NSI45025Z D

NSI45025ZT1G
Constant Current Regulator
& LED Driver
45 V, 25 mA + 15%, 1.4 W Package
The linear constant current regulator (CCR) is a simple, economical
and robust device designed to provide a cost−effective solution for
regulating current in LEDs (similar to Constant Current Diode, CCD).
The CCR is based on Self-Biased Transistor (SBT) technology and
regulates current over a wide voltage range. It is designed with a
negative temperature coefficient to protect LEDs from thermal
runaway at extreme voltages and currents.
The CCR turns on immediately and is at 25% of regulation with
only 0.5 V Vak. It requires no external components allowing it to be
designed as a high or low−side regulator. The high anode-cathode
voltage rating withstands surges common in Automotive, Industrial
and Commercial Signage applications. The CCR comes in thermally
robust packages and is qualified to AEC-Q101 standard, and
UL94−V0 certified.
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Ireg(SS) = 25 mA
@ Vak = 7.5 V
Anode 1
Cathode 2/4
Features
•
•
•
•
•
•
•
•
Robust Power Package: 1.4 Watts
Wide Operating Voltage Range
Immediate Turn-On
Voltage Surge Suppressing − Protecting LEDs
AEC-Q101 Qualified and PPAP Capable, UL94−V0 Certified
SBT (Self−Biased Transistor) Technology
Negative Temperature Coefficient
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
SOT−223
CASE 318E
STYLE 2
MARKING DIAGRAM
C
AYW
AAEG
G
Applications
• Automobile: Chevron Side Mirror Markers, Cluster, Display &
Instrument Backlighting, CHMSL, Map Light
1
• AC Lighting Panels, Display Signage, Decorative Lighting, Channel
Lettering
• Switch Contact Wetting
• Application Note AND8391/D − Power Dissipation Considerations
• Application Note AND8349/D − Automotive CHMSL
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Anode−Cathode Voltage
Reverse Voltage
Operating and Storage Junction
Temperature Range
ESD Rating:
Human Body Model
Machine Model
October, 2011 − Rev. 2
C
Value
Unit
Vak Max
45
V
VR
500
mV
Device
Package
TJ, Tstg
−55 to +150
°C
NSI45025ZT1G
SOT−223
(Pb−Free)
ESD
Class 1C
Class B
1
NC
A
= Assembly Location
Y
= Year
W
= Work Week
AAE
= Specific Device Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
Symbol
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
© Semiconductor Components Industries, LLC, 2011
A
ORDERING INFORMATION
Shipping†
1000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NSI45025Z/D
NSI45025ZT1G
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Steady State Current @ Vak = 7.5 V (Note 1)
Voltage Overhead (Note 2)
1.
2.
3.
4.
Symbol
Min
Typ
Max
Unit
Ireg(SS)
21.25
25
28.75
mA
Voverhead
Pulse Current @ Vak = 7.5 V (Note 3)
Ireg(P)
Capacitance @ Vak = 7.5 V (Note 4)
C
Capacitance @ Vak = 0 V (Note 4)
C
1.8
22
Ireg(SS) steady state is the voltage (Vak) applied for a time duration ≥ 10 sec, using FR−4 @ 300
Voverhead = Vin − VLEDs. Voverhead is typical value for 75% Ireg(SS).
Ireg(P) non−repetitive pulse test. Pulse width t ≤ 300 msec.
f = 1 MHz, 0.02 V RMS.
mm2
26
V
30
mA
2.6
pF
6.9
pF
2 oz. Copper traces, in still air.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
PD
954
7.6
mW
mW/°C
RθJA
131
°C/W
RψJL4
40.8
°C/W
PD
1074
8.6
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 6)
RθJA
116
°C/W
Thermal Reference, Junction−to−Lead 4 (Note 6)
RψJL4
39.9
°C/W
PD
1150
9.2
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 7)
RθJA
109
°C/W
Thermal Reference, Junction−to−Lead 4 (Note 7)
RψJL4
42
°C/W
PD
1300
10.4
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 8)
RθJA
96
°C/W
Thermal Reference, Junction−to−Lead 4 (Note 8)
RψJL4
39.4
°C/W
PD
1214
9.7
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 9)
RθJA
103
°C/W
Thermal Reference, Junction−to−Lead 4 (Note 9)
RψJL4
40.2
°C/W
PD
1389
11.1
mW
mW/°C
Total Device Dissipation (Note 5) TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 5)
Thermal Reference, Junction−to−Lead 4 (Note 5)
Total Device Dissipation (Note 6) TA = 25°C
Derate above 25°C
Total Device Dissipation (Note 7) TA = 25°C
Derate above 25°C
Total Device Dissipation (Note 8) TA = 25°C
Derate above 25°C
Total Device Dissipation (Note 9) TA = 25°C
Derate above 25°C
Total Device Dissipation (Note 10) TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 10)
RθJA
90
°C/W
Thermal Reference, Junction−to−Lead 4 (Note 10)
