ADM1026 Complete Thermal System Management Controller The ADM1026 is a complete system hardware monitor for microprocessor-based systems, providing measurement and limit comparison of various system parameters. The ADM1026 has up to 19 analog measurement channels. Fifteen analog voltage inputs are provided, five of which are dedicated to monitoring +3.3 V, +5.0 V, and 12 V power supplies, and the processor core voltage. The ADM1026 can monitor two other power supply voltages by measuring its own VCC and the main system supply. One input (two pins) is dedicated to a remote temperature-sensing diode. Two additional pins can be configured as general-purpose analog inputs to measure 0 V to 2.5 V, or as a second temperature sensing input. The eight remaining inputs are general-purpose analog inputs with a range of 0 V to 2.5 V or 0 V to 3.0 V. The ADM1026 also has an on-chip temperature sensor. The ADM1026 has eight pins that can be configured for fan speed measurement or as general-purpose logic I/O pins. Another eight pins are dedicated to general-purpose logic I/O. An additional pin can be configured as a general-purpose I/O or as the bidirectional THERM pin. Measured values can be read out via a 2-wire serial system management bus, and values for limit comparisons can be programmed over the same serial bus. The high speed, successive approximation ADC allows frequent sampling of all analog channels to ensure a fast interrupt response to any out-of-limit measurement. http://onsemi.com LQFP−48 CASE 932 MARKING DIAGRAM ADM1026 JSTZ #YYWW 1 Features Up to 19 Analog Measurement Channels (Including Internal Measurements) Up to 8 Fan Speed Measurement Channels Up to 17 General-Purpose Logic I/O Pins Remote Temperature Measurement with Remote Diode (Two Channels) On-Chip Temperature Sensor Analog and PWM Fan Speed Control Outputs 2-Wire Serial System Management Bus (SMBus) 8 kB On-Chip EEPROM Full SMBus 1.1 Support Includes Packet Error Checking (PEC) Chassis Intrusion Detection Interrupt Output (SMBAlert) Reset Input, Reset Outputs Thermal Interrupt (THERM) Output Limit Comparison of All Monitored Values This is a Pb-Free Device* ADM1026JSTZ = Special Device Code # = Pb-Free Package YYWW = Date Code ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 54 of this data sheet. Applications Network Servers and Personal Computers Telecommunications Equipment Test Equipment and Measuring Instruments *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 April, 2012 − Rev. 4 1 Publication Order Number: ADM1026/D ADM1026 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16/THERM AIN0(0V – 3V) AIN1(0V – 3V) AIN2(0V – 3V) AIN3(0V – 3V) AIN4(0V – 3V) 48 47 46 45 44 43 42 41 40 39 38 37 PIN ASSIGNMENT GPIO9 1 36 AIN5(0V – 3V) GPIO8 2 35 AIN6(0V – 2.5V) FAN0/GPIO0 3 34 AIN7(0V – 2.5V) FAN1/GPIO1 4 33 +VCCP FAN2/GPIO2 5 32 +12 VIN FAN3/GPIO3 6 31 –12 VIN 3.3V MAIN 7 30 +5 VIN DGND 8 29 VBAT FAN4/GPIO4 9 28 D2+/AIN8(0V – 2.5V) FAN5/GPIO5 10 27 D2–/AIN9(0V – 2.5V) FAN6/GPIO6 11 26 D1+ FAN7/GPIO7 12 25 D1-/NTESTIN PIN 1 ADM1026 VREF 24 DAC 23 3.3V STBY 22 AGND 21 RESETMAIN 20 RESETSTBY 19 PWM 18 INT 17 CI 16 ADD/NTESTOUT 15 SCL 13 SDA 14 TOP VIEW ADD/ NTESTOUT SDA 3.3V MAIN SCL 3.3V STBY VCC RESET IN GPIO15 GPIO14 3.3V MAIN RESET GENERATOR GPIO13 GPIO12 SERIAL BUS INTERFACE GPIO REGISTERS GPIO11 GPIO10 RESETMAIN VCC 100k GPIO9 GPIO8 VCC FAN 7/GPIO7 FAN 6/GPIO6 3.3V STBY RESET GENERATOR RESETSTBY PWM REGISTER AND CONTROLLER FAN 5/GPIO5 FAN SPEED COUNTER FAN 4/GPIO4 FAN 3/GPIO3 FAN 2/GPIO2 VALUE AND LIMIT REGISTERS FAN 1/GPIO1 ADDRESS POINTER REGISTER FAN 0/GPIO0 VBAT +5 VIN LIMIT COMPARATORS 8k BYTES EEPROM –12 VIN +12 VIN INTERRUPT STATUS REGISTERS AUTOMATIC FAN SPEED CONTROL +VCCP AIN0 (0V - +3V) INT MASK REGISTERS AIN1 (0V - +3V) AIN2 (0V - +3V) INPUT ATTENUATORS AND ANALOG MULTIPLEXER AIN3 (0V - +3V) AIN4 (0V - +3V) AIN5 (0V - +3V) AIN6 (0V - +2.5V) INTERRUPT MASKING 100k INT CONFIGURATION REGISTERS D2–/AIN9 (0V - +2.5V) BAND GAP REFERENCE ANALOG OUTPUT REGISTER AND 8−BIT DAC BAND GAP TEMPERATURE SENSOR DGND VREF (1.82V OR 2.5V) Figure 1. Functional Block Diagram http://onsemi.com 2 VCC GPIO16/THERM D2+/AIN8 (0V - +2.5V) AGND CI 100k 8−BIT ADC D1–/NTESTIN VCC ADM1026 AIN7 (0V - +2.5V) D1+ PWM TO GPIO REGISTERS DAC ADM1026 Table 1. ABSOLUTE MAXIMUM RATINGS Parameter Rating Unit Positive Supply Voltage (VCC) 6.5 V Voltage on +12 VIN Pin +20 V Voltage on −12 VIN Pin −20 V Voltage on Analog Pins −0.3 to (VCC + 0.3) V −0.3 to +6.5 V Input Current at Any Pin 5 mA Package Input Current 20 mA Voltage on Open-drain Digital Pins Maximum Junction Temperature (TJMAX) 150 C Storage Temperature Range −65 to +150 C Lead Temperature, Soldering Vapor Phase (60 sec) Infrared (15 sec) 215 200 ESD Rating −12 VIN Pin All Other Pins 1000 2000 C V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: This device is ESD sensitive. Use standard ESD precautions when handling. Table 2. THERMAL CHARACTERISTICS Package Type 48-lead LQFP qJA qJC Unit 50 10 C/W Table 3. PIN ASSIGNMENT Pin No. Mnemonic Type 1 GPIO9 Digital I/O† General-purpose I/O pin that can be configured as digital inputs or outputs. Description 2 GPIO8 Digital I/O† General-purpose I/O pin that can be configured as digital inputs or outputs. 3 FAN0/GPIO0 Digital I/O Fan tachometer input with internal 10 kW pullup resistor to 3.3 V STBY. Can be reconfigured as a general-purpose, open drain, digital I/O pin. 4 FAN1/GPIO1 Digital I/O Fan tachometer input with internal 10 kW pullup resistor to 3.3 V STBY. Can be reconfigured as a general-purpose, open drain, digital I/O pin. 5 FAN2/GPIO2 Digital I/O Fan tachometer input with internal 10 kW pullup resistor to 3.3 V STBY. Can be reconfigured as a general-purpose, open drain, digital I/O pin. 6 FAN3/GPIO3 Digital I/O Fan tachometer input with internal 10 kW pullup resistor to 3.3 V STBY. Can be reconfigured as a general-purpose, open drain, digital I/O pin. 7 3.3 V MAIN Analog Input 8 DGND Ground 9 FAN4/GPIO4 Digital I/O Fan tachometer input with internal 10 kW pullup resistor to 3.3 V STBY. Can be reconfigured as a general-purpose, open drain, digital I/O pin. 10 FAN5/GPIO5 Digital I/O Fan tachometer input with internal 10 kW pullup resistor to 3.3 V STBY. Can be reconfigured as a general-purpose, open drain, digital I/O pin. 11 FAN6/GPIO6 Digital I/O Fan tachometer input with internal 10 kW pullup resistor to 3.3 V STBY. Can be reconfigured as a general-purpose, open drain, digital I/O pin. 12 FAN7/GPIO7 Digital I/O Fan tachometer input with internal 10 kW pullup resistor to 3.3 V STBY. Can be reconfigured as a general-purpose, open drain, digital I/O pin. 13 SCL Digital Input Monitors the main 3.3 V system supply. Does not power the device. Ground pin for digital circuits. Open Drain Serial Bus Clock. Requires a 2.2 kW pullup resistor. 14 SDA Digital I/O 15 ADD/NTESTOUT Digital Input This is a three-state input that controls the two LSBs of the serial bus address. It also functions as the output for NAND tree testing. 16 CI Digital Input An active high input that captures a chassis intrusion event in Bit 6 of Status Register 4. This bit remains set until cleared, as long as battery voltage is applied to the VBAT input, even when the ADM1026 is powered off. Serial Bus Data. Open drain I/O. Requires a 2.2 kW pullup resistor. http://onsemi.com 3 ADM1026 Table 3. PIN ASSIGNMENT Pin No. Mnemonic Type 17 INT Digital Output Interrupt Request (Open Drain). The output is enabled when Bit 1 of the configuration register is set to 1. The default state is disabled. It has an on-chip 100 kW pullup resistor. Description 18 PWM Digital Output Open drain pulse width modulated output for control of the fan speed. This pin defaults to high for the 100% duty cycle for use with NMOS drive circuitry. If a PMOS device is used to drive the fan, the PWM output may be inverted by setting Bit 1 of Test Register 1 = 1. 19 RESETSTBY Digital Output Power-on Reset. 5 mA driver (weak 100 kW pullup), active low output (100 kW pullup) with a 180 ms typical pulse width. RESETSTBY is asserted whenever 3.3 V STBY is below the reset threshold. It remains asserted for approximately 180 ms after 3.3 V STBY rises above the reset threshold. 20 RESETMAIN Digital I/O Power-on Reset. 5 mA driver (weak 100 kW pullup), active low output (100 kW pullup) with a 180 ms typical pulse width. RESETMAIN is asserted whenever 3.3 V MAIN is below the reset threshold. It remains asserted for approximately 180 ms after 3.3 V MAIN rises above the reset threshold. If, however, 3.3 V STBY rises with or before 3.3 V MAIN, then RESETMAIN remains asserted for 180 ms after RESETSTBY is deasserted. Pin 20 also functions as an active low RESET input. 21 AGND Ground 22 3.3 V STBY Power Supply Supplies 3.3 V power. Also monitors the 3.3 V standby power rail. 23 DAC Analog Output 0 V to 2.5 V output for analog control of the fan speed. 24 VREF Analog Output Reference Voltage Output. Can be selected as 1.8 V (default) or 2.5 V. 25 D1–/NTESTIN Analog Input Connected to a cathode of the first remote temperature sensing diode. If it is held high at power-on, it activates the NAND tree test mode. 26 D1+ Analog Input Connected to the anode of the first remote temperature sensing diode. 27 D2–/AIN9 Programmable Connected to the cathode of the second remote temperature sensing diode or the analog input may be reconfigured as a 0 V − 2.5 V analog input. 28 D2+/AIN8 Programmable Connected to the anode of the second remote temperature sensing diode, or the analog input may be reconfigured as a 0 V − 2.5 V analog input. 29 VBAT Analog Input Monitors battery voltage, nominally +3.0 V. 30 +5.0 VIN Analog Input Monitors the +5.0 V supply. 31 −12 VIN Analog Input Monitors the −12 V supply. 32 +12 VIN Analog Input Monitors the +12 V supply. 33 +VCCP Analog Input Monitors the processor core voltage (0 V to 3.0 V). 34 AIN7 Analog Input General-purpose 0 V to 2.5 V analog inputs. 35 AIN6 Analog Input General-purpose 0 V to 2.5 V analog inputs. 36 AIN5 Analog Input General-purpose 0 V to 3.0 V analog inputs. 37 AIN4 Analog Input General-purpose 0 V to 3.0 V analog inputs. 38 AIN3 Analog Input General-purpose 0 V to 3.0 V analog inputs. 39 AIN2 Analog Input General-purpose 0 V to 3.0 V analog inputs. 40 AIN1 Analog Input General-purpose 0 V to 3.0 V analog inputs. 41 AIN0 Analog Input General-purpose 0 V to 3.0 V analog inputs. 42 GPIO16/THERM Digital I/O† General-purpose I/O pin that can be configured as a digital input or output. Can also be configured as a bidirectional THERM pin (100 kW pullup). 43 GPIO15 Digital I/O† General-purpose I/O pin that can be configured as a digital input or output. 44 GPIO14 Digital I/O† General-purpose I/O pin that can be configured as a digital input or output. GPIO13 Digital I/O† General-purpose I/O pin that can be configured as a digital input or output. 46 GPIO12 Digital I/O† General-purpose I/O pin that can be configured as a digital input or output. 47 GPIO11 Digital I/O† General-purpose I/O pin that can be configured as a digital input or output. 48 GPIO10 Digital I/O† General-purpose I/O pin that can be configured as a digital input or output. 45 Ground pin for analog circuits. †GPIO pins are open drain and require external pullup resistors. Fan inputs have integrated 10 kW pullups, but these pins become open drain when reconfigured as GPIOs. http://onsemi.com 4 ADM1026 Table 4. ELECTRICAL CHARACTERISTICS (TA = TMIN to TMAX, VCC = VMIN to VMAX, unless otherwise noted. (Note 1, 2, and 3)) Parameter Test Conditions/Comments Min Typ Max Unit 3.0 3.3 5.5 V − 2.5 4.0 mA POWER SUPPLY Supply Voltage, 3.3 V STBY Supply Current, ICC Interface Inactive, ADC Active TEMPERATURE-TO-DIGITAL CONVERTER Internal Sensor Accuracy − − 3.0 C Resolution − 1.0 − C − − 3.0 C − 1.0 − C − − 90 5.5 − − mA Total Unadjusted Error (TUE) (Note 4) − − 2.0 % Differential Non-linearity (DNL) − − 1.0 LSB Power Supply Sensitivity − 0.1 Conversion Time (Analog Input or Internal Temperature) (Note 5) − 11.38 12.06 ms Conversion Time (External Temperature) (Note 5) − 34.13 36.18 ms Input Resistance (+5.0 VIN, VCCP, AIN0 − AIN5) 80 100 120 kW Input Resistance of +12 VIN pin 70 100 115 kW Input Resistance of −12 VIN pin 8.0 10 12 kW Input Resistance (AIN6 − AIN9) 5.0 − − MW Input Resistance of VBAT pin (Note 4) 80 100 120 kW − 80 100 nA − 6.0 − nA 0 –2.5 − V 5.0 % External Diode Sensor Accuracy 0C < TD < 100C Resolution Remote Sensor Source Current High Level Low Level ANALOG-TO-DIGITAL CONVERTER (Including MUX and ATTENUATORS) VBAT Current Drain (when measured) CR2032 Battery Life >10 Years VBAT Current Drain (when not measured) %/V ANALOG OUTPUT (DAC) Output Voltage Range Total Unadjusted Error (TUE) IL = 2 mA − − Zero Error No Load − 1.0 − LSB Differential Non-linearity (DNL) Monotonic by Design − − 1.0 LSB Integral Non-linearity − 0.5 − LSB Output Source Current − 2.0 − mA Output Sink Current − 1.0 − mA 1.8 2.47 1.82 2.50 1.84 2.53 V − 0.15 − % − 0.15 − % − 25 − mA Output Current Source − 2.0 − mA Output Current Sink − 2.0 − mA REFERENCE OUTPUT Output Voltage Bit 2 of Register 07h = 0 Bit 2 of Register 07h = 1 Load Regulation (ISINK = 2 mA) Load Regulation (ISOURCE = 2 mA) Short Circuit Current VCC = 3.3 V http://onsemi.com 5 ADM1026 Table 4. ELECTRICAL CHARACTERISTICS (TA = TMIN to TMAX, VCC = VMIN to VMAX, unless otherwise noted. (Note 1, 2, and 3)) Parameter Test Conditions/Comments Min Typ Max Unit Accuracy − − 12 % Full-scale Count − − 255 − − − − 8800 4400 2200 1100 − − − − RPM 20 22.5 25 kHz FAN RPM-TO-DIGITAL CONVERTER (Note 6) FAN0 to FAN7 Nominal Input RPM (Note 5) Divisor = 1, fan count = 153 Divisor = 2, fan count = 153 Divisor = 4, fan count = 153 Divisor = 8, fan count = 153 Internal Clock Frequency OPEN DRAIN O/Ps, PWM, GPIO0 to 16 Output High Voltage, VOH IOUT = 3.0 mA, VCC = 3.3 V 2.4 − − V High Level Output Leakage Current, IOH VOUT = VCC − 0.1 1.0 mA Output Low Voltage, VOL IOUT = −3.0 mA, VCC = 3.3 V − − 0.4 V − 75 − Hz − − 0.4 V 140 180 240 ms PWM Output Frequency DIGITAL OUTPUTS (INT, RESETMAIN, RESETSTBY) Output Low Voltage, VOL IOUT = −3.0 mA, VCC = 3.3 V RESET Pulse Width OPEN DRAIN SERIAL DATABUS OUTPUT (SDA) Output Low Voltage, VOL IOUT = –3.0 mA, VCC = 3.3 V − − 0.4 V High Level Output Leakage Current, IOH VOUT = VCC − 0.1 1.0 mA Input High Voltage, VIH 2.2 − − V Input Low Voltage, VIL − − 0.8 V Hysteresis − 500 − mV SERIAL BUS DIGITAL INPUTS (SCL, SDA) DIGITAL INPUT LOGIC LEVELS (ADD, CI, FAN 0 to 7, GPIO 0 to 16) (Note 7 and 8) Input High Voltage, VIH VCC = 3.3 V 2.4 − − V Input Low Voltage, VIL VCC = 3.3 V 0.8 − − V Hysteresis (Fan 0 to 7) VCC = 3.3 V − 250 − mV RESETMAIN, RESETSTBY RESETMAIN Threshold Falling Voltage 2.89 2.94 2.97 V RESETSTBY Threshold Falling Voltage 3.01 3.05 3.10 V RESETMAIN Hysteresis − 60 − mV RESETSTBY Hysteresis − 70 − mV –1.0 − − mA − − 1.0 mA − 20 − pF Endurance (Note 9) 100 700 − kcycles Data Retention (Note 10) 10 − − Years − − 400 kHz Glitch Immunity, tSW − − 50 ns Bus Free Time, tBUF 4.7 − − ms Start Setup Time, tSU; STA 4.7 − − ms DIGITAL INPUT CURRENT Input High Current, IIH VIN = VCC Input Low Current, IIL VIN = 0 Input Capacitance, CIN EEPROM RELIABILITY SERIAL BUS TIMING Clock Frequency, fSCLK See Figure 2 for All Parameters. http://onsemi.com 6 ADM1026 Table 4. ELECTRICAL CHARACTERISTICS (TA = TMIN to TMAX, VCC = VMIN to VMAX, unless otherwise noted. (Note 1, 2, and 3)) Parameter Test Conditions/Comments Min Typ Max Unit Start Hold Time, tHD; STA 4.0 − − ms SCL Low Time, tLOW 4.7 − − ms SCL High Time, tHIGH 4.0 − − ms SCL, SDA Rise Time, tr − − 1000 ns SCL, SDA Fall Time, tf − − 300 ns Data Setup Time, tSU; DAT 250 − − ns Data Hold Time, tHD; DAT 300 − − ns SERIAL BUS TIMING 1. 2. 3. 4. All voltages are measured with respect to GND, unless otherwise specified. Typicals are at TA = 25C and represent the most likely parametric norm. Shutdown current typ is measured with VCC = 3.3 V. Timing specifications are tested at logic levels of VIL = 0.8 V for a falling edge and VIH = 2.1 V for a rising edge. Total unadjusted error (TUE) includes offset, gain, and linearity errors of the ADC, multiplexer, and on-chip input attenuators. VBAT is accurate only for VBAT voltages greater than 1.5 V (see Figure 14). 5. Total analog monitoring cycle time is nominally 273 ms, made up of 18 ms 11.38 ms measurements on analog input and internal temperature channels, and 2 ms 34.13 ms measurements on external temperature channels. 6. The total fan count is based on two pulses per revolution of the fan tachometer output. The total fan monitoring time depends on the number of fans connected and the fan speed. See the Fan Speed Measurement section for more details. 7. ADD is a three-state input that may be pulled high, low, or left open circuit. 8. Logic inputs accept input high voltages up to 5.0 V even when device is operating at supply voltages below 5.0 V. 9. Endurance is qualified to 100,000 cycles as per JEDEC Std. 22 method A117, and measured at −40C, +25C, and +85C. Typical endurance at +25C is 700,000 cycles. 10. Retention lifetime equivalent at junction temperature (TJ ) = 55C as per JEDEC Std. 22 method A117. Retention lifetime based on activation energy of 0.6 V derates with junction temperature as shown in Figure 15. t LOW tF t HD; STA tR SCL t HD; STA t HD; DAT t HIGH t SU; STA t SU; DAT t SU; STO SDA P t BUF S S Figure 2. Serial Bus Timing Diagram http://onsemi.com 7 P ADM1026 TYPICAL PERFORMANCE CHARACTERISTICS 14 25 12 15 10 TEMPERATURE ERROR (5C) TEMPERATURE ERROR (5C) 20 D+ TO GND 5 0 –5 D+ TO VCC –10 –15 10 8 250mV 6 4 100mV 2 –20 –25 0 0 30 60 90 LEAKAGE RESISTANCE (M) 120 Figure 3. Temperature Error vs. PCB Track Resistance 100 200 300 400 FREQUENCY (MHz) 500 600 Figure 4. Temperature Error vs. Power Supply Noise Frequency 12 110 100mV 60mV 40mV 10 TEMPERATURE ERROR (5C) 0 100 90 80 READING (5C) 8 6 4 70 60 50 40 30 20 2 10 0 0 100 200 300 400 FREQUENCY (MHz) 500 0 600 Figure 5. Temperature Error vs. Common-mode Noise Frequency 20 30 40 50 60 70 80 PIII TEMPERATURE (5C) 90 100 110 80 70 TEMPERATURE ERROR (5C) 0 TEMPERATURE ERROR (5C) 10 Figure 6. Pentium) III Temperature vs. ADM1026 Reading 5 –5 –10 –15 60 50 40 30 100mV 20 60mV –20 –25 0 10 0 10 20 30 CAPACITANCE (nF) 40 0 50 Figure 7. Temperature Error vs. Capacitance Between D+ and D– 100 40mV 200 300 400 FREQUENCY (MHz) 500 600 Figure 8. Temperature Error vs. Differential-mode Noise Frequency http://onsemi.com 8 ADM1026 TYPICAL PERFORMANCE CHARACTERISTICS 3.0 450 400 2.5 RESET TIMEOUT (ms) 350 2.0 IDD (mA) 300 250 200 1.5 1.0 150 100 0.5 50 0 –40 –20 80 20 40 60 TEMPERATURE (5C) 0 100 120 0 3.00 3.25 140 Figure 9. Powerup Reset Timeout vs. Temperature 3.50 3.75 4.00 4.25 4.50 VCC (V) 4.75 5.00 5.25 5.50 Figure 10. Supply Current vs. Supply Voltage 1.0 1.8 1.6 TEMPERATURE ERROR (5C) TEMPERATURE ERROR (5C) 0.5 1.4 1.2 1.0 0.8 0.6 0.4 0 –0.5 –1.0 –1.5 0.2 0 0 10 20 30 40 50 60 70 80 TEMPERATURE (5C) 90 –2.0 100 110 120 Figure 11. Local Sensor Temperature Error 20 30 40 50 60 70 80 TEMPERATURE (5C) 90 100 110 120 3.5 3.0 VBAT MEASUREMENT 100 TEMPERATURE (5C) 10 Figure 12. Remote Sensor Temperature Error 120 80 60 40 20 0 0 2.5 2.0 1.5 1.0 0.5 0 2 4 6 8 10 12 14 TIME (s) 16 18 20 22 24 0 26 0 1 2 VBAT VOLTAGE 3 Figure 14. VBAT Measurement vs. Voltage Figure 13. Response to Thermal Shock http://onsemi.com 9 4 ADM1026 Functional Description Chassis Intrusion The ADM1026 is a complete system hardware monitor for microprocessor-based systems. The device communicates with the system via a serial system management bus. The serial bus controller has a hardwired address line for device selection (ADD, Pin 15), a serial data line for reading and writing addresses and data (SDA, Pin 14), and an input line for the serial clock (SCL, Pin 13). All control and programming functions of the ADM1026 are performed over the serial bus. A chassis intrusion input (Pin 16) is provided to detect unauthorized tampering with the equipment. This event is latched in a battery-backed register bit. Resets The ADM1026 has two power-on reset outputs, RESETMAIN and RESETSTBY, that are asserted when 3.3 V MAIN or 3.3 V STBY fall below the reset threshold. These give a 180 ms reset pulse at powerup. RESETMAIN also functions as an active-low RESET input. Measurement