KAC 06040 D

KAC-06040
2832 (H) x 2128 (V)
CMOS Image Sensor
Description
The KAC−06040 Image Sensor is a high-speed 6 megapixel CMOS
image sensor in a 1″ optical format based on a 4.7 mm 5T CMOS
platform. The image sensor features very fast frame rate, excellent
NIR sensitivity, and flexible readout modes with multiple regions of
interest (ROI). The readout architecture enables use of 8, 4, or 2 LVDS
output banks for full resolution readout of 160 frames per second.
Each LVDS output bank consists of up to 8 differential pairs
operating at 200 MHz DDR for a 400 Mbps data rate per pair.
The pixel architecture allows rolling shutter operation for motion
capture with optimized dynamic range or global shutter for precise
still image capture.
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Table 1. GENERAL SPECIFICATIONS
Parameter
Typical Value
Architecture
5T Global Shutter CMOS
Resolution
6 Megapixels
Aspect Ratio
4:3
Pixel Size
4.7 mm (H) × 4.7 mm (V)
Total Number of Pixels
3024 (H) × 2320 (V)
Number of Effective Pixels
2848 (H) × 2144 (V)
Number of Active Pixels
2832 (H) × 2128 (V)
Active Image Size
13.1 mm (H) × 10.0 mm (V)
16.65 mm (diag.), 1″ Optical Format
Master Clock Input Speed
5 MHz to 50 MHZ
Maximum Pixel Clock Speed
200 MHz DDR LVDS, 400 Mbps
Number of LVDS Outputs
64 Differential Pairs
Number of Output Banks
8, 4, or 2
Frame Rate, 6 MP
1−160 fps 10 bits
Charge Capacity
17,000 electrons
Quantum Efficiency
KAC−06040−CBA
KAC−06040−ABA
40%, 47%, 45% (470, 540, 620 nm)
53%, 15%, 10% (500, 850, 900 nm)
Read Noise
(at Maximum LVDS Clock)
3.4 e− rms, Rolling Shutter
25 e− rms, Global Shutter
Dynamic Range
74 dB, Rolling Shutter
57 dB, Global Shutter
Blooming Suppression
> 10,000x
Image Lag
1.6 electron
Digital Core Supply
2.0 V
Analog Core Supply
1.8 V
Pixel Supply
2.8 V & 3.5 V
Power Consumption
2.3 W for 6 Mp @ 160 fps 10 bits
Package
267 Pin Ceramic Micro-PGA
Cover Glass
AR Coated, 2-sides
Figure 1. KAC−06040 CMOS Image Sensor
Features
•
•
•
•
•
Global Shutter and Rolling Shutter
Very Fast Frame Rate
High NIR Sensitivity
Multiple Regions of Interest
Interspersed Video Streams
Application
• Machine Vision
• Intelligent Transportation Systems
• Surveillance
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
NOTE: All Parameters are specified at T = 40°C unless otherwise noted.
© Semiconductor Components Industries, LLC, 2016
March, 2016 − Rev. 3
1
Publication Order Number:
KAC−06040/D
KAC−06040
The image sensor has a pre-configured QHD (4 × 720p,
16:9) video mode, fully programmable, multiple ROI for
windowing, programmable sub-sampling, and reverse
readout (flip and mirror). The two ADCs can be configured
for 8-bit, 10-bit, 12-bit or 14-bit conversion and output.
Additional features include interspersed video streams
(dual-video), on-chip responsivity calibration, black
clamping, overflow pixel for blooming reduction, black-sun
correction (anti-eclipse), column and row noise correction,
and integrated timing generation with SPI control, 4:1 and
9:1 averaging decimation modes.
ORDERING INFORMATION
Table 2. ORDERING INFORMATION − KAC−06040 IMAGE SENSOR
Part Number
Description
KAC−06040−ABA−JD−BA
Monochrome, Micro-PGA Package, Sealed Clear Cover Glass with AR
Coating (Both Sides), Standard Grade.
KAC−06040−ABA−JD−AE
Monochrome, Micro-PGA Package, Sealed Clear Cover Glass with AR
Coating (Both Sides), Engineering Grade.
KAC−06040−CBA−JD−BA
Bayer (RGB) Color Filter Pattern, Micro-PGA Package, Sealed Clear Cover
Glass with AR Coating (Both Sides), Standard Grade.
KAC−06040−CBA−JD−AE
Bayer (RGB) Color Filter Pattern, Micro-PGA Package, Sealed Clear Cover
Glass with AR Coating (Both Sides), Engineering Grade.
Marking Code
KAC−06040−ABA
Serial Number
KAC−06040−CBA
Serial Number
1. Engineering Grade samples might not meet final production testing limits, especially for cosmetic defects such as clusters, but also possibly
column and row artifacts. Overall performance is representative of final production parts.
Table 3. ORDERING INFORMATION − EVALUATION SUPPORT
Part Number
Description
KAC−06040−AB−A−GEVK
Evaluation Hardware for KAC−06040 Image Sensor (Bayer). Includes Image Sensor.
KAC−06040−CB−A−GEVK
Evaluation Hardware for KAC−06040 Image Sensor (Monochrome). Includes Image Sensor.
LENS−MOUNT−KIT−C−GEVK
Lens Mount Kit that Supports C, CS, and F Mount Lenses. Includes IR Cut-filter for Color Imaging.
See the ON Semiconductor Device Nomenclature document (TND310/D) for a full description of the naming convention
used for image sensors. For reference documentation, including information on evaluation kits, please visit our web site at
www.onsemi.com.
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2
KAC−06040
DEVICE DESCRIPTION
LVDS Bank 3
LVDS Bank 5
7D0 − 7D6
Clk7
5D0 − 5D6
Clk5
Clk3
3D0 − 3D6
Architecture
3.5 VA
3.3 VD
2.8 VA
2.0 VD
1.8 VA
LVDS Bank 7
B G
G R
B G
G R
8
B G
G R
(0, 0)
104
104
8
4000 (H) y 3000 (V)
4.7 mm Pixel
B G
G R
8
88
Chip Clock
Trigger
ResetN
CSN
SCLK
MOSI
MISO
RBFB
ADC_Ref1
4.02 kW ±1%
Even Row ADC, Analog Gain, Black-Sun Correction
LVDS Bank 2
Timing Control, Sub-Sampling/Averaging
88
8
LVDS Bank 4
ADC_Ref2
LVDS Bank 6
Figure 2. Block Diagram
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3
6D0 − 6D6
Clk6
4D0 − 4D6
Clk4
VSS 0 V
2D0 − 2D6
Clk0
Digital Gain/Offset, Noise Correction
0D0 − 0D6
LVDS Bank 0
Clk1
Clk2
1D0 − 1D6
LVDS Bank 1
Odd Row ADC, Analog Gain, Black-Sun Correction
Serial
Peripheral
Interface
(SPI)
KAC−06040
Physical Orientation
1 2 3 4
5
6
7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
A
B
C
D
E
LVDS Bank 5
LVDS Bank 7
LVDS Bank 2
LVDS Bank 4
LVDS Bank 6
LVDS Bank 0
LVDS Bank 1
LVDS Bank 3
AA
AB
AC
AD
AE
1 2 3 4
5
6
7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
Notes:
1. The center of the pixel array is aligned to the physical package center.
2. The region under the sensor die is clear of pins enabling the use of a heat sink.
3. Non-symmetric mounting holes provide orientation and mounting precision.
4. Non-symmetric pins prevent incorrect placement in PCB.
5. Letter “F” indicator shows default readout direction relative to package pin 1.
Figure 3. Package Pin Orientation − Top X-Ray View
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KAC−06040
Table 4. PRIMARY PIN DESCRIPTION
Pin
Name
Type
AB09
RESETN
DI
Sensor Reset (0 V = Reset State)
Description
E07
CLK_In1
DI
Sensor Input Clk_In1 (5−50 MHz)
D08
CLK_In2
DI
Sensor Input Clk_In2 (Connect to Clk1)
AB08
TRIGGER
DI
Trigger Input (Optional)
AA05
SCLK
DI
SPI Master Clock
AA06
CSN
DI
SPI Chip Select (0 V = Selected)
AA07
MISO
DO
SPI Master Input, Slave Output
AA08
MOSI
DI
SPI Master Output, Slave Input
AB05
FB
DO
SPI Register Read Feedback
D07
SPI_MS
DI
SPI CPOL/CPHA Mode Select
AA14
ADC_Ref1
AO
4.02 kW ±1% Resistor between Ref1 & Ref2
AA15
ADC_Ref2
AO
4.02 kW ±1% Resistor between Ref1 & Ref2
AB06
FLO
DO
Flash Output Sync (Optional)
AB07
MSO
DO
Mechanical Shutter Output Sync (Optional)
E05
FEN
DO
Frame Enable Reference Output (Optional)
E06
LEN
DO
Line Enable Reference Output (Optional)
1.
2.
3.
4.
5.
DI = Digital Input, DO = Digital Output, AO = Analog Output.
Tie unused DI pins to Ground, No Connect (NC) unused DO pins.
By default Clk_In2 should equal Clk_In1 and should be the same source clock.
The RESETN pin has a 62 kW internal pull-up resistor, so if left floating the chip will not be in reset mode.
