MC10SX1189 Fibre Channel Coaxial Cable Driver and Loop Resiliency Circuit Description The MC10SX1189 is a differential receiver, differential transmitter specifically designed to drive coaxial cables. It incorporates the output cable drive capability of the MC10EL89 Coaxial Cable Driver with additional circuitry to multiplex the output cable drive source between the cable receiver or the local transmitter inputs. The multiplexer control circuitry is TTL compatible for ease of operation. The MC10SX1189 is useful as a bypass element for Fibre Channel-Arbitrated Loop (FC-AL) or Serial Storage Architecture (SSA) applications, to create loop style interconnects with fault tolerant, active switches at each device node. This device is particularly useful for back panel applications where small size is desirable. The EL89 style drive circuitry produces swings twice as large as a standard PECL output. When driving a coaxial cable, proper termination is required at both ends of the line to minimize reflections. The 1.6 V output swings allow for proper termination at both ends of the cable, while maintaining the required swing at the receiving end of the cable. Because of the larger output swings, the QT, QT outputs are terminated into the thevenin equivalent of 50 W to VCC − 3.0 V instead of 50 W to VCC − 2.0 V. http://onsemi.com FIBRE CHANNEL COAXIAL CABLE DRIVER AND LOOP RESILIENCY CIRCUIT 10SX1189G AWLYWW 16 1 SOIC CASE 751B 10SX1189 = Specific Device Code A = Assembly Location WL = Wafer Lot Y = Year WW = Work Week G = Pb−Free Package Features • • • • • • • TRUTH TABLE 425 ps Propagation Delay 1.6 V Output Swing on the Cable Driving Output Operation Range: VCC = 4.5 V to 5.5 V 75 kW Internal Input Pull Down Resistors >1000 V ESD Protection Transistor Count = 102 Pb−Free Packages are Available* VCC DR DR GND VBB DT DT SEL 16 15 14 13 12 11 10 9 SEL Function L H DR → QT DT → QT PIN NAMES Pins Function DR/DR QR/QR Differential Input from Receive Cable Buffered Differential Output from Receive Cable Differential Input to Transmit Cable Buffered Differential Output to Transmit Cable Multiplexer Control Signal (TTL) Positive Power Supply Ground Reference Voltage Output DT/DT QT/QT 1 2 3 4 5 6 7 QR QR VCC NC VCC QT QT SEL VCC GND VBB 8 VCC Figure 1. Pinout: 16-Lead SOIC (Top View) ORDERING INFORMATION *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 January, 2006 − Rev. 4 1 See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Publication Order Number: MC10SX1189/D MC10SX1189 LOCAL RECEIVE DATA (ECL LEVELS) QR QR DR DR FROM INPUT CABLE (ECL LEVELS) VBB 1 LOCAL TRANSMIT DATA (ECL LEVELS) DT DT 0 QT QT TO OUTPUT CABLE (ENHANCED SWING) SEL (TTL) Figure 2. LOGIC DIAGRAM Table 1. ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit VCC Power Supply Voltage (Referenced to GND) 0 to +7.0 Vdc VIN Input Voltage (Referenced to GND) 0 to +6.0 Vdc IOUT Output Current 50 100 mA TA Operating Temperature Range −40 to +85 °C TSTG Storage Temperature Range −50 to +150 °C Continuous Surge Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. http://onsemi.com 2 MC10SX1189 Table 2. DC CHARACTERISTICS (VCC = 5.0 V, VEE = 0 V) -40°C Characteristic Symbol 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit VOH Output Voltage High (QR,QR) VCC =5.0 V, GND = 0 V (Notes 1, 2) 3.92 4.05 4.22 3.97 4.11 4.27 4.00 4.16 4.30 V VOL Output Voltage Low (QR,QR) VCC =5.0 V, GND = 0 V (Notes 1, 2) 3.05 3.23 3.35 3.07 3.24 3.37 3.10 3.25 3.41 V VOH Output Voltage High (QT,QT) VCC =5.0 V, GND = 0 V (Notes 1, 3) 3.83 3.95 4.10 3.88 4.02 4.15 3.90 4.09 4.17 V VOL Output Voltage Low (QT,QT) VCC =5.0 V, GND = 0 V (Notes 1, 3) 1.90 2.33 2.50 1.85 2.26 2.45 1.85 2.23 2.45 V ICC Quiescent Supply Current (Note 4) 20 25 42 23 27 47 25 28 47 mA VIH Input Voltage High (DR,DR & DT,DT) VCC = 5.0 V, GND = 0 V (Note 1) 3.77 4.11 3.87 4.19 3.94 4.28 V VIL Input Voltage Low (DR,DR & DT,DT) VCC = 5.0 V, GND = 0 V (Note 1) 3.05 3.50 3.05 3.52 3.05 3.56 V VIH Input Voltage High SEL 2.0 VIL Input Voltage Low SEL VBB Output Reference Voltage VCC = 5.0 V, GND = 0 V (Note 1) IIH Input HIGH Current IIL Input LOW Current 2.0 2.0 0.8 3.57 3.63 3.70 0.8 3.65 150 0.5 V 3.70 3.75 3.69 150 0.5 0.5 3.75 0.8 V 3.81 V 150 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Values will track 1:1 with the VCC supply. VEE can vary +0.5 V to −0.5 V. 2. Outputs loaded with 50 W to VCC − 2.0 V. 3. Outputs loaded with 50 W to VCC − 3.0 V. 4. Outputs open circuited. http://onsemi.com 3 MC10SX1189 Table 3. AC CHARACTERISTICS (VCC = 4.5 V to 5.5 V) (Note 5) −40°C Characteristic Symbol tPLH, tPHL 0 to 85°C Min Typ Max Min Typ Max Unit ps Propagation Delay to Output DR → QR (Diff) (SE) DR → QT (Diff) (SE) DT → QT (Diff) (SE) 175 150 250 225 225 200 300 300 425 425 400 400 450 500 650 700 650 725 225 175 300 250 275 225 325 325 450 450 425 425 500 550 650 700 650 725 Propagation Delay SEL → QT,QT 450 600 850 500 650 800 Condition Note 6 Note 7 1.5V to 50% Pt tr, tf Rise Time Fall Time QR,QR 100 100 275 275 400 400 125 125 275 275 400 400 ps 20% to 80% 80% to 20% tr, tf Rise Time Fall Time QT,QT 150 150 300 300 550 550 150 150 300 300 550 550 ps 20% to 80% 80% to 20% tskew Within Device Skew ps Note 8 VPP Minimum Input Swing 200 1000 200 1000 mV Note 9 VCMR Common Mode Range 3.00 4.35 3.00 4.35 V Note 10 15 15 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. VEE can vary +0.5 V to −0.5 V. 6. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the differential output signals. 7. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal. 8. Duty cycle skew is the difference between tPLH and tPHL propagation delay through a device. 9. Minimum input swing for which AC parameters are guaranteed. 10. The CMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPP Min and 1.0 V. ORDERING INFORMATION Package Shipping † MC10SX1189D SOIC−16 45 Units / Rail MC10SX1189DG SOIC−16 (Pb−Free) 45 Units / Rail MC10SX1189DR2 SOIC−16 2500 / Tape & Reel MC10SX1189DR2G SOIC−16 (Pb−Free) 2500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 MC10SX1189 PACKAGE DIMENSIONS SOIC CASE 751B−05 ISSUE J −A− 16 9 1 8 −B− P NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 8 PL 0.25 (0.010) M B S G R K F X 45 _ C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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