Inputs Fan Speed Control Outputs Programmability of the analog and digital measurement inputs makes the ADM1026 extremely flexible and versatile. The device has an 8-bit A/D converter, and 17 analog measurement input pins that can be configured in different ways. Pins 25 and 26 are dedicated temperature inputs and may be connected to the cathode and anode of a remote temperature sensing diode. Pins 27 and 28 may be configured as temperature inputs and connected to a second temperature-sensing diode, or may be reconfigured as analog inputs with a range of 0 V to 2.5 V. Pins 29 to 33 are dedicated analog inputs with on-chip attenuators configured to monitor VBAT, +5.0 V, −12 V, +12 V, and the processor core voltage VCCP, respectively. Pins 34 to 41 are general-purpose analog inputs with a range of 0 V to 2.5 V or 0 V to 3.0 V. These are mainly intended for monitoring SCSI termination voltages, but may be used for other purposes. The ADC also accepts input from an on-chip band gap temperature sensor that monitors system ambient temperature. In addition, the ADM1026 monitors the supply from which it is powered, 3.3 V STBY, so there is no need for a separate pin to monitor the power supply voltage. The ADM1026 has eight pins that are general-purpose logic I/O pins (Pins 1, 2, and 43 to 48), a pin that can be configured as GPIO or as a bidirectional thermal interrupt (THERM) pin (Pin 42), and eight pins that can be configured for fan speed measurement or as general-purpose logic pins (Pins 3 to 6 and Pins 9 to 12). The ADM1026 has two outputs intended to control fan speed, though they can also be used for other purposes. Pin 18 is an open drain, Pulse Width Modulated (PWM) output with a programmable duty cycle and an output frequency of 75 Hz. Pin 23 is connected to the output of an on-chip, 8-bit, digital-to-analog converter with an output range of 0 V to 2.5 V. Either or both of these outputs may be used to implement a temperature-controlled fan by controlling the speed of a fan using the temperature measured by the on-chip temperature sensor or remote temperature sensors. Internal Registers Table 5 describes the principal registers of the ADM1026. For more detailed information, see Table 12 to Table 125. Table 5. PRINCIPLE REGISTERS Type Description Address Pointer Contains the address that selects one of the other internal registers. When writing to the ADM1026, the first byte of data is always a register address, and is written to the address pointer register. Configuration Registers Sequential Measurement When the ADM1026 monitoring sequence is started, it cycles sequentially through the measurement of analog inputs and the temperature sensor, while at the same time the fan speed inputs are independently monitored. Measured values from these inputs are stored in value registers. These can be read over the serial bus, or can be compared with programmed limits stored in the limit registers. The results of out-of-limit comparisons are stored in the interrupt status registers. An out-of-limit event generates an interrupt on the INT line (Pin 17). Any or all of the interrupt status bits can be masked by appropriate programming of the interrupt mask registers. Provide control and configuration for various operating parameters. Fan Divisor Registers Contain counter prescaler values for fan speed measurement. DAC/PWM Control Registers Contain speed values for PWM and DAC fan drive outputs. GPIO Configuration Registers Configure the GPIO pins as input or output and for signal polarity. Value and Limit Registers Store the results of analog voltage inputs, temperature, and fan speed measurements, along with their limit values. Status Registers Store events from the various interrupt sources. Mask Registers Allow masking of individual interrupt sources. EEPROM The ADM1026 has 8 kB of non-volatile, electrically erasable, programmable read-only memory (EEPROM) from register Addresses 8000h to 9FFFh. This may be used for permanent storage of data that is not lost when the http://onsemi.com 10 ADM1026 Serial Bus Interface ADM1026 is powered down, unlike the data in the volatile registers. Although referred to as read-only memory, the EEPROM can be written to (as well as read from) via the serial bus in exactly the same way as the other registers. The main differences between the EEPROM and other registers are: An EEPROM location must be blank before it can be written to. If it contains data, it must first be erased. Writing to EEPROM is slower than writing to RAM. Writing to the EEPROM should be restricted because its typical cycle life is 100,000 write operations, due to the usual EEPROM wear-out mechanisms. Control of the ADM1026 is carried out via the serial system management bus (SMBus). The ADM1026 is connected to this bus as a slave device, under the control of a master device. The ADM1026 has a 7-bit serial bus slave address. When the device is powered on, it does so with a default serial bus address. The 5 MSBs of the address are set to 01011, and the 2 LSBs are determined by the logical states of Pin 15 ADD/NTESTOUT. This pin is a three-state input that can be grounded, connected to VCC, or left open-circuit to give three different addresses. Table 6. ADDRESS PIN TRUTH TABLE The EEPROM in the ADM1026 has been qualified for two key EEPROM memory characteristics: memory cycling endurance and memory data retention. Endurance qualifies the ability of the EEPROM to be cycled through many program, read, and erase cycles. In real terms, a single endurance cycle is composed of four independent, sequential events, as follows: 1. Initial page erase sequence 2. Read/verify sequence 3. Program sequence 4. Second read/verify sequence ADD Pin RETENTION (Years) 200 150 100 50 110 0 0 No Connect 1 0 VCC 0 1 Figure 16 and Figure 17 show timing diagrams for general read and write operations using the SMBus. The SMBus specification defines specific conditions for different types of read and write operations, which are discussed later in this section. The general SMBus protocol* operates as follows: 1. The master initiates data transfer by establishing a start condition, defined as a high-to-low transition on the serial data line (SDA) while the serial clock line SCL remains high. This indicates that a data stream follows. All slave peripherals connected to the serial bus respond to the start condition and shift in the next 8 bits, consisting of a 7-bit slave address (MSB first) and an R/W bit, which determine the direction of the data transfer, that is, whether data is written to or read from the slave device (0 = write, 1 = read). The peripheral whose address corresponds to the trans-mitted address responds by pulling the data line low during the low period before the ninth clock pulse, known as the acknowledge bit, and holding it low during the high period of this clock pulse. All other devices on the bus remain idle while the selected device waits for data to be read from or written to it. If the R/W bit is 0, the master writes to the slave device. If the R/W bit is 1, the master reads from the slave device. 250 60 70 80 90 100 JUNCTION TEMPERATURE (5C) GND General SMBus Timing 300 50 A0 If ADD is left open-circuit, the default address is 0101110 (5Ch). ADD is sampled only at powerup on the first valid SMBus transaction, so any changes made while the power is on (and the address is locked) have no effect. The facility to make hardwired changes to device addresses allows the user to avoid conflicts with other devices sharing the same serial bus, for example if more than one ADM1026 is used in a system. In reliability qualification, every byte is cycled from 00h to FFh until a first fail is recorded, signifying the endurance limit of the EEPROM memory. Retention quantifies the ability of the memory to retain its programmed data over time. The EEPROM in the ADM1026 has been qualified in accordance with the formal JEDEC Retention Lifetime Specification (A117) at a specific junction temperature (TJ = 55C) to guarantee a minimum of 10 years retention time. As part of this qualification procedure, the EEPROM memory is cycled to its specified endurance limit described above before data retention is characterized. This means that the EEPROM memory is guaranteed to retain its data for its full specified retention lifetime every time the EEPROM is reprogrammed. Note that retention lifetime based on an activation energy of 0.6 V derates with TJ, as shown in Figure 15. 0 40 A1 120 Figure 15. Typical EEPROM Memory Retention http://onsemi.com 11 ADM1026 2. Data is sent over the serial bus in sequences of nine clock pulses, 8 bits of data followed by an acknowledge bit from the slave device. Data transitions on the data line must occur during the low period of the clock signal and remain stable during the high period, because a low-to-high transition when the clock is high may be interpreted as a stop signal. If the operation is a write operation, the first data byte after the slave address is a command byte. This tells the slave device what to expect next. It may be an instruction telling the slave device to expect a block write, or it may simply be a register address that tells the slave where subsequent data is to be written. Because data can flow in only one direction as defined by the R/W bit, it is not possible to send a command to a slave device during a read operation. Before doing a read operation, it may first be necessary to do a write operation to tell the slave what type of read operation to expect and/or the address from which data is to be read. 3. When all data bytes have been read or written, stop conditions are established. In write mode, the master pulls the data line high during the 10th clock pulse to assert a stop condition. In read mode, the master device releases the SDA line during the low period before the ninth clock pulse, but the slave device does not pull it low (called No Acknowledge). The master takes the data line low during the low period before the 10th clock pulse, then high during the 10th clock pulse to assert a stop condition. *If it is required to perform several read or write operations in succession, the master can send a repeat start condition instead of a stop condition to begin a new operation. 1 9 1 9 SCL 0 SDA 1 0 1 1 A1 A0 D6 D7 R/W START BY MASTER D4 D5 D2 D3 D1 D0 ACK. BY SLAVE ACK. BY SLAVE FRAME 1 SLAVE ADDRESS FRAME 2 COMMAND CODE 1 9 9 1 SCL (CONTINUED) SDA (CONTINUED) D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 ACK. BY SLAVE ACK. BY SLAVE FRAME 3 DATA BYTE STOP BY MASTER FRAME N DATA BYTE Figure 16. General SMBus Write Timing Diagram 1 9 1 9 SCL 0 SDA 1 0 1 1 A1 A0 D6 D7 R/W START BY MASTER D4 D5 D2 D3 D1 D0 ACK. BY SLAVE ACK. BY MASTER FRAME 1 SLAVE ADDRESS FRAME 2 DATA BYTE 1 9 9 1 SCL (CONTINUED) SDA (CONTINUED) D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 ACK. BY MASTER Figure 17. General SMBus Read Timing Diagram http://onsemi.com 12 D0 NO ACK. FRAME N DATA BYTE FRAME 3 DATA BYTE D1 STOP BY MASTER ADM1026 SMBus Protocols for RAM and EEPROM S − START W − WRITE P − STOP A − ACKNOWLEDGE R −READ A − NO ACKNOWLEDGE The ADM1026 contains volatile registers (RAM) and non-volatile EEPROM. RAM occupies Addresses 00h to 6Fh, while EEPROM occupies Addresses 8000h to 9FFFh. Data can be written to and read from both RAM and EEPROM as single data bytes and as block (sequential) read or write operations of 32 data bytes, the maximum block size allowed by the SMBus specification. Data can only be written to unprogrammed EEPROM locations. To write new data to a programmed location, it is first necessary to erase it. EEPROM erasure cannot be done at the byte level; the EEPROM is arranged as 128 pages of 64 bytes, and an entire page must be erased. Note that of these 128 pages, only 124 pages are available to the user. The last four pages are reserved for manufacturing purposes and cannot be erased/rewritten. The EEPROM has three RAM registers associated with it, EEPROM Registers 1, 2, and 3 at Addresses 06h, 0Ch, and 13h. EEPROM Registers 1 and 2 are for factory use only. EEPROM Register 3 sets up the EEPROM operating mode. Setting Bit 0 of EEPROM Register 3 puts the EEPROM into read mode. Setting Bit 1 puts it into programming mode. Setting Bit 2 puts it into erase mode. Only one of these bits must be set before the EEPROM may be accessed. Setting no bits or more than one of them causes the device to respond with No Acknowledge if an EEPROM read, program, or erase operation is attempted. It is important to distinguish between SMBus write operations, such as sending an address or command, and EEPROM programming operations. It is possible to write an EEPROM address over the SMBus, whatever the state of EEPROM Register 3. However, EEPROM Register 3 must be correctly set before a subsequent EEPROM operation can be performed. For example, when reading from the EEPROM, Bit 0 of EEPROM Register 3 can be set, even though SMBus write operations are required to set up the EEPROM address for reading. Bit 3 of EEPROM Register 3 is used for EEPROM write protection. Setting this bit prevents accidental programming or erasure of the EEPROM. If an EEPROM write or erase operation is attempted when this bit is set, the ADM1026 responds with No Acknowledge. This bit is write-once and can only be cleared by a power-on reset. EEPROM Register 3 Bit 7 is used for clock extend. Programming an EEPROM byte takes approximately 250 ms, which would limit the SMBus clock for repeated or block write operations. Because EEPROM block read/write access is slow, it is recommended that this clock extend bit typically be set to 1. This allows the ADM1026 to pull SCL low and extend the clock pulse when it cannot accept any more data. ADM1026 Write Operations Send Byte In this operation, the master device sends a single command byte to a slave device, as follows: 1. The master device asserts a start condition on the SDA. 2. The master sends the 7-bit slave address followed by the write bit (low). 3. The addressed slave device asserts an ACK on the SDA. 4. The master sends a command code. 5. The slave asserts ACK on the SDA. 6. The master asserts a stop condition on the SDA and the transaction ends. In the ADM1026, the send byte protocol is used to write a register address to RAM for a subsequent single−byte read from the same address or block read or write starting at that address. This is illustrated in Figure 18. 1 2 3 SLAVE S W A ADDRESS 4 5 6 RAM ADDRESS A P (00h TO 6Fh) Figure 18. Setting a RAM Address for Subsequent Read If it is required to read data from the RAM immediately after setting up the address, the master can assert a repeat start condition immediately after the final ACK and carry out a single byte read, block read, or block write operation without asserting an intermediate stop condition. Write Byte/Word In this operation, the master device sends a command byte and one or two data bytes to the slave device as follows: 1. The master device asserts a start condition on the SDA. 2. The master sends the 7-bit slave address followed by the write bit (low). 3. The addressed slave device asserts an ACK on the SDA. 4. The master sends a command code. 5. The slave asserts an ACK on the SDA. 6. The master sends a data byte. 7. The slave asserts an ACK on the SDA. 8. The master sends a data byte (or may assert stop here.) 9. The slave asserts an ACK on the SDA. 10. The master asserts a stop condition on the SDA to end the transaction. ADM1026 SMBus Operations The SMBus specifications define several protocols for different types of read and write operations. The ones used in the ADM1026 are discussed below. The following abbreviations are used in the diagrams: http://onsemi.com 13 ADM1026 byte is the actual data. Bit 1 of EEPROM Register 3 must be set. This is illustrated in Figure 22. In the ADM1026, the write byte/word protocol is used for four purposes. The ADM1026 knows how to respond by the value of the command byte and EEPROM Register 3. The first purpose is to write a single byte of data to RAM. In this case, the command byte is the RAM address from 00h to 6Fh and the (only) data byte is the actual data. This is illustrated in Figure 19. 1 S 2 3 SLAVE W A ADDRESS 4 5 6 1 3 5 6 7 8 If it is required to read data from the EEPROM immediately after setting up the address, the master can assert a repeat start condition immediately after the final ACK and carry out a single-byte read or block read operation without asserting an intermediate stop condition. In this case, Bit 0 of EEPROM Register 3 should be set. The third use is to erase a page of EEPROM memory. EEPROM memory can be written to only if it is previously erased. Before writing to one or more EEPROM memory locations that are already programmed, the page or pages containing those locations must first be erased. EEPROM memory is erased by writing an EEPROM page address plus an arbitrary byte of data with Bit 2 of EEPROM Register 3 set to 1. Because the EEPROM consists of 128 pages of 64 bytes, the EEPROM page address consists of the EEPROM address high byte (from 80h to 9Fh) and the two MSBs of the low byte. The lower six bits of the EEPROM address (low byte only) specify addresses within a page and are ignored during an erase operation. S 3 SLAVE W A ADDRESS 4 5 6 7 7 8 9 10 A Y In this operation, the master device writes a block of data to a slave device. The start address for a block write must have been set previously. In the case of the ADM1026, this is done by a Send Byte operation to set a RAM address or by a write byte/word operation to set an EEPROM address. 1. The master device asserts a start condition on the SDA. 2. The master sends the 7-bit slave address followed by the write bit (low). 3. The addressed slave device asserts an ACK on the SDA. 4. The master sends a command code that tells the slave device to expect a block write. The ADM1026 command code for a block write is A0h (10100000). 5. The slave asserts an ACK on the SDA. 6. The master sends a data byte (20h) that tells the slave device that 32 data bytes are being sent to it. The master should always send 32 data bytes to the ADM1026. 7. The slave asserts an ACK on the SDA. 8. The master sends 32 data bytes. 9. The slave asserts an ACK on the SDA after each data byte. 10. The master sends a packet error checking (PEC) byte. 11. The ADM1026 checks the PEC byte and issues an ACK if correct. If incorrect (NACK), the master resends the data bytes. 12. The master asserts a stop condition on the SDA to end the transaction. Figure 20. Setting an EEPROM Address 2 6 Block Write EEPROM EEPROM ADDRESS SLAVE S W A A ADDRESS A P HIGH BYTE ADDRESS LOW BYTE (80h TO 9Fh) (00h TO FFh) 1 5 Figure 22. Single-Byte Write to EEPROM RAM ADDRESS A DATA A P (00h TO 6Fh) 4 4 7 8 The protocol is also used to set up a 2-byte EEPROM address for a subsequent read or block read. In this case, the command byte is the high byte of the EEPROM address from 80h to 9Fh. The (only) data byte is the low byte of the EEPROM address. This is illustrated in Figure 20. 2 3 EEPROM EEPROM ADDRESS ADDRESS SLAVE A S W A A DATA HIGH BYTE LOW BYTE ADDRESS (80h TO 9Fh) (00h TO FFh) Figure 19. Single Byte Write to RAM 1 2 8 S 9 10 EEPROM EEPROM ADDRESS ADDRESS ARBITRARY A Y A A HIGH BYTE LOW BYTE DATA (80h TO 9Fh) (00h TO FFh) COMMAND SLAVE W A DATA A PEC A A0h BLOCK A BYTE A DATA 1 A DATA 2 A ADDRESS 32 COUNT WRITE P Figure 23. Block Write to EEPROM or RAM When performing a block write to EEPROM, Bit 1 of EEPROM Register 3 must be set. Unlike some EEPROM devices that limit block writes to within a page boundary, there is no limitation on the start address when performing a block write to EEPROM, except: There must be at least 32 locations from the start address to the highest EEPROM address (9FF) to avoid writing to invalid addresses. If the addresses cross a page boundary, both pages must be erased before programming. Figure 21. EEPROM Page Erasure Page erasure takes approximately 20 ms. If the EEPROM is accessed before erasure is complete, the ADM1026 responds with No Acknowledge. Last, this protocol is used to write a single byte of data to EEPROM. In this case, the command byte is the high byte of the EEPROM address from 80h to 9Fh. The first data byte is the low byte of the EEPROM address, and the second data http://onsemi.com 14 ADM1026 ADM1026 Read Operations ADM1026 always returns 32 data bytes (20h), the maximum allowed by the SMBus 1.1 specification. 