. The test
mode is enabled asynchronously to the sample clock,
therefore several sample clock cycles may elapse before the
data is present on the output bus.
ADDRESS 0XC0: TEST_IO
Bits 7:6 User Test Mode
These bits set the test mode to static (0x00) or alternate
(0x01) mode. Other values are reserved.
The four LSBs in this register (Output Test Mode) determine
the test pattern in combination with registers 0xC2 through
0xC5. Refer to Table 16.
VALUE
0xC0[3:0]
OUTPUT TEST
MODE
0000
Off
0001
WORD 1
WORD 2
Midscale
0x8000
N/A
0010
Positive Full-Scale
0xFFFF
N/A
0011
Negative Full-Scale
0x0000
N/A
0100
Checkerboard
0xAAAA
0x5555
0101
Reserved
N/A
N/A
0110
Reserved
N/A
N/A
0111
One/Zero
0xFFFF
0x0000
1000
User Pattern
user_patt1
user_patt2
ADDRESS 0XC2: USER_PATT1_LSB
ADDRESS 0XC3: USER_PATT1_MSB
These registers define the lower and upper eight bits,
respectively, of the first user-defined test word.
ADDRESS 0XC4: USER_PATT2_LSB
ADDRESS 0XC5: USER_PATT2_MSB
These registers define the lower and upper eight bits,
respectively, of the second user-defined test word.
27
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October 1, 2009
KAD5512HP
SPI Memory Map
Indexed Device Config/Control
Info
SPI Config
TABLE 16. SPI MEMORY MAP
INDEXED/
GLOBAL
00h
G
00h
G
Chip ID #
Read only
G
Chip Version #
Read only
G
00h
I
Coarse Offset
cal. value
I
Fine Offset
cal. value
I
cal. value
I
Medium Gain
cal. value
I
Fine Gain
cal. value
I
00h
NOT
affected by
Soft
Reset
I
00h
G
PARAMETER
NAME
BIT 7
(MSB)
BIT 6
BIT 5
00
Port_Config
SDO
Active
LSB
First
Soft
Reset
01
Reserved
Reserved
02
Burst_End
Burst end address [7:0]
03-07
Reserved
Reserved
08
Chip_Id
09
Chip_Version
10
Device_Index_A
11-1F
Reserved
Reserved
20
Offset_Coarse
21
Offset_Fine
22
Gain_Coarse
23
Gain_Medium
24
Gain_Fine
25
Modes
26-5F
Reserved
Reserved
60-6F
Reserved
Reserved
70
Reserved
Reserved
71
Phase_Slip
BIT 4
BIT 3
Reserved
BIT 2
BIT 1
BIT 0
(LSB)
Mirror
(bit5)
Mirror
(bit6)
Mirror
(bit7)
ADC01
Reserved
ADC00
Coarse Gain
Reserved
Power-Down Mode [2:0]
000 = Pin Control
001 = Normal Operation
010 = Nap
100 = Sleep
other codes = reserved
Reserved
72
Global DeviceConfig/Control
DEF.
VALUE
(Hex)
ADDR
(Hex)
Next
Clock
Edge
clock_divide
Clock Divide [2:0]
000 = Pin Control
001 = Divide by 1
010 = Divide by 2
100 = Divide by 4
other codes = reserved
00h
NOT
affected by
Soft Reset
G
Output Mode [2:0]
000 = Pin Control
001 = LVDS 2mA
010 = LVDS 3mA
100 = LVCMOS
other codes = reserved
Output Format [2:0]
000 = Pin Control
001 = Twos Complement
010 = Gray Code
100 = Offset Binary
other codes = reserved
00h
NOT
affected by
Soft Reset
G
73
Output_Mode_A
74
Output_Mode_B
DLL
Range
0 = fast
1 = slow
DDR
Enable
(Note 13)
00h
NOT
affected by
Soft
Reset
G
75
Config_Status
XOR
Result
XOR
Result
Read Only
G
76-BF
Reserved
Reserved
28
FN6808.3
October 1, 2009
KAD5512HP
Device Test
TABLE 16. SPI MEMORY MAP (Continued)
ADDR
(Hex)
PARAMETER
NAME
C0
Test_io
BIT 7
(MSB)
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 0
(LSB)
BIT 1
Output Test Mode [3:0]
User Test Mode
[1:0]
00 = Single
01 = Alternate
10 = Reserved
11 = Reserved
0 = Off
1 = Midscale
Short
2 = +FS Short
3 = -FS Short
4 = Checker
Board
5 = reserved
6 = reserved
DEF.