RψJL4
37.7
°C/W
Junction and Storage Temperature Range
TJ, Tstg
−55 to +150
°C
5. FR−4 @ 100 mm2, 1 oz. copper traces, still air.
6. FR−4 @ 100 mm2, 2 oz. copper traces, still air.
7. FR−4 @ 300 mm2, 1 oz. copper traces, still air.
8. FR−4 @ 300 mm2, 2 oz. copper traces, still air.
9. FR−4 @ 500 mm2, 1 oz. copper traces, still air.
10. FR−4 @ 500 mm2, 2 oz. copper traces, still air.
NOTE: Lead measurements are made by non−contact methods such as IR with treated surface to increase emissivity to 0.9.
Lead temperature measurement by attaching a T/C may yield values as high as 30% higher °C/W values based upon empirical
measurements and method of attachment.
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2
NSI45025ZT1G
TYPICAL PERFORMANCE CURVES
Minimum FR−4 @ 300 mm2, 2 oz Copper Trace, Still Air
Ireg(SS), STEADY STATE CURRENT (mA)
Ireg, CURRENT REGULATION (mA)
60
50
40
30
20
10
VR
0
−10
−20
−10
0
10
20
30
50
40
60
TA = 25°C
25
TA = 85°C
20
15
10
5
0
DC Test Steady State, Still Air
0
1
2
4
5
6
7
8
9
Figure 2. Steady State Current (Ireg(SS)) vs.
Anode−Cathode Voltage (Vak)
Ireg(SS), STEADY STATE CURRENT (mA)
TA = 25°C
25
24
23
22
3.0
Non−Repetitive Pulse Test
4.0
5.0
6.0
7.0
8.0
9.0
10
Vak @ 7.5 V
TA = 25°C
28
27
26
25
24
23
22
21
22
23
24
Figure 3. Pulse Current (Ireg(P)) vs.
Anode−Cathode Voltage (Vak)
2200
POWER DISSIPATION (mW)
25
15
20
25
27
28
29
30
30
500 mm2/2 oz
2000
26
10
26
Figure 4. Steady State Current vs. Pulse
Current Testing
Vak @ 7.5 V
TA = 25°C
5
25
Ireg(P), PULSE CURRENT (mA)
27
300 mm2/2 oz
1800
1600
100 mm2/2 oz
1400
1200
1000
500 mm2/1 oz
800
300 mm2/1 oz
600
400
−40
35
100 mm2/1 oz
−20
0
20
40
60
TA, AMBIENT TEMPERATURE (°C)
TIME (s)
Figure 6. Power Dissipation vs. Ambient
Temperature @ TJ = 1505C
Figure 5. Current Regulation vs. Time
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3
10
29
Vak, ANODE−CATHODE VOLTAGE (V)
Ireg, CURRENT REGULATION (mA)
3
Figure 1. General Performance Curve for CCR
26
0
[ −0.051 mA/°C
typ @ Vak = 7.5 V
TA = 125°C
Vak, ANODE−CATHODE VOLTAGE (V)
27
24
[ −0.070 mA/°C
typ @ Vak = 7.5 V
[ −0.058 mA/°C
typ @ Vak = 7.5 V
TA = −40°C
Vak, ANODE−CATHODE VOLTAGE (V)
28
Ireg(P), PULSE CURRENT (mA)
30
80
NSI45025ZT1G
APPLICATIONS INFORMATION
The CCR is a self biased transistor designed to regulate the
current through itself and any devices in series with it. The
device has a slight negative temperature coefficient, as
shown in Figure 2 – Tri Temp. (i.e. if the temperature
increases the current will decrease). This negative
temperature coefficient will protect the LEDS by reducing
the current as temperature rises.
The CCR turns on immediately and is typically at 20% of
regulation with only 0.5 V across it.
The device is capable of handling voltage for short
durations of up to 45 V so long as the die temperature does
not exceed 150°C. The determination will depend on the
thermal pad it is mounted on, the ambient temperature, the
pulse duration, pulse shape and repetition.
Single LED String
The CCR can be placed in series with LEDs as a High Side
or a Low Side Driver. The number of the LEDs can vary
from one to an unlimited number. The designer needs to
calculate the maximum voltage across the CCR by taking the
maximum input voltage less the voltage across the LED
string (Figures 7 and 8).
Figure 8.
Higher Current LED Strings
Two or more fixed current CCRs can be connected in
parallel. The current through them is additive (Figure 9).
Figure 7.
Figure 9.