10. The master asserts an ACK on the SDA. 11. The master receives 32 data bytes. 12. The master asserts an ACK on the SDA after each data byte. 13. The ADM1026 issues a PEC byte to the master. The master should check the PEC byte and issue another block read if the PEC byte is incorrect. 14. A NACK is generated after the PEC byte to signal the end of the read. 15. The master asserts a stop condition on the SDA to end the transaction. The ADM1026 uses the SMBus read protocols described here. Receive Byte In this operation, the master device receives a single byte from a slave device as follows: 1. The master device asserts a start condition on the SDA. 2. The master sends the 7-bit slave address followed by the read bit (high). 3. The addressed slave device asserts an ACK on the SDA. 4. The master receives a data byte. 5. The master asserts a NO ACK on the SDA. 6. The master asserts a stop condition on the SDA to end the transaction. In the ADM1026, the receive byte protocol is used to read a single byte of data from a RAM or EEPROM location whose address has previously been set by a send byte or write byte/word operation. Figure 24 shows this. When reading from EEPROM, Bit 0 of EEPROM Register 3 must be set. 1 S 2 3 4 SLAVE R A DATA ADDRESS 5 S COMMAND SLAVE W A A1h BLOCK A ADDRESS READ A BYTE COUNT A DATA 1 A DATA 32 SLAVE R ADDRESS S A PEC A P Figure 25. Block Read from EEPROM or RAM When block reading from EEPROM, Bit 0 of EEPROM Register 3 must be set. Note that although the ADM1026 supports Packet Error Checking (PEC), its use is optional. The PEC byte is calculated using CRC-8. The Frame Check Sequence (FCS) conforms to CRC-8 by the polynomial: 6 A P Figure 24. Single-Byte Read from EEPROM or RAM Block Read C(x) + x 8 ) x 2 ) x ) 1 In this operation, the master device reads a block of data from a slave device. The start address for a block read must have been set previously. In the case of the ADM1026 this is done by a send byte operation to set a RAM address, or by a write byte/word operation to set an EEPROM address. The block read operation consists of a send byte operation that sends a block read command to the slave, immediately followed by a repeated start and a read operation that reads out multiple data bytes as follows: 1. The master device asserts a start condition on the SDA. 2. The master sends the 7-bit slave address followed by the write bit (low). 3. The addressed slave device asserts an ACK on the SDA. 4. The master sends a command code that tells the slave device to expect a block read. The ADM1026 command code for a block read is A 1h (10100001). 5. The slave asserts an ACK on the SDA. 6. The master asserts a repeat start condition on the SDA. 7. The master sends the 7-bit slave address followed by the read bit (high). 8. The slave asserts an ACK on the SDA. 9. The ADM1026 sends a byte count data byte that tells the master how many data bytes to expect. The (eq. 1) Consult the SMBus 1.1 Specification for more information. Measurement Inputs The ADM1026 has 17 external analog measurement pins that can be configured to perform various functions. It also measures two supply voltages, 3.3 V MAIN and 3.3 V STBY, and the internal chip temperature. Pins 25 and 26 are dedicated to remote temperature measurement, while Pins 27 and 28 can be configured as analog inputs with a range of 0 V to 2.5 V, or as inputs for a second remote temperature sensor. Pins 29 to 33 are dedicated to measuring VBAT, +5.0 V, −12 V, +12 V supplies, and the processor core voltage VCCP. The remaining analog inputs, Pins 34 to 41, are general-purpose analog inputs with a range of 0 V to 2.5 V (Pins 34 and 35) or 0 V to 3.0 V (Pins 36 to 41). A-to-D Converter (ADC) These inputs are multiplexed into the on-chip, successive approximation, analog-to-digital converter. The ADC has a resolution of 8 bits. The basic input range is 0 V to 2.5 V, which is the input range of AIN6 to AIN9, but five of the inputs have built-in attenuators to allow measurement of VBAT, +5.0 V, -12 V, +12 V, and the processor core voltage VCCP, without any external components. To allow the tolerance of these supply voltages, the ADC produces an http://onsemi.com 15 ADM1026 averaged to reduce noise, so the total conversion time for each input is 11.38 ms. Measurements on the remote temperature (D1 and D2) inputs take 2.13 ms. These are also measured 16 times and are averaged, so the total conversion time for a remote temperature input is 34.13 ms. output of 3/4 full scale (decimal 192) for the nominal input voltage, and so has adequate headroom to cope with over voltages. Table 7 shows the input ranges of the analog inputs and output codes of the ADC. When the ADC is running, it samples and converts an analog or local temperature input every 711 ms (typical value). Each input is measured 16 times and the measurements are Table 7. A-TO-D OUTPUT CODES VS. VIN Input Voltage A-to-D Output +12 VIN –12 VIN +5.0 VIN 3.3 V MAIN VBAT VCCP AIN (0–5) AIN (6–9) Decimal Binary < 0.0625 < −15.928 < 0.026 < 0.0172 NA < 0.012 < 0.012 < 0.010 0 00000000 0.062−0.125 −15.928−15.855 0.026−0.052 0.017−0.034 NA 0.012−0.023 0.012−0.023 0.010−0.019 1 00000001 0.125−0.187 −15.855−15.783 0.052−0.078 0.034−0.052 NA 0.023−0.035 0.023−0.035 0.019−0.029 2 00000010 0.188−0.250 −15.783−15.711 0.078−0.104 0.052−0.069 NA 0.035−0.047 0.035−0.047 0.029−0.039 3 00000011 0.250−0.313 −15.711−15.639 0.104−0.130 0.069−0.086 NA 0.047−0.058 0.047−0.058 0.039−0.049 4 00000100 0.313−0.375 −15.639−15.566 0.130−0.156 0.086−0.103 NA 0.058−0.070 0.058−0.070 0.049−0.058 5 00000101 0.375−0.438 −15.566−15.494 0.156−0.182 0.103−0.120 NA 0.070−0.082 0.070−0.082 0.058−0.068 6 00000110 0.438−0.500 −15.494−15.422 0.182−0.208 0.120−0.138 NA 0.082−0.094 0.082−0.094 0.068−0.078 7 00000111 0.500−0.563 −15.422−15.349 0.208−0.234 0.138−0.155 NA 0.094−0.105 0.094−0.105 0.078−0.087 8 00001000 1.667−1.693 1.110−1.127 NA 0.750−0.780 0.750−0.780 0.625−0.635 64 (1⁄4 scale) 01000000 3.333−3.359 2.000−2.016 2.000−2.016 1.500−1.512 1.500−1.512 1.250−1.260 128 (1⁄2 scale) 10000000 5−5.026 3.330−3.347 3.000−3.016 2.250−2.262 2.250−2.262 1.875−1.885 192 (3⁄4 scale) 11000000 − − − 4.000−4.063 −11.375−11.303 − − − 8.000−8.063 −6.750−6.678 − − − 12.000−12.063 −2.125−2.053 − − − 15.313−15.375 1.705−1.777 6.38−6.406 4.249−4.267 3.828−3.844 2.871−2.883 2.871−2.883 2.392−2.402 245 11110101 15.375−15.437 1.777−1.850 6.406−6.432 4.267−4.284 3.844−3.860 2.883−2.895 2.883−2.895 2.402−2.412 246 11110110 15.437−15.500 1.850−1.922 6.432−6.458 4.284−4.301 3.860−3.875 2.895−2.906 2.895−2.906 2.412−2.422 247 11110111 15.500−15.563 1.922−1.994 6.458−6.484 4.301−4.319 3.875−3.890 2.906−2.918 2.906−2.918 2.422−2.431 248 11111000 15.562−15.625 1.994−2.066 6.484−6.51 4.319−4.336 3.890−3.906 2.918−2.930 2.918−2.930 2.431−2.441 249 11111001 15.625−15.688 2.066−2.139 6.51−6.536 4.336−4.353 3.906−3.921 2.930−2.941 2.930−2.941 2.441−2.451 250 11111010 15.688−15.750 2.139−2.211 6.536−6.563 4.353−4.371 3.921−3.937 2.941−2.953 2.941−2.953 2.451−2.460 251 11111011 15.750−15.812 2.211−2.283 6.563−6.589 4.371−4.388 3.937−3.953 2.953−2.965 2.953−2.965 2.460−2.470 252 11111100 15.812−15.875 2.283−2.355 6.589−6.615 4.388−4.405 3.953−3.969 2.965−2.977 2.965−2.977 2.470−2.480 253 11111101 15.875−15.938 2.355−2.428 6.615−6.641 4.405−4.423 3.969−3.984 2.977−2.988 2.977−2.988 2.480−2.490 254 11111110 >15.938 >2.428 >6.634 >4.423 >3.984 >2.988 >2.988 >2.490 255 11111111 1. * VBAT is not accurate for voltages under 1.5 V (see Figure 14). http://onsemi.com 16 ADM1026 Voltage Measurement Inputs However, when scaling AIN0 to AIN5, it should be noted that these inputs already have an on-chip attenuator, because their primary function is to monitor SCSI termination voltages. This attenuator loads any external attenuator. The input resistance of the on-chip attenuator can be between 100 kW and 200 kW. For this tolerance not to affect the accuracy, the output resistance of the external attenuator should be very much lower than this, that is, 1 kW in order to add not more than 1% to the total unadjusted error (TUE). Alternatively, the input can be buffered using an op amp. The internal structure for all the analog inputs is shown in Figure 26. Each input circuit consists of an input protection diode, an attenuator, plus a capacitor to form a first-order low-pass filter that gives each voltage measurement input immunity to high frequency noise. The −12 V input also has a resistor connected to the on-chip reference to offset the negative voltage range so that it is always positive and can be handled by the ADC. This allows most popular power supply voltages to be monitored directly by the ADM1026 without requiring any additional resistor scaling. R1 + R2 21.9k AIN0 – A IN5 (0V – 3V) 109.4k 4.6pF R1 + R2 52.5k AIN6 – A IN9 (0V – 2.5V) 113.5k 9.3pF 21k 3.0 ǒVfs * 2.5Ǔ 2.5 ǒfor A IN0 through A IN5Ǔ (eq. 2) ǒfor A IN6 through A IN9Ǔ (eq. 3) Negative and bipolar input ranges can be accommodated by using a positive reference voltage to offset the input voltage range so that it is always positive. To monitor a negative input voltage, an attenuator can be used as shown in Figure 28. 4.6pF +12V ǒVfs * 3.0Ǔ VREF R2 17.5k MUX 114.3k –12V VIN R1 AIN(0–9) 9.3pF 83.5k +5V 50k Figure 28. Scaling and Offsetting AIN0 − AIN9 for Negative Inputs 4.6pF This offsets the negative voltage so that the ADC always sees a positive voltage. R1 and R2 are chosen so that the ADC input voltage is zero when the negative input voltage is at its maximum (most negative) value, that is: 49.5k VBAT 82.7k 4.5pF * SEE TEXT R1 + R2 21.9k +VCCP 109.4k 18.5pF Setting Other Input Ranges AIN0 to AIN9 can easily be scaled to voltages other than 2.5 V or 3.0 V. If the input voltage range is zero to some positive voltage, all that is required is an input attenuator, as shown in Figure 27. R1 Vf * s V OS (eq. 4) This is a simple and low cost solution, but note the following: Because the input signal is offset but not inverted, the input range is transposed. An increase in the magnitude of the negative voltage (going more negative) causes the input voltage to fall and give a lower output code from the ADC. Conversely, a decrease in the magnitude of the negative voltage causes the ADC code to increase. The maximum negative voltage corresponds to zero output from the ADC. This means that the upper and lower limits are transposed. For the ADC output to be full scale when the negative voltage is zero, VOS must be greater than the full−scale voltage of the ADC, because VOS is attenuated by R1 and R2. If VOS is equal to or less than the full−scale voltage of the ADC, the input range is bipolar but not necessarily symmetrical. Figure 26. Voltage Measurement Inputs VIN Ť Ť AIN(0–9) R2 Figure 27. Scaling AIN0 − AIN9 http://onsemi.com 17 ADM1026 For example, when VBAT = 3.0 V, This is a problem only if the ADC output must be full scale when the negative voltage is zero. Symmetrical bipolar input ranges can be accommodated easily by making VOS equal to the full-scale voltage of the analog input, and by adding a third resistor to set the positive full scale. I+ In addition to minimizing battery current drain, the VBAT measurement circuitry was specifically designed with battery protection in mind. Internal circuitry prevents the battery from being back-biased by the ADM1026 supply or through any other path under normal operating conditions. In the unlikely event of a catastrophic ADM1026 failure, the ADM1026 includes a second level of battery protection including a series 3 kW resistor to limit current to the battery, as recommended by UL. Thus, it is not necessary to add a series resistor between the battery and the VBAT input; the battery can be connected directly to the VBAT input to improve voltage measurement accuracy. AIN(0–9) R3 Figure 29. Scaling and Offsetting AIN0 − AIN9 for Bipolar Inputs Ť V * R1 + fs V OS R2 Ť (eq. 5) Note that R3 has no effect as the input voltage at the device pin is zero when VIN = negative full scale. R1 + R3 R1 + R3 ǒVfs * 3.0Ǔ 3.0 ǒVfs * 2.5Ǔ 2.5 ǒfor A IN0 through A IN5Ǔ VBAT 49.5k A IN6 through A IN9Ǔ Reference Output (VREF) The ADM1026 offers an on-chip reference voltage (Pin 24) that can be used to provide a 1.82 V or 2.5 V reference voltage output. This output is buffered and specified to sink or source a load current of 2 mA. The reference voltage outputs 1.82 V if Bit 2 of Configuration Register 3 (Address 07h) is 0; it outputs 2.5 V when this bit is set to 1. This voltage reference output can be used to provide a stable reference voltage to external circuitry such as LDOs. The load regulation of the VREF output is typically 0.15% for a sink current of 2 mA and 0.15% for 2 mA source current. There may be some ripple present on the VREF output that requires filtering (4 m VMAX). Figure 31 shows the recommended circuitry for the VREF output for loads less than 2 mA. For loads in excess of 2 mA, external circuitry, such as that shown in Figure 32, can be used to buffer the VREF output. The VBAT input allows the condition of a CMOS backup battery to be monitored. This is typically a lithium coin cell such as a CR2032. The VBAT input is accurate only for voltages greater than 1.5 V (see Figure 14). Typically, the battery in a system is required to keep some device powered on when the system is in a powered-off state. The VBAT measurement input is specially designed to minimize battery drain. To reduce current drain from the battery, the lower resistor of the VBAT attenuator is not connected, except whenever a VBAT measurement is being made. The total current drain on the VBAT pin is 80 nA typical (for a maximum VBAT voltage = 4.0 V), so a CR2032 CMOS battery functions in a system in excess of the expected 10 years. Note that when a VBAT measurement is not being made, the current drain is reduced to 6 nA typical. Under normal voltage measurement operating conditions, all measurements are made in a round-robin format, and each reading is actually the result of 16 digitally averaged measurements. However, averaging is not carried out on the VBAT measurement to reduce measurement time and therefore reduce the current drain from the battery. The VBAT current drain when a measurement is being made is calculated by: T PULSE T PERIOD ADC Figure 30. Equivalent VBAT Input Protection Circuit Battery Measurement Input (VBAT) V BAT 100 kW 3k 82.7k (eq. 7) Also, note that R2 has no effect as the input voltage at the device pin is equal to VOS when VIN = positive full scale. I+ DIGITAL CONTROL 3k (eq. 6) 4.5pF ǒfor (eq. 9) VBAT Input Battery Protection R2 R1 711 ms + 78 nA 273 ms where TPULSE = VBAT measurement time (711 ms typical), TPERIOD = time to measure all analog inputs (273 ms typical), and VBAT input battery protection. +VOS VIN 3.0 V 100 kW ADM1026 24 VREF 10k VREF 0.1F (eq. 8) Figure 31. VREF Interface Circuit for VREF Loads < 2 mA http://onsemi.com 18 ADM1026 by clearing Bit 3 of Configuration Register 1 (Address 00h) to 0. If this bit is 1, then Pins 27 and 28 are AIN8 and AIN9. The forward voltage of a diode or diode-connected transistor, operated at a constant current, exhibits a negative temperature coefficient of about −2 mV/C. Unfortunately, the absolute value of Vbe varies from device to device, and individual calibration is required to null this out, so the technique is unsuitable for mass production. The technique used in the ADM1026 is to measure the change in Vbe when the device is operated at two different currents, given by: If the VREF output is not being used, it should be left unconnected. Do not connect VREF to GND using a capacitor. The internal output buffer on the voltage reference is capacitively loaded, which can cause the voltage reference to oscillate. This affects temperature readings reported back by the ADM1026. The recommended interface circuit for the VREF output is shown in Figure 32. +12V ADM1026 VREF 24 10k DV be + K q T NDT3055 50 0.1F 10F Figure 32. VREF Interface Circuit for VREF Loads > 2 mA Temperature Measurement System Local Temperature Measurement The ADM1026 contains an on-chip band gap temperature sensor whose output is digitized by the on-chip ADC. The temperature data is stored in the local temperature value register (Address 1Fh). As both positive and negative temperatures can be measured, the temperature data is stored in twos complement format, as shown in Table 8. Theoretically, the temperature sensor and ADC can measure temperatures from −128C to +127C with a resolution of 1C. Temperatures below TMIN and above TMAX are outside the operating temperature range of the device; however, so local temperature measurements outside this range are not possible. Temperature measurement from −128C to +127C is possible using a remote sensor. Remote Temperature Measurement The ADM1026 can measure the temperature of two remote diode sensors, or diode-connected transistors, connected to Pins 25 and 26, or 27 and 28. Pins 25 and 26 are a dedicated temperature input channel. Pins 27 and 28 can be configured to measure a diode sensor VDD I NxI IBIAS D+ REMOTE SENSING TRANSISTOR VOUT+ TO ADC C1* D– BIAS DIODE (eq. 10) where K is Boltzmann’s constant, q is the charge on the carrier, T is the absolute temperature in Kelvins, and N is the ratio of the two currents. Figure 33 shows the input signal conditioning used to measure the output of a remote temperature sensor. This figure shows the external sensor as a substrate transistor provided for temperature monitoring on some microprocessors, but it could equally well be a discrete transistor such as a 2N3904. If a discrete transistor is used, the collector is not grounded and should be linked to the base. If a PNP transistor is used, the base is connected to the D− input and the emitter to the D+ input. If an NPN transistor is used, the emitter is connected to the D− input and the base to the D+ input. To prevent ground noise from interfering with the measurement, the more negative terminal of the sensor is not referenced to ground but is biased above ground by an internal diode at the D− input. To measure DVbe, the sensor is switched between operating currents of I and N I. The resulting waveform is passed through a 65 kHz low−pass filter to remove noise, and to a chopper-stabilized amplifier that performs the functions of amplification and rectification of the waveform to produce a DC voltage proportional to DVbe. This voltage is measured by the ADC to give a temperature output in 8-bit, twos complement format. To further reduce the effects of noise, digital filtering is performed by averaging the results of 16 measurement cycles. A remote temperature measurement takes nominally 2.14 ms. VREF 0.1F log n (N) LOW−PASS FILTER fC = 65kHz VOUT– * CAPACITOR C1 IS OPTIONAL. IT IS ONLY NECESSARY IN NOISY ENVIRONMENTS. C1 = 2.2nF TYPICAL, 3nF MAX. Figure 33. Signal Conditioning for Remote Diode Temperature Sensors http://onsemi.com 19 ADM1026 The results of external temperature measurements are stored in 8-bit, twos complement format, as illustrated in Table 8. Table 8. TEMPERATURE DATA FORMAT Temperature Digital Output Hex −128C 1000 0000 80 −125C 1000 0011 83 −100C 1001 1100 9C −75C 1011 0101 B5 −50C 1100 1110 CE −25C 1110 0111 E7 −10C 1111 0110 F6 0C 0000 0000 00 10C 0000 1010 0A 25C 0001 1001 19 50C 0011 0010 32 75C 0100 1011 4B 100C 0110 0100 64 125C 0111 1101 7D 127C 0111 1111 7F Because the measurement technique uses switched current sources, excessive cable and/or filter capacitance can affect the measurement. When using long cables, the filter capacitor may be reduced or removed. Cable resistance can also introduce errors. A 1 W series resistance introduces about 0.5C error. Limit Values Limit values for analog measurements are stored in the appropriate limit registers. In the case of voltage measurements, high and low limits can be stored so that an interrupt request is generated if the measured value goes above or below acceptable values. In the case of temperature, a hot temperature or high limit can be