AR0237CS D

AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Features
1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
AR0237/D, Rev. 4
For the latest datasheet, please visit www.onsemi.com
Features
ous video and single frames makes it the perfect choice
for a wide range of applications, including surveillance
and HD video.
• Superior low-light performance
• Latest 3.0 m pixel with ON Semiconductor
DR-Pix™ technology with Dual Conversion Gain
• Full HD support at up to 1080P 60 fps for superior
video performance
• Linear or high dynamic range capture
• Supports line interleaved T1/T2 readout to enable
HDR processing in ISP chip
• Support for external mechanical shutter
• On-chip phase-locked loop (PLL) oscillator
• Integrated position-based color and lens shading
correction
• Slave mode for precise frame-rate control
• Stereo/3D camera support
• Statistics engine
• Data interfaces: four-lane serial high-speed pixel
interface (HiSPi) differential signaling (SLVS and
HiVCM), or parallel
• Auto black level calibration
• High-speed configurable context switching
• Temperature sensor
Table 1:
Parameter
Typical Value
Optical format
1/2.7-inch (6.6 mm)
Active pixels
1928(H) x 1088(V) (16:9 mode)
Pixel size
3.0 m x 3.0m
Color filter array
RGB Bayer, RGB-IR
Shutter type
Electronic rolling shutter and GRR
Input clock range
6 – 48 MHz
Output clock
maximum
148.5 Mp/s (4-lane HiSPi)
74.25 Mp/s (Parallel)
Output
Frame
rate
Applications
Serial
HiSPi 10-, 12-, 14-, 16-, or 20-bit
Parallel
10-, 12-bit
1080p
60 fps Linear HiSPi
30 fps Linear Parallel
30 fps Line Interleaved HiSPi
15 fps Line Interleaved Parallel
Responsivity
4.0 V/lux-sec
SNRMAX
41 dB
Max Dynamic range Up to 96 dB
I/O
• Video surveillance
• 1080p60 (Surveillance) video applications
• High dynamic range imaging
Supply Digital
voltage Analog
HiSPi
General Description
1.8 or 2.8 V
1.8 V
2.8 V
0.3 V - 0.6 V (SLVS), 1.7 V - 1.9 V (HiVcm)
Power consumption < 300mW Line interleaved 1080p30
(typical)
<190mW 1080p30 Linear Mode
ON Semiconductor's AR0237 is a 1/2.7-inch CMOS
digital image sensor with an active-pixel array of
1928Hx1088V. It captures images in either linear or
high dynamic range modes, with a rolling-shutter
readout. It includes sophisticated camera functions
such as in-pixel binning, windowing and both video
and single frame modes. It is designed for both low
light and high dynamic range scene performance. It is
programmable through a simple two-wire serial interface. The AR0237 produces extraordinarily clear, sharp
digital pictures, and its ability to capture both continu-
AR0237CS/D Rev. 4, 6/16 EN
Key Parameters
1
Operating
temperature
–30°C to +85°C ambient
Package options
10x10 mm 80-pin iBGA
11.43x11.43 mm 48-pin mPLCC
©Semiconductor Components Industries, LLC 2016,
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Ordering Information
Ordering Information
Table 2:
Available Part Numbers
Part Number
Product Description
Orderable Product Attribute Description
AR0237CSSC00SUEA0-DR
2Mp 1/2.7" Image Sensor, RGB, 0 deg CRA, iBGA
package, multi output
Drypack
AR0237CSSC00SHRA0-DR
2Mp 1/2.7" Image Sensor, RGB, 0 deg CRA, mPLCC
package, HiSPi output
Drypack
AR0237CSSC00SPRA0-DR
2Mp 1/2.7" Image Sensor, RGB, 0 deg CRA, mPLCC
package, Parallel output
Drypack
AR0237CSSC12SHRA0-DR
2Mp 1/2.7" Image Sensor, RGB, 12 deg CRA, mPLCC
Drypack
package, HiSPi output
AR0237CSSC12SPRA0-DR
2Mp 1/2.7" Image Sensor, RGB, 12 deg CRA, mPLCC
Drypack
package, Parallel output
AR0237IRSH12SHRA0-DR-E
2Mp 1/2.7" Image Sensor, RGB-IR, 12 deg CRA,
mPLCC package, HiSPi output
Drypack
AR0237IRSH12SPRA0-DR-E
2Mp 1/2.7" Image Sensor, RGB-IR, 12 deg CRA,
mPLCC package, Parallel output
Drypack
AR0237CSSC00SUEAH3-GEVB
RGB, 0 deg CRA, iBGA package, multi output,
Headboard
Headboard
AR0237CSSC00SHRAH3-GEVB
RGB, 0 deg CRA, mPLCC package, HiSPi output,
Headboard
Headboard
AR0237CSSC00SPRAH3-GEVB
RGB, 0 deg CRA, mPLCC package, Parallel output,
Headboard
Headboard
AR0237CSSC12SHRAH3-GEVB
RGB, 12 deg CRA, mPLCC package, HiSPi output,
Headboard
Headboard
AR0237CSSC12SPRAH3-GEVB
RGB, 12 deg CRA, mPLCC package, Parallel output,
Headboard
Headboard
AR0237IRSH12SHRAH3-GEVB
RGB-IR, 12 deg CRA, mPLCC package, HiSPi output,
Headboard
Headboard
AR0237IRSH12SPRAH3-GEVB
RGB-IR, 12 deg CRA, mPLCC package, Parallel
output, Headboard
Headboard
See the ON Semiconductor Device Nomenclature document (TND310/D) for a full
description of the naming convention used for image sensors. For reference documentation, including information on evaluation kits, please visit our web site at
www.onsemi.com.
AR0237CS/D Rev. 4, 6/16 EN
2
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Ordering Information
AR0237CS/D Rev. 4, 6/16 EN
3
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Table of Contents
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Functional Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Pixel Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Features Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Power-On Reset and Standby Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
AR0237CS/D Rev. 4, 6/16 EN
4
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
General Description
General Description
The ON Semiconductor AR0237 can be operated in its default mode or programmed for
frame size, exposure, gain, and other parameters. The default mode output is a 1080presolution image at 60 frames per second (fps) through the HiSPi port. In linear mode, it
outputs 12-bit or 10-bit A-Law compressed raw data, using either the parallel or serial
(HiSPi) output ports. In high dynamic range mode, it outputs two exposure values that
the ISP will combine into an HDR image. The device may be operated in video (master)
mode or in single frame trigger mode.
FRAME_VALID and LINE_VALID signals are output on dedicated pins, along with a
synchronized pixel clock in parallel mode.
The AR0237 includes additional features to allow application-specific tuning:
windowing and offset, auto black level correction, and on-board temperature sensor.
Optional register information and histogram statistic information can be embedded in
the first and last 2 lines of the image frame.
The AR0237 is designed to operate over a wide temperature range of -30°C to +85°C
ambient.