The TRIGGER pin has an internal 100 kW pull down resistor. If left floating (and at default polarity) then the sensor state will not be affected
by this pin (i.e. defaults to ‘not triggered’ mode if floated).
6. All of the DI and DO pins nominally operate at 0 V → 2.0 V and are associated with the VDD_DIG power supply.
7. The SPI_MS pin has an internal 100 kW pull down resistor. If left floating the CPOL/CHPA will be compatible with CPOL = CPHA = 0 or
CPOL = CPHA = 1.
Table 5. POWER PIN DESCRIPTION
Name
Voltage
Pins
Description
VDD_LVDS
3.3 V D
C04, C05, C23, C24, D04, D24, E04, E24, AA04, AA24,
AB04, AB24, AC04, AC05 AC23, AC24
LVDS Output Supply
VDD_DIG
2.0 V D
C18, C19, C20, C21, C22, D18, D19, D20, D21, D22, D23,
E08, E18, E20, E21, E22, AA18, AA20, AA21, AA22, AB18,
AB19, AB20, AB21, AB22, AB23, AC18, AC19, AC20,
AC21, AC22, AB15
Digital Core Supply
AVDD_HV
3.5 V A
C11, D11, E11, AA11, AB11, AC11, C10, D10, E10, AA10,
AB10, AC10
Pixel Supply 1
Vref_P
2.8 V A
C13, D13, E13, AA13, AB13, AC13
Pixel Supply 2
AVDD_LV
1.8 V A
C17, D16, D17, E17, AA17, AB16, AB17, AC17
Analog Low Voltage Supply
Vpixel_low
0V
E09
Pixel Supply 3. Combine with VSS for
normal operation. Can be pulsed for
Extended Dynamic Range Operation.
VSS
0V
A02, A14, A26, B14, C03, C06, C12, C14, C25, D03, D12,
D14, D25, E03, E12, E19, E23, E25, AA03, AA12, AA19,
AA23, AA25, AB03, AB12, AB14, AB25, AC03, AC06,
AC12, AC14, AC25, AD14, AE02, AE14, AE26, D15, E15,
AA09
Sensor Ground Reference
No Connect
NA
A01, E14, E16, C09, D09, D05, D06, AA16, AC09
Unused and test-only pins. These
pins must be floated.
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KAC−06040
Table 6. LVDS PIN DESCRIPTION
Pin
Name
Description
Pin
Name
Description
Pin
Name
Description
Pin
Name
Description
E01
1DCLK+
Bank 1
C07
3DCLK+
Bank 3
C15
5DCLK+
Bank 5
A22
7DCLK+
Bank 7
E02
1DCLK−
LVDS Clock
C08
3DCLK−
LVDS Clock
C16
5DCLK−
LVDS Clock
B22
7DCLK−
LVDS Clock
D01
1DATA0+
A07
3DATA0+
A15
5DATA0+
A23
7DATA0+
D02
1DATA0−
B07
3DATA0−
B15
5DATA0−
B23
7DATA0−
C01
1DATA1+
A08
3DATA1+
A16
5DATA1+
A24
7DATA1+
C02
1DATA1−
B08
3DATA1−
B16
5DATA1−
B24
7DATA1−
B01
1DATA2+
A09
3DATA2+
A17
5DATA2+
A25
7DATA2+
B02
1DATA2−
B09
3DATA2−
B17
5DATA2−
B25
7DATA2−
A03
1DATA3+
A10
3DATA3+
A18
5DATA3+
B27
7DATA3+
Bank 1
LVDS Data
Bank 3
LVDS Data
Bank 5
LVDS Data
B03
1DATA3−
B10
3DATA3−
B18
5DATA3−
B26
7DATA3−
A04
1DATA4+
A11
3DATA4+
A19
5DATA4+
C27
7DATA4+
B04
1DATA4−
B11
3DATA4−
B19
5DATA4−
C26
7DATA4−
A05
1DATA5+
A12
3DATA5+
A20
5DATA5+
D27
7DATA5+
B05
1DATA5−
B12
3DATA5−
B20
5DATA5−
D26
7DATA5−
A06
1DATA6+
A13
3DATA6+
A21
5DATA6+
E27
7DATA6+
B06
1DATA6−
B13
3DATA6−
B21
5DATA6−
E26
7DATA6−
Bank 7
LVDS Data
Pin
Name
Description
Pin
Name
Description
Pin
Name
Description
Pin
Name
AA01
0DCLK+
Bank 0
AC07
2DCLK+
Bank 2
AC15
4DCLK+
Bank 4
AE22
6DCLK+
Bank 6
AA02
0DCLK−
LVDS Clock
AC08
2DCLK−
LVDS Clock
AC16
4DCLK−
LVDS Clock
AD22
6DCLK−
LVDS Clock
AB01
0DATA0+
AE07
2DATA0+
AE15
4DATA0+
AE23
6DATA0+
AB02
0DATA0−
AD07
2DATA0−
AD15
4DATA0−
AD23
6DATA0−
AC01
0DATA1+
AE08
2DATA1+
AE16
4DATA1+
AE24
6DATA1+
AC02
0DATA1−
AD08
2DATA1−
AD16
4DATA1−
AD24
6DATA1−
AD01
0DATA2+
AE09
2DATA2+
AE17
4DATA2+
AE25
6DATA2+
AD02
0DATA2−
AE03
0DATA3+
AD03
0DATA3−
Bank 0
LVDS Data
AD09
2DATA2−
AE10
2DATA3+
AD10
2DATA3−
Bank 2
LVDS Data
AD17
4DATA2−
AE18
4DATA3+
AD25
6DATA2−
AD26
6DATA3+
AD18
4DATA3−
AD27
6DATA3−
6DATA4+
Bank 4
LVDS Data
AE04
0DATA4+
AE11
2DATA4+
AE19
4DATA4+
AC26
AD04
0DATA4−
AD11
2DATA4−
AD19
4DATA4−
AC27
6DATA4−
AE05
0DATA5+
AE12
2DATA5+
AE20
4DATA5+
AB26
6DATA5+
AD05
0DATA5−
AD12
2DATA5−
AD20
4DATA5−
AB27
6DATA5−
AE06
0DATA6+
AE13
2DATA6+
AE21
4DATA6+
AA26
6DATA6+
AD06
0DATA6−
AD13
2DATA6−
AD21
4DATA6−
AA27
6DATA6−
1.
2.
3.
4.
5.
6.
Description
Bank 6
LVDS Data
All LVDS Data and Clock lines must be routed with 100 W differential transmission line traces.
All the traces for a single LVDS Bank should be the same physical length to minimize skew between the clock and data lines.
In 2 Bank mode, only LVDS banks 0 and 1 are active.
In 4 Bank mode, only LVDS bank 0, 1, 2, and 3 are active.
Float the pins of unused LVDS Banks to conserve power.
Unused pins in active banks (due to ADC bit depth < 14) are automatically tri-stated to save power, but these can also be floated.
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KAC−06040
IMAGING PERFORMANCE
Table 7. TYPICAL OPERATIONAL CONDITIONS
(Unless otherwise noted, the Imaging Performance Specifications are measured using the following conditions.)
Condition
Description
Notes
Light Source
Continuous Red, Green and Blue LED Illumination
1
Temperature
Measured Die Temperature: 40°C and 27°C
Integration Time
16.6 ms (1400d LL, Register 0201h)
Readout Mode
Dual-Scan, Global Shutter, 320 MHz, PLL2
Clamps
Column/Row Noise Correction Active, Frame Black Level Clamp Active
ADC Bit Depth
10 bit
Analog Gain
Unity Gain or Referred Back to Unity Gain
1. For monochrome sensor, only green LED used.
Table 8. KAC−12040−ABA CONFIGURATION (MONOCHROME)
Description
Symbol
Peak Quantum Efficiency
Green
NIR1
NIR2
QEMAX
Wavelength
(nm)
Nom.
550
850
900
52
15
9.0
Units
Sampling
Plan
Temperature
Tested at (5C)
%
Design
27
Test
Responsivity
83
ke *
Lux @ s
Design
27
20
Responsivity
7.3
V
Lux @ s
Design
27
21
Wavelength
(nm)
Nom.
Units
Sampling
Plan
Temperature
Tested at (5C)
Test
470
540
620
850
900
42
47
44
16
9.8
%
Design
27
Responsivity
Blue
Green
Red
18
36
39
Design
27
20
Responsivity
Blue
Green
Red
1.6
3.1
3.4
Design
27
21
Table 9. KAC−12040−CBA CONFIGURATION (BAYER RGB)
Description
Symbol
Peak Quantum Efficiency
Green
NIR1
NIR2
QEMAX
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ke *
Lux @ s
V
Lux @ s
KAC−06040
Table 10. PERFORMANCE SPECIFICATIONS ALL CONFIGURATIONS
Description
Symbol
Min
Nom.
