NCP161 D

NCP161
450 mA, Ultra-Low Noise
and High PSRR LDO
Regulator for RF and
Analog Circuits
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The NCP161 is a linear regulator capable of supplying 450 mA
output current. Designed to meet the requirements of RF and analog
circuits, the NCP161 device provides low noise, high PSRR, low
quiescent current, and very good load/line transients. The device is
designed to work with a 1 mF input and a 1 mF output ceramic capacitor.
It is available in two thickness ultra−small 0.35P, 0.65 mm x 0.65 mm
Chip Scale Package (CSP) and XDFN−4 0.65P, 1 mm x 1 mm.
MARKING
DIAGRAMS
X
WLCSP4
CASE 567KA
A1
WLCSP4
CASE 567JZ
A1
Features
•
•
•
•
•
•
•
•
•
•
•
Operating Input Voltage Range: 1.9 V to 5.5 V
Available in Fixed Voltage Option: 1.8 V to 5.14 V
±2% Accuracy Over Load/Temperature
Ultra Low Quiescent Current Typ. 18 mA
Standby Current: Typ. 0.1 mA
Very Low Dropout: 150 mV at 450 mA
Ultra High PSRR: Typ. 98 dB at 20 mA, f = 1 kHz
Ultra Low Noise: 10 mVRMS
Stable with a 1 mF Small Case Size Ceramic Capacitors
Available in −WLCSP4 0.65 mm x 0.65 mm x 0.4 mm CASE 567KA
−WLCSP4 0.65 mm x 0.65 mm x 0.33 mm CASE 567JZ
−XDFN4 1 mm x 1 mm x 0.4 mm
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
1
XDFN4
CASE 711AJ
XX M
1
X or XX = Specific Device Code
M
= Date Code
PIN CONNECTIONS
IN
Typical Applications
•
•
•
•
X
Battery−powered Equipment
Wireless LAN Devices
Smartphones, Tablets
Cameras, DVRs, STB and Camcorders
OUT
A1
A2
B1
B2
EN
GND
(Top View)
VOUT
VIN
IN
OUT
NCP161
CIN
1 mF
Ceramic
EN
COUT
1 mF
Ceramic
ON
OFF
GND
(Top View)
Figure 1. Typical Application Schematics
ORDERING INFORMATION
See detailed ordering and shipping information on page 15 of
this data sheet.
© Semiconductor Components Industries, LLC, 2016
June, 2016 − Rev. 6
1
Publication Order Number:
NCP161/D
NCP161
IN
EN
ENABLE
THERMAL
LOGIC
SHUTDOWN
BANDGAP
MOSFET
REFERENCE
INTEGRATED
DRIVER WITH
SOFT−START
CURRENT LIMIT
OUT
* ACTIVE DISCHARGE
Version A only
EN
GND
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
CSP4
Pin No.
XDFN4
Pin
Name
A1
4
IN
A2
2
OUT
B1
3
EN
B2
2
GND
Common ground connection
−
EPAD
EPAD
Expose pad should be tied to ground plane for better power dissipation
Description
Input voltage supply pin
Regulated output voltage. The output should be bypassed with small 1 mF ceramic capacitor.
Chip enable: Applying VEN < 0.4 V disables the regulator, Pulling VEN > 1.2 V enables the LDO.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN
−0.3 V to 6
V
Output Voltage
VOUT
−0.3 to VIN + 0.3, max. 6 V
V
Chip Enable Input
VCE
−0.3 to VIN + 0.3, max. 6 V
V
Output Short Circuit Duration
tSC
unlimited
s
Maximum Junction Temperature
TJ
150
°C
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Input Voltage (Note 1)
Storage Temperature
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating
Symbol
Thermal Characteristics, CSP4 (Note 3)
Thermal Resistance, Junction−to−Air
Value
Unit
108
°C/W
RqJA
Thermal Characteristics, XDFN4 (Note 3)
Thermal Resistance, Junction−to−Air
198.1
3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7
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2
NCP161
ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 1 V; IOUT = 1 mA, CIN = COUT = 1 mF, unless otherwise
noted. VEN = 1.2 V. Typical values are at TJ = +25°C (Note 4).