AR0237CS/D Rev. 4, 6/16 EN
5
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
Functional Overview
The AR0237 is a progressive-scan sensor that generates a stream of pixel data at a
constant frame rate. It uses an on-chip, phase-locked loop (PLL) that can be optionally
enabled to generate all internal clocks from a single master input clock running between
6 and 48 MHz. The maximum output pixel rate is 148.5 Mp/s, corresponding to a clock
rate of 74.25 MHz. Figure 1 shows a block diagram of the sensor configured in linear
mode, and in HDR mode.
Figure 1:
Block Diagram of AR0237
ADC Data
12
Row Noise Correction
Black Level Correction
Test Pattern Generator
Pixel Defect Correction
12
Digital Gain and Pedestal
A-Law Compression
10 bits
12 bits
HiSPi
Parallel
User interaction with the sensor is through the two-wire serial bus, which communicates with the array control, analog signal chain, and digital signal chain. The core of the
sensor is a 2.1 Mp Active- Pixel Sensor array. The timing and control circuitry sequences
through the rows of the array, resetting and then reading each row in turn. In the time
interval between resetting a row and reading that row, the pixels in the row integrate
incident light. The exposure is controlled by varying the time interval between reset and
readout. Once a row has been read, the data from the columns is sequenced through an
analog signal chain (providing offset correction and gain), and then through an analogto-digital converter (ADC). The output from the ADC is a 12-bit value for each pixel in
the array. The ADC output passes through a digital processing signal chain (which
provides further data path corrections and applies digital gain). The sensor also offers a
AR0237CS/D Rev. 4, 6/16 EN
6
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
high dynamic range mode of operation where two images and taken using different
exposures. These images are output in from the sensor and the ISP must combine them
into one high dynamic range image.
Typical Configuration: Serial Four-Lane HiSPi Interface
VDD_IO
1.5k:2
1.5k:2
Digital Digital
I/O
Core
power1 power1
VDD
Master clock
(6–48 MHz)
EXTCLK
From
controller
SADDR
SDATA
SCLK
TRIGGER
OE_BAR
RESET_BAR
HiSPi
power1
VDD_SLVS
Figure 2:
VDD
VDD_SLVS
Notes:
AR0237CS/D Rev. 4, 6/16 EN
VDD_PLL
VAA
VDD_PLL
VAA
VAA_PIX
SLVS0_P
SLVS0_N
SLVS1_P
SLVS1_N
SLVS2_P
SLVS2_N
SLVS3_P
SLVS3_N
SLVSC_P
SLVSC_N
FLASH
SHUTTER
TEST
VDD_IO
Analog Analog
PLL
power1 power1 power1
DGND
AGND
Digital
ground
Analog
ground
To
controller
VAA_PIX
1. All power supplies must be adequately decoupled.
2. ON Semiconductor recommends a resistor value of 1.5k, but a greater value may be used for
slower two-wire speed.
3. The parallel interface output pads can be left unconnected if the serial output interface is used.
4. ON Semiconductor recommends that 0.1F and 10F decoupling capacitors for each power supply
are mounted as close as possible to the pad. Actual values and results may vary depending on layout and design considerations. Refer to the AR0237 demo headboard schematics for circuit recommendations.
5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital power planes is minimized.
6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents.
7
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
Figure 3:
Typical Configuration: Parallel Pixel Data Interface
1.5kΩ2,
1.5kΩ2
Digital Digital
core
I/O
power1 power1
Master clock
(6-48 MHz)
VDD_IO
PLL Analog Analog
power1 power1 power1
VDD
DOUT [11:0]
EXTCLK
PIXCLK
LINE_VALID
FRAME_VALID
SADDR
SDATA
SCLK
TRIGGER
OE_BAR
From
Controller
VAA_PIX
VDD_PLL VAA
To
controller
FLASH
SHUTTER
RESET_BAR
TEST
DGND
VDD_IO
VDD
VDD_PLL
VAA
VAA_PIX
Digital
ground
Notes:
AR0237CS/D Rev. 4, 6/16 EN
AGND
Analog
ground
1. All power supplies must be adequately decoupled.
2. ON Semiconductor recommends a resistor value of 1.5k, but a greater value may be used for
slower two-wire speed.
3. The serial interface output pads and VDDSLVS can be left unconnected if the parallel output interface is used.
4. ON Semiconductor recommends that 0.1F and 10F decoupling capacitors for each power supply
are mounted as close as possible to the pad. Actual values and results may vary depending on layout and design considerations. Refer to the AR0237 demo headboard schematics for circuit recommendations.
5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital power planes is minimized.
6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents.
7. The EXTCLK input is limited to 6-48 MHz.
8
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
Figure 4:
80-Ball IBGA Package
1
A
2
3
4
5
6
7
8
9
SLVS0_P
SLVS1_P
SLVSC_P
SLVS2_P
SLVS3_P
VDD
VDD_IO
SLVSC_N
SLVS2_N
SLVS3_N
DGND
DGND
SHUTTER
DGND
DGND
DGND
Reserved
TRIGGER
DGND
AGND
AGND
B
VDD_PLL
SLVS0_N
SLVS1_N
C
VAA
AGND
DGND
VDD_
SLVS
VDD
D
VDD
DGND
EXTCLK
PIXCLK
SADDR
E
VDD_IO
DGND
SDATA
FLASH
FRAME_
VALID
SCLK
DGND
F
VDD
DGND
DOUT11
DOUT10
DOUT9
LINE_
VALID
Reserved
G
VAA
AGND
DGND
DOUT8
DOUT7
DOUT6
H
VDD_IO
DGND
DGND
DOUT5
DOUT4
DOUT3
J
DOUT2
VDD_IO
DOUT1
DOUT0
VDD
DGND
VDD
VAA
VAA_PIX
AGND
VAA
DGND
DGND
VDD_IO
RESET_
BAR
TEST
VDD_IO
VDD
OE_BAR
VDD_IO
Top View
(Ball Down)
AR0237CS/D Rev. 4, 6/16 EN
9
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
Table 3:
Pin Descriptions, 80-ball iBGA
Name
iBGA Pin
Type
Description
SLVS0_P
A2
Output HiSPi serial data, lane 0, differential P.
SLVS1_P
A3
Output HiSPi serial data, lane 1, differential P.
SLVSC_P
A4
Output HiSPi serial DDR clock differential P.
SLVS2_P
A5
Output HiSPi serial data, lane 2, differential P.
SLVS3_P
A6
Output HiSPi serial data, lane 3, differential P.
VDD_PLL
B1
Power
SLVS0_N
B2
Output HiSPi serial data, lane 0, differential N.
PLL power.
SLVS1_N
B3
Output HiSPi serial data, lane 1, differential N.
SLVSC_N
B4
Output HiSPi serial DDR clock differential N.
SLVS2_N
B5
Output HiSPi serial data, lane 2, differential N.
SLVS3_N
B6
Output HiSPi serial data, lane 3, differential N.
SHUTTER
B9
Output Control for external mechanical shutter. Can be left floating if not used.
VAA
C1, G1, D9, F9
Power
Analog power.
AGND
C2, G2, D8, E8, F8
Power
Analog ground.
VDD_SLVS
C4
Power
SLVS Power
VDD
C5, J5, A9, H9, A7, D1, F1
Power
Digital power.
