ESD5B5.0S, SZESD5B5.0S Transient Voltage Suppressor Micro−Packaged Diode for ESD Protection The ESD5B Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size and bi−directional design, it is ideal for use in cellular phones, MP3 players, and portable applications that require audio line protection. www.onsemi.com Specification Features • Low Capacitance 32 pF Low Clamping Voltage Small Body Outline Dimensions: nom 0.063″ x 0.032″ (1.6x0.8 mm) Low Body Height: nom 0.024″ (0.6 mm) Reverse Working (Stand−off) Voltage: 5.0 V Peak Power up to 50 W @ 8 x 20 ms Pulse Low Leakage Response Time is Typically < 1 ns ESD Rating of Class 3 (> 16 kV) per Human Body Model IEC61000−4−2 Level 4 ESD Protection SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable This is a Pb−Free Device 2 1 SOD−523 CASE 502 MARKING DIAGRAM 1 B5 M G Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic B5 G M • • • • • • • • • • • G 2 = Specific Device Code Date Code = Pb−Free Package (Note: Microdot may be in either location) Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any *Date Code orientation and/or position may vary depending upon manufacturing location. QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements ORDERING INFORMATION Package Shipping† ESD5B5.0ST1G SOD−523 (Pb−Free) 3000 / Tape & Reel ESD5B5.0ST5G SOD−523 (Pb−Free) 8000 / Tape & Reel SZESD5B5.0ST1G SOD−523 (Pb−Free) 3000 / Tape & Reel MAXIMUM RATINGS Device Rating Value Unit Contact Air ±30 ±30 kV Per Human Body Model Per Machine Model 16 400 kV V IEC 61000−4−2 (ESD) ESD Voltage Symbol Peak Power (Figure 1) Per 8 x 20 ms Waveform Peak Power (Figure 2)Per 10 x 1000 ms Waveform PPK 50 10 W Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C °PD° 200 mW TJ, Tstg −55 to +150 °C TL 260 °C Junction and Storage Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−5 = 1.0 x 0.75 x 0.62 in. See Application Note AND8308/D for further description of survivability specs. © Semiconductor Components Industries, LLC, 2015 November, 2015 − Rev. 5 1 Publication Order Number: ESD5B5.0ST1/D ESD5B5.0S, SZESD5B5.0S ELECTRICAL CHARACTERISTICS I (TA = 25°C unless otherwise noted) Symbol IPP Parameter IPP Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR VBR IT IT VC VBR VRWM IR IR VRWM VBR VC IT Working Peak Reverse Voltage V Reverse Leakage Current @ VRWM Breakdown Voltage @ IT IPP Test Current Bi−Directional TVS *See Application Note AND8308/D for detailed explanations of datasheet parameters. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) VRWM (V) IR (mA) @ VRWM VBR (V) @ IT (Note 2) Device* Max Max Min ESD5B5.0ST1G/T5G, SZESD5B5.0ST1G 5.0 1.0 5.8 IT C (pF) @ VR = 0 V, f = 1 MHz VC Max mA Typ Per IEC61000−4−2 (Note 3) 7.8 1.0 32 Figures 1 and 2 See Below *Other voltages available upon request. 2. VBR is measured with a pulse test current IT at an ambient temperature of 25°C. 3. For test procedure see Figures 3 and 4 and Application Note AND8307/D. Figure 1. ESD Clamping Voltage Screenshot Positive 8 kV Contact per IEC 61000−4−2 Figure 2. ESD Clamping Voltage Screenshot Negative 8 kV Contact per IEC 61000−4−2 www.onsemi.com 2 ESD5B5.0S, SZESD5B5.0S IEC61000−4−2 Waveform IEC 61000−4−2 Spec. Ipeak Level Test Voltage (kV) First Peak Current (A) Current at 30 ns (A) Current at 60 ns (A) 1 2 7.5 4 2 2 4 15 8 4 3 6 22.5 12 6 4 8 30 16 8 100% 90% I @ 30 ns I @ 60 ns 10% tP = 0.7 ns to 1 ns Figure 3. IEC61000−4−2 Spec ESD Gun Oscilloscope TVS 50 W Cable 50 W Figure 4. Diagram of ESD Test Setup The following is taken from Application Note AND8308/D − Interpretation of Datasheet Parameters for ESD Devices. systems such as cell phones or laptop computers it is not clearly defined in the spec how to specify a clamping voltage at the device level. ON Semiconductor has developed a way to examine the entire voltage waveform across the ESD protection diode over the time domain of an ESD pulse in the form of an oscilloscope screenshot, which can be found on the datasheets for all ESD protection diodes. For more information on how ON Semiconductor creates these screenshots and how to interpret them please refer to AND8307/D. ESD Voltage Clamping For sensitive circuit elements it is important to limit the voltage that an IC will be exposed to during an ESD event to as low a voltage as possible. The ESD clamping voltage is the voltage drop across the ESD protection diode during an ESD event per the IEC61000−4−2 waveform. Since the IEC61000−4−2 was written as a pass/fail spec for larger www.onsemi.com 3 ESD5B5.0S, SZESD5B5.0S PACKAGE DIMENSIONS SOD−523 CASE 502 ISSUE E −X− D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. −Y− E 2X b 0.08 1 M 2 X Y DIM A b c D E HE L L2 TOP VIEW A c MILLIMETERS MIN NOM MAX 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 1.10 1.20 1.30 0.70 0.80 0.90 1.50 1.60 1.70 0.30 REF 0.15 0.20 0.25 RECOMMENDED SOLDERING FOOTPRINT* HE SIDE VIEW 2X 1.80 0.48 2X 0.40 PACKAGE OUTLINE 2X L2 BOTTOM VIEW 2X L DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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