programmed, and a hot temperature hysteresis or low limit can be programmed, which is usually some degrees lower. This can be useful because it allows the system to be shut down when the hot limit is exceeded, and restarted automatically when it has cooled down to a safe temperature. Layout Considerations Digital boards can be electrically noisy environments. Take these precautions to protect the analog inputs from noise, particularly when measuring the very small voltages from a remote diode sensor. Place the ADM1026 as close as possible to the remote sensing diode. Provided that the worst noise sources such as clock generators, data/address buses, and CRTs are avoided, this distance can be 4 to 8 inches. Route the D+ and D− tracks close together, in parallel, with grounded guard tracks on each side. Provide a ground plane under the tracks if possible. Use wide tracks to minimize inductance and reduce noise pickup. A 10 mil track minimum width and spacing is recommended. GND Analog Monitoring Cycle Time The analog monitoring cycle begins when a 1 is written to the start bit (Bit 0), and a 0 to the INT_Clear bit (Bit 2) of the configuration register. INT_Enable (Bit 1) should be set to 1 to enable the INT output. The ADC measures each analog input in turn, starting with Remote Temperature Channel 1 and ending with local temperature. As each measurement is completed, the result is automatically stored in the appropriate value register. This round-robin monitoring cycle continues until it is disabled by writing a 0 to Bit 0 of the configuration register. Because the ADC is typically left to free-run in this way, the most recently measured value of any input can be read out at any time. For applications where the monitoring cycle time is important, it can easily be calculated. The total number of channels measured is: Five Dedicated Supply Voltage Inputs Ten General-purpose Analog Inputs 3.3 V MAIN 3.3 V STBY Local Temperature Two Remote Temperature 10MIL 10MIL D+ 10MIL 10MIL D– 10MIL 10MIL GND 10MIL Figure 34. Arrangement of Signal Tracks Try to minimize the number of copper/solder joints, thermocouple voltages are about 3 mV/C of temperature difference. Unless there are two thermocouples with a big temperature differential between them, thermocouple voltages should be much less than 200 mV. Place a 0.1 mF bypass capacitor close to the ADM1026. If the distance to the remote sensor is more than eight inches, the use of twisted-pair cable is recommended. This works from about 6 to 12 feet. For very long distances (up to 100 feet), use shielded twisted pair such as Belden #8451 microphone cable. Connect the twisted pair to D+ and D− and the shield to GND close to the ADM1026. Leave the remote end of the shield unconnected to avoid ground loops. which can cause thermocouple effects. Where copper/ solder joints are used, make sure that they are in both the D+ and D− paths and are at the same temperature. Thermocouple effects should not be a major problem because 1C corresponds to about 240 mV, and http://onsemi.com 20 ADM1026 Pins 28 and 27 are measured both as analog inputs AIN8/AIN9 and as remote temperature input D2+/D2−, irrespective of which configuration is selected for these pins. If Pins 28 and 27 are configured as AIN8/AIN9, the measurements for these channels are stored in Registers 27h and 29h, and the invalid temperature measurement is discarded. On the other hand, if Pins 28 and 27 are configured as D2+/D2−, the temperature measurement is stored in Register 29h, and there is no valid result in Register 27h. As mentioned previously, the ADC performs a conversion every 711 ms on the analog and local temperature inputs and every 2.13 ms on the remote temperature inputs. Each input is measured 16 times and averaged to reduce noise. The total monitoring cycle time for voltage and temperature inputs is therefore nominally: (18 16 0.711) ) (2 16 To amplify the 2.5 V range of the analog output up to 2.13) + 273 ms (eq. 11) The ADC uses the internal 22.5 kHz clock, which has a tolerance of 6%, so the worst-case monitoring cycle time is 290 ms. The fan speed measurement uses a completely separate monitoring loop, as described later. Input Safety Scaling of the analog inputs is performed on-chip, so external attenuators are typically not required. However, because the power supply voltages appear directly at the pins, it is advisable to add small external resistors (that is, 500 W) in series with the supply traces to the chip to prevent damaging the traces or power supplies should an accidental short such as a probe connect two power supplies together. Because the resistors form part of the input attenuators, they affect the accuracy of the analog measurement if their value is too high. The worst such accident would be connecting −12 V to +12 V where there is a total of 24 V difference. With the series resistors, this would draw a maximum current of approximately 24 mA. 12 V, the gain of these circuits needs to be about 4.8. Take care when choosing the op amp to ensure that its input common-mode range and output voltage swing are suitable. The op amp may be powered from the +12 V rail alone or from 12 V. If it is powered from +12 V, the input common-mode range should include ground to accommodate the minimum output voltage of the DAC, and the output voltage should swing below 0.6 V to ensure that the transistor can be turned fully off. If the op amp is powered from −12 V, precautions such as a clamp diode to ground may be needed to prevent the base-emitter junction of the output transistor being reverse-biased in the unlikely event that the output of the op amp should swing negative for any reason. In all these circuits, the output transistor must have an ICMAX greater than the maximum fan current, and be capable of dissipating power due to the voltage dropped across it when the fan is not operating at full speed. If the fan motor produces a large back EMF when switched off, it may be necessary to add clamp diodes to protect the output transistors in the event that the output goes from full scale to zero very quickly. 12 V 1/4 LM324 DAC Q1 2N2219A R1 10k Analog Output The ADM1026 has a single analog output from an unsigned 8-bit DAC that produces 0 V to 2.5 V (independent of the reference voltage setting). The input data for this DAC is contained in the DAC control register (Address 04h). The DAC control register defaults to FFh during a power-on reset, which produces maximum fan speed. The analog output may be amplified and buffered with external circuitry such as an op amp and a transistor to provide fan speed control. During automatic fan speed control, described later, the four MSBs of this register set the minimum fan speed. Suitable fan drive circuits are shown in Figure 35 through Figure 39. When using any of these circuits, note the following: All of these circuits provide an output range from 0 V to almost +12 V, apart from Figure 35, which loses the base-emitter voltage drop of Q1 due to the emitter-follower configuration. Figure 35. Fan Drive Circuit with Op Amp and Emitter-follower 12 V 1/4 LM324 R4 1kW DAC R3 1kW Q1 BD136 2SA968 R2 39kW R1 10k Figure 36. Fan Drive Circuit with Op Amp and PNP Transistor http://onsemi.com 21 ADM1026 described below, the four MSBs of this register set the minimum fan speed. The open drain PWM output must be amplified and buffered to drive the fans. The PWM output is intended to be used with an NMOS driver, but may be inverted by setting Bit 1 of Test Register 1 (Address 14h) if using PMOS drivers. Figure 40 shows how a fan may be driven under PWM control using an N-channel MOSFET. 12 V 1/4 LM324 R3 100kW DAC Q1 IRF9620 R2 39kW +V R1 10k 5.0 V OR 12 V FAN 3.3 V 10k TYP Figure 37. Fan Drive Circuit with Op Amp and P-channel MOSFET PWM Q1 NDT3055L 12 V R2 100kW R2 100kW Figure 40. PWM Fan Drive Circuit Using an N-channel MOSFET Q3 IRF9620 Automatic Fan Speed Control DAC The ADM1026 offers a simple method of controlling fan speed according to temperature without intervention from the host processor. Monitoring must be enabled by setting Bit 0 of Configuration Register 1 (Address 00h), to enable automatic fan speed control. Automatic fan speed control can be applied to the DAC output, the PWM output, or both, by setting Bit 5 and/or Bit 6 of Configuration Register 1. The TMIN registers (Addresses 10h to 12h) contain minimum temperature values for the three temperature channels (on-chip sensor and two remote diodes). This is the temperature at which a fan starts to operate when the temperature sensed by the controlling sensor exceeds TMIN. TMIN can be the same or different for all three channels. TMIN is set by writing a twos complement temperature value to the TMIN registers. If any sensor channel is not required for automatic fan speed control, TMIN for that channel should be set to 127C (01111111). In automatic fan speed control mode, (as shown Figure 41 and Figure 42) the four MSBs of the DAC control register (Address 04h) and PWM control register (Address 05h) set the minimum values for the DAC and PWM outputs. Note that, if both DAC control and PWM control are enabled (Bits 5 and 6 of Configuration Register 1 = 1), the four MSBs of the DAC control register (Address 04h) define the minimum fan speed values for both the DAC and PWM outputs. The value in the PWM control register (Address 05h) has no effect. Minimum DAC Code DACMIN = 16 D R3 39k Q1/Q2 MBT3904 DUAL R4 10k Figure 38. Discrete Fan Drive Circuit with P-channel MOSFET, Single Supply +12 V R2 100kW Q3 IRF9620 DAC Q1/Q2 MBT3904 DUAL R3 39k R4 10k R1 4.7k –12 V Figure 39. Discrete Fan Drive Circuit with P-channel MOSFET, Dual Supply PWM Output DAC Output Voltage + 2.5 Fan speed may also be controlled using pulse width modulation (PWM). The PWM output (Pin 18) produces a pulsed output with a frequency of approximately 75 Hz and a duty cycle defined by the contents of the PWM control register (Address 05h). During automatic fan speed control, Code 256 (eq. 12) Minimum PWM Duty Cycle PWMMIN = 6.67 D where D is the decimal equivalent of Bits 7 to 4 of the register. http://onsemi.com 22 ADM1026 When the temperature measured by any of the sensors exceeds the corresponding TMIN, the fan is spun up for 2 seconds with the fan drive set to maximum (full scale from the DAC or 100% PWM duty cycle). The fan speed is then set to the minimum as previously defined. As the temperature increases, the fan drive increases until the temperature reaches TMIN + 20C. The fan drive at any temperature up to 20C above TMIN is given by: PWM + PWM MIN ) ǒ100 * PWM MINǓ SPIN UP FOR 2 SECONDS 255 240 DAC OUTPUT MIN T ACTUAL * T MIN 20 (eq. 13) TMIN - 45C or TMIN TMIN + 205C TEMPERATURE DAC + DAC MIN ) ǒ240 * DAC MINǓ Figure 42. Automatic DAC Fan Control Transfer Function T ACTUAL * T MIN 20 (eq. 14) Fan Inputs Pins 3 to 6 and 9 to 12 may be configured as fan speed measuring inputs by clearing the corresponding bit(s) of Configuration Register 2 (Address 01h), or as general-purpose logic inputs/outputs by setting bits in this register. The power-on default value for this register is 00h, which means all the inputs are set for fan speed measurement. Signal conditioning in the ADM1026 accommodates the slow rise and fall times typical of fan tachometer outputs. The fan tach inputs have internal 10 kW pullup resistors to 3.3 V STBY. In the event that these inputs are supplied from fan outputs that exceed the supply, either resistive attenuation of the fan signal or diode clamping must be included to keep inputs within an acceptable range. Figure 43 through Figure 47 show circuits for common fan tach outputs. If the fan tach output is open-drain or has a resistive pullup to VCC, then it can be connected directly to the fan input, as shown in Figure 44. For simplicity of the automatic fan speed algorithm, the DAC code increases linearly up to 240, not its full scale of 255. However, when the temperature exceeds TMIN +20C, the DAC output jumps to full scale. To ensure that the maximum cooling capacity is always available, the fan drive is always set by the sensor channel demanding the highest fan speed. If the temperature falls, the fan does not turn off until the temperature measured by all three temperature sensors has fallen to their corresponding TMIN − 4C. This prevents the fan from cycling on and off continuously when the temperature is close to TMIN. Whenever a fan starts or stops during automatic fan speed control, a one-off interrupt is generated at the INT output. This is described in more detail in the section on the ADM1026 Interrupt Structure. SPIN UP FOR 2 SECONDS 100% 12 V PWM OUTPUT PULLUP 4.7k TYP VCC FAN(0–7) FAN SPEED COUNTER MIN Figure 43. Fan with Tach Pullup to +VCC TMIN ć 45C TMIN If the fan output has a resistive pullup to +12 V (or other voltage greater than 3.3 V STBY), the fan output can be clamped with a Zener diode, as shown in Figure 46. The Zener voltage should be chosen so that it is greater than VIH but less than 3.3 V STBY, allowing for the voltage tolerance of the Zener. TMIN + 205C TEMPERATURE Figure 41. Automatic PWM Fan Control Transfer Function http://onsemi.com 23 ADM1026 12 V 22.5kHz CLOCK VCC CONFIGURATION REG. 1 BIT 0 PULLUP 4.7k TYP FAN(0–7) FAN SPEED COUNTER 1 2 3 4 FAN0 INPUT 1 * CHOOSE ZD1 VOLTAGE APPROXIMATELY 0.8 x VCC Figure 44. Fan with Tach Pullup to Voltage > VCC (e.g. 12 V), Clamped with Zener Diode START OF MONITORING CYCLE If the fan has a strong pullup (less than 1 kW) to +12 V, or a totem pole output, a series resistor can be added to limit the Zener current, as shown in Figure 45. Alternatively, a resistive attenuator may be used, as shown in Figure 47. R1 and R2 should be chosen such that: 2.0 V t V PULLUP R2 ǒR PULLUP ) R1 ) R2Ǔ 12 V FAN(0–7) t 3.3 V STBY (eq. 15) FAN SPEED COUNTER * CHOOSE ZD1 VOLTAGE APPROXIMATELY 0.8 x VCC VCC <1 k R1* FAN(0–7) TACH OUTPUT FAN1 MEASUREMENT PERIOD The monitoring cycle begins when a 1 is written to the monitor bit (Bit 0 of Configuration Register 1). The INT_Enable (Bit 1) should be set to 1 to enable the INT output. The fan speed counter starts counting as soon as the fan channel has been switched to. If the fan tach count reaches 0xFF, the fan has failed or is not connected. If a fan is connected and running, the counter is reset on the second tach rising edge, and oscillator pulses are actually counted from the second rising tach edge to the fourth rising edge. The measurement then switches to the next fan channel. Here again, the counter begins counting and is reset on the second tach rising edge, and oscillator pulses are counted from the second rising edge to the fourth rising edge. This is repeated for the other six fan channels. Note that fan speed measurement does not occur until 1.8 seconds after the monitor bit has been set. This is to allow the fans adequate time to spin up. Otherwise, the ADM1026 could generate false fan failure interrupts. During the 1.8 second fan spin-up time, all fan tach registers read 0x00. To accommodate fans of different speed and/or different numbers of output pulses per revolution, a prescaler (divisor) of 1, 2, 4, or 8 may be added before the counter. Divisor values for Fans 0 to 3 are contained in the Fan 0–3 divisor register (Address 02h) and those for Fans 4 to 7 in the Fan 4–7 divisor register (Address 03h). The default value is 2, which gives a count of 153 for a fan running at 4400 RPM producing two output pulses per revolution. The count is calculated by the equation: Figure 45. Fan with Strong Tach Pullup to >VCC or Totem Pole Output, Attenuated with R1/R2 12 V 4 3 Figure 47. Fan Speed Measurement VCC PULLUP TYP <1 k FAN0 MEASUREMENT PERIOD 2 FAN SPEED COUNTER * SEE TEXT Figure 46. Fan with Strong Tach Pullup to > VCC or Totem Pole Output, Clamped with Zener and Resistor Fan Speed Measurement The fan counter does not count the fan tach output pulses directly because the fan speed may be less than 1000 RPM and it would take several seconds to accumulate a reasonably large and accurate count. Instead, the period of the fan revolution is measured by gating an on-chip 22.5 kHz oscillator into the input of an 8-bit counter for two periods of the fan tach output, as shown in Figure 47, so the accumulated count is actually proportional to the fan tach period and inversely proportional to the fan speed. 3 60 Count + 22.5 10 RPM Divisor (eq. 16) For constant-speed fans, fan failure is typically considered to have occurred when the speed drops below 70% of nominal, corresponding to a count of 219. Full scale (255) is reached if the fan speed fell to 60% of its nominal value. For temperature-controlled, variable-speed fans, the situation is different. http://onsemi.com 24 ADM1026 initialization or before the fourth tach pulse during measurement, the measurement is terminated. This also occurs if an input is configured as GPIO instead of fan. Any channels connected in this manner time out after 255 clock pulses. The worst-case measurement time for a fan−configured channel occurs when the counter reaches 254 from start to the second tach pulse and reaches 255 after the second tach pulse. Taking into account the tolerance of the oscillator frequency, the worst-case measurement time is: Table 9 shows the relationship between fan speed and time per revolution at 60%, 70%, and 100% of nominal RPM for fan speeds of 1100, 2200, 4400, and 8800 RPM, and the divisor that would be used for each of these fans, based on two tach pulses per revolution. Limit Values Fans generally do not over-speed if run from the correct voltage, so the failure condition of interest is under speed due to electrical or mechanical failure. For this reason, only low speed limits are programmed into the limit registers for the fans. It should be noted that because fan period rather than speed is being measured, a fan failure interrupt occurs when the measurement exceeds the limit value. 509 D 0.05 ms (eq. 17) where: 509 is the total number of clock pulses. D is the divisor: 1, 2, 4, or 8. 