Power
Digital ground.
Input
External input clock.
Reserved
C9, F7
DGND
EXTCLK
B7, C7, D7, E7, G7, B8, C8, G8,
D2, E2, F2, H2, C3, G3, H3, C6,
J6
D3
PIXCLK
D4
Output Pixel clock out. Dout is valid on rising edge of this clock.
SADDR
D5
Input
TRIGGER
D6
Input
Exposure synchronization input.
VAA_PIX
E9
Power
Pixel power.
VDD_IO
E1, H1, J2, J7, A8, G9, J9
Power
I/O supply power.
SDATA
E3
I/O
Two-Wire Serial data I/O.
Two-Wire Serial address select. 0: 0x20. 1: 0x30
FLASH
E4
Output Flash control output.
FRAME_VALID
E5
Output Asserted when Dout frame data is valid.
SCLK
E6
Input
DOUT11
F3
Output Parallel pixel data output (MSB)
DOUT10
F4
Output Parallel pixel data output.
Two-Wire Serial clock input.
DOUT9
F5
Output Parallel pixel data output.
LINE_VALID
F6
Output Asserted when Dout line data is valid.
DOUT8
G4
Output Parallel pixel data output.
DOUT7
G5
Output Parallel pixel data output.
DOUT6
G6
Output Parallel pixel data output.
DOUT5
H4
Output Parallel pixel data output.
DOUT4
H5
Output Parallel pixel data output.
Output Parallel pixel data output.
DOUT3
H6
RESET_BAR
H7
TEST
H8
AR0237CS/D Rev. 4, 6/16 EN
Input
Asynchronous reset (active LOW). All settings are restored to factory
default.
Input.
Manufacturing test enable pin (connect to Dgnd).
10
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
Table 3:
Pin Descriptions, 80-ball iBGA
Name
iBGA Pin
DOUT2
J1
Output Parallel pixel data output.
DOUT1
J3
Output Parallel pixel data output.
DOUT0
J4
Output Parallel pixel data output (LSB)
OE_BAR
J8
Input
Figure 5:
Type
Description
Output enable (active LOW).
48 Pin mPLCC Package HiSPi
AR0237CS/D Rev. 4, 6/16 EN
11
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
Table 4:
mPLCC HiSPi Pin Out
Pin
Name
Type
Description
1
SLVSCN
Output
HiSPi serial DDR clock differential N
2
SLVS1P
Output
HiSPi serial data, lane 1, differential P
3
SLVS1N
Output
HiSPi serial data, lane 1, differential N
4
SLVS0P
Output
HiSPi serial data, lane 0, differential P
5
SLVS0N
Output
HiSPi serial data, lane 0, differential N
6
VDD_SLVS
Power
SLVS Power 0.3 V-0.6 V
7
DGND
Power
Digital ground
8
VDD_PLL
Power
PLL power
9
EXTCLK
Input
External input clock
10
VAA
Power
Analog Power
11
AGND
Power
Analog Ground
12
VDD_IO
Power
I/O Power Supply
13
VDD
Power
Digital Power
14
DGND
Power
Digital ground
15
Reserved
16
VAA
Power
Analog Power
17
AGND
Power
Analog Ground
18
DGND
Power
Digital ground
19
VDD
Power
Digital Power
20
VDD_IO
Power
I/O Power Supply
21
FLASH
Output
Flash control output
22
TEST
Input
Manufacturing test enable pin (connect to DGNG)
23
SDATA
I/O
Two-Wire Serial data I/O
24
SADDR
Input
Two-Wire Serial address select. 0: 0x20, 1: 0x30
25
SCLK
Input
Two-Wire Serial clock input
26
RESET_BAR
Input
27
OE_BAR
Input
Asynchronous reset (active LOW). All settings are restored to
factory default
Output enable (active LOW)
28
TRIGGER
Input
Exposure synchronization input
29
SHUTTER
Output
30
VDD_IO
Power
Control for external mechanical shutter. Can be left floating if
not used.
I/O Power Supply
31
VDD
Power
Digital Power
32
DGND
Power
Digital ground
33
AGND
Power
Analog Ground
34
VAA_PIX
Power
Pixel Power
35
VAA
Power
Analog Power
36
Reserved
37
VAA
Power
Analog Power
38
VAA_PIX
Power
Pixel Power
39
AGND
Power
Analog Ground
AR0237CS/D Rev. 4, 6/16 EN
12
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
Table 4:
mPLCC HiSPi Pin Out
40
DGND
Power
Digital ground
41
VDD
Power
Digital Power
42
VDD_IO
Power
I/O Power Supply
43
VDD 1V8_PHY
Power
1.8 V supply for HiVcm mode
44
SLSV3P
Output
HiSPi serial data, lane 3, differential P
45
SLVS3N
Output
HiSPi serial data, lane 3, differential N
46
SLVS2P
Output
HiSPi serial data, lane 2, differential P
47
SLVS2N
Output
HiSPi serial data, lane 2, differential N
48
SLVSLCP
Output
HiSPi serial DDR clock differential P
AR0237CS/D Rev. 4, 6/16 EN
13
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
Figure 6:
48 Pin mPLCC Package Parallel
Table 5:
mPLCC Parallel Pin Out
Pin
Name
Type
Description
1
DOUT6
Output
Data output 6
2
DOUT7
Output
Data output 7
3
DOUT8
Output
Data output 8
4
DOUT9
Output
Data output 9
5
DOUT10
Output
Data output 10
6
DOUT11
Power
Data output 11
7
DGND
Power
Digital ground
8
VDD_PLL
Power
PLL power
9
EXTCLK
Input
External input clock
10
VAA
Power
Analog Power
11
AGND
Power
Analog Ground
12
VDD_IO
Power
I/O Power Supply
13
VDD
Power
Digital Power
14
DGND
Power
Digital ground
15
Reserved
16
VAA
Power
Analog Power
17
AGND
Power
Analog Ground
18
VDD
Power
Digital Power
19
VDD_IO
Power
I/O Power Supply
20
FLASH
Power
Flash control output
21
PIXCLK
Output
Pixel Clock
22
FRAME_VALID
Output
Frame Valid
23
TEST
Input
Manufacturing test enable pin (connect to DGNG)
24
DGND
Power
Digital Ground
AR0237CS/D Rev. 4, 6/16 EN
14
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
Table 5:
mPLCC Parallel Pin Out
25
SDATA
I/O
Two-Wire Serial data I/O
26
LINE_VALID
Output
Line Valid
27
SADDR
Input
Two-Wire Serial address select. 0: 0x20, 1: 0x30
28
SCLK
Input
Two-Wire Serial clock input
29
VDD_IO
Power
I/O Power Supply
30
VDD
Power
Digital Power
31
RESET_BAR
Input
Asynchronous reset (active LOW). All settings are restored to factory default
32
OE_BAR
Input
Output enable (active LOW)
33
TRIGGER
Input
Exposure synchronization input
34
SHUTTER
Output
Control for external mechanical shutter. Can be left floating if not used.