Parameter
Test Conditions
Symbol
Min
VIN
VIN = VOUT(NOM) + 1 V
0 mA ≤ IOUT ≤ 450 mA
VOUT
Line Regulation
VOUT(NOM) + 1 V ≤ VIN ≤ 5.5 V
LineReg
0.02
%/V
Load Regulation
IOUT = 1 mA to 450 mA
LoadReg
0.001
%/mA
Operating Input Voltage
Output Voltage Accuracy
Dropout Voltage (Note 5)
IOUT = 450 mA
Typ
Max
Unit
1.9
5.5
V
−2
+2
%
VOUT(NOM) = 1.8 V
300
450
VOUT(NOM) = 2.5 V
190
315
VOUT(NOM) = 2.8 V
175
290
VOUT(NOM) = 2.85 V
170
290
165
275
150
260
VOUT(NOM) = 3.5 V
150
255
VOUT(NOM) = 4.5 V
120
210
VOUT(NOM) = 5.0 V
105
190
VOUT(NOM) = 5.14 V
105
185
VOUT(NOM) = 3.0 V
VOUT(NOM) = 3.3 V
VDO
Output Current Limit
VOUT = 90% VOUT(NOM)
ICL
Short Circuit Current
VOUT = 0 V
ISC
690
Quiescent Current
IOUT = 0 mA
IQ
18
23
mA
Shutdown Current
VEN ≤ 0.4 V, VIN = 4.8 V
IDIS
0.01
1
mA
EN Input Voltage “H”
VENH
EN Input Voltage “L”
VENL
VEN = 4.8 V
IEN
EN Pin Threshold Voltage
EN Pull Down Current
Turn−On Time
Power Supply Rejection Ratio
Output Voltage Noise
Thermal Shutdown Threshold
Active output discharge resistance
Line transient (Note 6)
IOUT = 20 mA
700
mA
1.2
0.4
0.2
COUT = 1 mF, From assertion of VEN to
VOUT = 95% VOUT(NOM)
0.5
V
mA
120
ms
dB
f = 100 Hz
f = 1 kHz
f = 10 kHz
f = 100 kHz
PSRR
91
98
82
48
IOUT = 1 mA
IOUT = 250 mA
VN
14
10
mVRMS
Temperature rising
TSDH
160
°C
Temperature falling
TSDL
140
°C
VEN < 0.4 V, Version A only
RDIS
280
W
f = 10 Hz to 100 kHz
VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) +
1.6 V) in 30 ms, IOUT = 1 mA
VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) +
1 V) in 30 ms, IOUT = 1 mA
Load transient (Note 6)
450
mV
IOUT = 1 mA to 450 mA in 10 ms
IOUT = 450 mA to 1mA in 10 ms
−1
TranLINE
mV
+1
−40
TranLOAD
+40
mV
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TA = 25°C.
Low duty cycle pulse techniques are used during the testing to maintain the junction temperature as close to ambient as possible.
5. Dropout voltage is characterized when VOUT falls 100 mV below VOUT(NOM).
6. Guaranteed by design.
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NCP161
TYPICAL CHARACTERISTICS
2.520
1.820
1.815
VOUT, OUTPUT VOLTAGE (V)
VOUT, OUTPUT VOLTAGE (V)
IOUT = 10 mA
1.810
1.805
IOUT = 450 mA
1.800
1.795
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
1.790
1.785
0
20
40
60
80
100
120
2.505
IOUT = 450 mA
2.500
2.495
VIN = 3.5 V
VOUT = 2.5 V
CIN = 1 mF
COUT = 1 mF
2.490
2.485
2.480
−40 −20
140
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 3. Output Voltage vs. Temperature −
VOUT = 1.8 V − XDFN Package
Figure 4. Output Voltage vs. Temperature −
VOUT = 2.5 V − XDFN Package
3.33
3.35
3.32
3.34
3.31
IOUT = 10 mA
3.30
3.29
IOUT = 450 mA
3.28
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
3.27
3.26
3.25
−40 −20
0
20
40
60
80
100
120
3.33
IOUT = 10 mA and 450 mA
3.32
3.31
3.30
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
3.29
3.28
3.27
−40 −20
140
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 5. Output Voltage vs. Temperature −
VOUT = 3.3 V − XDFN Package
Figure 6. Output Voltage vs. Temperature −
VOUT = 3.3 V − CSP Package
0.010
REGLINE, LINE REGULATION (%/V)
5.19
VOUT, OUTPUT VOLTAGE (V)
IOUT = 10 mA
2.510
VOUT, OUTPUT VOLTAGE (V)
VOUT, OUTPUT VOLTAGE (V)
1.780
−40 −20
2.515
5.18
5.17
IOUT = 10 mA
5.16
5.15
IOUT = 450 mA
5.14
VIN = 5.5 V
VOUT = 5.14 V
CIN = 1 mF
COUT = 1 mF
5.13
5.12
5.11
−40 −20
0
20
40
60
80
100
120
140
0.009
0.008
0.007
0.006
0.005
0.004
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
0.003
0.002
0.001
0
−40 −20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 7. Output Voltage vs. Temperature −