Max
Units
Sampling
Plan
Temperature
Tested at (5C)
Test
Die
27, 40
16
Notes
Photodiode Charge
Capacity
PNe
17
ke−
Read Noise
ne−T
3.4 RS/GR DS
3.7 RS/GR TS
25 GS DS/TS
e− rms
Die
27
8
Total Pixelized
Noise
TPN
3.6 RS/GR DS
3.9 RS/GR TS
25 GS DS/TS
e− rms
Die
27
19
Dynamic Range
DR
74 RS/GR DS
73 RS/GR TS
57 GS DS/TS
dB
Die
27
Column Noise
CN
0.4 RS/GR DS/TS
2.4 GS DS/TS
e− rms
Die
27
9
5
Row Noise
RN
0.4 RS/GR DS
0.7 RS/GR TS
2.7 GS DS/TS
e− rms
Die
27
10
6
Dark Field Local
Non-Uniformity
Floor
DSNU_flr
1.3 RS/GR DS
1.7 RS/GR TS
10 GS DS/TS
e− rms
Die
27, 40
1
4
Bright Field Local
Photoresponse
Non-Uniformity
PRNU_1
1.1 Mono
1.5 Bayer
% rms
Die
27, 40
2
1
Bright Field Global
Photoresponse
Non-Uniformity
PRNU_2
3.7 Mono
3.4 Bayer
% pp
Die
27, 40
3
1
Maximum
Photoresponse
Non-Linearity
NL
5.4
%
Die
27, 40
11
2
Maximum Gain
Difference between
Outputs
DG
0.3
%
Die
27, 40
12
7
Photodiode Dark
Current
IPD
6.6
e/p/s
Die
40
13
8
Storage Node Dark
Current
IVD
1490
e/p/s
Die
40
14
4
Image Lag
Lag
1.6
e−
Design
27, 40
15
15
> 10,000
W/cm2
Design
27
7
13
Design
27
6
9
Black-Sun
Anti-Blooming
XAB
Parasitic Light
Sensitivity
PLS
3
xllumSat
728
Dual-Video WDR
140 RS
120 GS
dB
Design
27
10, 11
Pulsed Pixel WDR
(GS Only)
100
dB
Design
27
12, 11
NOTE: RS = Rolling Shutter Operation Mode, GS = Global Shutter Operation Mode, GR = Global Reset, DS = Dual−Scan, TS = Tri−Scan
1. Measured per color, worst of all colors reported.
2. Value is over the range of 10% to 90% of photodiode saturation, Green response used.
3. Uses 20LOG (PNe / ne−T).
4. Photodiode dark current made negligible.
5. Column Noise Correction active.
6. Row Noise Correction active.
7. Measured at ∼70% illumination.
8. Storage node dark current made negligible.
9. GSE (Global Shutter Efficiency) = 1 − 1 / PLS.
10. Min vs Max integration time at 30 fps.
11. WDR measures expanded exposure latitude from linear mode DR.
12. Min/Max responsivity in a 30 fps image.
13. Saturation Illumination referenced to a 3 line time integration.
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KAC−06040
TYPICAL PERFORMANCE CURVES
Monochrome with Microlens
Figure 4. Monochrome QE (with Microlens)
Color (Bayer RGB) with Microlens
Figure 5. Bayer QE (with Microlens)
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KAC−06040
Angular Quantum Efficiency
For the curves marked “Horizontal”, the incident light angle is varied along the wider array dimension.
For the curves marked “Vertical”, the incident light angle is varied along the shorter array dimension.
Figure 6. Monochrome Relative Angular QE (with Microlens)
Figure 7. Bayer Relative Angular QE (with Microlens)
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KAC−06040
Dark Current vs. Temperature
NOTE: “Dbl” denotes an approximate doubling temperature for the dark current for the displayed temperature range.
Figure 8. Dark Current vs. Temperature
Power vs. Frame Rate
The most effective method to set the frame rate is to use
vertical blanking (Register 01F1h). Unnecessary chip
operations are suspended during vertical blanking
conserving significant power consumption and also
minimizing the image storage time on the storage node when
in Global Shutter Operation. Tri−scan can reach higher
frame rates, but consumes more power at all frame rates. It
is recommended use Dual−Scan unless the frame rate
required can only be reached with Tri−Scan. The LVDS
clock is 1/2 the PLL2 clock frequency.
Figure 9. Dual−Scan Power vs. Frame Rate, 10 bit Mode
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KAC−06040
Figure 10. Tri−Scan Power vs. Frame Rate, 10 bit Mode
Power and Frame Rate vs. ADC Bit Depth
parameters impacting the line time, Tri−Scan only has
significant benefit at 10 bit operation. At 8 bit operation the
LVDS readout time dominates the line time; and at 12 and
14 bit the ADC time dominates the line time and the pixel
time is not significant. But at 10 bit operation Tri−Scan can
almost halve the line time at the cost of additional power
consumption.
Increasing the ADC bit depth impacts the frame rate by
changing the ADC conversion time. The following figure
shows the power and Frame rate range for several typical
cases. For optimum image quality and power consumption
the PLL2 and vertical blanking have been optimized for
each bit depth and target frame rate. Because of the different
Figure 11. Dual−Scan ADC Bit Depth Impact on Frame Rate and Power
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KAC−06040
Figure 12. Tri−Scan vs. Dual−Scan Power
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KAC−06040
DEFECT DEFINITIONS
Table 11. OPERATION CONDITIONS FOR DEFECT TESTING
Description
Condition
Notes
Operational Mode
10 bit ADC, 8 LVDS outputs, Global Shutter and Rolling Shutter modes, Dual−Scan,
Black Level Clamp on, Column/Row Noise Correction on, 1x Analog Gain, 1x Digital Gain
Pixels per Line
2832
Lines per Frame
2128
Line Time
6.875 ms
Frame Time
8.25 ms
Photodiode Integration Time
33 ms
Storage Readout Time
7.85 ms
Temperature
40°C and 30°C
Light Source
Continuous Red, Green and Blue LED Illumination (Green only for monochrome sensor)
Operation
Nominal Operating Voltages and Timing, PLL1 = 320 MHz, PLL2 = 410 MHz
Table 12. DEFECT DEFINITIONS FOR TESTING
Description
Definition
40°C
RS: Defect ≥ 30 dn
GS: Defect ≥ 240 dn
Limit
Test
Notes
60
4
1, 4, 5
5
2, 5
Dark Field Defective Pixel
30°C
RS: Defect ≥ 20 dn
GS: Defect ≥ 180 dn
Bright Field Defective Pixel
Defect ≥ ±12% from Local Mean
60
Cluster Defect
A group of 2 to 10 contiguous defective pixels, but
no more than 3 adjacent defects horizontally.
11
Column/Row Major Defect
A group of more than 10 contiguous defective pixels
along a single column or row.
0
Dark Field Faint Column/Row Defect
RS: 3 dn Threshold
GS: 10 dn Threshold
0
17
1
Bright Field Faint Column/Row Defect
RS: 12 dn Threshold
GS: 18 dn Threshold
0
18
1
1.
2.
3.
4.
3
RS = Rolling Shutter, GS = Global Shutter.
For the color devices, all bright defects are defined within a single color plane, each color plane is tested.
Cluster defects are separated by no less than two good pixels in any direction.
Rolling Shutter Dark Field points are dominated by photodiode integration time, Global Shutter Dark Field defects are dominated by the
readout time.
5. The net sum of all bright and dark field pixel defects in rolling and global shutter are combined and then compared to the test limit.
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KAC−06040
TEST DEFINITIONS
Test Regions of Interest
Image Area ROI:
Active Area ROI:
Pixel (0, 0) to Pixel (2847, 2143)
Pixel (8, 8) to Pixel (2839, 2135)
Only the Active Area ROI pixels are used for performance and defect tests.
88
8
B G
G R
B G
G R
8
88
8
8,8
88
2832 (H) y 2128 (V)
4.7 mm Pixel
0,0
B G
G R
8
88
Figure 13. Regions of Interest
Tests
The highest sub-ROI average (Maximum Signal) and the
lowest sub-ROI average (Minimum Signal) are then used in
the following formula to calculate PRNU_2.
1) Dark Field Local Non-Uniformity Floor (DSNU_flr)
This test is performed under dark field conditions.
A 4 frame average image is collected. This image is
partitioned into 180 sub-regions of interest, each of which is
190 by 178 pixels in size. For each sub-region the standard
deviation of all its pixels is calculated. The dark field local
non-uniformity is the largest standard deviation found from
all the sub regions of interest. Units: e− rms (electrons rms).
PRNU_2 + 100 @
ǒ
Ǔ
Max. Signal * Min. Signal
Active Area Signal
Units : % pp
4) Dark Field Defect Test
This test is performed under dark field conditions.
The sensor is partitioned into 390 sub regions of interest,
each of which is 128 by 128 pixels in size. In each region of
interest, the median value of all pixels is found. For each
region of interest, a pixel is marked defective if it is greater
than or equal to the median value of that region of interest
plus the defect threshold specified in the Defect Definition
Table section.
2) Bright Field Local Photoresponse Non-Uniformity
(PRNU_1)
The sensor illuminated to 70% of saturation (∼700 dn). In
this condition a 4 frame average image is collected. From
this 4 frame average image a 4 frame average dark image is
subtracted. The Active Area Standard Deviation is the
standard deviation of the resultant image and the Active
Area Signal is the average of the resultant image.
PRNU_1 + 100 @
ǒ
5) Bright Field Defect Test
This test is performed with the imager illuminated to
a level such that the output is at approximately 700 dn.
The average signal level of all active pixels is found.