35
RESERVED
Input
Reserved
36
AGND
Power
Analog Ground
37
VAA_2V8
Power
Analog Power
38
VAA_PIX
Power
Pixel Power
39
AGND
Power
Analog Ground
40
DGND
Power
Digital ground
41
VDD
Power
Digital Power
42
VDD_IO
Power
I/O Power Supply
43
DOUT0
Output
Data Output 0
44
DOUT1
Output
Data Output 1
45
DOUT2
Output
Data Output 2
46
DOUT3
Output
Data Output 3
47
DOUT4
Output
Data Output 4
48
DOUT5
Output
Data Output 5
AR0237CS/D Rev. 4, 6/16 EN
15
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Pixel Data Format
Pixel Data Format
Pixel Array Structure
While the sensor's format is 1928 x1088, additional active columns and active rows are
included for use when horizontal or vertical mirrored readout is enabled, to allow
readout to start on the same pixel. The pixel adjustment is always performed for monochrome or color versions. The active area is surrounded with optically transparent
dummy pixels to improve image uniformity within the active area. Not all dummy pixels
or barrier pixels can be read out.
Figure 7:
Pixel Array Description
1944
10 barrier + 4 border pixels
19281 x 1088
5.78 mm x 3.26 mm
1116
2 barrier + 6 border pixels
2 barrier + 6 border pixels
10 barrier + 4 border pixels
Light dummy
pixel
AR0237CS/D Rev. 4, 6/16 EN
Active pixel
16
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Pixel Data Format
Figure 8:
Pixel Color Pattern Detail (RGB) (Top Right Corner)
Column Readout Direction
Row Readout Direction
Figure 9:
Active Pixel (0,0)
Array Pixel (0, 0)
R G
R
G R
G R
G
G B
G
B G
B G
B
R G
R
G R
G R
G
G B
G
B G
B G
B
R G
R
G R
G R
G
G B
G
B G
B G
B
Pixel Color Pattern Detail RGB IR (Top Right Corner)
Column Readout Direction
Row Readout Direction
AR0237CS/D Rev. 4, 6/16 EN
Active Pixel (0,0)
Array Pixel (0, 0)
B G
R
G B
G IR G IR G
R G
B
G R
G IR G IR G
G R
G
IR G IR
G B
G
IR G IR
17
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Pixel Data Format
Default Readout Order
By convention, the sensor core pixel array is shown with pixel (0,0) in the top right
corner (see Figure 8). This reflects the actual layout of the array on the die. Also, the first
pixel data read out of the sensor in default condition is that of pixel (10, 14).
When the sensor is imaging, the active surface of the sensor faces the scene as shown in
Figure 10. When the image is read out of the sensor, it is read one row at a time, with the
rows and columns sequenced as shown in Figure 10.
Figure 10:
Imaging a Scene
Lens
Scene
Sensor (rear view)
Row
Readout
Order
Column Readout Order
AR0237CS/D Rev. 4, 6/16 EN
Pixel (0,0)
18
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Features Overview
Features Overview
For a complete description, recommendations, and usage guidelines for product
features, refer to the AR0237 Developer Guide.
3.0m Dual Conversion Gain Pixel
To improve the low light performance and keep the high dynamic range, a large (3.0um)
dual conversion gain pixel is implemented for better image optimization. With a dual
conversion gain pixel, the conversion gain of the pixel may be dynamically changed to
better adapt the pixel response based on dynamic range of the scene.
HDR
By default, the sensor powers up in Linear Mode. One can change to HDR Mode. The
HDR scheme used is multi-exposure HDR. This allows the sensor to handle up to 96 dB
of dynamic range. In HDR mode, the sensor sequentially captures two exposures by
maintaining two separate read and reset pointers that are interleaved within the rolling
shutter readout. The exposure ratio may be set to 4x, 8x, 16x, or 32x. Sensor also provides
flexibility to choose any exposure ratio by setting number of t2 exposure rows independent of the t1 exposure. The data will be output as line interleaved data as described in
the T1/T2 Line Interleaved Mode section. There is also an option to output either T1
only or T2 only.
Resolution
The active array supports a maximum of 1928x1088 pixels to support 1080p resolution.
Utilizing a 3.0um pixel will result in an optical format of 1/2.7-inch (approximately
6.6mm diagonal).
Frame Rate
At full (1080p) resolution, the AR0237 is capable of running up to 60 fps in linear mode
and 30 fps in line interleaved mode.
Image Acquisition Mode
The AR0237 supports two image acquisition modes:
• Electronic rolling shutter (ERS) mode
This is the normal mode of operation. When the AR0237 is streaming, it generates
frames at a fixed rate, and each frame is integrated (exposed) using the ERS. When ERS
mode is in use, timing and control logic within the sensor sequences through the rows of
the array, resetting and then reading each row in turn. In the time interval between resetting a row and subsequently reading that row, the pixels in the row integrate incident
light. The integration (exposure) time is controlled by varying the time between row
reset and row readout. For each row in a frame, the time between row reset and row
readout is the same, leading to a uniform integration time across the frame. When the
integration time is changed (by using the two-wire serial interface to change register
settings), the timing and control logic controls the transition from old to new integration
time in such a way that the stream of output frames from the AR0237 switches cleanly
from the old integration time to the new while only generating frames with uniform integration. See “Changes to Integration Time” in the AR0237 Register Reference.
AR0237CS/D Rev. 4, 6/16 EN
19
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Features Overview
• Global reset mode.
This mode can be used to acquire a single image at the current resolution. In this mode,
the end point of the pixel integration time is controlled by an external electromechanical
shutter, and the AR0237 provides control signals to interface to that shutter. The benefit
of using an external electromechanical shutter is that it eliminates the visual artifacts
associated with ERS operation. Visual artifacts arise in ERS operation, particularly at low
frame rates, because an ERS image effectively integrates each row of the pixel array at a
different point in time.
Embedded Data and Statistics
The AR0237 has the capability to output image data and statistics embedded within the
frame timing. There are two types of information embedded within the frame readout.
• Embedded Data:
If enabled, these are displayed on the two rows immediately before the first active
pixel row is displayed.
• Embedded Statistics:
If enabled, these are displayed on the two rows immediately after the last active pixel
row is displayed.
Multi-Camera Synchronization
The AR0237 supports advanced line synchronization controls for multi-camera (stereo)
support.
Slave Mode
The slave mode feature of the AR0237 supports triggering the start of a frame readout
from an input signal that is supplied from an external ASIC. The slave mode signal allows
for precise control of frame rate and register change updates.
Context Switching and Register Updates
The user has the option of using the highly configurable context memory, or a simplified
implementation in which only a subset of registers is available for switching. The
AR0237 supports a highly configurable context switching RAM of size 256 x 16. Within
this Context Memory, changes to any register may be stored. The register set for each
context must be the same, but the number of contexts and registers per context are
limited only by the size of the context memory.