VOUT = 5.14 V − XDFN Package
Figure 8. Line Regulation vs. Temperature −
VOUT = 1.8 V
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NCP161
TYPICAL CHARACTERISTICS
REGLINE, LINE REGULATION (%/V)
0.020
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
0.009
0.008
0.007
0.006
0.005
0.004
0.003
0.002
0.001
0
−40 −20
0
20
40
60
80
100
120
140
VIN = 5.5 V
VOUT = 5.14 V
CIN = 1 mF
COUT = 1 mF
0.018
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
−40 −20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 9. Line Regulation vs. Temperature −
VOUT = 3.3 V
Figure 10. Line Regulation vs. Temperature −
VOUT = 5.14 V
0.0020
REGLOAD, LOAD REGULATION (%/mA)
REGLOAD, LOAD REGULATION (%/mA)
REGLINE, LINE REGULATION (%/V)
0.010
0.0018
0.0016
0.0014
0.0012
0.0010
0.0008
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
0.0006
0.0004
0.0002
0
−40 −20
0
20
40
60
80
100
0.0020
0.0018
0.0016
0.0014
0.0012
0.0010
0.0008
0.0006
0.0002
0
140
−40 −20
120
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
0.0004
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 11. Load Regulation vs. Temperature −
VOUT = 1.8 V
Figure 12. Load Regulation vs. Temperature −
VOUT = 3.3 V
2.0
REGLOAD, LOAD REGULATION (%/mA)
0.0020
IGND, GROUND CURRENT (mA)
0.0018
0.0016
0.0014
0.0012
0.0010
0.0008
0.0006
0.0004
0.0002
0
−40 −20
VIN = 5.5 V, COUT = 1 mF
VOUT = 5.14 V, CIN = 1 mF
0
20
40
60
80
100
120
140
1.8
TJ = 125°C
1.6
1.4
TJ = 25°C
1.2
1.0
0.8
TJ = −40°C
0.6
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
0.4
0.2
0
0
50
100 150 200 250 300 350 400 450 500
TJ, JUNCTION TEMPERATURE (°C)
IOUT, OUTPUT CURRENT (mA)
Figure 13. Load Regulation vs. Temperature −
VOUT = 5.14 V
Figure 14. Ground Current vs. Load Current −
VOUT = 1.8 V
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NCP161
2.0
2.50
1.8
2.25
IGND, GROUND CURRENT (mA)
IGND, GROUND CURRENT (mA)
TYPICAL CHARACTERISTICS
TJ = 125°C
1.6
1.4
TJ = 25°C
1.2
1.0
0.8
TJ = −40°C
0.6
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
0.4
0.2
0
0
50
100 150 200 250 300 350 400
TJ = 25°C
1.50
1.25
1.00
TJ = −40°C
0.75
VIN = 5.5 V
VOUT = 5.14 V
CIN = 1 mF
COUT = 1 mF
0.50
0.25
0
0
50
100 150 200 250 300 350 400 450 500
IOUT, OUTPUT CURRENT (mA)
IOUT, OUTPUT CURRENT (mA)
Figure 15. Ground Current vs. Load Current −
VOUT = 3.3 V
Figure 16. Ground Current vs. Load Current −
VOUT = 5.14 V
225
360
VDROP, DROPOUT VOLTAGE (V)
VDROP, DROPOUT VOLTAGE (V)
1.75
450 500
400
TJ = 125°C
320
280
TJ = 25°C
240
200
TJ = −40°C
160
120
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
80
40
0
0
50
100 150 200 250 300 350 400
200
TJ = 125°C
175
TJ = 25°C
150
125
100
TJ = −40°C
75
50
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
25
0
0
450 500
50
100 150 200 250 300 350 400 450 500
IOUT, OUTPUT CURRENT (mA)
IOUT, OUTPUT CURRENT (mA)
Figure 17. Dropout Voltage vs. Load Current −
VOUT = 1.8 V
Figure 18. Dropout Voltage vs. Load Current −
VOUT = 3.3 V
150
400
TJ = 125°C
135
120
VDROP, DROPOUT VOLTAGE (mV)
VDROP, DROPOUT VOLTAGE (V)
TJ = 125°C
2.00
TJ = 25°C
105
90
75
TJ = −40°C
60
45
VOUT = 5.14 V
CIN = 1 mF
COUT = 1 mF
30
15
0
0
50
100 150 200 250 300 350 400
450 500
360
320
IOUT = 450 mA
280
240
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
200
160
120
80
40
0
−40 −20
IOUT = 0 mA
0
20
40
60
80
100
120 140
IOUT, OUTPUT CURRENT (mA)
TJ, JUNCTION TEMPERATURE (°C)
Figure 19. Dropout Voltage vs. Load Current −
VOUT = 5.14 V
Figure 20. Dropout Voltage vs. Temperature−
VOUT = 1.8 V
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NCP161