The bright and dark thresholds are set as:
Dark Defect Threshold = Active Area Signal ⋅ Threshold
Bright Defect Threshold = Active Area Signal ⋅ Threshold
Ǔ
Active Area Standard Deviation
Active Area Signal
Units : % rms
3) Bright Field Global Non-Uniformity (PRNU_2)
This test is performed with the sensor uniformly
illuminated to 70% of saturation (∼700 dn), a 4 frame
average image is collected and a 4 frame averaged dark
image is subtracted. The resultant image is partitioned into
180 sub regions of interest, each of which is 190 by
178 pixels in size. The average signal level of each sub
regions of interest (sub-ROI) is calculated.
The sensor is then partitioned into 390 sub regions of
interest, each of which is 128 by 128 pixels in size. In each
region of interest, the average value of all pixels is found.
For each region of interest, a pixel is marked defective if it
is greater than or equal to the median value of that region of
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KAC−06040
detected, typically several orders of magnitude greater than
the photodiode integration time.
interest plus the bright threshold specified or if it is less than
or equal to the median value of that region of interest minus
the dark threshold specified.
Example for bright field defective pixels:
• Average value of all active pixels is found to be 700 dn
• Lower defect threshold: 700 dn ⋅ 12% = 84 dn
• A specific 128 × 128 ROI is selected:
♦ Median of this region of interest is found to be
690 dn.
♦ Any pixel in this region of interest that is
≤ (690 − 84 dn) in intensity will be marked
defective.
♦ Any pixel in this region of interest that is
≥ (690 − 84 dn) in intensity will be marked
defective.
• All remaining 299 sub regions of interest are analyzed
for defective pixels in the same manner.
7) Black-Sun Anti-Blooming
A typical CMOS image sensor has a light response profile
that goes from 0 dn to saturation (1023 dn for KAC−06040
in 10 bit ADC mode) and, with enough light, back to 0 dn.
The sensor reaching 0 dn at very bright illumination is often
called the “Black-sun” artifact and is undesirable. Black-sun
artifact is typically the dominant form of anti-blooming
image distortion. For the KAC−06040 the Black-sun artifact
threshold is measured at the onset of saturation distortion,
not at the point where the output goes to 0 dn. To first order
the onset of black-sun artifact for the KAC−06040 is not
proportional to the integration time or readout time.
The sensor is placed in the dark at unity gain and
illuminated with a 532 nm laser with the intensity of about
26 W/cm2 at the center of the sensor. The laser is strong
enough to make the center of the laser spot below 1020 dn
without any ND filters. ND filters are added to adjust the
laser intensity until the signal in the region at the center of
the spot increases to > 1020 dn.
This illumination intensity at this ND filter is recorded
(W/cm2) as the Black-Sun Anti-blooming.
The ‘xIlumSat’ unit is calculated using and integration
time of 100 msec.
Exposing the sensor to very strong illumination for
extended periods of time will permanently alter the sensor
performance in that localized region.
6) Parasitic Light Sensitivity (PLS)
Parasitic Light Sensitivity is the ratio of the light
sensitivity of the photodiode to the light sensitivity of the
storage node in Global Shutter. There is no equivalent
distortion in Rolling Shutter. A low PLS value can provide
distortion of the image on the storage node by the scene
during readout.
PLS +
Photodiode Responsivity
Storage Node Responsivity
(UnitlessRatio)
GSE (Global Shutter Efficiency) is a related unit.
ǒ
GSE + 1 *
Ǔ
8) Read Noise
This test is performed with no illumination and one line of
integration time. The read noise is defined as one standard
deviation of the frequency histogram containing the values
of all pixels after the excessively deviant pixels (± three
standard deviations) are removed.
1
%
PLS
Detailed Method: Photodiode Responsivity:
The sensor is set in global shutter serial mode (integration
time not overlapping readout) and the FLO signal is used to
control a 550 nm normal incident (or large f# focused)
illumination source so that the sensor is illuminated only
during photodiode integration time (not illuminated during
readout time). The integration time is not critical but should
be large enough to create a measurable mean during this
time. A 16 frame-average illuminated photodiode image is
recorded. A 16 frame-average dark frame using the same
sensor settings is captured and is subtracted from the
illuminated image.
9) Column Noise
After all rows are averaged together. Shading (low
frequency change wrt column address) is removed.
A frequency histogram is constructed of the resulting
column values. The column noise is the standard deviation
of the frequency histogram of the column values. This
Metric includes both temporal and FPN.
10) Row Noise
All columns are averaged together. Shading (low
frequency change wrt row address) is removed. A frequency
histogram is constructed of the resulting row values.
The row noise is the standard deviation of the frequency
histogram of the row values. This Metric includes both
temporal and FPN.
Detailed Method: Storage Node Responsivity:
The sensor is set to a special characterization mode where
the PD signal is discarded and does not impact the storage
node. A long total frame time (storage node exposure time)
is used to increase the storage node signal. A 16
frame-average dark frame is captured. The sensor is
illuminated by the same 550 nm incident light source used
for the photodiode responsivity. A 16 frame-average
illuminated photodiode image is recorded; the dark frame
image is subtracted from this. The integration time is not
critical but should be set such that a significant response is
11) Maximum Photoresponse Non-Linearity
The photoresponse non-linearity is defined as the
deviation from the best fit of the sensor response using 70%
of saturation and zero signal as the reference points.
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KAC−06040
14) Storage Node Dark Current
The storage node dark current is measured in global
shutter read out mode using a special timing mode to prevent
the photodiode dark current from being transferred to the
storage node. In global shutter mode, the integration time of
the storage node is the time it takes to read out a frame. The
sensor analog gain is set to 2:
The different signal levels are determined by varying the
integration time. The sensor saturation level is (1023-dark
offset). The dark offset is subtracted from the image for the
following MAVG and LAVG.
• The integration time is varied until the integration time
required to reach the 70% saturation is determined.
MAVG = the active array mean at the 70% saturation
integration time.
• The integration is set to 1/14 (5% exposure point).
LAVG = meant at the 5% exposure point.
• PRNL (@ 5% saturation) = ((LAVG/MAVG) ⋅ (14/1) −1)
⋅ 100
Storage Node Dark Current + Aver. Signal (DN) @
where ‘average signal (DN)’ is the average of all pixels in
the sensor array and ‘el-per-DN (gain=2)’ is measured on
each sensor using the photon transfer method.
15) Lag
Lag is measured as the number of electrons left in the
photodiode after readout when the sensor is illuminated at
70% of Photodiode Charge Capacity.
Analog gain is set to 8. With no illumination a 64 average
dark image is recorded (Dark_ref). The ‘el-per-DN’ is
measured using the photon transfer method.
Illumination is adjusted blink every other frame such that
the mean image output is 70% of the Photodiode Charge
Capacity for even frames, and with no illumination for odd
frames. A 64 frame average of Odd Dark Frames is recorded
as Dark_Lag.
12) Maximum Gain Difference between Outputs
The LVDS outputs contain no gain or offset error since
these are purely digital segmentations. The predominant
output mismatch comes from the pixel array readout
segmentation. The sensor contains two ADC banks and four
channels of analog line stores in its highest frame rate
configuration, Tri−Scan. The sensor is factory calibrated to
match the gain differences between all four possible gain
channels. The gain variations are manifest as an every 4th
row gain pattern. In tri−scan, and an even/odd row gain
difference in Dual−Scan. The sensor is factory calibrated to
match the four possible row gains. This test is performed in
Tri−Scan mode to test the worst case gain error including all
possible 4 row gains after the calibration has been applied.
The sensor is illuminated at 70% of saturation. The entire
test frame ROI into 4 groups of every 4th row. The first row
group(average) is used as a reference and the following three
row groups are compared to the first. The largest error is
reported.
ǒ
ǒ
Lag + (Dark_Lag * Dark_Ref) @ el−per−DN
Units : Electrons rms
16) Photodiode Charge Capacity
The sensor analog gain is reduced to < 1 to prevent ADC
clipping at 1023 dn. The ‘el-per-DN’ is measured using the
photon transfer method. The sensor is illuminated at a light
level ∼1.5x the illumination at which the pixel output no
longer linearly changes with illumination level.
The Photodiode Charge Capacity is equal to the average
signal (DN) ⋅ el-per-DN. Units: electrons rms.
Ǔ
Second Row Average
* 1 @ 100
First Row Average
ǒ
Ǔ
Third Row Average
* 1 @ 100
First Row Average
17) Dark Field Faint Column/Row Defect
A 4 frame average, no illumination image is acquired at
one line time of integration. Major defective pixels are
removed (> 5 Sigma). All columns or rows are averaged
together. The average of the local ROI of 128 columns or
rows about the column/row being tested is determined. Any
columns/rows greater than the local average by more than
the threshold are identified.
Ǔ
Fourth Row Average
* 1 @ 100
First Row Average
13) Photodiode Dark Current
The photodiode dark current is measured in rolling shutter
read out mode using 105 ms integration time and an analog
gain = 8. The value is converted to electrons/pix/sec using
the formula:
Photodiode Dark Current + Aver. Signal (DN) @
el−per−DN (gain=2)
0.138 seconds
18) Bright Field Faint Column/Row Defect
A 4 frame average, 70% illumination image is acquired at
one line time of integration. Major defective pixels are
removed (> 5 Sigma). All columns or rows are averaged
together. The average of the local ROI of 128 columns or
rows about the column/row being tested is determined. Any
columns/rows greater than the local average by more than
the threshold are identified.
el−per−DN (gain=8)
0.105 seconds
where ‘average signal (DN)’ is the average of all pixels in
the sensor array, and ‘el-per-DN (gain=8)’ is measured on
each sensor using the photon transfer method.