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4
NSI45025ZT1G
Other Currents
LEDs on and off for a portion of a single cycle. This on/off
cycle is called the Duty cycle (D) and is expressed by the
amount of time the LEDs are on (Ton) divided by the total
time of an on/off cycle (Ts) (Figure 12).
The adjustable CCR can be placed in parallel with any
other CCR to obtain a desired current. The adjustable CCR
provides the ability to adjust the current as LED efficiency
increases to obtain the same light output (Figure 10).
Figure 12.
The current through the LEDs is constant during the period
they are turned on resulting in the light being consistent with
no shift in chromaticity (color). The brightness is in proportion
to the percentage of time that the LEDs are turned on.
Figure 13 is a typical response of Luminance vs Duty Cycle.
6000
ILLUMINANCE (lx)
5000
4000
Figure 10.
3000
Dimming using PWM
The dimming of an LED string can be easily achieved by
placing a BJT in series with the CCR (Figure 11).
2000
Lux
Linear
1000
0
0
10
20
30
40 50
60 70
DUTY CYCLE (%)
80
90 100
Figure 13. Luminous Emmitance vs. Duty Cycle
Reducing EMI
Designers creating circuits switching medium to high
currents need to be concerned about Electromagnetic
Interference (EMI). The LEDs and the CCR switch
extremely fast, less than 100 nanoseconds. To help eliminate
EMI, a capacitor can be added to the circuit across R2.
(Figure 11) This will cause the slope on the rising and falling
edge on the current through the circuit to be extended. The
slope of the CCR on/off current can be controlled by the
values of R1 and C1.
The selected delay / slope will impact the frequency that
is selected to operate the dimming circuit. The longer the
delay, the lower the frequency will be. The delay time should
not be less than a 10:1 ratio of the minimum on time. The
frequency is also impacted by the resolution and dimming
steps that are required. With a delay of 1.5 microseconds on
the rise and the fall edges, the minimum on time would be
30 microseconds. If the design called for a resolution of 100
dimming steps, then a total duty cycle time (Ts) of 3
milliseconds or a frequency of 333 Hz will be required.
Figure 11.
The method of pulsing the current through the LEDs is
known as Pulse Width Modulation (PWM) and has become
the preferred method of changing the light level. LEDs being
a silicon device, turn on and off rapidly in response to the
current through them being turned on and off. The switching
time is in the order of 100 nanoseconds, this equates to a
maximum frequency of 10 Mhz, and applications will
typically operate from a 100 Hz to 100 kHz. Below 100 Hz
the human eye will detect a flicker from the light emitted
from the LEDs. Between 500 Hz and 20 kHz the circuit may
generate audible sound. Dimming is achieved by turning the
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5
NSI45025ZT1G
Thermal Considerations
P D(MAX) +
As power in the CCR increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
affect the rate of junction temperature rise for the part. When
the device has good thermal conductivity through the PCB,
the junction temperature will be relatively low with high
power applications. The maximum dissipation the device
can handle is given by:
T J(MAX) * T A
R qJA
Referring to the thermal table on page 2 the appropriate
RqJA for the circuit board can be selected.
AC Applications
The CCR is a DC device; however, it can be used with full
wave rectified AC as shown in application notes
AND8433/D and AND8492/D and design notes
DN05013/D and DN06065/D. Figure 14 shows the basic
circuit configuration.
Figure 14. Basic AC Application
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NSI45025ZT1G
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE N
D
b1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
4
HE
1
2
3
b
e1
e
A1
C
q
A
0.08 (0003)
DIM
A
A1
b
b1
c
D
E
e
e1
L
L1
HE
E
MIN
1.50
0.02
0.60
2.90
0.24
6.30
3.30
2.20
0.85
0.20
1.50
6.70
0°
q
L
STYLE 2:
PIN 1.
2.
3.
4.
L1
MILLIMETERS
NOM
MAX
1.63
1.75
0.06
0.10
0.75
0.89
3.06
3.20
0.29
0.35
6.50
6.70
3.50
3.70
2.30
2.40
0.94
1.05
−−−
−−−
1.75
2.00
7.00
7.30
10°
−
MIN
0.060
0.001
0.024
0.115
0.009
0.249
0.130
0.087
0.033
0.008
0.060
0.264
0°
INCHES
NOM
0.064
0.002
0.030
0.121
0.012
0.256
0.138
0.091
0.037
−−−
0.069
0.276
−
MAX
0.068
0.004
0.035
0.126
0.014
0.263
0.145
0.094
0.041
−−−
0.078
0.287
10°
ANODE
CATHODE
NC
CATHODE
SOLDERING FOOTPRINT
3.8
0.15
2.0
0.079
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
SCALE 6:1
mm Ǔ
ǒinches
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NSI45025Z/D