TYPICAL CHARACTERISTICS
150
VDROP, DROPOUT VOLTAGE (mV)
VDROP, DROPOUT VOLTAGE (mV)
250
225
IOUT = 450 mA
200
175
150
125
100
75
IOUT = 0 mA
50
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
25
0
−40 −20
0
20
40
60
80
100
120
140
IOUT = 450 mA
105
90
IOUT = 0 mA
75
60
45
VOUT = 5.14 V
CIN = 1 mF
COUT = 1 mF
30
15
0
−40 −20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
Figure 21. Dropout Voltage vs. Temperature−
VOUT = 3.3 V
Figure 22. Dropout Voltage vs. Temperature−
VOUT = 5.14 V
ICL, SHORT CIRCUIT CURRENT (mA)
740
730
720
710
700
690
680
VIN = 4.3 V
VOUT = 90% VOUT(nom)
CIN = 1 mF
COUT = 1 mF
670
660
650
−40 −20
0
20
40
60
80
100
120
140
700
690
680
670
660
650
640
VIN = 4.3 V
VOUT = 0 V (Short)
CIN = 1 mF
COUT = 1 mF
630
620
610
600
−40 −20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 23. Current Limit vs. Temperature
Figure 24. Short Circuit Current vs.
Temperature
1.0
0.50
0.9
IEN, ENABLE PIN CURRENT (mA)
ICL, CURRENT LIMIT (mA)
120
TJ, JUNCTION TEMPERATURE (°C)
750
VEN, ENABLE VOLTAGE THRESHOLD (V)
135
0.8
OFF −> ON
0.7
0.6
ON −> OFF
0.5
0.4
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
0.3
0.2
0.1
0
−40 −20
0
20
40
60
80
100
120
140
0.45
0.40
0.35
0.30
0.25
0.20
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
0.15
0.10
0.05
0
−40 −20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 25. Enable Threshold Voltage vs.
Temperature
Figure 26. Enable Current Temperature
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NCP161
TYPICAL CHARACTERISTICS
90
80
70
300
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
RDIS, DISCHARGE RESISTIVITY
IDIS, DISABLE CURRENT (nA)
100
60
50
40
30
20
10
0
−40 −20
0
20
40
60
80
100
120 140
290
280
270
260
250
240
230
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
220
210
200
−40 −20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 27. Disable Current vs. Temperature
Figure 28. Discharge Resistivity vs.
Temperature
OUTPUT VOLTAGE NOISE (nV/√Hz)
10,000
IOUT = 450 mA
IOUT = 250 mA
1000
IOUT = 10 mA
RMS Output Noise (mV)
IOUT = 1 mA
100
10
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
IOUT
10 Hz − 100 kHz
100 Hz − 100 kHz
1 mA
14.62
14.10
10 mA
11.12
10.48
250 mA
10.37
9.82
450 mA
10.22
9.62
1
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
Figure 29. Output Voltage Noise Spectral Density − VOUT = 1.8 V
OUTPUT VOLTAGE NOISE (nV/√Hz)
10,000
IOUT = 250 mA
IOUT = 450 mA
1000
IOUT = 10 mA
RMS Output Noise (mV)
IOUT = 1 mA
100
10
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
IOUT
10 Hz − 100 kHz
100 Hz − 100 kHz
1 mA
16.9
15.79
10 mA
12.64
11.13
250 mA
11.96
10.64
450 mA
11.50
10.40
1
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
Figure 30. Output Voltage Noise Spectral Density − VOUT = 3.3 V
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NCP161
TYPICAL CHARACTERISTICS
120
120
IOUT = 10 mA
VIN = 2.5 V
VOUT = 1.8 V
COUT = 1 mF
100
RR, RIPPLE REJECTION (dB)
80
60
IOUT = 20 mA
IOUT = 100 mA
40
IOUT = 250 mA
20
0
IOUT = 450 mA
0.01
0.1
10
100
1k
IOUT = 450 mA
0.1
1
10
100
1k
Figure 31. Power Supply Rejection Ratio,
VOUT = 1.8 V
Figure 32. Power Supply Rejection Ratio,
VOUT = 3.3 V
10k
100
IOUT = 20 mA
VIN = 5.5 V
VOUT = 5.14 V
COUT = 1 mF
Unstable Operation
10
60
50
ESR (W)
RR, RIPPLE REJECTION (dB)
IOUT = 250 mA
20
FREQUENCY (kHz)
IOUT = 10 mA
40
IOUT = 100 mA
30
1
Stable Operation
IOUT = 250 mA
20
IOUT = 450 mA
0.1
0.01
0.1
1
10
100
1k
10k
0
50
100 150 200
250 300 350 400 450 500
IOUT, OUTPUT CURRENT (mA)
Figure 33. Power Supply Rejection Ratio,
VOUT = 5.14 V