0.05 ms is the worst-case oscillator period in ms. The worst-case fan monitoring cycle time is the sum of the worst-case measurement time for each fan. Although the fan monitoring cycle and the analog input monitoring cycle are started together, they are not synchronized in any other way. Fan Monitoring Cycle Time The fan speeds are measured in sequence from 0 to 7. The monitoring cycle time depends on the fan speed, the number of tach output pulses per revolution, and the number of fans being monitored. If a fan is stopped or running so slowly that the fan speed counter reaches 255 before the second tach pulse after Table 9. FAN SPEEDS AND DIVISORS Time Per Divisor RPM Nominal Rev RPM (ms) 70% RPM Rev 70% (ms) 60% RPM 1 8800 6.82 6160 9.74 5280 11.36 2 4400 13.64 3080 19.48 2640 22.73 4 2200 27.27 1540 38.96 1320 45.45 8 1100 54.54 770 77.92 660 90.9 Chassis Intrusion Input Rev 60% (ms) The chassis intrusion input can also be used for other types of alarm input. Figure 48 shows a temperature alarm circuit using an AD22105 temperature switch sensor. This produces a low-going output when the preset temperature is exceeded, so the output is inverted by Q1 to make it compatible with the CI input. Q1 can be almost any small-signal NPN transistor, or a TTL or CMOS inverter gate may be used if one is available. The chassis intrusion input is an active high input intended for detection and signaling of unauthorized tampering with the system. When this input goes high, the event is latched in Bit 6 of Status Register 4, and an interrupt is generated. The bit remains set until cleared by writing a 1 to CI clear, Bit 1 of Configuration Register 3 (05h), as long as battery voltage is connected to the VBAT input. The CI clear bit itself is cleared by writing a 0 to it. The CI input detects chassis intrusion events even when the ADM1026 is powered off (provided battery voltage is applied to VBAT) but does not immediately generate an interrupt. Once a chassis intrusion event is detected and latched, an interrupt is generated when the system is powered on. The actual detection of chassis intrusion is performed by an external circuit that detects, for example, when the cover has been removed. A wide variety of techniques may be used for the detection, for example: A Microswitch that Opens or Closes when the Cover is Removed A Reed Switch Operated by Magnet Fixed to the Cover A Hall-effect Switch Operated by Magnet Fixed to the Cover A Phototransistor that Detects Light when the Cover is Removed 6 RSET 7 AD22105 TEMPERATURE SENSOR 1 3 R1 10k VCC CI 18 Q1 2 Figure 48. Using the CI Input with a Temperature Sensor General-Purpose I/O Pins (Open Drain) The ADM1026 has eight pins that are dedicated to general-purpose logic input/output (Pins 1, 2, and 43 to 48), eight pins that can be configured as general-purpose logic pins or fan speed inputs (Pins 3 to 6, and 9 to 12), and one pin that can be configured as GPIO16 or the bidirectional THERM pin (Pin 42). The GPIO/FAN pins are configured as general-purpose logic pins by setting Bits 0 to 7 of http://onsemi.com 25 ADM1026 Analog/Temperature Inputs Configuration Register 2 (Address 01h). Pin 42 is configured as GPIO16 by setting Bit 0 of Configuration Register 3, or as the THERM function by clearing this bit. Each GPIO pin has four data bits associated with it, two bits in one of the GPIO configuration registers (Addresses 08h to 0Bh), one in the GPIO status registers (Addresses 24h and 25h), and one in the GPIO mask registers (Addresses 1Ch and 1Dh) Setting a direction bit = 1 in one of the GPIO configuration registers makes the corresponding GPIO pin an output. Clearing the direction bit to 0 makes it an input. Setting a polarity bit = 1 in one of the GPIO configuration registers makes the corresponding GPIO pin active high. Clearing the polarity bit to 0 makes it active low. When a GPIO pin is configured as an input, the corresponding bit in one of the GPIO status registers is read-only, and is set when the input is asserted (“asserted” may be high or low depending on the setting of the polarity bit). When a GPIO pin is configured as an output, the corresponding bit in one of the GPIO status registers becomes read/write. Setting this bit then asserts the GPIO output. (Here again, “asserted” may be high or low depending on the setting of the polarity bit.) The effect of a GPIO status register bit on the INT output can be masked out by setting the corresponding bit in one of the GPIO mask registers. When the pin is configured as an output, this bit is automatically masked to prevent the data written to the status bit from causing an interrupt, with the exception of GPIO16, which must be masked manually by setting Bit 7 of Mask Register 4 (Reg 1Bh). When configured as inputs, the GPIO pins may be connected to external interrupt sources such as temperature sensors with digital output. Another application of the GPIO pins would be to monitor a processor’s voltage ID code (VID code). As each analog measurement value is obtained and stored in the appropriate value register, the value and the limits from the corresponding limit registers are fed to the high and low limit comparators. The device performs greater than comparisons to the high limits. An out-of-limit is also generated if a result is less than or equal to a low limit. The result of each comparison (1 = out of limit, 0 = in limit) is routed to the corresponding bit input of Interrupt Status Register 1, 2, or 4 via a data de-multiplexer, and used to set that bit high or low as appropriate. Status bits are self-clearing. If a bit in a status register is set due to an out-of-limit measurement, it continues to cause INT to be asserted as long as it remains set, as described later. However, if a subsequent measurement is in limit, it is reset and does not cause INT to be reasserted. Status bits are unaffected by clearing the interrupt. Interrupt Mask Registers 1, 2, and 4 have bits corresponding to each of the interrupt status register bits. Setting an interrupt mask bit high conceals an asserted status bit from display on Interrupt Pin 17. Setting an interrupt mask bit low allows the corresponding status bit to be asserted and displayed on Pin 17. After mask gating, the status bits are all OR’ed together to produce the analog and fan interrupt that is used to set a latch. The output of this latch is OR’ed with other interrupt sources to produce the INT output. This pulls low if any unmasked status bit goes high, that is, when any measured value goes out of limit. When an INT output caused by an out-of-limit analog/ temperature measurement is cleared by one of the methods described later, the latch is reset. It is not set again, and INT is not reasserted until after two local temperature measurements have been taken, even if the status bit remains set or a new analog/temperature event occurs, as shown in Figure 49. This delay corresponds to almost two monitoring cycles, and is about 530 ms. However, interrupts from other sources such as a fan or GPIO can still occur. This is illustrated in Figure 50. ADM1026 Interrupt Structure The Interrupt Structure of the ADM1026 is shown in Figure 52. Interrupts can come from a number of sources, which are combined to form a common INT output. When INT is asserted, this output pulls low. The INT pin has an internal, 100 kW pullup resistor. START OF ANALOG OUT-OF-LIMIT MONITORING MEASUREMENT CYCLE INT CLEARED LOCAL TEMPERATURE MEASUREMENT START OF ANALOG MONITORING CYCLE OUT-OF-LIMIT MEASUREMENT LOCAL TEMPERATURE MEASUREMENT INT START OF ANALOG MONITORING CYCLE INT RE−ASSERTED FULL MONITORING CYCLE = 273ms Figure 49. Delay After Clearing INT Before Reassertion http://onsemi.com 26 ADM1026 START OF ANALOG OUT-OF-LIMIT MONITORING CYCLE MEASUREMENT INT CLEARED LOCAL TEMPEREATURE START OF ANALOG MEASUREMENT MONITORING CYCLE INT CLEARED LOCAL TEMPERATURE MEASUREMENT START OF ANALOG MONITORING CYCLE GPIO DE−ASSERTED INT INT RE−ASSERTED NEW INT FROM FAN NEW INT FROM GPIO Figure 50. Other Interrupt Sources Can Reassert INT Immediately Registers 5 and 6, or Bit 7 of Status Register 4 (GPIO16). A chassis intrusion event sets Bit 6 of Status Register 4. The GPIO and CI status bits, after mask gating, are OR’ed together and OR’ed with other interrupt sources to produce the INT output. GPIO and CI interrupts are not latched and cannot be cleared by normal interrupt clearing. They can only be cleared by masking the status bits or by removing the source of the interrupt. Status Register 4 also stores inputs from two other interrupt sources that operate in a different way from the other status bits. If automatic fan speed control (AFC) is enabled, Bit 4 of Status Register 4 is set whenever a fan starts or stops. This bit causes a one-off INT output as shown in Figure 51. It is cleared during the next monitoring cycle and if INT has been cleared, it does not cause INT to be reasserted. FAN ON Enabling and Clearing Interrupts FAN OFF The INT output is enabled when Bit 1 of Configuration Register 1 (INT_Enable) is high, and Bit 2 (INT_Clear) is low. INT may be cleared if: Status Register 1 is read. Ideally, if polling the status registers trying to identify interrupt sources, Status Register 1 should be polled last, because a read of Status Register 1 clears all the other interrupt status registers. The ADM1026 receives the alert response address (ARA) (0001 100) over the SMBus. Bit 2 of Configuration Register 1 is set. INT INT CLEARED BY STATUS REGULAR 1 READ, BIT 2 OF CONFIGURATION REGULAR 1 SET, OR ARA Figure 51. Assertion of INT Due to AFC Event In a similar way, a change of state at the THERM output (described in more detail later), sets Bit 3 of Status Register 4 and causes a one-off INT output. A change of state at the THERM output also causes Bit 0 of Status Register 1, Bit 1 of Status Register 1, or Bit 0 of Status Register 4 to be set, depending on which temperature channel caused the THERM event. This bit is reset during the next monitoring cycle, provided the temperature channel is within the normal high and low limits. Bidirectional THERM Pin The ADM1026 has a second interrupt pin (GPIO16/ THERM Pin 42) that responds only to critical thermal events. The THERM pin goes low whenever a THERM limit is exceeded. This function is useful for CPU throttling or system shutdown. In addition, whenever THERM is activated, the PWM and DAC outputs go full scale to provide fail-safe system cooling. This output is enabled by setting Bit 4 of Configuration Register 1 (Register 00h). Whenever a THERM limit is exceeded, Bit 3 of Status Register 4 (Reg 23h) is set, even if the THERM function is disabled (Bit 4 of Configuration Register 1 = 0). In this case, the THERM status bit is set, but the PWM and DAC outputs are not forced to full scale. Three thermal limit registers are provided for the three temperature sensors at Addresses 0Dh to 0Fh. These registers are dedicated to the THERM function and none of the other limit registers have any effect on the THERM output. If any of the temperature measurements exceed the corresponding limit, THERM is asserted (low) and the DAC and PWM outputs go to maximum to drive any cooling fans to full speed. To avoid cooling fans cycling on and off continually when the temperature is close to the limit, a fixed hysteresis of 5C Fan Inputs Fan inputs generate interrupts in a similar way to analog/temperature inputs, but as the analog/temperature inputs and fan inputs have different monitoring cycles, they have separate interrupt circuits. As the speed of each fan is measured, the output of the fan speed counter is stored in a value register. The result is compared to the fan speed limit and is used to set or clear a bit in Status Register 3. In this case, the fan is monitored only for underspeed (fan counter > fan speed limit). Mask Register 3 is used to mask fan interrupts. After mask gating, the fan status bits are OR’ed together and used to set a latch, whose output is OR’ed with other interrupt sources to produce the INT output. Like the analog/temp interrupt, an INT output caused by an out−of−limit fan speed measurement, once cleared, is not reasserted until the end of the next monitoring cycle, although other interrupt sources may cause INT to be asserted. GPIO and CI Pins. When GPIO pins are configured as inputs, asserting a GPIO input (high or low, depending on polarity) sets the corresponding GPIO status bit in Status http://onsemi.com 27 ADM1026 if INT is subsequently cleared by one of the methods previously described, it is not reasserted, even if THERM remains asserted. THERM causes INT to be reasserted only when it changes state. is provided. THERM is only deasserted when the measured temperature of all three sensors is 5C below the limit. Whenever the THERM output changes, INT is asserted, as shown in Figure 53. However, this is edge-triggered, so LOW LIMIT AIN3 AIN4 AIN5 AIN6 AIN7 MASK DATA FROM SMBus (SAME BIT NAMES AND ORDER AS STATUS BITS) INT TEMP VBAT AIN8 THERM AFC RESERVED CI GPIO16 FROM FAN SPEED VALUE AND LIMIT REGISTERS HIGH LIMIT 1 = OUT OF LIMIT FAN0 FAN1 FAN2 FAN3 FAN4 FAN5 FAN6 FAN7 DATA DEMULTIPLEXER VALUE HIGH LIMIT COMPARATOR MASK DATA FROM SMBus (SAME BIT NAMES AND ORDER AS STATUS BITS) MASK DATA FROM SMBus (SAME BIT NAMES AND ORDER AS STATUS BITS) STATUS REGISTER 1 STATUS BIT MASK BIT MASK REGISTER 1 0 1 2 3 4 5 6 7 MASK GATING STATUS REGISTER 2 VALUE 1 = OUT OF LIMIT AIN0 AIN1 AIN2 DATA DEMULTIPLEXER HIGH LIMIT HIGH AND LOW LIMIT COMPARATORS FROM ANALOG/TEMP VALUE AND LIMIT REGISTERS MASK GATING STATUS BIT IN OUT LATCH MASK BIT RESET MASK REGISTER 2 0 1 2 3 4 5 6 7 MASK GATING STATUS REGISTER 4 MASK DATA FROM SMBus (SAME BIT NAMES AND ORDER AS STATUS BITS) 0 1 2 3 4 5 6 7 STATUS BIT MASK BIT MASK REGISTER 4 0 1 2 3 4 5 6 7 CI GPIO16 MASK GATING STATUS REGISTER 3 EXT1 TEMP EXT 2 TEMP 3.3V STBY 3.3V MAIN +5V VCCP +12V –12V STATUS BIT MASK BIT MASK REGISTER 3 STATUS REGISTER 5 MASKING DATA FROM SMBus MASK REGISTER 5 GPIO8 TO GPIO15 STATUS REGISTER 6 MASKING DATA FROM SMBus MASK REGISTER 6 STATUS BIT MASK BIT MASK GATING STATUS BIT MASK BIT Figure 52. Interrupt Structure http://onsemi.com 28 LATCH RESET INT ENABLE MASK GATING GPIO0 TO GPIO7 INT IN OUT INT CLEAR ADM1026 NAND Tree Tests Note that the THERM pin is bidirectional, so THERM may be pulled low externally as an input. This causes the PWM and DAC outputs to go to full scale until THERM is returned high again. To disable THERM as an input, set Bit 0 of Configuration Register 3 (Reg. 07h). This configures Pin 42 as GPIO16 and prevents a low on Pin 42 from driving the fans at full speed. A NAND tree is provided in the ADM1026 for automated test equipment (ATE) board-level connectivity testing. This allows the functionality of all digital inputs to be tested in a simple manner and any pins that are nonfunctional or shorted together to be identified. The structure of the NAND tree is shown in Figure 55. The device is placed into NAND tree test mode by powering up with Pin 25 held high. This pin is sampled automatically after powerup, and if it is connected high, then the NAND test mode is invoked. TEMPERATURE THERM LIMIT THERM LIMIT - 55C GPIO8 THERM FAN0 FAN1 INT FAN2 INT CLEARED BY STATUS REG 1 READ, BIT 2 OF CONFIG. REG. 1 SET, OR ARA INT Figure 53. Assertion of INT Due to THERM Event CI Reset Input and Outputs SDA The ADM1026 has two active low, power-on reset outputs, RESETMAIN and RESETSTBY. These operate as follows. RESETSTBY monitors 3.3 V STBY. At powerup, RESETSTBY is asserted (pulled low) until 180 ms after 3.3 V STBY rises above the reset threshold. RESETMAIN monitors 3.3 V MAIN. This means that at powerup, RESETMAIN is asserted (pulled low) until 180 ms after 3.3 V MAIN rises above the reset threshold. If 3.3 V MAIN rises with or before DVCC, RESETMAIN remains asserted until 180 ms after RESETSTBY is negated. RESETMAIN can also function as a RESET input. Pulling this pin low resets the registers, which are initialized to their default values by a software reset. (See the Software Reset Function section for register details). Note that the 3.3 V STBY pin supplies power to the ADM1026. In applications that do not require monitoring of a 3.3 V STBY and 3.3 V MAIN supply, these two pins should be connected together (3.3 V MAIN should not be left floating). To ensure that the 3.3 V STBY pin does not become back driven, the 3.3 V STBY supply should power on before all other voltages in the system. See Table 5 for more information about pin configuration. 3.3VSTBY 3.3VMAIN SCL FAN7 FAN4 FAN5 FAN6 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 NTESTOUT Figure 55. NAND Tree The NAND tree test may be carried out in one of two ways. 1. Start with all inputs low and take them high in turn, starting with the input nearest to NTEST_OUT (GPIO16/ THERM) and working back up the tree to the input furthest from NTESTOUT (INT). This should give the characteristic output pattern shown in Figure 56, with NTESTOUT toggling each time an input is taken high. 2. Start with all inputs high and take them low in turn, starting with the input furthest from NTEST_OUT (INT) and working down the tree to the input nearest to NTEST_OUT (GPIO16/THERM). This should give a similar output pattern to Figure 57. ~1.0 V ~1.0 V RESETSTBY RESETMAIN 180ms FAN3 GPIO9 180ms POWER−ON RESET Figure 54. Operation of Offset Outputs http://onsemi.com 29 ADM1026 Notes: For a NAND tree test to work, all outputs (INT, RSTMAIN, RSTSTBY, and PWM) must remain high during the test. When generating test waveforms, allow for a typical propagation delay of 500 ns through the NAND tree. If any of the inputs shown in Figure 55 are unused, they should not be connected direct to ground, but via a resistor such as 10 kW. This allows the automatic test equipment (ATE) to drive every input high so that the NAND tree test can be properly carried out. INT CI SDA SCL FAN7 FAN6 FAN5 FAN4 FAN3 FAN2 FAN1 GPIO16 FAN0 GPIO15 GPIO8 GPIO14 GPIO9 GPIO13 GPIO10 GPIO12 GPIO11 GPIO11 GPIO12 GPIO10 GPIO13 GPIO9 GPIO14 GPIO8 GPIO15 FAN0 GPIO16 FAN1 NTESTOUT FAN2 Figure 57. NAND Tree Test Taking Inputs Low in Turn FAN3 FAN4 FAN5 GPIO16 FAN6 GPIO15 FAN7 GPIO14 SCL GPIO13 SDA GPIO12 CI GPIO11 INT GPIO10 GPIO9 NTESTOUT GPIO8 FAN0 Figure 56. NAND Tree Test Taking Inputs High in Turn FAN1 NTESTOUT In the event of an input being nonfunctional (stuck high or low) or two inputs shorted together, the output pattern is different. Some examples are given in Figure 58 through Figure 60. Figure 58 shows the effect of one input being stuck low. The output pattern is normal until the stuck input is reached. Because that input is permanently low, neither it nor any inputs further up the tree can have any effect on the output. Figure 58. NAND Tree Test with GPIO11 Stuck Low Figure 59 shows the effect of one input being stuck high. Taking GPIO12 high should take the output high. However, the next input up the tree, GPIO11, is already high, so the output immediately goes low again, causing a missing pulse in the output pattern. http://onsemi.com 30 ADM1026 Setting the fan divisors using the fan divisor registers GPIO16 GPIO15 GPIO14 GPIO13 GPIO12 GPIO11 GPIO10 GPIO9 GPIO8 (Addresses 02h and 03h). Configuring the GPIO pins for input/output polarity, using GPIO Configuration Registers 1 to 4 (Addresses 08h to 0Bh) and Bits 6 and 7 of Configuration Register 3. Setting mask bits in Mask Registers 1 to 6 (Addresses 18h to 1Dh) for any inputs that are to be masked out. Setting up Configuration Registers 1 and 3, as described in Table 10 and Table 11. FAN0 Table 10. CONFIGURATION REGISTER 1 FAN1 Bit Description 0 Controls the monitoring loop of the ADM1026. Setting Bit 0 low stops the monitoring loop and puts the ADM1026 into low power mode and reduces power consumption. Serial bus communication is still possible with any register in the ADM1026 while in low power mode. Setting bit 0 high starts the monitoring loop. 1 Enables or disables the INT interrupt output. Setting Bit 1 high enables the INT output, setting Bit 1 low disables the output. 2 Used to clear the INT interrupt output when set high. GPIO pins and interrupt status register contents are not affected. 3 Configures Pins 27 and 28 as the second external temperature channel when 0, and as AIN8 and AIN9 when set to 1. GPIO13 4 Enables the THERM output when set to 1. GPIO12 5 Enables automatic fan speed control on the DAC output when set to 1. 6 Enables automatic fan speed control on the PWM output when set to 1. 7 Performs a soft reset when set to 1. NTESTOUT Figure 59. NAND Tree Test with One Input Stuck High A similar effect occurs if two adjacent inputs are shorted together. The example in Figure 60 assumes that the current sink capability of the circuit driving the inputs is considerably higher than the source capability, so the inputs are low if either is low, but high only if both are high. When GPIO12 goes high the output should go high. But because GPIO12 and GPIO11 are shorted, they both go high together, causing a missing pulse in the output pattern. GPIO16 GPIO15 GPIO14 GPIO11 GPIO10 GPIO9 GPIO8 FAN0 Table 11. CONFIGURATION REGISTER 3 FAN1 Bit NTESTOUT Figure 60. NAND Tree Test with Two Inputs Shorted Using the ADM1026 When power is first applied, the ADM1026 performs a power−on reset on all its registers (not EEPROM), which sets them to default conditions as shown in Table 13. In particular, note that all GPIO pins are configured as inputs to avoid possible conflicts with circuits trying to drive these pins. The ADM1026 can also be initialized at any time by writing a 1 to Bit 7 of Configuration Register 1, which sets some registers to their default power−on conditions. This bit should be cleared by writing a 0 to it. After power−on, the ADM1026 must be configured to the user’s specific requirements. This consists of: Writing values to the limit registers. Configuring Pins 3 to 6, and 9 to 12 as fan inputs or GPIO, using Configuration Register 2 (Address 01h). Description 0 Configures Pin 42 as GPIO when set to 1 or as THERM when cleared to 0. 1 Clears the CI latch when set to 1. Thereafter, a 0 must be written to allow subsequent CI detection. 2 Selects VREF as 2.5 V when set to 1 or as 1.82 V when cleared to 0. 3–5 Unused. 