VALUE
(Hex)
INDEXED/
GLOBAL
00h
G
00h
G
7 = One/Zero Word
Toggle
8 = User Input
9-15 = reserved
C1
Reserved
Reserved
C2
User_Patt 1_LSB
B7
B6
B5
B4
B3
B2
B1
B0
00h
G
C3
User_Patt1_MSB
B15
B14
B13
B12
B11
B10
B9
B8
00h
G
C4
User_Patt 2_LSB
B7
B6
B5
B4
B3
B2
B1
B0
00h
G
C5
User_Patt2_MSB
B15
B14
B13
B12
B11
B10
B9
B8
00h
G
C6-FF
Reserved
Reserved
NOTE:
13. At power-up, the DDR Enable bit is at a logic ‘0’ for the 72 pin package and set to a logic ‘1’ internally for the 48 pin package by an internal pull-up.
Equivalent Circuits
AVDD
TO
CLOCKPHASE
GENERATION
AVDD
CLKP
AVDD
CSAMP
1.6pF
INP
Ω
1000O
Φ2
F
Φ1
F
CSAMP
1.6pF
AVDD
INN
Φ2
F
Φ
F1
FIGURE 41. ANALOG INPUTS
29
TO
CHARGE
PIPELINE
Φ
F3
TO
CHARGE
PIPELINE
Φ3
F
AVDD
11kO
Ω
AVDD 11kO
Ω
Ω
18kO
Ω
18kO
CLKN
FIGURE 42. CLOCK INPUTS
FN6808.3
October 1, 2009
KAD5512HP
Equivalent Circuits
(Continued)
AVDD
AVDD
(20k PULL-UP
ON RESETN
ONLY)
AVDD
Ω
75kO
AVDD
Ω
75kO
OVDD
TO
SENSE
LOGIC
Ω
280O
OVDD
OVDD
20kΩ
INPUT
INPUT
Ω
75kO
Ω
75kO
TO
LOGIC
280Ω
FIGURE 43. TRI-LEVEL DIGITAL INPUTS
FIGURE 44. DIGITAL INPUTS
OVDD
2mA OR
3mA
OVDD
DATA
DATA
D[11:0]P
OVDD
OVDD
D[11:0]N
OVDD
DATA
DATA
DATA
D[11:0]
2mA OR
3mA
FIGURE 46. CMOS OUTPUTS
FIGURE 45. LVDS OUTPUTS
AVDD
VCM
0.535V
+
–
FIGURE 47. VCM_OUT OUTPUT
72 Pin/48 Pin Package Options
The KAD5512HP is available in both 72 pin and 48 pin
packages. The 48 pin package option supports LVDS DDR
only. A reduced set of pin selectable functions are available
in the 48 pin package due to the reduced pinout;
(OUTMODE, OUTFMT, and CLKDIV pins are not available).
Table 17 shows the default state for these functions for the
48 pin package. Note that these functions are available
through the SPI, allowing a user to set these modes as they
desire, offering the same flexibility as the 72 pin package
30
option. DC and AC performance of the ADC is equivalent for
both package options.
.
TABLE 17. 48 PIN SPI - ADDRESSABLE FUNCTIONS
FUNCTION
DESCRIPTION
DEFAULT STATE
CLKDIV
Clock Divider
Divide by 1
OUTMODE
Output Driver
Mode
LVDS, 3mA (DDR)
OUTFMT
Data Coding
Two’s Complement
FN6808.3
October 1, 2009
KAD5512HP
ADC Evaluation Platform
Definitions
Intersil offers an ADC Evaluation platform which can be used
to evaluate any of the KADxxxxx ADC family. The platform
consists of a FPGA based data capture motherboard and a
family of ADC daughtercards. This USB based platform
allows a user to quickly evaluate the ADC’s performance at a
user’s specific application frequency requirements. More
information is available at
http://www.intersil.com/converters/adc_eval_platform/
Analog Input Bandwidth is the analog input frequency at
which the spectral output power at the fundamental
frequency (as determined by FFT analysis) is reduced by
3dB from its full-scale low-frequency value. This is also
referred to as Full Power Bandwidth.
Layout Considerations
Aperture Jitter is the RMS variation in aperture delay for a
set of samples.
Split Ground and Power Planes
Data converters operating at high sampling frequencies require
extra care in PC board layout. Many complex board designs
benefit from isolating the analog and digital sections. Analog
supply and ground planes should be laid out under signal and
clock inputs. Locate the digital planes under outputs and logic
pins. Grounds should be joined under the chip.