Alternatively, the user may switch between two predefined register sets A and B by
writing to a context switch change bit. When the context switch is configured to context
A the sensor will reference the context A registers. If the context switch is changed from A
to B during the readout of frame n, the sensor will then reference the context B
coarse_integration_time registers in frame n+1 and all other context B registers at the
beginning of reading frame n+2. The sensor will show the same behavior when changing
from context B to context A. The registers listed in Table 6 are context-switchable:
AR0237CS/D Rev. 4, 6/16 EN
20
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Features Overview
Table 6:
List of Configurable Registers for Context A and Context B
Context A
Context B
Register Description
Register Description
coarse_integration_time
coarse_integration_time_cb
line_length_pck
line_length_pck_cb
frame_length_lines
frame_length_lines_cb
row_bin
row_bin_cb
col_bin
col_bin_cb
fine_gain
fine_gain_cb
coarse_gain
coarse_gain_cb
coarse_integration_time2
coarse_integration_time2_cb
dcg_manual_set
dcg_manual_set_cb
dcg_manual_set_t1
dcg_manual_set_t1_cb
bypass_pix_comb
bypass_pix_cb
coarse_gain_t1
coarse_gain_t1_cb
fine_gain_t1
fine_gain_t1_cb
x_addr_start
x_addr_start_cb
y_addr_start
y_addr_start_cb
x_addr_end
x_addr_end_cb
y_addr_end
y_addr_end_cb
y_odd_inc
y_odd_inc_cb
x_odd_inc
x_odd_inc_cb
green1_gain
green1_gain_cb
blue_gain
blue_gain_cb
red_gain
red_gain_cb
green2_gain
green2_gain_cb
global_gain
global_gain_cb
operation_mode_ctrl
operation_mode_ctrl_cb
bypass_pix_comb
bypass_pix_comb_cb
Analog/Digital Gains
A programmable analog gain of 1.0x to 16x (linear and HDR) applied simultaneously to
all color channels will be featured along with a digital gain of 1x to 16x that may be
configured on a per color channel basis. Note that with the RGB IR sensor digital gain
should only be applied to all color channels equally since with the 4x4 kernel the gains
will not be applied to the proper color channel. Analog gain can be applied per exposure
in line interleaved mode.
Skipping/Binning Modes
The AR0237 supports subsampling. Subsampling allows the sensor to read out a smaller
set of active pixels by either skipping, binning, or summing pixels within the readout
window. Horizontal binning is achieved in the digital readout. The sensor will sample
the combined 2x adjacent pixels within the same color plane. Vertical row binning is
applied in the pixel readout. Row binning can be configured as 2x rows within the same
color plane. Pixel skipping can be configured up to 2x in both the x-direction and y-
AR0237CS/D Rev. 4, 6/16 EN
21
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Features Overview
direction. Skipping pixels in the x-direction will not reduce the row time. Skipping pixels
in the y direction will reduce the number of rows from the sensor effectively reducing the
frame time. Skipping will introduce image artifacts from aliasing.
The AR0237 supports row wise vertical binning. Row wise vertical summing is only
supported in monochrome sensors.
Binning and summing is not supported with RGB IR sensors.
Clocking Options
The sensor contains a phase-locked loop (PLL) that is used for timing generation and
control. The required VCO clock frequency is attained through the use of a pre-PLL clock
divider followed by a multiplier. The PLL multiplier should be an even integer. If an odd
integer (M) is programmed, the PLL will default to the lower (M-1) value to maintain an
even multiplier value. The multiplier is followed by a set of dividers used to generate the
output clocks required for the sensor array, the pixel analog and digital readout paths,
and the output parallel and serial interfaces. Use of the PLL is required when using the
HiSPi interface.
Temperature Sensor
The AR0237 sensor has a built-in PTAT-based temperature sensor, accessible through
registers, that is capable of measuring die junction temperature. The value read out from
the temperature sensor register is an ADC output value that needs to be converted
downstream to a final temperature value in degrees Celsius. Since the PTAT device characteristic response is quite linear in the temperature range of operation required, a
simple linear function can be used to convert the ADC output value to the final temperature in degrees Celsius.
A single reference point will be made available via register read as well as a slope for
back-calculating the junction temperature value. An error of +/-5% or better over the full
specified operating range of the sensor is to be expected.
Silicon / Firmware / Sequencer Revision Information
A revision register will be provided to read out (via I2C) silicon and sequencer/OTPM
revision information. This will be helpful to distinguish among different lots of material
if there are future OTPM or sequencer revisions.
Lens Shading Correction
The latest lens shading correction algorithm will be included for potential low Z height
applications.
Compression
When the AR0237 is configured for linear mode operation, the sensor can optionally
compress 12-bit data to 10-bit using A-law compression. The A-law compression is
disabled by default.
Packaging
The AR0237 will be offered in a 10x10 80-iBGA package (parallel and HiSPi) and a
11.43x1143 48 pin mPLCC (HiSSPi) package.
AR0237CS/D Rev. 4, 6/16 EN
22
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Features Overview
Parallel Interface
The parallel pixel data interface uses these output-only signals:
• FRAME_VALID
• LINE_VALID
• PIXCLK
• DOUT[11:0]
The parallel pixel data interface is disabled by default at power up and after reset. It can
be enabled by programming R0x301A. When the parallel pixel data interface is in use,
the serial data output signals can be left unconnected.
High Speed Serial Pixel (HiSPi) Interface
The HiSPi interface supports three protocols, Streaming-S, Streaming-SP, and Packetized
SP. The streaming protocols conform to a standard video application where each line of
active or intra-frame blanking provided by the sensor is transmitted at the same length.
The Packetized SP protocol will transmit only the active data ignoring line-to-line and
frame-to-frame blanking data.
The HiSPi interface building block is a unidirectional differential serial interface with
four data and one double data rate (DDR) clock lanes. One clock for every four serial
data lanes is provided for phase alignment across multiple lanes. The AR0237 supports
serial data widths of 10 or 12 bits on one, two, or four lanes. The specification includes a
DLL to compensate for differences in group delay for each data lane. The DLL is
connected to the clock lane and each data lane, which acts as a control master for the
output delay buffers. Once the DLL has gained phase lock, each lane can be delayed in
1/8 unit interval (UI) steps. This additional delay allows the user to increase the setup or
hold time at the receiver circuits and can be used to compensate for skew introduced in
PCB design. Delay compensation may be set for clock and/or data lines in the
hispi_timing register R0x31C0. If the DLL timing adjustment is not required, the data
and clock lane delay settings should be set to a default code of 0x0000 to reduce jitter,
skew, and power dissipation.
Sensor Control Interface
The two-wire serial interface bus enables read/write access to control and status registers within the AR0237. The interface protocol uses a master/slave model in which a
master controls one or more slave devices. The sensor acts as a slave device. The master
generates a clock (SCLK) that is an input to the sensor and is used to synchronize transfers.
Data is transferred between the master and the slave on a bidirectional signal (SDATA).
SDATA is pulled up to VDD_IO off-chip by a 1.5k resistor. Either the slave or master
device can drive SDATA LOW-the interface protocol determines which device is allowed
to drive SDATA at any given time. The two-wire serial interface can run at 100 kHz or 400
kHz.
T1/T2 Line Interleaved Mode
The AR0237 outputs the T1 and T2 exposures separately, in a line interleaved format.