6, 7 Set up GPIO16 for direction and polarity. Starting Conversion The monitoring function (analog inputs, temperature, and fan speeds) in the ADM1026 is started by writing to Configuration Register 1 and setting Start (Bit 0) high. The INT_Enable (Bit 1) should be set to 1, and INT Clear (Bit 2) set to 0 to enable interrupts. The THERM enable bit (Bit 4) should be set to 1 to enable temperature interrupts at the THERM pin. Apart from initially starting together, the analog measurements and fan speed measurements proceed independently, and are not synchronized in any way. http://onsemi.com 31 ADM1026 Reduced Power Mode Note that the limit registers (0Dh to 12h, 40h to 6Dh) are not reset by the software reset function. This can be useful if one needs to reset the part but does not want to reprogram all parameters again. Note that a power-on reset initializes all registers on the ADM1026, including the limit registers. The ADM1026 can be placed in a low power mode by setting Bit 0 of the configuration register to 0. This disables the internal ADC. Software Reset Function As previously mentioned, the ADM1026 can be reset in software by setting Bit 7 of Configuration Register 1 (Reg. 00h) to 1. Configuration Register 1, 00h, should then be manually cleared. Note that the software reset differs from a power-on reset in that only some of the ADM1026 registers are reinitialized to their power-on default values. The registers that are initialized to their default values by the software reset are Configuration Registers (Registers 01h to 0Bh) Mask Registers 1 to 6, internal temperature offset, and Status Registers 4, 5, and 6 (Registers 18h to 25h) All value registers (Registers 1Fh, 20h to 3Fh) External 1 and External 2 Offset Registers (6Eh, 6Fh) Application Schematic Figure 61 shows how the ADM1026 could be used in an application that requires system management of a PC or server. Several GPIOs are used to read the VID codes of the CPU. Up to two CPU temperature measurements can be read back. All power supply voltages are monitored in the system. Up to eight fan speeds can be measured, irrespective of whether they are controlled by the ADM1026 or hardwired to a system supply. The VREF output includes the recommended filtering circuitry. http://onsemi.com 32 X5 Figure 61. ADM1026 Schematic http://onsemi.com 33 FAN 3 Q1 SDATA SCLOCK 46 GPIO12 R2 2k 12 DAC 23 3.3V STBY 22 AGND 21 2 R1 2k FAN7/GPIO7 D1– 25 D1+ 26 D2–/A IN9 27 D2+/A IN8 28 +VBAT 29 –12V IN 31 +5 VIN 30 AIN7 34 +VCCP 33 +12 VIN 32 AIN5 36 AIN6 35 R3 470k R6 10k CPU1_THERMDC CPU1_THERMDA CPU2_THERMDC CPU2_THERMDA +5 VIN –12 VIN CPU1_VCCP +12 VIN CPU2_VCCP SYS_THERM 4 1 3.3V STDY FAN6/GPIO6 FAN5/GPIO5 11 10 9 FAN4/GPIO4 45 GPIO13 +12V 3 3 FAN 2 2 1 44 GPIO14 8 DGND 42 THERM 43 GPIO15 U1 ADM1026_SKT 41 A IN0 7 3.3VMAIN 6 FAN3/GPIO3 5 FAN2/GPIO2 4 FAN1/GPIO1 38 A IN3 1 +12V 48 GPIO10 +12V X4 FAN 47 GPIO11 3 FAN0/GPIO0 1 GPIO9 2 GPIO8 39 A IN2 40 A IN1 FAN FAN 3 3 1 +12V 2 X2 2 1 +12V 37 A IN4 X3 X1 CPU1_VID4 CPU1_VID3 CPU1_VID2 CPU1_VID1 CPU1_VID0 R5 10k C1 0.1F R4 10k VCC + B1 SMB_ALERT CPURESET POWER_GOOD 0–2.5V_OUT VREF_OUT ADM1026 S1 1 VREF 24 3.3V_STBY RESETSTBY 19 PWM 18 RESETMAIN 20 INT 17 ADD 15 CI 16 SDA 14 SCL 13 ADM1026 Registers Table 12. ADDRESS POINTER REGISTER Bit Name R/W 7–0 Address Pointer W Description Address of ADM1026 registers. See the following tables for details. Table 13. LIST OF REGISTERS Hex Address Name Power-on Value Description 00 Configuration 1 00h Configures various operating parameters . 01 Configuration 2 00h Configures Pins 3–6 and 9–12 as fan inputs or GPIO. 02 Fan 0–3 Divisor 55h Sets oscillator frequency for Fan 0–3 speed measurement. 03 Fan 4–7 Divisor 55h Sets oscillator frequency for Fan 4–7 speed measurement. 04 DAC Control FFh Contains value for fan speed DAC (analog fan speed control) or minimum value for automatic fan speed control. 05 PWM Control FFh Contains value for PWM fan speed control or minimum value for automatic fan speed control. 06 EEPROM Register 100h For factory use only. 07 Configuration Register 300h Configuration register for THERM, VREF and GPIO16. 08 GPIO Config 1 00h Configures GPIO0 to GPIO3 as input or output and as active high or active low. 09 GPIO Config 2 00h Configures GPIO4 to GPIO7 as input or output and as active high or active low. 0A GPIO Config 3 00h Configures GPIO8 to GPIO11 as input or output and as active high or active low. 0B GPIO Config 4 00h Configures GPIO12 to GPIO15 as input or output and as active high or active low. 0C EEPROM Register 2 00h For factory use only. 0D Int Temp THERM Limit 37h (55C) High limit for THERM interrupt output based on internal temperature measurement. 0E TDM1 THERM Limit 50h (80C) High limit for THERM interrupt output based on Remote Channel 1 (D1) temperature measurement. 0F TDM2 THERM Limit 50h (80C) High limit for THERM interrupt output based on Remote Channel 2 (D2) temperature measurement. 10 Int Temp TMIN 28h (40C) TMIN value for automatic fan speed control based on internal temperature measurement. 11 TDM1 TMIN 40h (64C) TMIN value for automatic fan speed control based on Remote Channel 1 (D1) temperature measurement. 12 TDM2 TMIN 40h (64C) TMIN value for automatic fan speed control based on Remote Channel 2 (D2) temperature measurement. 13 EEPROM Register 3 00h Configures EEPROM for read/write/erase, etc. 14 Test Register 1 00h Manufacturer’s test register. 15 Test Register 2 00h For manufacturer’s use only. 16 Manufacturer’s ID 41h Contains manufacturer’s ID code. 17 Revision 4xh Contains code for major and minor revisions. 18 Mask Register 1 00h Interrupt mask register for temperature and supply voltage faults. 19 Mask Register 2 00h Interrupt mask register for analog input faults. 1A Mask Register 3 00h Interrupt mask register for fan faults. 1B Mask Register 4 00h Interrupt mask register for local temp, VBAT, AIN8, THERM, AFC, CI and GPIO16. 1C Mask Register 5 00h Interrupt mask register for GPIO0 to GPIO7. 1D Mask Register 6 00h Interrupt mask register for GPIO8 to GPIO15. 1E Int Temp Offset 00h Offset register for internal temperature measurement. 1F Int Temp Value 00h Measured temperature from on-chip sensor. 20 Status Register 1 00h Interrupt status register for external temp and supply voltage faults. 21 Status Register 2 00h Interrupt status register for analog input faults. 22 Status Register 3 00h Interrupt status register for fan faults. http://onsemi.com 34 ADM1026 Table 13. LIST OF REGISTERS Hex Address Name Power-on Value Description 23 Status Register 4 00h Interrupt status register for local temp, VBAT, AIN8, THERM, AFC, CI, and GPIO16. 24 Status Register 5 00h Interrupt status register for GPIO0 to GPIO7. 25 Status Register 6 00h Interrupt status register for GPIO8 to GPIO15. 26 VBAT Value 00h Measured value of VBAT. 27 AIN8 Value 00h Measured value of AIN8. 28 TDM1 Value 00h Measured value of remote temperature channel 1 (D1). 29 TDM2/AIN9 Value 00h Measured value of remote temperature channel 2 (D2) or AIN9. 2A 3.3 V STBY Value 00h Measured value of 3.3 V STBY. 2B 3.3 V MAIN Value 00h Measured value of 3.3 V MAIN. 2C +5.0 V Value 00h Measured value of +5.0 V supply. 2D VCCP Value 00h Measured value of processor core voltage. 2E +12 V Value 00h Measured value of +12 V supply. 2F −12 V Value 00h Measured value of -12 V supply. 30 AIN0 Value 00h Measured value of AIN0. 31 AIN1 Value 00h Measured value of AIN1 32 AIN2 Value 00h Measured value of AIN2. 33 AIN3 Value 00h Measured value of AIN3. 34 AIN4 Value 00h Measured value of AIN4. 35 AIN5 Value 00h Measured value of AIN5. 36 AIN6 Value 00h Measured value of AIN6. 37 AIN7 Value 00h Measured value of AIN7. 38 FAN0 Value 00h Measured speed of Fan 0. 39 FAN1 Value 00h Measured speed of Fan 1. 3A FAN2 Value 00h Measured speed of Fan 2. 3B FAN3 Value 00h Measured speed of Fan 3. 3C FAN4 Value 00h Measured speed of Fan 4. 3D FAN5 Value 00h Measured speed of Fan 5. 3E FAN6 Value 00h Measured speed of Fan 6. 3F FAN7 Value 00h Measured speed of Fan 7. 40 TDM1 High Limit 64h (100C) High limit for Remote Temperature Channel 1 (D1) measurement. 41 TDM2/AIN9 High Limit 64h (100C) High limit for Remote Temperature Channel 2 (D2) or AIN9 measurement. 42 3.3 V STBY High Limit FFh High limit for 3.3 V STBY measurement. 43 3.3 V MAIN High Limit FFh High limit for 3.3 V MAIN measurement. 44 +5.0 V High Limit FFh High limit for +5.0 V supply measurement. 45 VCCP High Limit FFh High limit for processor core voltage measurement. 46 +12 V High Limit FFh High limit for +12 V supply measurement. 47 −12 V High Limit FFh High limit for -12 V supply measurement. 48 TDM1 Low Limit 80h Low limit for Remote Temperature Channel 1 (D1) measurement. 49 TDM2/AIN9 Low Limit 80h Low limit for Remote Temperature Channel 2 (D2) or AIN9 measurement. 4A 3.3 V STBY Low Limit 00h Low limit for 3.3 V STBY measurement. 4B 3.3 V MAIN Low Limit 00h Low limit for 3.3 V MAIN measurement. 4C +5.0 V Low Limit 00h Low limit for +5.0 V supply. 4D VCCP Low Limit 00h Low limit for processor core voltage measurement. 4E +12 V Low Limit 00h Low limit for +12 V supply measurement. 4F −12 V Low Limit 00h Low limit for -12 V supply measurement. 50 AIN0 High Limit FFh High limit for AIN0 measurement. 51 AIN1 High Limit FFh High limit for AIN1 measurement. http://onsemi.com 35 ADM1026 Table 13. LIST OF REGISTERS Hex Address Name Power-on Value Description 52 AIN2 High Limit FFh High limit for AIN2 measurement. 53 AIN3 High Limit FFh High limit for AIN3 measurement. 54 AIN4 High Limit FFh High limit for AIN4 measurement. 55 AIN5 High Limit FFh High limit for AIN5 measurement. 56 AIN6 High Limit FFh High limit for AIN6 measurement. 57 AIN7 High Limit FFh High limit for AIN7 measurement. 58 AIN0 Low Limit 00h Low limit for AIN0 measurement. 59 AIN1 Low Limit 00h Low limit for AIN1 measurement. 5A AIN2 Low Limit 00h Low limit for AIN2 measurement. 5B AIN3 Low Limit 00h Low limit for AIN3 measurement. 5C AIN4 Low Limit 00h Low limit for AIN4 measurement. 5D AIN5 Low Limit 00h Low limit for AIN5 measurement. 5E AIN6 Low Limit 00h Low limit for AIN6 measurement. 5F AIN7 Low Limit 00h Low limit for AIN7 measurement. 60 FAN0 High Limit FFh High limit for Fan 0 speed measurement (no low limit). 61 FAN1 High Limit FFh High limit for Fan 1 speed measurement (no low limit). 62 FAN2 High Limit FFh High limit for Fan 2 speed measurement (no low limit). 63 FAN3 High Limit FFh High limit for Fan 3 speed measurement (no low limit). 64 FAN4 High Limit FFh High limit for Fan 4 speed measurement (no low limit). 65 FAN5 High Limit FFh High limit for Fan 5 speed measurement (no low limit). 66 FAN6 High Limit FFh High limit for Fan 6 speed measurement (no low limit). 67 FAN7 High Limit FFh High limit for Fan 7 speed measurement (no low limit). 68 Int. Temp. High Limit 50h (80C) High limit for local temperature measurement. 69 Int. Temp. Low Limit 80h Low limit for local temperature measurement. 6A VBAT High Limit FFh High limit for VBAT measurement. 6B VBAT Low Limit 00h Low limit for VBAT measurement. 6C AIN8 High Limit FFh High limit for AIN8 measurement. 6D AIN8 Low Limit 00h Low limit for AIN8 measurement. 6E Ext1 Temp Offset 00h Offset register for Remote Temperature Channel 1. 6F Ext2 Temp Offset 00h Offset register for Remote Temperature Channel 2. http://onsemi.com 36 ADM1026 Detailed Register Descriptions Table 14. REGISTER 00H, CONFIGURATION REGISTER 1 (POWER-ON DEFAULT 00H) Bit Name R/W Description 0 Monitor = 0 R/W When this bit is set the ADM1026 monitors all voltage, temperature and fan channels in a round robin manner. 1 Int Enable = 0 R/W When this bit is set, the INT output pin is enabled. 2 Int Clear = 0 R/W Setting this bit clears an interrupt from the voltage, temperature or fan speed channels. Because GPIO interrupts are level triggered, this bit has no effect on interrupts originating from GPIO channels. This bit is cleared by writing a 0 to it. If in monitoring mode voltages, temperatures and fan speeds continue to be monitored after writing to this bit to clear an interrupt, so an interrupt may be set again on the next monitoring cycle. 3 Enable Voltage/Ext2 = 0 R/W When this bit is 1, the ADM1026 monitors voltage (AIN8 and AIN9) on Pins 28 and 27, respectively. When this bit is 0, the ADM1026 monitors a second thermal diode temperature channel, D2, on these pins. If the second thermal diode channel is not being used, it is recommended that the bit be set to 1. 4 Enable THERM = 0 R/W When this bit is 1, the THERM pin (Pin 42) is asserted (go low) if any of the THERM limits are exceeded. If THERM is pulled low as an input, the DAC and PWM outputs are forced to full scale until THERM is taken high. 5 Enable DAC AFC = 0 R/W When this bit is 1, the DAC output is enabled for automatic fan speed control (AFC) based on temperature. When this bit is 0, the DAC Output reflects the value in Reg 04h, the DAC Control Register. 6 Enable PWM AFC = 0 R/W When this bit is 1, the PWM output is enabled for automatic fan speed control (AFC) based on temperature. When this bit is 0, the PWM Output reflects the value in Reg 05h, the PWM Control Register. 7 Software Reset = 0 R/W Writing a 1 to this bit restores all registers to the power-on defaults. This bit is cleared by writing a 0 to it. For more info, see the Software Reset Function section. Table 15. REGISTER 01H, CONFIGURATION REGISTER 2 (POWER-ON DEFAULT 00H) Bit Name R/W Description 0 Enable GPIO0/Fan0 = 0 R/W When this bit is 1, Pin 3 is enabled as a general−purpose I/O pin (GPIO0), otherwise it is a fan tach measurement input (Fan 0). 1 Enable GPIO1/Fan1 = 0 R/W When this bit is 1, Pin 4 is enabled as a general−purpose I/O pin (GPIO1), otherwise it is a fan tach measurement input (Fan 1). 2 Enable GPIO2/Fan2 = 0 R/W When this bit is 1, Pin 5 is enabled as a general−purpose I/O pin (GPIO2), otherwise it is a fan tach measurement input (Fan 2). 3 Enable GPIO3/Fan3 = 0 R/W When this bit is 1, Pin 6 is enabled as a general−purpose I/O pin (GPIO3), otherwise it is a fan tach measurement input (Fan 3). 4 Enable GPIO4/Fan4 = 0 R/W When this bit is 1, Pin 9 is enabled as a general−purpose I/O pin (GPIO4), otherwise it is a fan tach measurement input (Fan 4). 5 Enable GPIO5/Fan5 = 0 R/W When this bit is 1, Pin 10 is enabled as a general−purpose I/O pin (GPIO5), otherwise it is a fan tach measurement input (Fan 5). 6 Enable GPIO6/Fan6 = 0 R/W When this bit is 1, Pin 11 is enabled as a general−purpose I/O pin (GPIO6), otherwise it is a fan tach measurement input (Fan 6). 7 Enable GPIO7/Fan7 = 0 R/W When this bit is 1, Pin 12 is enabled as a general−purpose I/O pin (GPIO7), otherwise it is a fan tach measurement input (Fan 7). http://onsemi.com 37 ADM1026 Table 16. REGISTER 02H, FANS 0 TO 3 FAN DIVISOR REGISTER (POWER-ON DEFAULT 55H) Bit Name R/W 1–0 Fan 0 Divisor R/W Description Sets the oscillator prescaler division ratio for Fan 0 speed measurement. The division ratios, oscillator frequencies, and typical fan speeds (based on 2 tach pulses per revolution) are as follows: Code Divide By: Oscillator Frequency (kHz) 00 01 10 11 1 2 4 8 22.5 11.25 5.62 2.81 3–2 Fan 1 Divisor R/W Same as Fan 0 5–4 Fan 2 Divisor R/W Same as Fan 0 7–6 Fan 3 Divisor R/W Same as Fan 0 Fan Speed (RPM) 8800, nominal, for count of 153 4400, nominal, for count of 153 2200, nominal, for count of 153 1100, nominal, for count of 153 Table 17. REGISTER 03H, FANS 4 TO 7 FAN DIVISOR REGISTER (POWER-ON DEFAULT 55H) Bit Name R/W 1–0 Fan 4 Divisor R/W Description Sets the oscillator prescaler division ratio for Fan 4 speed measurement. The division ratios, oscillator frequencies, and typical fan speeds (based on 2 tach pulses per revolution) are as follows: Code Divide By: Oscillator Frequency (kHz) 00 01 10 11 1 2 4 8 22.5 11.25 5.62 2.81 3–2 Fan 5 Divisor R/W Same as Fan 4 5–4 Fan 6 Divisor R/W Same as Fan 4 7–6 Fan 7 Divisor R/W Same as Fan 4 Fan Speed (RPM) 8800, nominal, for count of 153 4400, nominal, for count of 153 2200, nominal, for count of 153 1100, nominal, for count of 153 Table 18. REGISTER 04H, DAC CONFIGURATION REGISTER (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 DAC Control R/W Description This register contains the value to which the fan speed DAC is programmed in normal mode, or the 4 MSBs contain the minimum fan speed in auto fan speed control mode. Table 19. REGISTER 05H, PWM CONTROL REGISTER (POWER-ON DEFAULT FFH) Bit Name R/W 7–4 PWM Control R/W 3–0 Unused R Description This register contains the value to which the PWM fan speed is programmed in normal mode, or the 4 MSBs contain the minimum fan speed in auto fan speed control mode. 0000 = 0% Duty Cycle 0001 = 7% Duty Cycle 0101 = 33% Duty Cycle 0110 = 40% Duty Cycle 0111 = 47% Duty Cycle 1110 = 93% Duty Cycle 1111 = 100% Duty Cycle Undefined Table 20. REGISTER 06H, EEPROM REGISTER 1 (POWER-ON DEFAULT 00H) Bit Name R/W Description 7–0 Factory Use R/W For factory use only. Do not write to this register. http://onsemi.com 38 ADM1026 Table 21. REGISTER 07H, CONFIGURATION REGISTER 3 (POWER-ON DEFAULT 00H) Bit Name R/W 0 Enable GPIO16/ THERM = 0 R/W When this bit is 1, Pin 42 is enabled as a general−purpose I/O pin (GPIO16); otherwise it is the THERM output. Description 1 CI Clear = 0 R/W Writing a 1 to this bit clears the CI latch. This bit is cleared by writing a 0 to it. When this bit is 0, VREF (Pin 24) outputs 1.82 V, otherwise, it outputs 2.5 V. 2 VREF Select = 0 R/W 5–3 Unused R 6 GPIO16 Direction R/W When this bit is 0, GPIO16 is configured as an input; otherwise, it is an output. 7 GPIO16 Polarity R/W When this bit is 0, GPIO16 is active low; otherwise, it is active high. Undefined, reads back 0. Table 22. REGISTER 08H, GPIO CONFIGURATION REGISTER 1 (POWER-ON DEFAULT 00H) Bit Name R/W Description 0 GPIO0 Direction R/W When this bit is 0, GPIO0 is configured as an input; otherwise, it is an output. 1 GPIO0 Polarity R/W When this bit is 0, GPIO0 is active low; otherwise it is active high. 2 GPIO1 Direction R/W When this bit is 0, GPIO1 is configured as an input; otherwise, it is an output. 3 GPIO1 Polarity R/W When this bit is 0, GPIO1 is active low; otherwise it is active high. 4 GPIO2 Direction R/W When this bit is 0, GPIO2 is configured as an input; otherwise, it is an output. 5 GPIO2 Polarity R/W When this bit is 0, GPIO2 is active low; otherwise, it is active high. 6 GPIO3 Direction R/W When this bit is 0, GPIO3 is configured as an input; otherwise, it is an output. 7 GPIO3 Polarity R/W When this bit is 0, GPIO3 is active low; otherwise, it is active high. Table 23. REGISTER 09H, GPIO CONFIGURATION REGISTER 2 (POWER-ON DEFAULT 00H) Bit Name R/W Description 0 GPIO4 Direction R/W When this bit is 0, GPIO4 is configured as an input; otherwise, it is an output. 1 GPIO4 Polarity R/W When this bit is 0, GPIO4 is active low; otherwise, it is active high. 2 GPIO5 Direction R/W When this bit is 0, GPIO5 is configured as an input; otherwise, it is an output. 3 GPIO5 Polarity R/W When this bit is 0, GPIO5 is active low; otherwise, it is active high. 4 GPIO6 Direction R/W When this bit is 0, GPIO6 is configured as an input; otherwise, it is an output. 5 GPIO6 Polarity R/W When this bit is 0, GPIO6 is active low; otherwise, it is active high. 6 GPIO7 Direction R/W When this bit is 0, GPIO7 is configured as an input; otherwise, it is an output. 7 GPIO7 Polarity R/W When this bit is 0, GPIO7 is active low; otherwise, it is active high. Table 24. REGISTER 0AH, GPIO CONFIGURATION REGISTER 3 (POWER-ON DEFAULT 00H) Bit Name R/W Description 0 GPIO8 Direction R/W When this bit is 0, GPIO8 is configured as an input; otherwise, it is an output. 1 GPIO8 Polarity R/W When this bit is 0, GPIO8 is active low; otherwise, it is active high. 2 GPIO9 Direction R/W When this bit is 0, GPIO9 is configured as an input; otherwise, it is an output. 3 GPIO9 Polarity R/W When this bit is 0, GPIO9 is active low; otherwise, it is active high. 4 GPIO10 Direction R/W When this bit is 0, GPIO10 is configured as an input; otherwise, it is an output. 5 GPIO10 Polarity R/W When this bit is 0, GPIO10 is active low; otherwise, it is active high. 6 GPIO11 Direction R/W When this bit is 0, GPIO11 is configured as an input; otherwise, it is an output. 