Clock Input Considerations
Use matched transmission lines to the transformer inputs for
the analog input and clock signals. Locate transformers and
terminations as close to the chip as possible.
Exposed Paddle
The exposed paddle must be electrically connected to analog
ground (AVSS) and should be connected to a large copper
plane using numerous vias for optimal thermal performance.
Bypass and Filtering
Bulk capacitors should have low equivalent series
resistance. Tantalum is a good choice. For best
performance, keep ceramic bypass capacitors very close to
device pins. Longer traces will increase inductance, resulting
in diminished dynamic performance and accuracy. Make
sure that connections to ground are direct and low
impedance. Avoid forming ground loops.
LVDS Outputs
Output traces and connections must be designed for 50Ω
(100Ω differential) characteristic impedance. Keep traces
direct and minimize bends where possible. Avoid crossing
ground and power-plane breaks with signal traces.
LVCMOS Outputs
Output traces and connections must be designed for 50Ω
characteristic impedance.
Unused Inputs
Standard logic inputs (RESETN, CSB, SCLK, SDIO, SDO)
which will not be operated do not require connection to
ensure optimal ADC performance. These inputs can be left
floating if they are not used. Tri-level inputs (NAPSLP,
OUTMODE, OUTFMT, CLKDIV) accept a floating input as a
valid state, and therefore should be biased according to the
desired functionality.
31
Aperture Delay or Sampling Delay is the time required
after the rise of the clock input for the sampling switch to
open, at which time the signal is held for conversion.
Clock Duty Cycle is the ratio of the time the clock wave is at
logic high to the total time of one clock period.
Differential Non-Linearity (DNL) is the deviation of any
code width from an ideal 1 LSB step.
Effective Number of Bits (ENOB) is an alternate method of
specifying Signal to Noise-and-Distortion Ratio (SINAD). In
dB, it is calculated as: ENOB = (SINAD - 1.76)/6.02
Gain Error is the ratio of the difference between the voltages
that cause the lowest and highest code transitions to the
full-scale voltage less 2 LSB. It is typically expressed in percent.
Integral Non-Linearity (INL) is the maximum deviation of
the ADC’s transfer function from a best fit line determined by
a least squares curve fit of that transfer function, measured
in units of LSBs.
Least Significant Bit (LSB) is the bit that has the smallest
value or weight in a digital word. Its value in terms of input
voltage is VFS/(2N-1) where N is the resolution in bits.
Missing Codes are output codes that are skipped and will
never appear at the ADC output. These codes cannot be
reached with any input value.
Most Significant Bit (MSB) is the bit that has the largest
value or weight.
Pipeline Delay is the number of clock cycles between the
initiation of a conversion and the appearance at the output
pins of the data.
Power Supply Rejection Ratio (PSRR) is the ratio of the
observed magnitude of a spur in the ADC FFT, caused by an
AC signal superimposed on the power supply voltage.
Signal to Noise-and-Distortion (SINAD) is the ratio of the
RMS signal amplitude to the RMS sum of all other spectral
components below one half the clock frequency, including
harmonics but excluding DC.
Signal-to-Noise Ratio (without Harmonics) is the ratio of
the RMS signal amplitude to the RMS sum of all other
spectral components below one-half the sampling frequency,
excluding harmonics and DC.
FN6808.3
October 1, 2009
KAD5512HP
SNR and SINAD are either given in units of dB when the
power of the fundamental is used as the reference, or dBFS
(dB to full scale) when the converter’s full-scale input power
is used as the reference.
Spurious-Free-Dynamic Range (SFDR) is the ratio of the
RMS signal amplitude to the RMS value of the largest
spurious spectral component. The largest spurious spectral
component may or may not be a harmonic.
Revision History
DATE
REVISION
7/30/08
Rev 1
CHANGE
Initial Release of Production Datasheet
10/29/08 FN6808.0 Converted to intersil template. Assigned file number FN6808. Rev 0 - first release (as preliminary datasheet) with new file
number.
12/5/08
FN6808.0 Applied Intersil Standards
1/13/09
FN6808.1 P1; revised Key Specs. Features - 1st bullet; changed 2.5dB to 2.2dB
P2; added Part Marking column to Order Info
P4; Moved Thermal Impedance under Thermal Info (used to be on p. 8). Added Theta JA Note 3.
P4-6; edits throughout the Elec Specs table. Revised Note 6.