The purpose of this is to enable off chip HDR linear combination and processing. See the
AR0237 Developer Guide for more information.
AR0237CS/D Rev. 4, 6/16 EN
23
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Features Overview
Figure 11:
Quantum Efficiency - RGB
80
70
60
Quantum Efficiency (%)
50
Red
40
Green
Blue
30
20
10
0
350
AR0237CS/D Rev. 4, 6/16 EN
450
550
650
750
Wavelength (nm)
24
850
950
1050
1150
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Features Overview
Figure 12:
Quantum Efficiency - RGB - IR
70
60
Quantum Efficiency (%)
50
40
Red (%)
Green (R) (%)
Green (B) (%)
Blue (%)
30
IR (%)
20
10
0
0
AR0237CS/D Rev. 4, 6/16 EN
200
400
600
Wavelength (nm)
800
25
1000
1200
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Electrical Specifications
Electrical Specifications
Unless otherwise stated, the following specifications apply under the following conditions: VDD = 1.8V – 0.10/+0.15; VDD_IO = VDD_PLL = VAA = VAA_PIX = 2.8V ± 0.3V;
VDD_SLVS = 0.4V – 0.1/+0.2; TA = -30°C to +85°C-40°C to +105°C; output load = 10pF;
frequency = 74.25 MHz; HiSPi off.
Two-Wire Serial Register Interface
The electrical characteristics of the two-wire serial register interface (SCLK, SDATA) are
shown in Figure 13 and Table 7.
Figure 13:
Two-Wire Serial Bus Timing Parameters
SDATA
tLOW
tf
tf
tSU;DAT
tr
tHD;STA
tr
tBUF
SCLK
S
tHD;STA
tHD;DAT
Note:
Table 7:
tSU;STA
tHIGH
tSU;STO
Sr
P
S
Read sequence: For an 8-bit READ, read waveforms start after WRITE command and register
address are issued.
Two-Wire Serial Bus Characteristics
fEXTCLK = 27 MHz; VDD = 1.8V; VDD_IO = 2.8V; VAA = 2.8V; VAA_PIX = 2.8V; VDD_PLL = 2.8V; T = 25°C
A
Standard Mode
Parameter
Symbol
Min
Max
fSCL
0
tHD;STA
4.0
LOW period of the SCLK clock
tLOW
HIGH period of the SCLK clock
t
SCLK Clock Frequency
Hold time (repeated) START condition.
After this period, the first clock pulse is
generated
Fast Mode
Min
Max
Unit
100
0
400
KHz
-
0.6
-
s
4.7
-
1.3
-
s
HIGH
4.0
-
0.6
-
s
Set-up time for a repeated START
condition
t
SU;STA
4.7
-
0.6
-
s
Data hold time
t
HD;DAT
04
3.455
06
0.95
s
Data set-up time
t
6
SU;DAT
250
-
100
-
ns
Rise time of both SDATA and SCLK signals
tr
-
1000
20 + 0.1Cb7
300
ns
Fall time of both SDATA and SCLK signals
t
7
Set-up time for STOP condition
Bus free time between a STOP and START
condition
Capacitive load for each bus line
AR0237CS/D Rev. 4, 6/16 EN
f
-
300
20 + 0.1Cb
300
ns
tSU;STO
4.0
-
0.6
-
s
tBUF
4.7
-
1.3
-
s
Cb
-
400
-
400
pF
26
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Electrical Specifications
Table 7:
Two-Wire Serial Bus Characteristics (continued)
f
EXTCLK = 27 MHz; VDD = 1.8V; VDD_IO = 2.8V; VAA = 2.8V; VAA_PIX = 2.8V; VDD_PLL = 2.8V; TA = 25°C
Standard Mode
Fast Mode
Parameter
Symbol
Min
Max
Min
Max
Unit
Serial interface input pin capacitance
CIN_SI
-
3.3
-
3.3
pF
SDATA max load capacitance
SDATA pull-up resistor
Notes:
CLOAD_SD
-
30
-
30
pF
RSD
1.5
4.7
1.5
4.7
K
This table is based on I2C standard (v2.1 January 2000). Philips Semiconductor.
Two-wire control is I2C-compatible.
All values referred to VIHmin = 0.9 VDD and VILmax = 0.1VDD levels. Sensor EXCLK = 27 MHz.
A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the
undefined region of the falling edge of SCLK.
5. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of
the SCLK signal.
6. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement
tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch
the LOW period of the SCLK signal. If such a device does stretch the LOW period of the SCLK signal, it
must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according
to the Standard-mode I2C-bus specification) before the SCLK line is released.
7. Cb = total capacitance of one bus line in pF.
1.
2.
3.
4.
I/O Timing
By default, the AR0237 launches pixel data, FV, and LV with the falling edge of PIXCLK.
The expectation is that the user captures DOUT[11:0], FV, and LV using the rising edge of
PIXCLK.
See Figure 14 below and Table 8 on page 28 for I/O timing (AC) characteristics.
Figure 14:
I/O Timing Diagram
tR
t RP
tF
t FP
90%
90%
10%
10%
t EXTCLK
EXTCLK
PIXCLK
t PD
Data[11:0]
LINE_VALID/
FRAME_VALID
AR0237CS/D Rev. 4, 6/16 EN
Pxl _0
Pxl _1
Pxl _2
Pxl _n
t PLH
t PFL
t PFH
t PLL
FRAME_VALID leads LINE_VALID by 6 PIXCLKs.
27
FRAME_VALID trails
LINE_VALID by 6 PIXCLKs.
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Electrical Specifications
Table 8:
I/O Timing Characteristics
Symbol
Definition
fEXTCLK1s
Input clock frequency
Condition
tEXTCLK1
Input clock period
Min
Typ
Max
Unit
6
–
48
MHz
20.8
–
166
ns
tR
Input clock rise time
–
3
–
ns
–
3
–
ns
tF
Input clock fall time
tRP
Pixclk rise time
2
3.5
5
ns
tFP
Pixclk fall time
2
3.5
5
ns
Clock duty cycle
45
50
55
%
EXTCLK to PIXCLK propagation delay
Nominal voltages,
PLL Disabled
10
14
18
ns
PIXCLK frequency
Default,
Nominal Voltages
6
–
74.25
MHz
tPD
PIXCLK to data valid
Default,
Nominal Voltages
–
3
–
ns
tPFH
PIXCLK to FV HIGH
Default,
Nominal Voltages
–
3
–
ns
tPLH
PIXCLK to LV HIGH
Default,
Nominal Voltages
–
3
–
ns
tPFL
PIXCLK to FV LOW
Default,
Nominal Voltages
–
3
–
ns
tPLL
PIXCLK to LV LOW
Default,
Nominal Voltages
–
3
–
ns
Output load capacitance
–
<10
–
pF
Input pin capacitance
–
2.5
–
pF
tCP
fPIXCLK
CLOAD
CIN
Note:
AR0237CS/D Rev. 4, 6/16 EN
I/O timing characteristics are measured under the following conditions:
- Temperature is 25°C ambient
- 10 pF load
- 1.8V I/O supply voltage
28
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Electrical Specifications
DC Electrical Characteristics
The DC electrical characteristics are shown in the tables below.