7 GPIO11 Polarity R/W When this bit is 0, GPIO11 is active low; otherwise, it is active high. http://onsemi.com 39 ADM1026 Table 25. REGISTER 0BH, GPIO CONFIGURATION REGISTER 4 (POWER-ON DEFAULT 00H) Bit Name R/W 0 GPIO12 Direction R/W When this bit is 0, GPIO12 is configured as an input; otherwise, it is an output. Description 1 GPIO12 Polarity R/W When this bit is 0, GPIO12 is active low; otherwise, it is active high. 2 GPIO13 Direction R/W When this bit is 0, GPIO13 is configured as an input; otherwise, it is an output. 3 GPIO13 Polarity R/W When this bit is 0, GPIO13 is active low; otherwise, it is active high. 4 GPIO14 Direction R/W When this bit is 0, GPIO14 is configured as an input; otherwise, it is an output. 5 GPIO14 Polarity R/W When this bit is 0, GPIO14 is active low; otherwise, it is active high. 6 GPIO15 Direction R/W When this bit is 0, GPIO15 is configured as an input; otherwise, it is an output. 7 GPIO15 Polarity R/W When this bit is 0, GPIO15 is active low; otherwise, it is active high. Table 26. REGISTER 0CH, EEPROM CONFIGURATION REGISTER 2 (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 Factory Use R Description For factory use only. Do not write to this register. Table 27. REGISTER 0DH, INTERNAL TEMPERATURE THERM LIMIT (POWER-ON DEFAULT, 37H 555C) Bit Name R/W 7–0 Int Temp THERM Limit R/W Description This register contains the THERM limit for the internal temperature channel. Exceeding this limit causes the THERM output pin to be asserted. Table 28. REGISTER 0EH, TDM1 THERM LIMIT (POWER-ON DEFAULT, 50H 805C) Bit Name R/W 7–0 TDM1 THERM Limit R/W Description This register contains the THERM limit for the TDM1 temperature channel. Exceeding this limit causes the THERM output pin to be asserted. Table 29. REGISTER 0FH, TDM2 THERM LIMIT (POWER-ON DEFAULT, 50H 805C) Bit Name R/W 7–0 TDM2 THERM Limit R/W Description This register contains the THERM limit for the TDM2 temperature channel. Exceeding this limit causes the THERM output pin to be asserted. Table 30. REGISTER 10H, INTERNAL TEMPERATURE TMIN (POWER-ON DEFAULT, 28H 405C) Bit Name R/W 7–0 Internal Temp TMIN R/W Description This register contains the TMIN value for automatic fan speed control based on the internal temperature channel. Table 31. REGISTER 11H, TDM1 TEMPERATURE TMIN (POWER-ON DEFAULT, 40H 645C) Bit Name R/W 7–0 TDM1 Temp TMIN R/W Description This register contains the TMIN value for automatic fan speed control based on the TDM1 temperature channel. Table 32. REGISTER 12H, TDM2 TEMPERATURE TMIN (POWER-ON DEFAULT, 40H 645C) Bit Name R/W 7–0 TDM2 Temp TMIN R/W Description This register contains the TMIN value for automatic fan speed control based on the TDM2 temperature channel. http://onsemi.com 40 ADM1026 Table 33. REGISTER 13H, EEPROM REGISTER 3 (POWER-ON DEFAULT, 00H) Bit Name R/W 0 Read R/W Setting this bit puts the EEPROM into read mode. Description 1 Write R/W Setting this bit puts the EEPROM in write (program) mode. 2 Erase R/W Setting this bit puts the EEPROM into erase mode. 3 Write Protect R/W Once Setting this bit protects the EEPROM against accidental writing or erasure. This bit can write once and only be cleared by a power−on reset. 4 Test Mode Bit 0 R/W Test mode bits. For factory use only 5 Test Mode Bit 1 R/W Test mode bits. For factory use only. 6 Test Mode Bit 2 R/W Test mode bits. For factory use only 7 Clock Extend R/W Setting this bit enables SMBus clock extension. The ADM1026 can pull SCL low to extend the clock pulse if it cannot accept any more data. It is recommended to set this bit to 1 to extend the clock pulse during repeated EEPROM write or block write operations. Table 34. REGISTER 14H, MANUFACTURER’S TEST REGISTER 1 (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 Manufacturer’s Test 1 R/W Description This register is used by the manufacturer for test purposes. It should not be read from or written to in normal operation. Table 35. REGISTER 15H, MANUFACTURER’S TEST REGISTER 2 (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 Manufacturer’s Test 2 R/W Description This register is used by the manufacturer for test purposes. It should not be read from or written to in normal operation. Table 36. REGISTER 16H, MANUFACTURER’S ID (POWER-ON DEFAULT, 041H) Bit Name R/W 7–0 Manufacturer ID Code R/W Description This register contains the manufacturer’s ID code. Table 37. REGISTER 17H, REVISION REGISTER (POWER-ON DEFAULT, 4XH) Bit Name R/W Description 3–0 Minor Revision Code R This nibble contains the manufacturer’s code for minor revisions to the device. Rev 1 = 0h, Rev 2 = 1h, and so on. 7–4 Major Revision Code R This nibble denotes the generation of the device. For the ADM1026, this nibble reads 4h. Table 38. REGISTER 18H, MASK REGISTER 1 (POWER-ON DEFAULT, 00H) Bit Name R/W 0 Ext1 Temp Mask = 0 R/W When this bit is set, interrupts generated on the Ext1 temperature channel are masked out. Description 1 Ext2 Temp R/W When this bit is set, interrupts generated on the Ext2/AIN9 channel are masked out. 2 3.3 V STBY Mask = 0 R/W When this bit is set, interrupts generated on the 3.3 V STBY voltage channel are masked out. 3 3.3 V MAIN Mask = 0 R/W When this bit is set, interrupts generated on the 3.3 V MAIN voltage channel are masked out. 4 +5.0 V Mask = 0 R/W When this bit is set, interrupts generated on the +5.0 V voltage channel are masked out. 5 VCCP Mask = 0 R/W When this bit is set, interrupts generated on the VCCP voltage channel are masked out. 6 +12 V Mask = 0 R/W When this bit is set, interrupts generated on the +12 V voltage channel are masked out. 7 −12 V Mask = 0 R/W When this bit is set, interrupts generated on the −12 V voltage channel are masked out. http://onsemi.com 41 ADM1026 Table 39. REGISTER 19H, MASK REGISTER 2 (POWER-ON DEFAULT, 00H) Bit Name R/W Description 0 AIN0 Mask = 0 R/W When this bit is set, interrupts generated on the AIN0 voltage channel are masked out. 1 AIN1 Mask = 0 R/W When this bit is set, interrupts generated on the AIN1 voltage channel are masked out. 2 AIN2 Mask = 0 R/W When this bit is set, interrupts generated on the AIN2 voltage channel are masked out. 3 AIN3 Mask = 0 R/W When this bit is set, interrupts generated on the AIN3 voltage channel are masked out. 4 AIN4 Mask = 0 R/W When this bit is set, interrupts generated on the AIN4 voltage channel are masked out. 5 AIN5 Mask = 0 R/W When this bit is set, interrupts generated on the AIN5 voltage channel are masked out. 6 AIN6 Mask = 0 R/W When this bit is set, interrupts generated on the AIN6 voltage channel are masked out. 7 AIN7 Mask = 0 R/W When this bit is set, interrupts generated on the AIN7 voltage channel are masked out. Table 40. REGISTER 1AH, MASK REGISTER 3 (POWER-ON DEFAULT, 00H) Bit Name R/W Description 0 FAN0 Mask = 0 R/W When this bit is set, interrupts generated on the FAN0 tach channel are masked out. 1 FAN1 Mask = 0 R/W When this bit is set, interrupts generated on the FAN1 tach channel are masked out. 2 FAN2 Mask = 0 R/W When this bit is set, interrupts generated on the FAN2 tach channel are masked out. 3 FAN3 Mask = 0 R/W When this bit is set, interrupts generated on the FAN3 tach channel are masked out. 4 FAN4 Mask = 0 R/W When this bit is set, interrupts generated on the FAN4 tach channel are masked out. 5 FAN5 Mask = 0 R/W When this bit is set, interrupts generated on the FAN5 tach channel are masked out. 6 FAN6 Mask = 0 R/W When this bit is set, interrupts generated on the FAN6 tach channel are masked out. 7 FAN7 Mask = 0 R/W When this bit is set, interrupts generated on the FAN7 tach channel are masked out. Table 41. REGISTER 1BH, MASK REGISTER 4 (POWER-ON DEFAULT, 00H) Bit Name R/W Description 0 Int Temp Mask = 0 R/W When this bit is set, interrupts generated on the internal temperature channel are masked out. 1 VBAT Mask = 0 R/W When this bit is set, interrupts generated on the VBAT voltage channel are masked out. 2 AIN8 Mask = 0 R/W When this bit is set, interrupts generated on the AIN8 voltage channel are masked out. 3 THERM Mask = 0 R/W When this bit is set, interrupts generated from THERM events are masked out. 4 AFC Mask = 0 R/W When this bit is set, interrupts generated from automatic fan control events are masked out. 5 Unused R/W Unused. Reads back 0. 6 CI Mask = 0 R/W When this bit is set, interrupts generated by the chassis intrusion input are masked out. 7 GPIO16 Mask = 0 R/W When this bit is set, interrupts generated on the GPIO16 channel are masked out. Table 42. REGISTER 1CH, MASK REGISTER 5 (POWER-ON DEFAULT, 00H) Bit Name R/W 0 GPIO0 Mask = 0 R/W When this bit is set, interrupts generated on the GPIO0 channel are masked out. Description 1 GPIO1 Mask = 0 R/W When this bit is set, interrupts generated on the GPIO1 channel are masked out. 2 GPIO2 Mask = 0 R/W When this bit is set, interrupts generated on the GPIO2 channel are masked out. 3 GPIO3 Mask = 0 R/W When this bit is set, interrupts generated on the GPIO3 channel are masked out. 4 GPIO4 Mask = 0 R/W When this bit is set, interrupts generated on the GPIO4 channel are masked out. 5 GPIO5 Mask = 0 R/W When this bit is set, interrupts generated on the GPIO5 channel are masked out. 6 GPIO6 Mask = 0 R/W When this bit is set, interrupts generated on the GPIO6 channel are masked out. 7 GPIO7 Mask = 0 R/W When this bit is set, interrupts generated on the GPIO7 channel are masked out. http://onsemi.com 42 ADM1026 Table 43. REGISTER 1DH, MASK REGISTER 6 (POWER-ON DEFAULT, 00H) Bit Name R/W 0 GPIO8 Mask = 0 R/W When this bit is set, interrupts generated on the GPIO8 channel are masked out. Description 1 GPIO9 Mask = 0 R/W When this bit is set, interrupts generated on the GPIO9 channel are masked out. 2 GPIO10 Mask = 0 R/W When this bit is set, interrupts generated on the GPIO10 channel are masked out. 3 GPIO11Mask = 0 R/W When this bit is set, interrupts generated on the GPIO11 channel are masked out. 4 GPIO12 Mask = 0 R/W When this bit is set, interrupts generated on the GPIO12 channel are masked out. 5 GPIO13 Mask = 0 R/W When this bit is set, interrupts generated on the GPIO13 channel are masked out. 6 GPIO14 Mask = 0 R/W When this bit is set, interrupts generated on the GPIO14 channel are masked out. 7 GPIO15 Mask = 0 R/W When this bit is set, interrupts generated on the GPIO15 channel are masked out. Table 44. REGISTER 1EH, INT TEMP OFFSET (POWER-ON DEFAULT, 00H) Bit Name R/W Description 7–0 Int Temp Offset R/W This register contains the offset value for the internal temperature channel, a twos complement result before it is stored or compared to limits. In this way, a sort of one-point calibration can be done whereby the whole transfer function of the channel can be moved up or down. From a software point of view, this may be a very simple method to vary the characteristics of the measurement channel if the thermal characteristics change for any reason (for instance from one chassis to another), if the measurement point is moved, if a plug-in card is inserted or removed, and so on. Table 45. REGISTER 1FH, INT TEMP MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 Int Temp Value R Description This register contains the measured value of the internal temperature channel. Table 46. REGISTER 20H, STATUS REGISTER 1 (POWER-ON DEFAULT, 00H) Bit Name R/W Description 0 Ext1 Temp Status = 0 R 1, if Ext1 value is above the high limit or below the low limit on the previous conversion cycle; 0 otherwise. This bit is set (once only) if a THERM mode is engaged as a result of Ext1 temp readings exceeding the Ext1 THERM limit. This bit is also set (once only) if THERM mode is disengaged as a result of Ext1 temperature readings going 5C below Ext1 THERM limit. 1 Ext2 Temp Status = 0 R 1, if Ext 2 value (or AIN9 if in voltage measurement mode) is above the /AIN9 status = 0 high limit or below the low limit on the previous conversion cycle; 0 otherwise. This bit is set (once only) if a THERM mode is engaged as a result of Ext2 temperature readings exceeding the Ext2 THERM limit. This bit is also set (once only) if THERM mode is disengaged as a result of Ext2 temperature readings going 5C below Ext2 THERM limit. 2 3.3 V STBY Status = 0 R 1, if 3.3 V STBY value is above the high limit or below the low limit on the previous conversion cycle; 0 otherwise. 3 3.3 V MAIN Status = 0 R 1, if 3.3 V MAIN value is above the high limit or below the low limit on the previous conversion cycle; 0 otherwise. 4 +5.0 V Status = 0 R 1, if +5.0 V value is above the high limit or below the low limit on the previous conversion cycle; 0 otherwise. 5 VCCP Status = 0 R 1, if VCCP value is above the high limit or below the low limit on the previous conversion cycle; 0 otherwise. 6 +12 V Status = 0 R 1, if +12 V value is above the high limit or below the low limit on the previous conversion cycle; 0 otherwise. 7 −12 V Status = 0 R 1, if -12 V value is above the high limit or below the low limit on the previous conversion cycle; 0 otherwise. http://onsemi.com 43 ADM1026 Table 47. REGISTER 21H, STATUS REGISTER 2 (POWER-ON DEFAULT, 00H) Bit Name R/W 0 AIN0 Status = 0 R 1, if AIN0 to AIN7 value is above the high limit or below the low limit on the previous conversion cycle; 0 otherwise. Description 1 AIN1 Status = 0 R 1, if AIN0 to AIN7 value is above the high limit or below the low limit on the previous conversion cycle; 0 otherwise. 2 AIN2 Status = 0 R 1, if AIN0 to AIN7 value is above the high limit or below the low limit on the previous conversion cycle; 0 otherwise. 3 AIN3 Status = 0 R 1, if AIN0 to AIN7 value is above the high limit or below the low limit on the previous conversion cycle; 0 otherwise. 4 AIN4 Status = 0 R 1, if AIN0 to AIN7 value is above the high limit or below the low limit on the previous conversion cycle; 0 otherwise. 5 AIN5 Status = 0 R 1, if AIN0 to AIN7 value is above the high limit or below the low limit on the previous conversion cycle; 0 otherwise. 6 AIN6 Status = 0 R 1, if AIN0 to AIN7 value is above the high limit or below the low limit on the previous conversion cycle; 0 otherwise. 7 AIN7 Status = 0 R 1, if AIN0 to AIN7 value is above the high limit or below the low limit on the previous conversion cycle; 0 otherwise. Table 48. REGISTER 22H, STATUS REGISTER 3 (POWER-ON DEFAULT, 00H) Bit Name R/W 0 FAN0 Status 1 = 0 R 1, if FAN0 to FAN7 value is above the high limit on the previous conversion cycle; 0 otherwise. Description 1 FAN1 Status 1 = 0 R 1, if FAN0 to FAN7 value is above the high limit on the previous conversion cycle; 0 otherwise. 2 FAN2 Status 1 = 0 R 1, if FAN0 to FAN7 value is above the high limit on the previous conversion cycle; 0 otherwise. 3 FAN3 Status 1 = 0 R 1, if FAN0 to FAN7 value is above the high limit on the previous conversion cycle; 0 otherwise. 4 FAN4 Status 1 = 0 R 1, if FAN0 to FAN7 value is above the high limit on the previous conversion cycle; 0 otherwise. 5 FAN5 Status 1 = 0 R 1, if FAN0 to FAN7 value is above the high limit on the previous conversion cycle; 0 otherwise. 6 FAN6 Status 1 = 0 R 1, if FAN0 to FAN7 value is above the high limit on the previous conversion cycle; 0 otherwise. 7 FAN7 Status 1 = 0 R 1, if FAN0 to FAN7 value is above the high limit on the previous conversion cycle; 0 otherwise. http://onsemi.com 44 ADM1026 Table 49. REGISTER 23H, STATUS REGISTER 4 (POWER-ON DEFAULT, 00H) Bit Name R/W 0 INT Temp Status = 0 R 1, if INT value is above the high limit or below the low limit on the previous conversion cycle, 0 otherwise. This bit is set (once only) if a THERM mode is engaged as a result of INT temperature readings exceeding the INT THERM limit. This bit is also set (once only) if THERM mode is disengaged as a result of internal temperature readings going 5C below Int THERM limit. 1 VBAT Status = 0 R 1, if VBAT value is above the high limit or below the low limit on the previous conversion cycle, 0 otherwise. 2 AIN8 Status = 0 R 1, if AIN8 value is above the high limit or below the low limit on the previous conversion cycle, 0 otherwise. 3 THERM Status = 0 R This bit is set (once only) if a THERM mode is engaged as a result of temperature readings exceeding the THERM limits on any channel. This bit is also set (once only) if THERM mode is disengaged as a result of temperature readings going 5C below THERM limits on any channel. 4 AFC Status = 0 R This bit is set (once only) if the fan turns on when in automatic fan speed control (AFC) mode as a result of a temperature reading exceeding TMIN on any channel. This bit is also set (once only) if the fan turns off when in automatic fan speed control mode. 5 Unused R Unused. Reads back 0. 6 CI Status = 0 R This bit latches a chassis intrusion event. 7 GPIO16 Status = 0 R When GPIO16 is configured as an input, this bit is set when GPIO16 is asserted. (Asserted may be active high or active low depending on the setting in GPIO configuration register.) When GPIO16 is configured as an output, setting this bit asserts GPIO16. (Asserted may be active high or active low depending on setting in GPIO configuration register.) R/W Description http://onsemi.com 45 ADM1026 Table 50. REGISTER 24H, STATUS REGISTER 5 (POWER-ON DEFAULT, 00H) Bit Name R/W (Note 1) 0 GPIO0 Status = 0 R R/W 1 GPIO1 Status = 0 R R/W 2 GPIO2 Status = 0 R R/W 3 GPIO3 Status = 0 R R/W 4 GPIO4 Status = 0 R R/W 5 GPIO5 Status = 0 R R/W 6 GPIO6 Status = 0 R R/W 7 GPIO7 Status = 0 R R/W Description When GPIO0 is configured as an input, this bit is set when GPIO0 is asserted. (Asserted may be active high or active low depending on setting of Bit 1 in GPIO Configuration Register 1.) When GPIO0 is configured as an output, setting this bit asserts GPIO0. (Asserted may be active high or active low depending on setting of Bit 1 in GPIO Configuration Register 1.) When GPIO1 is configured as an input, this bit is set when GPIO1 is asserted. (Asserted may be active high or active low depending on setting of Bit 3 in GPIO Configuration Register 1.) When GPIO1 is configured as an output, setting this bit asserts GPIO1. (Asserted may be active high or active low depending on setting of Bit 3 in GPIO Configuration Register 1.) When GPIO2 is configured as an input, this bit is set when GPIO2 is asserted. (Asserted may be active high or active low depending on setting of Bit 5 in GPIO Configuration Register 1.) When GPIO2 is configured as an output, setting this bit asserts GPIO2. (Asserted may be active high or active low depending on setting of Bit 5 in GPIO Configuration Register 1.) When GPIO3 is configured as an input, this bit is set when GPIO3 is asserted. (Asserted may be active high or active low depending on setting of Bit 7 in GPIO Configuration Register 1.) When GPIO3 is configured as an output, setting this bit asserts GPIO3. (Asserted may be active high or active low depending on setting of Bit 7 in GPIO Configuration Register 1.) When GPIO4 is configured as an input, this bit is set when GPIO4 is asserted. (Asserted may be active high or active low depending on setting of Bit 1 in GPIO Configuration Register 2.) When GPIO4 is configured as an output, setting this bit asserts GPIO4. (Asserted may be active high or active low depending on setting of Bit 1 in GPIO Configuration Register 2.) When GPIO5 is configured as an input, this bit is set when GPIO5 is asserted. (Asserted may be active high or active low depending on setting of Bit 3 in GPIO Configuration Register 2.) When GPIO5 is configured as an output, setting this bit asserts GPIO5. (Asserted may be active high or active low depending on setting of Bit 3 in GPIO Configuration Register 2.) When GPIO6 is configured as an input, this bit is set when GPIO6 is asserted. (Asserted may be active high or active low depending on setting of Bit 5 in GPIO Configuration Register 2.) When GPIO6 is configured as an output, setting this bit asserts GPIO6. (Asserted may be active high or active low depending on setting of Bit 5 in GPIO Configuration Register 2.) When GPIO7 is configured as an input, this bit is set when GPIO7 is asserted. (Asserted may be active high or active low depending on setting of Bit 7 in GPIO Configuration Register 2.) When GPIO7 is configured as an output, setting this bit asserts GPIO7. (Asserted may be active high or active low depending on setting of Bit 7 in GPIO Configuration Register 2.) 