P6; Revised Digital Specs table (added VIH, VIL specs)
P8; added Notes 9-10 to Switching Specs table. Removed ESD section
P13-15; revised Performance Curves throughout
P16; Functional Description section; revised 6th sentence of 1st paragraph
P17; User Initiated Reset section; revised 2nd sentence of 1st paragraph
P20; SPI section; revised 4th sentence of 1st paragraph
P22; SPI Physical Interface; revised 2nd sentence of 4th paragraph
P23; added last 2 sentences to 1st paragraph of "ADDRESS 0X24: GAIN_FINE". Revised Table 8
P24; revised last 2 sentence of "ADDRESS 0X71: PHASE_SLIP". Removed Figure of "PHASE SLIP: CLK÷2 MODE, fCLOCK
= 500MHz"
P27; revised Figure 45, Table 17; revised Bits7:4, Addr C0
Throughout; formatted graphics to Intersil standards
2/25/09
FN6808.2 Changed “odd” bits N in Figure 1A - DDR to “even” bits N, Replaced POD L48.7x7E due to changed dimension from “9.80 sq”
to “6.80” sq. in land pattern
5/29/09
FN6808.3 1) Added nap mode, sleep mode wake up times to spec table
2) Added CSB, SCLK Setup time specs for nap, sleep modes
3) Added section showing 72pin/48pin package feature differences and default state for clkdiv, outmode, outfmt page 30
4) Changed SPI setup time specs wording in spec table
5) Added ‘Reserved’ to SPI memory map at address 25H
6) Renumbered Notes
7) Added test platform link on page 31
8) Added DDR enable Note 13 for 48 pin/72 pin options
9) Changed pin description table for 72/48 pin option, added DDR notes
10) Changed multi device note in SPI physical interface section to show 3-wire application.page 23
11) Updated digital output section for DDR operation page 20
12) Change to Figures 23 and 24 and description in text
13) Added connect note for thermal pad
14) Formatted Figures 25 and 26 with Intersil Standards,
15) Added Pb-free reflow link, Over-temp reference in Min and Max and Note
08/19/09
9/3/09
16) Updated sleep mode Power spec
17) Change to SPI interface section in spec table, timing in cycles now, added write, read specific timing specs.
18) Updated SPI timing diagrams, Figures 35, 36
19) Updated wakeup time description in “Nap/Sleep” on page 21.
20) Removed calibration note in spec table
21) Updated cal paragraph in user initiated reset section per DC.
22) Removed “ADDRESS 0X70: SKEW_DIFF” and associated Table 11 from page 25.
23) Modified Note 4 from: "Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified.
Temperature limits established by characterization and are not production tested."
to: "Parameters with Min and/or MAX limits are 100% production tested at their worst case temperature extreme ( +85C)."
24) Removed reference to Note 7 in digital and switching specification table headers (Note 7 reads "The DLL Range setting
must be changed for low speed operation. See Table 14 on page 26."
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
32
FN6808.3
October 1, 2009
KAD5512HP
Package Outline Drawing
L48.7x7E
48 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 2/09
7.00
PIN 1
INDEX AREA
PIN 1
INDEX AREA
4X 5.50
A
6
B
37
6
48
1
36
44X 0.50
Exp. DAP
5.60 Sq.
7.00
(4X)
12
25
0.15
24
13
48X 0.25
48X 0.40
TOP VIEW
4
0.10 M C A B
BOTTOM VIEW
SEE DETAIL "X"
0.90 Max
C
0.10 C
0.08 C
SEATING PLANE
SIDE VIEW
44X 0.50
6.80 Sq
C
0 . 2 REF
5
48X 0.25
5.60 Sq
0 . 00 MIN.
0 . 05 MAX.
DETAIL "X"
48X 0.60
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
33
FN6808.3
October 1, 2009
KAD5512HP
Package Outline Drawing
L72.10x10D
72 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 11/08
10.00
A
4X 8.50
PIN 1
INDEX AREA
B
55
6
72
1
54
68X 0.50
Exp. DAP
6.00 Sq.
10.00
18
37
(4X)
PIN 1
INDEX AREA
6
0.15
36
19
72X 0.24
72X 0.40
TOP VIEW
4
0.10 M C A B
BOTTOM VIEW
SEE DETAIL "X"
0.90 Max
C
0.10 C
0.08 C
SEATING PLANE
68X 0.50
SIDE VIEW
72X 0.24
9.80 Sq
6.00 Sq
C
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
72X 0.60
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
34
FN6808.3
October 1, 2009