Figure 34. Stability vs. ESR
VEN
1 V/div
IINPUT
VOUT
500 mV/div
FREQUENCY (kHz)
200 mA/div
500 mV/div
IOUT = 100 mA
0.01
0
1 V/div
IOUT = 20 mA
40
FREQUENCY (kHz)
70
10
60
10k
90
80
80
0
1
VIN = 3.6 V
VOUT = 3.3 V
COUT = 1 mF
100
VIN = 2.8 V, VOUT = 1.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
200 mA/div
RR, RIPPLE REJECTION (dB)
IOUT = 10 mA
VEN
IINPUT
VOUT
VIN = 2.8 V, VOUT = 1.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
100 ms/div
100 ms/div
Figure 35. Enable Turn−on Response −
COUT = 1 mF, IOUT = 10 mA
Figure 36. Enable Turn−on Response −
COUT = 1 mF, IOUT = 250 mA
www.onsemi.com
9
NCP161
TYPICAL CHARACTERISTICS
500 mV/div
10 mV/div
2.3 V
VIN
VOUT
VOUT = 1.8 V, IOUT = 10 mA
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
3.8 V
VIN
VOUT
VOUT = 3.3 V, IOUT = 10 mA
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
20 ms/div
20 ms/div
Figure 37. Line Transient Response −
VOUT = 1.8 V
Figure 38. Line Transient Response −
VOUT = 3.3 V
5.5 V
VIN
VIN
5.3 V
VOUT
1 V/div
VOUT
VOUT = 5.14 V, IOUT = 10 mA
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
VOUT = 2.8 V, CIN = 1 mF (MLCC)
IOUT = 10 mA, COUT = 1 mF (MLCC)
4 ms/div
Figure 40. Turn−on/off − Slow Rising VIN
IOUT
200 mA/div
20 ms/div
Figure 39. Line Transient Response −
VOUT = 5.14 V
tRISE = 1 ms
100 mV/div
100 mV/div
200 mA/div
10 mV/div
200 mV/div
10 mV/div
500 mV/div
4.8 V
3.3 V
VOUT
VIN = 2.8 V, VOUT = 1.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
IOUT
tFALL = 1 ms
VOUT
VIN = 2.8 V, VOUT = 1.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
4 ms/div
20 ms/div
Figure 41. Load Transient Response −
1 mA to 450 mA − VOUT = 1.8 V
Figure 42. Load Transient Response −
450 mA to 1 mA − VOUT = 1.8 V
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10
NCP161
TYPICAL CHARACTERISTICS
200 mA/div
IOUT
tRISE = 1 ms
100 mV/div
100 mV/div
200 mA/div
IOUT
VOUT
VIN = 4.3 V, VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
tFALL = 1 ms
VOUT
VIN = 4.3 V, VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
4 ms/div
20 ms/div
Figure 43. Load Transient Response −
1 mA to 450 mA − VOUT = 3.3 V
Figure 44. Load Transient Response −
450 mA to 1 mA − VOUT = 3.3 V
VOUT
VIN = 5.5 V, VOUT = 5.14 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
VOUT
VIN = 5.5 V, VOUT = 5.14 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
20 ms/div
Figure 45. Load Transient Response −
1 mA to 450 mA − VOUT = 5.14 V
Figure 46. Load Transient Response −
450 mA to 1 mA − VOUT = 5.14 V
TSD Cycling
500 mV/div
500 mA/div
tFALL = 1 ms
4 ms/div
Short Circuit Event
Overheating
1 V/div
200 mA/div
tRISE = 1 ms
100 mV/div
IOUT
VEN
IOUT
VOUT
Thermal Shutdown
VOUT
VIN = 5.5 V
VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
COUT = 4.7 mF
1 V/div
100 mV/div
200 mA/div
IOUT
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF
10 ms/div
400 ms/div
Figure 47. Short Circuit and Thermal
Shutdown
Figure 48. Enable Turn−off
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11
NCP161
APPLICATIONS INFORMATION
General
transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
The NCP161 is an ultra−low noise 450 mA low dropout
regulator designed to meet the requirements of RF
applications and high performance analog circuits. The
NCP161 device provides very high PSRR and excellent
dynamic response. In connection with low quiescent current
this device is well suitable for battery powered application
such as cell phones, tablets and other. The NCP161 is fully
protected in case of current overload, output short circuit and
overheating.