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KAC−06040
20) Responsivity ke −/lux-sec
This number is calculated by integrating the
multiplication of the sensor QE by the human photopic
response assuming a 3200K light source with a QT100 IR
filter. This is a sharp 650 nm cutoff filter. If the IR filter is
removed a higher response value will result.
19) Total Pixelized Noise
This test is performed with no illumination and one line of
integration time. A single image is captured including both
Temporal and Fixed Pattern Noise (FPN). A spatial low pass
filter is applied to remove shading and excessively deviant
pixels (± three standard deviations) are removed. The Total
Pixelized Noise is defined as one standard deviation of the
frequency histogram.
21) Responsivity V/lux-sec
Voltage levels are not output from the sensor. This value
uses the pixel output before analog gain to match the ADC
input range. Including the ADC matching gain will result in
a larger responsivity value.
OPERATION
This section is a brief discussion of the most common
features and functions assuming default conditions. See the
KAC−06040 User Guide for a full explanation of the sensor
operation modes, options, and registers.
All SPI reads are to an even address, all SPI writes are to an
odd address.
Sensor States
Figure 14 shows the sensor states, see the KAC−06040
User Guide for detailed explanation of the States.
Register Address
The last bit of any register address is a Read/Write bit.
Most references in this document refer to the Write address.
RESETN low or
reset Reg 4060h
RESET
<35µ s
STANDBY
150µ s
<2µ s
CONFIG
WAKE−UP
(50 ms)
<2µ s
Slave Integration Mode
<50µ s
TRIG_WAIT
IDLE
TRIGGER Active Edge
End of
acquisition
<2µ s
EXT_INT
End of acquisition AND
IDLE mode AND
No TRIGGER
RUNNING mode OR
TRIGGER pin
<50µ s
TRIGGER Inactive Edge
RUNNING
READOUT
Figure 14. Sensor State Diagram
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KAC−06040
Encoded Syncs
the following Figure 15. This is performed for each of the
8 LVDS output banks providing frame, line, and output
synchronization. See the KAC−06040 User Guide for
additional detail on LVDS and Encoded Sync output.
To facilitate system acquisition synchronization the
KAC−06040 places synchronization words (SW) at the
beginning and at the end of each output row as indicated in
V Blanking Period
SOL
Data
EOL
H Blanking Period
SOF
EOF
V Blanking Period
Line Length (LL)
Figure 15. Encoded Frame Syncs
Line Time
conversion time and LVDS readout time are similar in size.
For full resolution this corresponds to 8 LVDS bank and 10
bit ADC bit depth. In Tri−Scan mode the longest of the three
components will define the minimum line time.
The KAC−06040 architecture always outputs two rows at
once, one row from the top ADC, and one from the bottom
ADC. Each ADC then divides up the pixel into 1 → 4
parallel pixel output LVDS Banks. The default is 4 output
banks per ADC for a total of 8 parallel pixel outputs to
minimize the LVDS data output time. Since the sensor
always outputs 2 rows at a time the timing and registers are
based on a Line Time (LT) or Line Length (LL) where one
LT = the time to readout 2 rows in parallel (one even row and
one odd row).
This Datasheet presumes the recommended startup script
that is defined in the KAC−06040 User Guide has been
applied. The KAC−06040 defaults to Dual−Scan mode. In
this mode the LVDS data readout overlaps the pixel readout
and ADC conversion time. The Pixel read time is fixed, and
the ADC Conversion Time is dependent on the ADC bit
depth selected. The LVDS time will be dependent on the
PLL2 frequency selected. Depending on the ADC bit depth
and the PLL2 frequency the LVDS readout or the (Pixel +
ADC conversion) may limit the minimum possible line
time. The Line Time is not impacted by the selection of
Rolling Shutter or Global Shutter mode.
Tri−scan mode can be used in for shorter line times and
faster frame rates (at elevated power consumption).
Tris−scan is of most value when the Pixel time and ADC
10 bit ADC n+1
Pixel n+1
Line
8 Bank LVDS Output n
Line n Time = Line Length register (0200h)
Figure 16. Dual−Scan Line Time Relationship
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19
KAC−06040
Pixel (Line n+2)
10 bit ADC (n+1)
8 Bank LVDS (n)
Min Line Time
Figure 17. Tri−Scan Line Time Relationship
Frame Time
By default the Integration Phase overlaps the Readout and
Frame Wait Phases. If the Integration Phase is larger than the
Readout + Frame Wait time, then the Integration Phase will
determine the video frame rate. Otherwise the frame rate
will be set by the Readout + Frame Wait time. In other words,
if the programmed integration time is larger than the
minimum readout time (and vertical blanking) then extra
vertical blanking will be added and the frame rate will slow
to accommodate the requested integration time.
The frame time is defined in units of Line Time. 1 Line
Time unit = 2 output rows. To first-order the frame rate is not
directly impacted by selection of Global Shutter, Rolling
Shutter, Dual-Scan, or Tri-Scan.
The Frame Time is made up of three phases:
1. Integration Phase
2. Readout Phase
3. Frame Wait Phase (Vertical Blanking, VBLANK)
Integration Phase Frame m
Integration Phase Frame m+1
Frame
Wait
Readout Phase Frame m
Integration Phase Frame m+2
Readout Phase Frame m+1
Frame
Wait
Video Frame Time = Readout + Wait
Figure 18. Default Frame Time Configuration (Frame A)
If the Integration Phase is less than the Readout Phase then the start of integration is automatically delayed to minimize the
storage time and dark current.
Integration Phase Frame m
Integration Phase Frame m+1
Readout Phase Frame m
Frame
Wait
Integration Phase Frame m+2
Readout Phase Frame m+1
Frame
Wait
Video Frame Time = Integration Time
Figure 19. Frame Time with Extended Integration Time
If the Readout Phase (+ VBLANKING) is less than the
Integration Phase, then the readout occurs as soon the
integration is complete to minimize the storage time and
dark current.
See the KAC−06040 User Guide for detailed calculation
of the Integration Phase, Readout Phase, and Frame Wait.
To first-order the Readout Phase is equal to the number of
rows ⋅ row_time.
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KAC−06040
Global Shutter Readout
Global Shutter readout provides the maximum precision
for freezing scene motion. Any motion artifacts will be
100% defined by an ideal integration time edge. Every pixel
in the array starts and stops integration at the same time.
Integration of Next Frame Overlaps
Readout of Previous Frame
Row Address Axis
Integration Time
Figure 20 illustrates a Global Shutter Frame readout
assuming the recommended Start-up Script defined in the
KAC−06040 User Guide (8 LVDS banks, Dual-Scan,
8.75 ms line time). The Frame Wait Phase is not shown due
to its small default size (1 LL) and for clarity.
Frame Readout
Time/Col Address Axis
Effective Frame Time (Video) = Readout Time
Trigger Pin: True
Figure 20. Illustration of Frame Time for Global Shutter Readout
TRIGGER input pin is true when at the start of the
integration time for the next frame then the sensor will
complete an additional frame integration and readout. In the
case shown in Figure 20 two frames will be output.
Global Shutter readout mode is selected using Bits [1:0]
of Register 01D1h.
Images can be initiated by setting and holding the
TRIGGER input pin or by placing the sensor into
RUNNING mode by writing 03d to register 4019h. If the
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KAC−06040
Rolling Shutter Readout
The KAC−06040 high speed Rolling Shutter readout
provides the maximum dynamic range while still providing
excellent motion capture. In Rolling Shutter the readout
more closely matches a film camera shutter. Each row of the
image receives the same integration time, but each row starts
and ends at a different time as the shutter travels from the top
Integration of Next Frame Overlaps
Readout of Previous Frame
Row Address Axis
Integration Time
of the array to the bottom. In the Figure 21 frame time
illustration this ‘moving shutter’ displays as a sloped edge
for the blue pixel array region, just as the readout edge is
sloped.
The Figure 21 illustration shows a 2 frame output
sequence using the external TRIGGER pin.
Frame Readout
Time/Col Address Axis
Effective Frame Time (Video) = Readout Time
Trigger Pin: True
Figure 21. Illustration of Frame Time for Rolling Shutter Readout
RUNNING mode by writing 03d to register 4019h. If the
TRIGGER input pin is True when at the start of the
integration time for the next frame then the sensor will
complete an additional frame integration and readout.
Rolling Readout mode can be selected using Bits [1:0] of
Register 01D1h.
Images can be initiated by setting and holding the
TRIGGER input pin or by placing the sensor into
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KAC−06040
8 BANK LVDS DATA READOUT
LVDS Banks
period. All 7 data pairs, of each bank, are used only in 14 bit
operation mode. By default only 5 data pairs are used for
10 bit mode (D4 → D0). The unused pairs are held in
low-power high impedance mode.