1. GPIO status bits can be written only when a GPIO pin is configured as output. Read-only otherwise. http://onsemi.com 46 ADM1026 Table 51. REGISTER 25H, STATUS REGISTER 6 (POWER-ON DEFAULT, 00H) Bit Name R/W (Note 1) 0 GPIO8 Status = 0 R R/W 1 GPIO9 Status = 0 R R/W 2 GPIO10 Status = 0 R R/W 3 GPIO11 Status = 0 R R/W 4 GPIO12 Status = 0 R R/W 5 GPIO13 Status = 0 R R/W 6 GPIO14 Status = 0 R R/W 7 GPIO15 Status = 0 R R/W Description When GPIO8 is configured as an input, this bit is set when GPIO8 is asserted. (Asserted may be active high or active low depending on setting of Bit 1 in GPIO Configuration Register 3.) When GPIO8 is configured as an output, setting this bit asserts GPIO8. (Asserted may be active high or active low depending on setting of Bit 1 in GPIO Configuration Register 3.) When GPIO9 is configured as an input, this bit is set when GPIO9 is asserted. (Asserted may be active high or active low depending on setting of Bit 3 in GPIO Configuration Register 3.) When GPIO9 is configured as an output, setting this bit asserts GPIO9. (Asserted may be active high or active low depending on setting of Bit 3 in GPIO Configuration Register 3.) When GPIO10 is configured as an input, this bit is set when GPIO10 is asserted. (Asserted may be active high or active low depending on setting of Bit 5 in GPIO Configuration Register 3.) When GPIO10 is configured as an output, setting this bit asserts GPIO10. (Asserted may be active high or active low depending on setting of Bit 5 in GPIO Configuration Register 3.) When GPIO11 is configured as an input, this bit is set when GPIO11 is asserted. (Asserted may be active high or active low depending on setting of Bit 7 in GPIO Configuration Register 3.) When GPIO11 is configured as an output, setting this bit asserts GPIO11. (Asserted may be active high or active low depending on setting of Bit 7 in GPIO Configuration Register 3.) When GPIO12 is configured as an input, this bit is set when GPIO12 is asserted. (Asserted may be active high or active low depending on setting of Bit 1 in GPIO Configuration Register 4.) When GPIO12 is configured as an output, setting this bit asserts GPIO12. (Asserted may be active high or active low depending on setting of Bit 1 in GPIO Configuration Register 4.) When GPIO13 is configured as an input , this bit is set when GPIO13 is asserted. (Asserted may be active high or active low depending on setting of Bit 3 in GPIO Configuration Register 4.) When GPIO13 is configured as an output, setting this bit asserts GPIO13. (Asserted may be active high or active low depending on setting of Bit 3 in GPIO Configuration Register 4.) When GPIO14 is configured as an input , this bit is set when GPIO14 is asserted. (Asserted may be active high or active low depending on setting of Bit 5 in GPIO Configuration Register 4.) When GPIO14 is configured as an output, setting this bit asserts GPIO14. (Asserted may be active high or active low depending on setting of Bit 5 in GPIO Configuration Register 4.) When GPIO15 is configured as an input, this bit is set when GPIO15 is asserted. (Asserted may be active high or active low depending on setting of Bit 7 in GPIO Configuration Register 4.) When GPIO15 is configured as an output, setting this bit asserts GPIO15. (Asserted may be active high or active low depending on setting of Bit 7 in GPIO Configuration Register 4.) 1. GPIO status bits can be written only when a GPIO pin is configured as output. Read-only otherwise. Table 52. REGISTER 26H, VBAT MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 VBAT Value R Description This register contains the measured value of the VBAT analog input channel. Table 53. REGISTER 27H, AIN8 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 AIN8 Value R Description This register contains the measured value of the AIN8 analog input channel. http://onsemi.com 47 ADM1026 Table 54. REGISTER 28H, EXT1 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 Ext1 Value R Description This register contains the measured value of the Ext1 Temp channel. Table 55. REGISTER 29H, EXT2/AIN9 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W Description 7–0 Ext2 Temp/ AIN9 Low Limit R This register contains the measured value of the Ext2 Temp/AIN9 channel depending on which bit is configured. Table 56. REGISTER 2AH, 3.3 V STBY MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 3.3 V STBY Value R Description This register contains the measured value of the 3.3 V STBY voltage. Table 57. REGISTER 2BH, 3.3 V MAIN MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 3.3 V MAIN Value R Description This register contains the measured value of the 3.3 V MAIN voltage. Table 58. REGISTER 2CH, +5.0 V MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 +5.0 V Value R Description This register contains the measured value of the +5.0 V analog input channel. Table 59. REGISTER 2DH, VCCP MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 VCCP Value R Description This register contains the measured value of the VCCP analog input channel. Table 60. REGISTER 2EH, +12 V MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 +12 V Value R Description This register contains the measured value of the +12 V analog input channel. Table 61. REGISTER 2FH, −12 V MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 –12 V Value R Description This register contains the measured value of the -12 V analog input channel. Table 62. REGISTER 30H, AIN0 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 AIN0 Value R Description This register contains the measured value of the AIN0 analog input channel. Table 63. REGISTER 31H, AIN1 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 AIN1 Value R Description This register contains the measured value of the AIN1 analog input channel. Table 64. REGISTER 32H, AIN2 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 AIN2 Value R Description This register contains the measured value of the AIN2 analog input channel. http://onsemi.com 48 ADM1026 Table 65. REGISTER 33H, AIN3 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 AIN3 Value R Description This register contains the measured value of the AIN3 analog input channel. Table 66. REGISTER 34H, AIN4 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 AIN4 Value R Description This register contains the measured value of the AIN4 analog input channel. Table 67. REGISTER 35H, AIN5 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 AIN5 Value R Description This register contains the measured value of the AIN5 analog input channel. Table 68. REGISTER 36H, AIN6 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 AIN6 Value R Description This register contains the measured value of the AIN6 analog input channel. Table 69. REGISTER 37H, AIN7 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 AIN7 Value R Description This register contains the measured value of the AIN7 analog input channel. Table 70. REGISTER 38H, FAN0 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 FAN0 Value R Description This register contains the measured value of the FAN0 tach input channel. Table 71. REGISTER 39H, FAN1 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 FAN1 Value R Description This register contains the measured value of the FAN1 tach input channel. Table 72. REGISTER 3AH, FAN2 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 FAN2 Value R Description This register contains the measured value of the FAN2 tach input channel. Table 73. REGISTER 3BH, FAN3 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 FAN3 Value R Description This register contains the measured value of the FAN3 tach input channel. Table 74. REGISTER 3CH, FAN4 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 FAN4 Value R Description This register contains the measured value of the FAN4 tach input channel. Table 75. REGISTER 3DH, FAN5 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 FAN5 Value R Description This register contains the measured value of the FAN5 tach input channel. http://onsemi.com 49 ADM1026 Table 76. REGISTER 3EH, FAN6 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 FAN6 Value R Description This register contains the measured value of the FAN6 tach input channel. Table 77. REGISTER 3FH, FAN7 MEASURED VALUE (POWER-ON DEFAULT, 00H) Bit Name R/W 7–0 FAN7 Value R Description This register contains the measured value of the FAN7 tach input channel. Table 78. REGISTER 40H, EXT1 HIGH LIMIT (POWER-ON DEFAULT 64H/1005C) Bit Name R/W 7–0 Ext1 High Limit R/W Description This register contains the high limit of the Ext1 Temp channel. Table 79. REGISTER 41H, EXT2/AIN9 HIGH LIMIT (POWER-ON DEFAULT 64H/1005C) Bit Name R/W 7–0 Ext2 Temp/ AIN9 High Limit R/W Description This register contains the high limit of the Ext2 Temp/AIN9 channel depending on which one is configured. Table 80. REGISTER 42H, 3.3 V STBY HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 3.3 V STBY High Limit R/W Description This register contains the high limit of the 3.3 V STBY analog input channel. Table 81. REGISTER 43H, 3.3 V MAIN HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 3.3 V MAIN High Limit R/W Description This register contains the high limit of the 3.3 V MAIN analog input channel. Table 82. REGISTER 44H, +5.0 V HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 +5.0 V High Limit R/W Description This register contains the high limit of the +5.0 V analog input channel. Table 83. REGISTER 45H, VCCP HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 VCCP High Limit R/W Description This register contains the high limit of the VCCP analog input channel. Table 84. REGISTER 46H, +12 V HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 +12 V High Limit R/W Description This register contains the high limit of the +12 V analog input channel. Table 85. REGISTER 47H, −12 V HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 −12 V High Limit R/W Description This register contains the high limit of the -12 V analog input channel. Table 86. REGISTER 48H, EXT1 LOW LIMIT (POWER-ON DEFAULT 80H) Bit Name R/W 7–0 Ext1 Low Limit R/W Description This register contains the low limit of the Ext1 Temp channel. http://onsemi.com 50 ADM1026 Table 87. REGISTER 49H, EXT/AIN9 LOW LIMIT (POWER-ON DEFAULT 80H) Bit Name R/W 7–0 Ext2 Temp /AIN9 Low Limit R/W Description This register contains the low limit of the Ext2 Temp/AIN9 channel depending on which bit is configured. Table 88. REGISTER 4AH, 3.3 V STBY LOW LIMIT (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 3.3 V STBY Low Limit R/W Description This register contains the low limit of the 3.3 V STBY analog input channel. Table 89. REGISTER 4BH, 3.3 V MAIN LOW LIMIT (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 3.3 V MAIN Low Limit R/W Description This register contains the low limit of the 3.3 V MAIN analog input channel. Table 90. REGISTER 4CH, +5.0 V LOW LIMIT (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 +5.0 V Low Limit R/W Description This register contains the low limit of the +5.0 V analog input channel. Table 91. REGISTER 4DH, VCCP LOW LIMIT (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 VCCP Low Limit R/W Description This register contains the low limit of the VCCP analog input channel. Table 92. REGISTER 4EH, +12 V LOW LIMIT (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 +12 V Low Limit R/W Description This register contains the low limit of the +12 V analog input channel. Table 93. REGISTER 4FH, −12 V LOW LIMIT (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 −12 V Low Limit R/W Description This register contains the low limit of the -12 V analog input channel. Table 94. REGISTER 50H, AIN0 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 AIN0 High Limit R/W Description This register contains the high limit of the AIN0 analog input channel. Table 95. REGISTER 51H, AIN1 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 AIN1 High Limit R/W Description This register contains the high limit of the AIN1 analog input channel. Table 96. REGISTER 52H, AIN2 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 AIN2 High Limit R/W Description This register contains the high limit of the AIN2 analog input channel. Table 97. REGISTER 53H, AIN3 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 AIN3 High Limit R/W Description This register contains the high limit of the AIN3 analog input channel. http://onsemi.com 51 ADM1026 Table 98. REGISTER 54H, AIN4 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 AIN4 High Limit R/W Description This register contains the high limit of the AIN4 analog input channel. Table 99. REGISTER 55H, AIN5 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 AIN5 High Limit R/W Description This register contains the high limit of the AIN5 analog input channel. Table 100. REGISTER 56H, AIN6 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 AIN6 High Limit R/W Description This register contains the high limit of the AIN6 analog input channel. Table 101. REGISTER 57H, AIN7 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 AIN7 High Limit R/W Description This register contains the high limit of the AIN7 analog input channel. Table 102. REGISTER 58H, AIN0 LOW LIMIT (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 AIN0 Low Limit R/W Description This register contains the low limit of the AIN0 analog input channel. Table 103. REGISTER 59H, AIN1 LOW LIMIT (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 AIN1 Low Limit R/W Description This register contains the low limit of the AIN1 analog input channel. Table 104. REGISTER 5AH, AIN2 LOW LIMIT (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 AIN2 Low Limit R/W Description This register contains the low limit of the AIN2 analog input channel. Table 105. REGISTER 5BH, AIN3 LOW LIMIT (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 AIN3 Low Limit R/W Description This register contains the low limit of the AIN3 analog input channel. Table 106. REGISTER 5CH, AIN4 LOW LIMIT (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 AIN4 Low Limit R/W Description This register contains the low limit of the AIN4 analog input channel. Table 107. REGISTER 5DH, AIN5 LOW LIMIT (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 AIN5 Low Limit R/W Description This register contains the low limit of the AIN5 analog input channel. Table 108. REGISTER 5EH, AIN6 LOW LIMIT (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 AIN6 Low Limit R/W Description This register contains the low limit of the AIN6 analog input channel. http://onsemi.com 52 ADM1026 Table 109. REGISTER 5FH, AIN7 LOW LIMIT (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 AIN7 Low Limit R/W Description This register contains the low limit of the AIN7 analog input channel. Table 110. REGISTER 60H, FAN0 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 FAN0 High Limit R/W Description This register contains the high limit of the FAN0 tach channel. Table 111. REGISTER 61H, FAN1 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 FAN1 High Limit R/W Description This register contains the high limit of the FAN1 tach channel. Table 112. REGISTER 62H, FAN2 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 FAN2 High Limit R/W Description This register contains the high limit of the FAN2 tach channel. Table 113. REGISTER 63H, FAN3 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 FAN3 High Limit R/W Description This register contains the high limit of the FAN3 tach channel. Table 114. REGISTER 64H, FAN4 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 FAN4 High Limit R/W Description This register contains the high limit of the FAN4 tach channel. Table 115. REGISTER 65H, FAN5 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 FAN5 High Limit R/W Description This register contains the high limit of the FAN5 tach channel. Table 116. REGISTER 66H, FAN6 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 FAN6 High Limit R/W Description This register contains the high limit of the FAN6 tach channel. Table 117. REGISTER 67H, FAN7 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 FAN7 High Limit R/W Description This register contains the high limit of the FAN7 tach channel. Table 118. REGISTER 68H, INT TEMP HIGH LIMIT (POWER-ON DEFAULT, 50H 805C) Bit Name R/W 7–0 Int Temp High Limit R/W Description This register contains the high limit of the internal temperature channel. Table 119. REGISTER 69H, INT TEMP HIGH LIMIT (POWER-ON DEFAULT 80H) Bit Name R/W 7–0 Int Temp Low Limit R/W Description This register contains the low limit of the internal temperature channel. http://onsemi.com 53 ADM1026 Table 120. REGISTER 6AH, VBAT HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 VBAT High Limit R/W Description This register contains the high limit of the VBAT analog input channel. Table 121. REGISTER 6BH, VBAT LOW LIMIT (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 VBAT Low Limit R/W Description This register contains the low limit of the VBAT analog input channel. Table 122. REGISTER 6CH, AIN8 HIGH LIMIT (POWER-ON DEFAULT FFH) Bit Name R/W 7–0 AIN8 High Limit R/W Description This register contains the high limit of the AIN8 analog input channel. Table 123. REGISTER 6DH, AIN8 LOW LIMIT (POWER-ON DEFAULT 00H) Bit Name R/W 7–0 AIN8 Low Limit R/W Description This register contains the low limit of the AIN8 analog input channel. Table 124. REGISTER 6EH, EXT1 TEMP OFFSET (POWER-ON DEFAULT 00H) Bit Name R/W Description 7–0 Ext1 Temp Offset R/W This register contains the offset value for the external 1 temperature channel. A twos complement number can be written to this register, which is then added to the measured result before it is stored or compared to limits. In this way, a sort of one-point calibration can be done whereby the whole transfer function of the channel can be moved up or down. From a software point of view, this may be a very simple method to vary the characteristics of the measurement channel if the thermal characteristics change for any reason (for instance from one chassis to another), if the measurement point is moved, if a plug-in card is inserted or removed, and so on. Table 125. REGISTER 6FH, EXT2 TEMP OFFSET (POWER-ON DEFAULT 00H) Bit Name R/W Description 7–0 Ext2 Temp Offset R/W This register contains the offset value for the external 2 temperature channel. A twos complement number can be written to this register, which is then added to the measured result before it is stored or compared to limits. In this way, a sort of one-point calibration can be done whereby the whole transfer function of the channel can be moved up or down. From a software point of view, this may be a very simple method to vary the characteristics of the measurement channel if the thermal characteristics change for any reason (for instance from one chassis to another), if the measurement point is moved, if a plug-in card is inserted or removed, and so on. Table 126. ORDERING INFORMATION Device Order Number Temperature Range Package Type Package Option Shipping† ADM1026JSTZ−REEL 0C to +100C 48−Lead LQFP (Pb−Free) ST−48 2,000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *The “Z’’ suffix indicates Pb−Free part. http://onsemi.com 54 ADM1026 PACKAGE DIMENSIONS 48 LEAD LQFP, 7x7, 0.5P CASE 932AA−01 ISSUE A 4X 0.2 Y T-U Z D PIN 1 CORNER D/2 Z 48 e/2 DETAIL K 37 1 36 T U G E G E1 E/2 E1/2 12 T, U, Z 25 DETAIL K NOTE 9 13 24 D1/2 D1 4X BASE METAL 0.2 H T-U Z 0.08 Y e/2 44 X 48 X e ÇÇÇÇ ÉÉÉ ÇÇÇÇ ÉÉÉ ÇÇÇÇ ÉÉÉ PLATING DETAIL F H Y NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DATUM PLANE H IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS T, U, AND Z TO BE DETERMINED AT DATUM PLANE H. 5. DIMENSIONS D AND E TO BE DETERMINED AT SEATING PLANE Y. 6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 PER SIDE. DIMENSIONS D1 AND E1 DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE H. 7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE b DIMENSION TO EXCEED 0.350. 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076. 9. EXACT SHAPE OF EACH CORNER IS OPTIONAL. c1 c b1 b b SEATING PLANE 0.08 M Y T-U Z SECTION G−G q1 DIM A A1 A2 b b1 c c1 D D1 e E E1 L L1 R S q q1 MILLIMETERS MIN MAX 1.4 1.6 0.05 0.15 1.35 1.45 0.17 0.27 0.17 0.23 0.09 0.20 0.09 0.16 9.0 BSC 7.0 BSC 0.5 BSC 9.0 BSC 7.0 BSC 0.5 0.7 1.0 REF 0.15 0.25 0.2 REF 1_ 5_ 12 REF TOP & BOTTOM R A A2 A1 (S) DETAIL F L (L1) 0.250 q GAUGE PLANE ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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