Enable Operation
Input capacitor connected as close as possible is necessary
for ensure device stability. The X7R or X5R capacitor
should be used for reliable performance over temperature
range. The value of the input capacitor should be 1 mF or
greater to ensure the best dynamic performance. This
capacitor will provide a low impedance path for unwanted
AC signals or noise modulated onto constant input voltage.
There is no requirement for the ESR of the input capacitor
but it is recommended to use ceramic capacitors for their low
ESR and ESL. A good input capacitor will limit the
influence of input trace inductance and source resistance
during sudden load current changes.
The NCP161 uses the EN pin to enable/disable its device
and to deactivate/activate the active discharge function.
If the EN pin voltage is <0.4 V the device is guaranteed to
be disabled. The pass transistor is turned−off so that there is
virtually no current flow between the IN and OUT. The
active discharge transistor is active so that the output voltage
VOUT is pulled to GND through a 280 Ω resistor. In the
disable state the device consumes as low as typ. 10 nA from
the VIN.
If the EN pin voltage >1.2 V the device is guaranteed to
be enabled. The NCP161 regulates the output voltage and
the active discharge transistor is turned−off.
The EN pin has internal pull−down current source with
typ. value of 200 nA which assures that the device is
turned−off when the EN pin is not connected. In the case
where the EN function isn’t required the EN should be tied
directly to IN.
Output Decoupling (COUT)
Output Current Limit
The NCP161 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
recommended capacitor value is 1 mF and X7R or X5R
dielectric due to its low capacitance variations over the
specified temperature range. The NCP161 is designed to
remain stable with minimum effective capacitance of 0.7 mF
to account for changes with temperature, DC bias and
package size. Especially for small package size capacitors
such as 0201 the effective capacitance drops rapidly with the
applied DC bias. Please refer Figure 49.
Output Current is internally limited within the IC to a
typical 700 mA. The NCP161 will source this amount of
current measured with a voltage drops on the 90% of the
nominal VOUT. If the Output Voltage is directly shorted to
ground (VOUT = 0 V), the short circuit protection will limit
the output current to 690 mA (typ). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration.
Input Capacitor Selection (CIN)
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD * 160°C typical), Thermal Shutdown event
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (TSDU − 140°C typical).
Once the IC temperature falls below the 140°C the LDO is
enabled again. The thermal shutdown feature provides the
protection from a catastrophic device failure due to
accidental overheating. This protection is not intended to be
used as a substitute for proper heat sinking.
Power Dissipation
As power dissipated in the NCP161 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
Figure 49. Capacity vs DC Bias Voltage
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the COUT but the
maximum value of ESR should be less than 2 Ω. Larger
output capacitors and lower ESR could improve the load
www.onsemi.com
12
NCP161
ambient temperature affect the rate of junction temperature
rise for the part.
The maximum power dissipation the NCP161 can handle
is given by:
P D [ V IN @ I GND ) I OUTǒV IN * V OUTǓ
(eq. 1)
q JA
160
1.6
PD(MAX), TA = 25°C, 2 oz Cu
150
PD(MAX), TA = 25°C, 1 oz Cu
140
1.4
1.2
130
1.0
120
0.8
qJA, 1 oz Cu
110
0.6
0.4
100
qJA, 2 oz Cu
90
0.2
80
0
100
200
300
400
500
600
PD(MAX), MAXIMUM POWER DISSIPATION (W)
qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)
P D(MAX) +
ƪ125oC * T Aƫ
The power dissipated by the NCP161 for given
application conditions can be calculated from the following
equations:
0
700
PCB COPPER AREA (mm2)
220
1.0
qJA, 2 oz Cu
210
0.9
200
0.8
qJA, 1 oz Cu
190
PD(MAX), TA = 25°C, 2 oz Cu
PD(MAX), TA = 25°C, 1 oz Cu
180
0.7
0.6
170
0.5
160
0.4
150
0
100
200
300
400
PCB COPPER AREA (mm2)
500
600
Figure 51. qJA and PD (MAX) vs. Copper Area (XDFN4)
www.onsemi.com
13
0.3
700
PD(MAX), MAXIMUM POWER DISSIPATION (W)
qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)
Figure 50. qJA and PD (MAX) vs. Copper Area (CSP4)
(eq. 2)
NCP161
Reverse Current
Turn−On Time
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that VOUT > VIN.
