NCP2811 NOCAPt Advanced Stereo Headphone Amplifier NCP2811 is a dual audio power amplifier designed for portable communication device applications such as mobile phones. This part is capable of delivering 27 mW of continuous average power into a 16 Ω load from a 2.7 V power supply with a THD+N of 1%. Based on the power supply delivered to the device, an internal power management block generates a symmetrical positive and negative voltage. Thus, the internal amplifiers provide outputs referenced to Ground. In this True Ground configuration, the two external heavy coupling capacitors can be removed. It offers significant space and cost savings compared to a typical stereo application. NCP2811 is available with an external adjustable gain (version A), or with an internal gain of −1.5 V/V (version B). It reaches a superior −100 dB PSRR and noise floor. Thus, it offers high fidelity audio sound, as well as a direct connection to the battery. It contains circuitry to prevent from “Pop & Click” noise that would otherwise occur during turn−on and turn−off transitions. The device is available in 12 bump CSP package (2 x 1.5 mm) which help to save space on the board. It is also available in WQFN12 and TSSOP−14 packages. http://onsemi.com MARKING DIAGRAMS 12 PIN CSP FC SUFFIX CASE 499AZ x = A for NCP2811A = B for NCP2811B z = C for backside laminate A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package Features WQFN12 MT SUFFIX CASE 510AH 1 • True Ground Configuration Output Eliminates DC−Blocking • • • • • • • • • • Capacitors: − Save Board Area − Save Component Cost − No Low−Frequency Response Attenuation High PSRR (−100 dB): Direct Connection to the Battery “Pop and Click” Noise Protection Circuitry Internal Gain (−1.5 V/V) or External Adjustable Gain Ultra Low Current Shutdown Mode 2.7 V – 5.0 V Operation Thermal Overload Protection Circuitry CSP 2 x 1.5 mm WQFN12 3 x 3 mm TSSOP−14 These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Typical Applications • Headset Audio Amplifier for − Cellular Phones − MP3 Player − Personal Digital Assistant and Portable Media Player − Portable Devices 2811xz AYWW G x A L Y W G 2811x ALYWG G = A for NCP2811A = B for NCP2811B = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) 14 TSSOP−14 DTB SUFFIX CASE 948G 14 1 2811 x ALYWG G 1 x A L Y W G = A for NCP2811A = B for NCP2811B = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information on page 12 of this data sheet. © Semiconductor Components Industries, LLC, 2010 November, 2010 − Rev. 3 1 Publication Order Number: NCP2811/D NCP2811 C3 1 mF C2 PGND C4 PVM PVM B3 INL SPVM B4 A2 10 OUTL SD A4 B2 OUTL INR A3 OUTR OUTR AGND 10 A version A1 CPP CPM B1 C1 VP Audio Left SD Audio Right CPM VP CPP 1 mF B1 C1 VP C3 1 mF C2 PGND C4 PVM PVM Audio Left B3 INL SPVM B4 SD A2 SD A4 10 OUTL OUTL Audio Right B2 INR OUTR A3 OUTR AGND 10 A1 B version CPP CPM VP 1 mF CPM 1 mF CPP 1 mF Figure 1. Application Schematics VP OUTL OUTR WQFN12 12 PIN CSP A2 AGND SD A3 A4 OUTR OUTL B1 B2 B3 B4 VP INR INL SPVM C1 C2 C3 C4 CPP PGND CPM (Top View) PVM CPP PGND CPM NC INR AGND PVM SD INL A1 TSSOP14 (Top View) Figure 2. Pin Configurations http://onsemi.com 2 OUTL OUTR NC INR AGND INL NC NC VP CPP PGND CPM PVM SD (Top View) NCP2811 1 mF VP Cs 1 mF VP CPM CPP VRP PGND PVM POWER MANAGEMENT 1 mF SPVM VRM Left Audio VRP INL − OUTL + VRM SD BIASING Use 10 ohm resistor for capacitive drive capability CLICK/POP SUPPRESSION VRP + Right Audio OUTR INR − VRM AGND Figure 3. Typical Application Schematic version A http://onsemi.com 3 NCP2811 VP 1 mF Cs 1 mF CPP VP CPM VRP PGND 1 