Bank 7
Bank 3
Bank 5
Pixel Array
4 Bank Mode
Bank 0
Bank 0
Pixel Array
2 Bank Mode
Bank 7
Bank 2
Bank 4
Bank 6
Bank 3
Bank 5
Bank 7
Pixel Array
8 Bank Mode
Bank 0
Bank 5
Bank 1
Bank 1
Bank 3
Bank 1
The KAC−06040 provides 8 parallel pixel banks, each
consisting of 8 LVDS differential pairs (7 data pairs + 1clock
pair). This allows the output of 8 pixels per LVDS clock
Bank 2
Bank 4
Bank 6
Bank 2
Bank 4
Bank 6
Figure 22. LVDS Bank Labeling
In order to minimize the LVDS clock rate (and power) for
a given data rate the pixels are output in DDR (Double Data
Rate) where the MSB is always sent first (on rising edge) and
the LSB second (falling edge) This is not programmable.
The number of output banks used is independent of the
ADC bit depth chosen. By default the KAC−06040 uses all
8 output banks for maximum frame rate. If technical
restrictions prevent the use of 8 LVDS banks, the sensor can
be programmed to use 4 or 2 banks, however this can result
in reduced frame rate and reduction of image quality. It is
recommended that 8 banks be used when possible. Only the
8 bank option is discussed in detail in this specification, see
the KAC−06040 User Guide for additional detail on 4 and 2
bank mode.
Ports per LVDS Bank
The MSB comes out first on the falling edge, followed by
the LSB on the net rising edge.
Table 13. NUMBER OF LVDS PAIRS (PORTS) USED VS. BIT DEPTH
Bit Depth
Edge of DATA CLK
Data0
Data1
Data2
Data3
Data4
Data5
Data6
14 bits
Falling (MSB Nibble)
D7
D8
D9
D10
D11
D12
D13
Rising (LSB Nibble)
D0
D1
D2
D3
D4
D5
D6
12 bits
Falling (MSB Nibble)
D6
D7
D8
D9
D10
D11
HiZ
Rising (LSB Nibble)
D0
D1
D2
D3
D4
D5
HiZ
Falling (MSB Nibble)
D5
D6
D7
D8
D9
HiZ
HiZ
Rising (LSB Nibble)
D0
D1
D2
D3
D4
HiZ
HiZ
Falling (MSB Nibble)
D4
D5
D6
D7
HiZ
HiZ
HiZ
Rising (LSB Nibble)
D0
D1
D2
D3
HiZ
HiZ
HiZ
10 bits
8 bits
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KAC−06040
8 Bank Pixel Order
4. Each LVDS Bank outputs one pixel per clock
cycle, so 4 pixels of each row are output each full
LVDS clock cycle, two rows in parallel for
8 pixels per clock cycle total.
5. The pixels are sent out from left to right
(low column number to high column number).
So the first 4 pixels are sent out on clock cycle 1,
and the next 4 pixels to the right are sent out on
clock cycle 2.
6. To conserve the number of wires per port,
the 10 bits per pixel are sent out DDR (Dual Data
Rate) over 5 ports. On the falling edge the upper
5 MSB bits are sent out, and on the rising edge the
lower 5 bits LSB are sent out. Completing one full
LVDS clock cycle and one set of eight pixels.
The KAC−06040 always processes two rows at a time.
Even row decodes are sent to the bottom ADC and LVDS
output banks (0, 2, 4, 6). Odd rows are sent to the top ADC
and LVDS banks (1, 3, 5, 7). The ROI must be (and is
internally forced to) an even size and always starting on an
even row decode.
The rows are read out progressively left to right (small
column address to large). Eight pixels are sent out of the chip
at once, one pixel per LVDS bank per LVDS clock cycle.
Pixel Readout order:
1. Two rows are selected, the even row is sent to
the bottom ADC and the odd row to the top ADC.
2. Each ADC converts its row of pixel data at once
and stores the result in a line buffer.
3. At default settings there are 4 output LVDS banks
for each ADC.
Bank 5
Bank 7
Bank 1
Bank 3
First CLK−DATA
Pulse
0
1
2
3
4
5
6
7
Row 2n +1
0
1
2
3
4
5
6
7
Row 2n
Bank 0
Second CLK−DATA
Pulse
Bank 2
Bank 4
Bank 6
Figure 23. Pixel Readout Order Diagram
Table 14. PIXEL READOUT ORDER TABLE
LVDS Bank
Row
Bank 0
2n (Even)
0
4
8
12
16
Bank 2
2n (Even)
1
5
9
13
17
Bank 4
2n (Even)
2
6
10
14
18
Bank 6
2n (Even)
3
7
11
15
19
Bank 1
2n+1 (Odd)
0
4
8
12
16
Bank 3
2n+1 (Odd)
1
5
9
13
17
Bank 5
2n+1 (Odd)
2
6
10
14
18
Bank 7
2n+1 (Odd)
3
7
11
15
19
1
2
3
4
5
LVDS Clock Cycle
Pixel Number
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KAC−06040
De-Serializer Settings
The SOL/SOF synchronization words are sent out of each
LVDS bank before the first valid pixel data from that bank.
Each bank outputs all 4 syncs of the SOF or SOL.
And each of the active LVDS banks each output all 4 sync
codes for the EOL/EOF.
Figure 24 shows the data stream of one LVDS bank for
10 bit resolution.
Data serialization is fixed at 2 cycle DDR for all bit depths.
Data output order is MSB first on the falling edge, and LSB
following on the rising edge.
Four pixel values per synchronization word are embedded
into the video stream per LVDS bank.
Dclk0
Data0
D5
D0
D5
D0
D5
D0
D5
D0
D5
D0
D5
D0
D5
D0
D5
D0
D5
D0
D5
D0
D5
D0
D5
D0
D5
D0
D5
D0
Data1
D6
D1
D6
D1
D6
D1
D6
D1
D6
D1
D6
D1
D6
D1
D6
D1
D6
D1
D6
D1
D6
D1
D6
D1
D6
D1
D6
D1
Data2
D7
D2
D7
D2
D7
D2
D7
D2
D7
D2
D7
D2
D7
D2
D7
D2
D7
D2
D7
D2
D7
D2
D7
D2
D7
D2
D7
D2
Data3
D8
D3
D8
D3
D8
D3
D8
D3
D8
D3
D8
D3
D8
D3
D8
D3
D8
D3
D8
D3
D8
D3
D8
D3
D8
D3
D8
D3
Data4
D9
D4
D9
D4
D9
D4
D9
D4
D9
D4
D9
D4
D9
D4
D9
D4
D9
D4
D9
D4
D9
D4
D9
D4
D9
D4
D9
D4
MSB LSB MSB LSB MSB LSB MSB LSB MSB LSB MSB LSB MSB LSB MSB LSB
SW1
SW2
SW3
SW4
P0
P1
P2
P3
MSB LSB MSB LSB MSB LSB MSB LSB MSB LSB MSB LSB
PN−1
PN
SW1
SW2
SW3
SW4
t
Synchronized Word on 10 bits
Data on 10 bits
Synchronized Word on 10 bits
Figure 24. Data Stream of One LVDS Bank for 10 bits ADC Resolution
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25
KAC−06040
REGISTER DEFINITION
Table 15. REGISTER DEFINITION
16 bit Address (Hex)
Reset Value
Hex/Dec
SPI State
Register Name
0001
0d
Any
Frame A ROI y1
0009
2144d
Any
Frame A ROI h1
0011
0d
Any
Frame A ROI x1
0019
2848d
Any
Frame A ROI w1
0021
0d
Any
Frame A sub-ROI y2
0029
0d
Any
Frame A sub-ROI h2
0031
0d
Any
Frame A sub-ROI x2
0039
0d
Any
Frame A sub-ROI w2
0041
0d
Any
Frame A sub-ROI y3
0049
0d
Any
Frame A sub-ROI h3
0051
0d
Any
Frame A sub-ROI x3
0059
0d
Any
Frame A sub-ROI w3
0061
0d
Any
Frame A sub-ROI y4
0069
0d
Any
Frame A sub-ROI h4
0071
0d
Any
Frame A sub-ROI x4
0079
0d
Any
Frame A sub-ROI w4
0081
0011h
Any
Frame A Decimation
0089
0d
Any
Frame A Video Blanking
0091
3430d
Any
Frame A Integration Rows
0099
0d
Any
Frame A Integration Sub−Row
00A1
10d
Any
Frame A Black Level
00A9
001Fh
Any
Frame A Gain
00E9
344d
Any
Frame B ROI y1
00F1
1456d
Any
Frame B ROI h1
00F9
136d
Any
Frame B ROI x1
0101
2576d
Any
Frame B ROI w1
0109
0d
Any
Frame B sub-ROI y2
0111
0d
Any
Frame B sub-ROI h2
0119
0d
Any
Frame B sub-ROI x2
0121
0d
Any
Frame B sub-ROI w2
0129
0d
Any
Frame B sub-ROI y3
0131
0d
Any
Frame B sub-ROI h3
0139
0d
Any
Frame B sub-ROI x3
0141
0d
Any
Frame B sub-ROI w3
0149
0d
Any
Frame B sub-ROI y4
0151
0d
Any
Frame B sub-ROI h4
0159
0d
Any
Frame B sub-ROI x4
0161
0d
Any
Frame B sub-ROI w4
0169
0011h
Any
Frame B Decimation
0171
0d
Any
Frame B Video Blanking
0179
3430d
Any
Frame B Integration Rows
0181
0d
Any
Frame B Integration Sub−Row
0189
10d
Any
Frame B Black Level
0191
001Fh
Any
Frame B Gain
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26
KAC−06040
Table 15. REGISTER DEFINITION (continued)
16 bit Address (Hex)
Reset Value
Hex/Dec
SPI State
Description
01D1
FC10h
CONFIG Only