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
The turn−on time is defined as the time period from EN
assertion to the point in which VOUT will reach 98% of its
nominal value. This time is dependent on various
application conditions such as VOUT(NOM), COUT, TA.
Power Supply Rejection Ratio
To obtain good transient performance and good regulation
characteristics place CIN and COUT capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 or 0201 capacitors with
appropriate capacity. Larger copper area connected to the
pins will also improve the device thermal resistance. The
actual power dissipation can be calculated from the equation
above (Equation 2). Expose pad can be tied to the GND pin
for improvement power dissipation and lower device
temperature.
PCB Layout Recommendations
The NCP161 features very high Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
100 kHz – 10 MHz can be tuned by the selection of COUT
capacitor and proper PCB layout.
www.onsemi.com
14
NCP161
ORDERING INFORMATION
Device
Nominal
Output
Voltage
Description
Marking
Rotation
NCP161AFCS180T2G
1.8 V
A
180°
NCP161AFCS250T2G
2.5 V
D
180°
NCP161AFCS280T2G
2.8 V
E
180°
NCP161AFCS285T2G
2.85 V
F
180°
NCP161AFCS300T2G
3.0 V
J
180°
NCP161AFCS320T2G
3.2 V
T
180°
NCP161AFCS330T2G
3.3 V
K
180°
NCP161AFCS350T2G
3.5 V
L
180°
NCP161AFCS450T2G
4.5 V
P
180°
NCP161AFCS500T2G
5.0 V
R
180°
NCP161AFCS514T2G
5.14 V
Q
180°
NCP161BFCS180T2G
1.8 V
A
270°
NCP161BFCS250T2G
2.5 V
D
270°
NCP161BFCS280T2G
2.8 V
E
270°
NCP161BFCS285T2G
2.85 V
F
270°
NCP161BFCS300T2G
3.0 V
J
270°
NCP161BFCS330T2G
3.3 V
K
270°
NCP161BFCS350T2G
3.5 V
L
270°
NCP161BFCS450T2G
4.5 V
P
270°
450 mA, Active Discharge
450 mA, Non-Active
Discharge
NCP161BFCS500T2G
5.0 V
R
270°
NCP161BFCS514T2G
5.14 V
Q
270°
NCP161AFCT180T2G
1.8 V
A
180°
NCP161AFCT185T2G
1.85 V
V
180°
NCP161AFCT250T2G
2.5 V
D
180°
NCP161AFCT280T2G
2.8 V
E
180°
NCP161AFCT285T2G
2.85 V
F
180°
NCP161AFCT290T2G
2.9 V
T
180°
NCP161AFCT300T2G
3.0 V
J
180°
NCP161AFCT310T2G
3.1 V
6
180°
NCP161AFCT330T2G
3.3 V
K
180°
NCP161AFCT350T2G
3.5 V
L
180°
NCP161AFCT450T2G
4.5 V
P
180°
NCP161AFCT500T2G
5.0 V
R
180°
NCP161AFCT514T2G
5.14 V
Q
180°
NCP161BFCT180T2G
1.8 V
A
270°
NCP161BFCT185T2G
1.85 V
V
270°
NCP161BFCT250T2G
2.5 V
D
270°
NCP161BFCT280T2G
2.8 V
E
270°
NCP161BFCT285T2G
2.85 V
F
270°
J
270°
K
270°
450 mA, Active Discharge
450 mA, Non-Active
Discharge
NCP161BFCT300T2G
3.0 V
NCP161BFCT330T2G
3.3 V
NCP161BFCT350T2G
3.5 V
L
270°
NCP161BFCT450T2G
4.5 V
P
270°
NCP161BFCT500T2G
5.0 V
R
270°
NCP161BFCT514T2G
5.14 V
Q
270°
*UBM = 180 mm (±5 mm)
www.onsemi.com
15
Package
Shipping
WLCSP4
CASE 567KA*
(Pb-Free)
5000 /
Tape &
Reel
WLCSP4
CASE 567KA*
(Pb-Free)
5000 /
Tape &
Reel
WLCSP4
CASE 567JZ
(Pb-Free)
5000 /