Table 9:
DC Electrical Characteristics
Symbol
Definition
Condition
Min
Typ
Max
Unit
VDD
Core digital voltage
1.7
1.8
1.95
V
VDD_IO
I/O digital voltage
1.7/2.5
1.8/2.8
1.9/3.1
V
Analog voltage
2.5
2.8
3.1
V
VAA_PIX
VAA
Pixel supply voltage
2.5
2.8
3.1
V
VDD_PLL
PLL supply voltage
2.5
2.8
3.1
V
VDD_SLVS
HiSPi supply voltage
0.3
0.4
0.6
V
VIH
Input HIGH voltage
VDD_IO*0.7
–
–
V
VIL
Input LOW voltage
–
–
VDD_IO*0.3
V
20
–
–
A
IIN
Input leakage current
No pull-up resistor; VIN = VDD_IO or
DGND
VOH
Output HIGH voltage
VDD_IO-0.3
–
–
V
VOL
Output LOW voltage
–
–
0.4
V
IOH
Output HIGH current
At specified VOH
-22
–
–
mA
IOL
Output LOW current
At specified VOL
–
–
22
mA
Caution
Table 10:
Stresses greater than those listed in Table 10 may cause permanent damage to the device.
This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol
Definition
Condition
Min
Max
Unit
VDD_MAX
Core digital voltage
–0.3
2.4
V
VDD_IO_MAX
I/O digital voltage
–0.3
4
V
VAA_MAX
Analog voltage
–0.3
4
V
VAA_PIX
Pixel supply voltage
–0.3
4
V
VDD_PLL
PLL supply voltage
–0.3
4
V
HiSPi I/O digital voltage
–0.3
2.4
V
Storage temperature
–40
85
°C
VDD_SLVS_MAX
tST
Note:
AR0237CS/D Rev. 4, 6/16 EN
Exposure to absolute maximum rating conditions for extended periods may affect reliability.
29
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Electrical Specifications
Table 11:
1080p30 Linear 74 MHz Parallel 2.8V
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Unit
Digital operating current
Streaming 1080p30
IDD
1.8
20
34
50
mA
I/O digital operating current
Streaming 1080p30
IDD_IO
2.8
15
28
50
mA
Analog operating current
Streaming 1080p30
IAA
2.8
15
26
50
mA
Pixel supply current
Streaming 1080p30
IAA_PIX
2.8
1
3
7
mA
PLL supply current
Streaming 1080p30
IDD_PLL
2.8
5.5
6.4
7
mA
Power
138.2
238.72
409.2
mW
Note:
Table 12:
Operating currents are measured in mA at the following conditions:
- VAA = VAA_PIX = VDD_PLL = VDD_IO =2.8 V
- VDD= 1.8 V
- PLL Enabled and PIXCLK = 74.25 MHz
- Low power mode enabled
- TA = 25°C
1080p30 Linear 74 MHz Parallel 1.8V
Condition
Symbol
Voltage
Min
Typ
Max
Unit
Digital operating current
Definition
Streaming 1080p30
IDD
1.8
20
34
50
mA
I/O digital operating current
Streaming 1080p30
IDD_IO
1.8
10
14
30
mA
Analog operating current
Streaming 1080p30
IAA
2.8
15
26
50
mA
Pixel supply current
Streaming 1080p30
IAA_PIX
2.8
1
3
7
mA
PLL supply current
Streaming 1080p30
IDD_PLL
2.8
5.5
6.4
7
mA
Power
114.2
185.52
323.2
mW
Note:
AR0237CS/D Rev. 4, 6/16 EN
Operating currents are measured in mA at the following conditions:
- VAA = VAA_PIX = VDD_PLL =2.8 V
- VDD = VDD_IO= 1.8 V
- PLL Enabled and PIXCLK = 74.25 MHz
- Low power mode enabled
- TA = 25°C Dark Image, 8x Analog Gain, HCG, 20ms integration time
30
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Electrical Specifications
Table 13:
1080p30 Linear 74 MHz HiSPi SLVS
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Unit
Digital Operating Current
Streaming 1080p30
IDD
1.8
25
44
65
mA
Analog Operating Current
Streaming 1080p30
IAA
2.8
15
26
50
mA
Pixel Supply Current
Streaming 1080p30
IAA_PIX
2.8
1
3
7
mA
PLL Supply Current
Streaming 1080p30
IDD_PLL
2.8
6
7.5
8.5
mA
SLVS Supply Current
Streaming 1080p30
IDD_SLVS
Note:
Table 14:
0.4
6
9.5
14
mA
Power
109
185.2
306
mW
Operating currents are measured in mA at the following conditions:
- VAA = VAA_PIX = VDD_PLL =2.8 V
- VDD = VDD_IO= 1.8 V
- VDD_SLVS= 0.4V
- PLL Enabled and PIXCLK = 74.25 MHz
- 4-lane HiSPi mode
- Low power mode enabled
- TA = 25°C Dark Image, 8x Analog Gain, HCG, 20ms integration time
1080p30 Linear 74 MHz HiSPi HiVcm
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Unit
Digital Operating Current
Streaming 1080p30
IDD
1.8
25
44
65
mA
Analog Operating Current
Streaming 1080p30
IAA
2.8
15
26
50
mA
Pixel Supply Current
Streaming 1080p30
IAA_PIX
2.8
1
3
7
mA
PLL Supply Current
Streaming 1080p30
IDD_PLL
2.8
6
7.5
8.5
mA
SLVS Supply Current
Streaming 1080p30
IDD_SLVS
1.8
12
20
35
mA
Power
128.2
217.4
363.4
mW
Note:
AR0237CS/D Rev. 4, 6/16 EN
Operating currents are measured in mA at the following conditions:
- VAA = VAA_PIX = VDD_PLL =2.8 V
- VDD = VDD_IO = VDD_SLVS= 1.8 V
- PLL Enabled and PIXCLK = 74.25 MHz
- 4-lane HiSPi mode
- Low power mode enabled
- TA = 25°C Dark Image, 8x Analog Gain, HCG, 20ms integration time
31
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Electrical Specifications
Table 15:
1080p30 74 MHz Line Interleaved SLVS
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Unit
Digital Operating Current
Streaming 1080p30
IDD
1.8
50
88
130
mA
Analog Operating Current
Streaming 1080p30
IAA
2.8
20
36
60
mA
Pixel Supply Current
Streaming 1080p30
IAA_PIX
2.8
1
4
8
mA
PLL Supply Current
Streaming 1080p30
IDD_PLL
2.8
7
8.5
9.5
mA
SLVS Supply Current
Streaming 1080p30
IDD_SLVS
0.4
6
9.5
14
mA
Power
170.8
298
442.6
mW
Note:
Table 16:
Operating currents are measured in mA at the following conditions:
- VAA = VAA_PIX = VDD_PLL =2.8 V
- VDD = VDD_IO= 1.8 V
- VDD_SLVS= 0.4V
- PLL Enabled and PIXCLK = 74.25 MHz
- 4-lane HiSPi mode
- TA= 25°C Dark Image, 8x Analog Gain, HCG, 20ms integration time
1080p30 74 MHz Line Interleaved HiVcm
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Unit
Digital Operating Current
Streaming 1080p30
IDD
1.8
50
88
130
mA
Analog Operating Current
Streaming 1080p30
IAA
2.8
20
36
60
mA
Pixel Supply Current
Streaming 1080p30
IAA_PIX
2.8
1
4
8
mA
PLL Supply Current
Streaming 1080p30
IDD_PLL
2.8
7
8.5
9.5
mA
SLVS Supply Current
Streaming 1080p30
IDD_SLVS
1.8
12
20
35
mA
Power
190
330.2
500
mW
Note:
Operating currents are measured in mA at the following conditions:
- VAA = VAA_PIX = VDD_PLL = 2.8 V
- VDD= VDD_IO = 1.8 V
- VDD_SLVS = 1.8 V
- PLL Enabled and PIXCLK = 74.25 MHz
- 4-lane HiSPi mode
- TA = 25°C Dark Image, 8x Analog Gain, HCG, 20ms integration time
HiSPi Electrical Specifications
The ON Semiconductor AR0237 sensor supports both SLVS and HiVCM HiSPi modes.