Config1
01D9
0500h
CONFIG or IDLE
Config2
01E1
00AAh
CONFIG or IDLE
Analog/Digital Power Mode
01E9
0000h
CONFIG or IDLE
Dual-Video Repetition
01F1
0d
CONFIG or IDLE
Vertical Blanking
01F9
3431d
CONFIG or IDLE
Fixed Frame Period
0201
1400d
CONFIG or IDLE
Line Length (LL)
0209
002Dh
CONFIG or IDLE
ADC Bit Depth
0211
0000h
CONFIG or IDLE
FLO Edge Delay
0219
0000h
CONFIG or IDLE
MSO Edge Delay
0708
0000h
Any
Sensor Type FB
0710
0000h
Any
Temperature Sensor FB
0718
0000h
Any
General Feedback
0720
0000h
Any
Minimum LL FB
0730
0000h
Any
User OTP1 FB
0738
0000h
Any
User OTP2 FB
2059
0300h
CONFIG Only
Output Bank Select 1
2099
2877h
CONFIG Only
PLL1 Setting
20A1
0861h
CONFIG Only
PLL2 Setting
2449
1C32h
CONFIG Only
Sub-LVDS Enable
2479
10B8h
Any
BSC Clamp Threshold A
2481
20C7h
Any
BSC Clamp Threshold B
2499
0000h
CONFIG or IDLE
Test Pattern Control 1
24A1
536d
CONFIG or IDLE
Test Pattern Control 2
24B9
202d
CONFIG Only
Companding Slope 1 Length
24C1
101d
CONFIG Only
Companding Slope 2 Length
24C9
101d
CONFIG Only
Companding Slope 3 Length
24D1
101d
CONFIG Only
Companding Slope 4 Length
24D9
101d
CONFIG Only
Companding Slope 5 Length
24E1
420d
CONFIG Only
Companding Slope 6 Length
24E9
0083h
CONFIG Only
Companding Slope 1/2 Gain
24F1
038Fh
CONFIG Only
Companding Slope 3/4 Gain
24F9
0FBFh
CONFIG Only
Companding Slope 5/6 Gain
2501
1F9Fh
CONFIG Only
Companding Slope 7 Gain
2559
7804h
Any
Defect Avoidance Threshold
2561
003Fh
Any
Defect Avoidance Enable
25C1
0003h
CONFIG or IDLE
Encoded Sync Config
2619
000Bh
CONFIG Only
Output Bank Select 2
4000
4100h
Any
Chip Revision Code
4008
0011h
Any
Chip ID Code MSB
4010
0080h
Any
Chip ID Code LSB
4019
0000h
Any
Set Sensor State
4021
0000h
CONFIG or IDLE
OTP Address
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27
KAC−06040
Table 15. REGISTER DEFINITION (continued)
16 bit Address (Hex)
Reset Value
Hex/Dec
SPI State
4029
0000h
CONFIG or IDLE
OTP Write Data
4031
0000h
CONFIG or IDLE
Command_Done_FB
4041
0000h
CONFIG or IDLE
OTP Read Data
4061
0000h
CONFIG or IDLE
Soft Reset
Description
NOTES: SPI State (the Sensor State from which the register can be set):
1. “Any”: Can be written from any state (including RUNNING).
2. “CONFIG or IDLE”: These registers can be changed in IDLE or CONFIG states.
3. “CONFIG Only”: Sensor must be in CONFIG state to set these registers.
4. Only Register 4018h and 4060h may be set when the sensor is in STANDBY state.
5. FB = Feedback, a read−only register that provides some error or status.
NOTES: Decimal, hexadecimal, binary values:
1. “b” denotes a binary number, a series of bits: MSB is on the left, LSB is on the right.
2. “h” or “hex” denotes a hexadecimal number (Base 16, 1−9, A−F). The letters in a hex number are always capitalized.
3. “d” denotes a decimal number.
4. Note that “0” and “1” are the same value in all number base systems and sometimes the base notation is omitted.
The KAC−06040 features an embedded microprocessor by Cortus.
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28
KAC−06040
ABSOLUTE MAXIMUM RATINGS
For Supplies and Inputs the maximum rating is defined as
a level or condition that should not be exceeded at any time.
If the level or the condition is exceeded, the device will be
degraded and may be damaged. Operation at these values
will reduce Mean Time to Failure (MTTF).
Table 16. SUPPLIES
Description
Value
AVDD_LV, VDD_DIG
−0.25 V; 2.3 V
AVDD_HV, Vref_P, VDD_LVDS
−0.25 V; 4 V
DC Input Voltage at Any Input Pin
−0.25 V; VDD_DIG + 0.25 V
Table 17. CMOS INPUTS
Parameter
Symbol
Minimum
Typical
Maximum
Unit
Input Voltage Low Level
VIL
−0.3
−
0.35 VDD_DIG
V
Input Voltage High Level
VIH
0.65 VDD_DIG
−
VDD_DIG + 0.3
V
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KAC−06040
OPERATING RATINGS
Table 18. INPUT CLOCK CONDITIONS
Minimum
Typical
Maximum
Unit
Frequency for Clk_In1 and Clk_In2
5
48
50
MHz
Duty Cycle for Clk_In1 and Clk_In2
40
50
60
%
RESETN
10
−
−
ns
TRIGGER Pin Minimum Pulse Width
20
−
−
ns
Parameter
TRIGGER must be active at least 4 periods of PLL1 (∼12.5 ns at 320 MHz) to start a capture cycle. The polarity of the active
level is configurable by SPI (Register 01D8h Bit 0), the default is active high (i.e. pin = VDD_DIG = trigger request).
Table 19. OPERATING TEMPERATURE
Description
Operating Temperature (Note 1)
Symbol
Minimum
Maximum
Unit
TOP
−40
80
°C
1. Under conditions of no condensation on the sensor.
Table 20. CMOS IN/OUT CHARACTERISTICS
Parameter
Symbol
Minimum
Typical
Maximum
Unit
Output Voltage Low Level
VOL
−
−
0.45
V
Output Voltage High Level
VOH
VDD_DIG − 0.45
−
−
V
Input Hysteresis Voltage
VTH
−
0.25
−
Pull-up Resistor Value for RESETN Pin
RPU
62
−
−
kW
Pull-down Resistor Value for TRIGGER Pin
RPD
100
−
−
kW
IADC_REF
−
100
−
mA
Current on ADC_REF Pin
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KAC−06040
Table 21. SUPPLIES
Parameter
Symbol
Minimum
Typical
Maximum
Unit
LVDS IO Supply
VDD_LVDS
3.15
3.30
3.63
V
Pixel High Voltage Supply
AVDD_HV
3.40
3.50
3.60
V
Pixel Low Voltage Supply
Vref_P
2.71
2.80
2.88
V
Analog Power Supply
AVDD_LV
1.71
1.80
1.89
V
Digital Power Supply
VDD_DIG
1.90
2.00
2.10
V
AVDD_HV − Vref_P
−
0.5
−
V
Power in STANDBY State
−
10
−
mW
Current in STANDBY State
VDD_LVDS
AVDD_HV
AVDD_LV
Vref_P
VDD_DIG
−
−
−
−
−
< 0.5
< 0.5
< 0.5
< 0.5
1
−
−
−
−
−
Power in CONFIG State
−
320
−
Current in CONFIG State
VDD_LVDS
AVDD_HV
AVDD_LV
Vref_P
VDD_DIG
−
−
−
−
−
< 0.5
< 0.5
< 0.5
< 0.5
162
−
−
−
−
−
Power in IDLE State
−
510
−
Current in IDLE State
VDD_LVDS
AVDD_HV
AVDD_LV
Vref_P
VDD_DIG
−
−
−
−
−
< 0.5
20
< 0.5
< 0.5
222
−
−
−
−
−
Power in RUNNING State
−
2.26
−
Current in RUNNING State
VDD_LVDS in Sub-LVDS Mode
AVDD_HV
AVDD_LV
Vref_P
VDD_DIG
−
−
−
−
115
100
20
20
721
−
−
−
−
mA
mW
mA
mW
mA
W
mA
1. Voltages relative to VSS. Current measurements made in darkness.
2. Max frame rate (and thus maximum current mode).
a. Tri0Scam mode
b. 10 bit ADC
c. PLL2 = Max spec MHz
d. No horizontal or vertical blanking and 8 active LVDS banks.
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31
KAC−06040
SPI (SERIAL PERIPHERAL INTERFACE)
The SPI communication interface lets the application
system to control and configure the sensor. The sensor has
an embedded slave SPI interface. The application system is
the master of the SPI bus.
Table 22.
Name
Sensor I/O
Direction
CSN
I
SPI Chip Select − Active low, this input activates the slave interface in the sensor.
Description
SCK
I
SPI Clock − Toggled by the master.
MISO
O
SPI Master Serial Data Input − Slave (sensor) serial data output.
MOSI
I
SPI Master Serial Data Output − Slave (sensor) serial data input.
Table 23.
Parameter
Minimum
Typical
Maximum
Unit
SPI SCK
5
25
50
MHz
Duty Cycle on SPI SCK
40
50
60
%
Clock Polarity and Phase
CPOL (Clock POLarity) and CPHA (Clock PHAse) are
commonly defined in SPI protocol such as to define SCK
clock phase and polarity. The KAC−06040 defaults to
expecting the master to be configured with CPOL = 1
(the base value of the clock is VDD_DIG) and CPHA = 1
(data is valid on the clock rising edge).