Tape &
Reel
WLCSP4
CASE 567JZ
(Pb-Free)
5000 /
Tape &
Reel
NCP161
ORDERING INFORMATION
Device
Nominal Output Voltage
Description
NCP161AMX180TBG
1.8 V
DN
NCP161AMX250TBG
2.5 V
DP
NCP161AMX280TBG
2.8 V
DQ
NCP161AMX285TBG
2.85 V
DR
NCP161AMX300TBG
3.0 V
DT
NCP161AMX320TBG
3.2 V
NCP161AMX330TBG
3.3 V
DD
NCP161AMX350TBG
3.5 V
DU
NCP161AMX450TBG
4.5 V
DV
NCP161AMX500TBG
5.0 V
DX
NCP161AMX514TBG
5.14 V
DE
NCP161BMX180TBG
1.8 V
EN
NCP161BMX250TBG
2.5 V
EP
NCP161BMX280TBG
2.8 V
EQ
NCP161BMX285TBG
2.85 V
ER
NCP161BMX300TBG
3.0 V
450 mA, Active Discharge
Marking
DZ
ET
450 mA, Non-Active Discharge
NCP161BMX330TBG
3.3 V
NCP161BMX350TBG
3.5 V
EU
NCP161BMX450TBG
4.5 V
EV
NCP161BMX500TBG
5.0 V
EW
NCP161BMX514TBG
5.14 V
EE
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16
ED
Package
Shipping
XDFN-4
(Pb-Free)
3000 /
Tape &
Reel
XDFN-4
(Pb-Free)
3000 /
Tape &
Reel
NCP161
PACKAGE DIMENSIONS
WLCSP4, 0.64x0.64
CASE 567KA
ISSUE O
A
D
È
PIN A1
REFERENCE
0.05 C
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
DIM
A
A1
A2
b
D
E
e
0.05 C TOP VIEW
2X
A2
0.05 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.05 C
A1
NOTE 3
C
SIDE VIEW
SEATING
PLANE
A1
4X
0.03 C
PACKAGE
OUTLINE
e
b
0.05 C A B
MILLIMETERS
MIN
MAX
0.35
0.45
0.14
0.18
0.25 REF
0.185
0.215
0.64 BSC
0.64 BSC
0.35 BSC
e
0.35
PITCH
B
A
1
4X
0.20
0.35
PITCH
DIMENSIONS: MILLIMETERS
2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
www.onsemi.com
17
NCP161
PACKAGE DIMENSIONS
XDFN4 1.0x1.0, 0.65P
CASE 711AJ
ISSUE O
PIN ONE
REFERENCE
0.05 C
2X
4X
A
B
D
ÉÉ
ÉÉ
E
4X
L2
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
b2
DETAIL A
DIM
A
A1
A3
b
b2
D
D2
E
e
L
L2
0.05 C
2X
TOP VIEW
(A3)
0.05 C
A
0.05 C
NOTE 4
A1
SIDE VIEW
C
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.33
0.43
0.00
0.05
0.10 REF
0.15
0.25
0.02
0.12
1.00 BSC
0.43
0.53
1.00 BSC
0.65 BSC
0.20
0.30
0.07
0.17
e
RECOMMENDED
MOUNTING FOOTPRINT*
e/2
DETAIL A
1
4X
2
L
0.65
PITCH
D2
45 5
PACKAGE
OUTLINE
D2
4
3
4X
4X
BOTTOM VIEW
2X
0.52
b
0.05
4X
M
0.11
0.39
1.20
C A B
NOTE 3
4X
0.24
4X
0.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
18
NCP161
PACKAGE DIMENSIONS
WLCSP4, 0.64x0.64
CASE 567JZ
ISSUE O
A
D
È
PIN A1
REFERENCE
0.05 C
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
DIM
A
A1
A2
b
D
E
e
0.05 C TOP VIEW
2X
A2
0.05 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.05 C
A1
NOTE 3
C
SIDE VIEW
SEATING
PLANE
A1
4X
PACKAGE
OUTLINE
e
b
0.03 C A B
MILLIMETERS
MIN
MAX
−−−
0.33
0.04
0.08
0.23 REF
0.195
0.225
0.64 BSC
0.64 BSC
0.35 BSC
e
0.35
PITCH
B
A
1
4X
0.20
0.35
PITCH
DIMENSIONS: MILLIMETERS
2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
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19
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCP161/D