Refer to the High-Speed Serial Pixel (HiSPi) Interface Physical Layer Specification
v2.00.00 for electrical definitions, specifications, and timing information. The VDD_SLVS
supply in this datasheet corresponds to VDD_TX in the HiSPi Physical Layer Specification. Similarly, VDD is equivalent to VDD_HiSPi as referenced in the specification. The
DLL as implemented on AR0237 is limited in the number of available delay steps and
differs from the HiSPi specification as described in this section.
Table 17:
Channel Skew
Measurement Conditions: VDD_HiSPi = 1.8V;VDD_HiSPi_TX = 0.4V; Data Rate =480 Mbps; DLL set to 0
Data Lane Skew in Reference to Clock
AR0237CS/D Rev. 4, 6/16 EN
tCHSKEW1PHY
32
-150
ps
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Power-On Reset and Standby Timing
Power-On Reset and Standby Timing
Power-Up Sequence
The recommended power-up sequence for the AR0237 is shown in Figure 15. The available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA, VAA_PIX) must have the
separation specified below.
1. Turn on VDD_PLL power supply.
2. After 100s, turn on VAA and VAA_PIX power supply.
3. After 100s, turn on VDD_IO power supply.
4. After 100s, turn on VDD power supply.
5. After 100s, turn on VDD_SLVS power supply.
6. After the last power supply is stable, enable EXTCLK.
7. Assert RESET_BAR for at least 1ms. The parallel interface will be tri-stated during this
time.
8. Wait 150000 EXTCLKs (for internal initialization into software standby.
9. Configure PLL, output, and image settings to desired values.
10. Wait 1ms for the PLL to lock.
11. Set streaming mode (R0x301a[2] = 1).
Figure 15:
Power Up
VDD_PLL (2.8)
VAA_PIX
VAA (2.8)
VDD_IO (1.8/2.8)
VDD (1.8)
t0
t1
t2
t3
VDD_SLVS (0.4)
EXTCLK
t4
RESET_BAR
tx
t5
Hard Reset
AR0237CS/D Rev. 4, 6/16 EN
33
Internal
Initialization
t6
Software
Standby
PLL Lock
Streaming
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Power-On Reset and Standby Timing
Table 18:
Power-Up Sequence
Definition
Symbol
Minimum
Typical
Maximum
Unit
VDD_PLL to VAA/VAA_PIX3
VAA/VAA_PIX to VDD_IO
VDD_IO to VDD
VDD to VDD_SLVS
Xtal settle time
Hard Reset
Internal Initialization
PLL Lock Time
t0
t1
t2
t3
tx
t4
t5
t6
0
0
0
0
–
12
150000
1
100
100
100
100
301
–
–
–
–
–
–
–
–
–
–
–
s
s
s
s
ms
ms
EXTCLKs
ms
Notes:
AR0237CS/D Rev. 4, 6/16 EN
1. Xtal settling time is component-dependent, usually taking about 10 – 100 ms.
2. Hard reset time is the minimum time required after power rails are settled. In a circuit where Hard
reset is held down by RC circuit, then the RC time must include the all power rail settle time and
Xtal settle time.
3. It is critical that VDD_PLL is not powered up after the other power supplies. It must be powered
before or at least at the same time as the others. If the case happens that VDD_PLL is powered after
other supplies then sensor may have functionality issues and will experience high current draw on
this supply.
34
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Power-On Reset and Standby Timing
Power-Down Sequence
The recommended power-down sequence for the AR0237 is shown in Figure 16. The
available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA, VAA_PIX) must have
the separation specified below.
1. Disable streaming if output is active by setting standby R0x301a[2] = 0
2. The soft standby state is reached after the current row or frame, depending on configuration, has ended.
3. Turn off VDD_SLVS.
4. Turn off VDD.
5. Turn off VDD_IO.
6. Turn off VAA/VAA_PIX.
7. Turn off VDD_PLL.
Figure 16:
Power Down
VDD_SLVS (0.4)
t0
VDD (1.8)
t1
V DD_IO (1.8/2.8)
t2
VAA_PIX
VAA (2.8)
t3
VDD_PLL (2.8)
EXTCLK
t4
Power Down until next Power up cycle
Table 19:
Power-Down Sequence
Definition
Symbol
Minimum
Typical
Maximum
Unit
VDD_SLVS to VDD
VDD to VDD_IO
VDD_IO to VAA/VAA_PIX
VAA/VAA_PIX to VDD_PLL
Power Down until Next Power Up Time
t0
t1
t2
t3
t4
0
0
0
0
100
–
–
–
–
–
–
–
–
–
–
s
s
s
s
ms
t4 is required between power down and next power up time; all decoupling caps from
regulators must be completely discharged.
AR0237CS/D Rev. 4, 6/16 EN
35
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Power-On Reset and Standby Timing
Package Diagrams
Figure 17:
PLCC 48 11.43 x 11.43 Package Diagram (Case 776AQ)
PLCC48 11.43x11.43
CASE 776AQ
ISSUE A
DATE 20 NOV 2015
AR0237CS/D Rev. 4, 6/16 EN
36
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Power-On Reset and Standby Timing
Figure 18:
80iBGA 10x10 Package Diagram (Case 503BA)
IBGA80 10x10
CASE 503BA
ISSUE O
DATE 07 JUL 2015
AR0237CS/D Rev. 4, 6/16 EN
37
©Semiconductor Components Industries, LLC, 2016.
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
ON Semiconductor and the ON Logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor's product/patent coverage may be
accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no
warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using
ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by
ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. ON Semiconductor does not convey any license under its patent
rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or
medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for
any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims,
costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject
to all applicable copyright laws and is not for resale in any manner.
AR0237CS/D Rev. 4, 6/16 EN
38
©Semiconductor Components Industries, LLC,2016 .