CSN
…
SCK
…
MOSI
X
…
X
MISO
X
…
X
Figure 25. CPOL = 1 and CPHA = 1 Configuration
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32
KAC−06040
SPI Protocol
Byte 0
Byte 1
Byte 2
Byte 3
8 Cycles
8 Cycles
8 Cycles
8 Cycles
CSN
Sclk
16 Bit
Address Word
MOSI
MSB
16 Bit
Data to Write
LSB
MSB
LSB
Figure 26. SPI Write Byte Order
Byte 0
Byte 1
8 Cycles
8 Cycles
Byte 2
Byte 3
CSN
Sclk
MOSI
16 Bit
Address Word
MSB
MISO
8 Cycles 8 Cycles
LSB
16 Bit
Read Data
Wait Time
1.5 ms
MSB
LSB
Figure 27. SPI Read Byte Order
There is a delay during readback between presenting the
address to be read on the MOSI and being able to read the
register contents on the MISO. This delay is not the same for
all registers. Some are available immediately, some require
a longer fetch time. The 1.5 ms shown in Figure 27 is the
maximum time to fetch a register’s value when in CONFIG
state (the recommended state for changing registers). Some
registers can be adjusted during RUNNING state (see the
Register Summary on page 26). If performing a readback
during RUNNING state, the delay could be as long as 4.5 ms
depending on when in the row the request was sent and the
sensor’s microcontroller activity at that moment.
The SPI FB pin can be used to dynamically adjust the wait
time for a register contents to be fetched. Figure 29
illustrates the use of the FB pin. The FB output will be low
(VSS) until the requested register contents are ready to be
clocked out of the MOSI pin. Once the FB pin goes high
(VDD_DIG) then clocking the Sclk will transmit the
requested register contents. The SPI FB pin is inactive by
default, this function is enabled in register 4041h.
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33
KAC−06040
Byte 0
Byte 1
8 Cycles
8 Cycles
Byte 2
Byte 3
CSN
Sclk
MOSI
16 Bit
Address Word
MSB
MISO
8 Cycles 8 Cycles
LSB
Variable Wait Time
16 Bit
Read Data
MSB
LSB
FB
Figure 28. SPI Read with FBRB Handshaking
active memory. For instance if the sensor is in RUNNING
mode and you adjust the LL in register 200h. You can read
back and confirm that your register change was received by
the sensor; however, the LL will not change since register
200h can only be changed in CONFIG state. If you change
the sensor state to CONFIG and then back to RUNNING,
then the new LL will take effect.
The Note that readback does not provide the actual
register value being used, but reflects the next value to be
used. All new register writes are placed in a shadow memory
until they can be updated into the active memory. This active
memory update occurs at the start of the next frame or upon
entering the state listed in the Register Summary table on
page 26. Register reads access this shadow memory not the
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34
KAC−06040
SPI Interface
…
CS
TCS_HOLD
TCYCLE
TCS_SETUP
…
SCK
TSETUP
X
MOSI
THOLD
MSB
TOUT_DELAY
TOUT_DELAY_CSN
MISO
MSB
MSB−1
Figure 29. SPI Timing Chronogram
Table 24. SPI TIMING SPECIFICATION
Symbol
Minimum Value
TCYCLE
25
Maximum Value
Unit
ns
TSETUP
2.9
ns
THOLD
0.8
ns
TCS_SETUP
12.5
ns
TCS_HOLD
12.5
TOUT_DELAY_CSN
3.1
4.7
ns
ns
TOUT_DELAY
4.9
8.7
ns
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35
KAC−06040
LVDS INTERFACE
RL = 100 W ±1%, Typical values are at VDD_LVDS =
3.3 V.
Use register 2449h to select standard or Sub-LVDS. This
document assumes that Sub-LVDS is active for all power
measurements. Standard LVDS can increase the average
power consumption as much as 200 mW in the case of
minimum horizontal and vertical blanking.
The data output can be configured to follow standard
TIA/EIA−644−A LVDS specification or a low power mode
compatible with common Sub-LVDS definition used in
FPGA industry. (Please refer to the KAC−06040 User Guide
for more information).
Unless otherwise noted, min/max characteristics are for
T = −40°C to +85°C, output termination resistance
Table 25. STANDARD LVDS CHARACTERISTICS
Parameter
Differential Output Voltage
Symbol
Minimum
Typical
Maximum
Unit
VOD
250
355
450
mV
VOD Variation between Complementary Output States
DVOD
−20
−
20
mV
Common Mode Output Voltage
VOCM
1.235
1.259
1.275
V
DVOCM
−25
−
25
mV
High Impedance Leakage Current
IOZD
−1
−
1
mA
Output Short Circuit Current:
When D+ or D− Connected to Ground
When D+ or D− Connected to 3.3 V
IOSD
2.9
12.25
−
−
4.3
30.47
Output Capacitance
CDO
−
1.3
−
pF
−
−
10
pF
Symbol
Minimum
Typical
Maximum
Unit
VOD
140
180
220
mV
VOD Variation between Complementary Output States
DVOD
−5
−
5
mV
Common Mode Output Voltage
VOCM
0.88
0.90
0.92
V
DVOCM
−10
−
10
mV
High Impedance Leakage Current
IOZD
−1
−
1
mA
Output Short Circuit Current:
When D+ or D− Connected to Ground
When D+ or D− Connected to 3.3 V
IOSD
1.4
10.21
−
−
2.2
30.47
Output Capacitance
CDO
−
1.3
−
pF
−
−
10
pF
Minimum
Typical
Maximum
Unit
LVDS_CLK
50
160
160
MHz
Duty Cycle on LVDS_CLK
−
50
−
%
VOCM Variation between Complementary Output States
Maximum Transmission Capacitance Load Expected
(for 260 MHz LVDS Clock)
mA
Table 26. SUB-LVDS CHARACTERISTICS
Parameter
Differential Output Voltage
VOCM Variation between Complementary Output States
Maximum Transmission Capacitance Load Expected
(for 260 MHz LVDS Clock)
mA
Table 27.
Parameter
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36
KAC−06040
In-Block LVDS Timing Specification
The table below gives LVDS timing specification for one group of LVDS for nominal frequency of 260 MHz. There is no
skew specification between groups.
Table 28. IN-BLOCK LVDS TIMING SPECIFICATION
Parameter
Symbol
Value
Typical
Maximum
Unit
Minimum Time between Data Change and Clock Rising Edge
tsDLH
600
−
−
ps
Minimum Time between Clock Rising and Data Change
thDLH
600
−
−
ps
Minimum Time between Data Change and Clock Falling Edge
tsDHL
600
−
−
ps
Minimum Time between Clock Falling Edge and Data Change
thDHL
600
−
−
ps
Maximum Differential Skew between the 7 Data Pairs
tSKD
−
200
700
ps
VOH
Differential Data
VOL
Differential Clock
tsDLH
thDLH
tsDHL
thDHL
Figure 30. LVDS Timing Chronogram
Table 29. INTER-BLOCK LVDS TIMING SPECIFICATION
Parameter
Minimum
Typical
Maximum
Unit
−
6
12
LVDS Clock Periods
Inter-Block Skew
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37
KAC−06040
STORAGE AND HANDLING
Table 30. STORAGE CONDITIONS
Description
Symbol
Minimum
Maximum
Unit
Notes
Storage Temperature
TST
−40
80
°C
1
Humidity
RH
5
90
%
2
1. Long-term storage toward the maximum temperature will accelerate color filter degradation.
2. T = 25°C. Excessive humidity will degrade MTTF.
For information on ESD and cover glass care and
cleanliness, please download the Image Sensor Handling
and Best Practices Application Note (AN52561/D) from
www.onsemi.com.
For quality and reliability information, please download
the Quality & Reliability Handbook (HBD851/D) from
www.onsemi.com.
For information on device numbering and ordering codes,
please download the Device Nomenclature technical note
(TND310/D) from www.onsemi.com.
For information on soldering recommendations, please
download the Soldering and Mounting Techniques
Reference
Manual
(SOLDERRM/D)
from
www.onsemi.com.
For information on Standard terms and Conditions of
Sale, please download Terms and Conditions from
www.onsemi.com.
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38
KAC−06040
MECHANICAL INFORMATION
Completed Assembly
Notes:
1. See Ordering Information for marking code.
2. No materials to interfere with clearance through package holes.
3. Imaging Array is centered at the package center.
4. Length dimensions in mm units.
Figure 31. Completed Assembly (1 of 5)
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39
KAC−06040
Figure 32. Completed Assembly (2 of 5)
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40
KAC−06040
Figure 33. Completed Assembly (3 of 5)
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41
KAC−06040
Figure 34. Completed Assembly (4 of 5)
Figure 35. Completed Assembly (5 of 5)
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42
KAC−06040
MAR (Multi-Layer Anti-Reflective Coating) Cover Glass
Notes:
1. Units: IN [MM]
2. A-Zone Dust/Scratch Spec: 10 mm Maximum
3. Index of Refraction: 1.5231
Figure 36. MAR Cover Glass Specification
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www.onsemi.com
43
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
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KAC−06040/D