mF PVM POWER MANAGEMENT VRM Left Audio VRP INL − OUTL + VRM SD BIASING Use 10 ohm resistor for capacitive drive capability CLICK/POP SUPPRESSION VRP + Right Audio INR OUTR − VRM AGND Figure 4. Typical Application Schematic version B Table 1. PIN FUNCTION DESCRIPTION PIN CSP PIN TQFN PIN TSSOP PIN NAME TYPE A1 7 10 AGND GROUND A2 5 7 SD INPUT A3 10 13 OUTR OUTPUT Right audio channel output signal A4 11 14 OUTL OUTPUT Left audio channel output signal B1 12 2 VP POWER Positive supply voltage. It can be connected for example to a Lithium/Ion battery B2 8 11 INR INPUT Right input of the first audio source B3 6 9 INL INPUT Left input of the first audio source B4 − − SPVM POWER Amplifier negative power supply voltage. Connect to PVM C1 1 3 CPP INPUT/ OUTPUT Charge pump flying capacitor positive terminal. A 1 mF ceramic filtering capacitor to CPM is needed C2 2 4 PGND GROUND Power ground, connect to ground reference C3 3 5 CPM INPUT C4 4 6 PVM OUTPUT DESCRIPTION Analog ground. Connect to ground reference Enable activation Charge pump flying capacitor negative terminal. A 1 mF ceramic filtering capacitor to CPP is needed Charge pump output. A 1 mF ceramic filtering capacitor to ground is needed http://onsemi.com 4 NCP2811 Table 2. MAXIMUM RATINGS Rating Symbol Value Unit AVIN, PVIN Pins: Power Supply Voltage (Note 2) VP − 0.3 to + 6.0 V INL, INR Pins: Input (Note 2) A version B version VIN V −VP – 0.3 to VP + 0.3 −2 to +2 VYY −0.3 to VP + 0.3 V Human Body Model (HBM) ESD Rating are (Note 3) SD Pin: Input (Note 2) ESD HBM 2000 V Machine Model (MM) ESD Rating are (Note 3) ESD MM 200 V RqJC (Note 7) °C/W Operating Ambient Temperature Range TA −40 to + 85 °C Operating Junction Temperature Range TJ −40 to + 125 °C Maximum Junction Temperature (Note 6) TJMAX + 150 °C Storage Temperature Range TSTG −65 to + 150 °C Moisture Sensitivity (Note 5) MSL Level 1 CSP 1.5 x 2.0 mm package (Notes 6 and 7) Thermal Resistance Junction to Case Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Notes: 1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C. 2. According to JEDEC standard JESD22−A108B. 3. This device series contains ESD protection and passes the following tests: Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins. Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins. 4. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78 class II. 5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A. 6. The thermal shutdown set to 150°C (typical) avoids irreversible damage on the device due to power dissipation. 7. The RJA is highly dependent of the PCB Heatsink area. For example, RJA can equal 195°C/W with 50 mm2 total area and also 135°C/W with 50 mm2. The bumps have the same thermal resistance and all need to be connected to optimize the power dissipation. R qCA + 125 * T A * R qJC PD http://onsemi.com 5 NCP2811 Table 3. ELECTRICAL CHARACTERISTICS Min & Max Limits apply for TA between −40°C to +85°C and TJ up to + 125°C for VIN between 2.7 V to 5.0 V (Unless otherwise noted). Typical values are referenced to TA = + 25°C and VIN = 3.6 V. Parameter Symbol Conditions VP Operational Power Supply IDD Supply quiescent current Both channels enabled ISD Shutdown current VP = 2.7 V to 5.0 V VOS Output offset voltage VP = 2.7 V to 5.0 V VIH High−Level input voltage SD pin VIL Low−Level input voltage SD pin RSD SD pin pull−down impedance TWU Turning on time TSD Thermal shutdown temperature VLP Max output swing (peak value) VP = 2.9 V to 5.0 V Headset ≥ 16 W THD+N = 1% PO Max output power (output in phase) VP = 2.7V, THD+N = 1% Headset = 16 W VP = 2.7V, THD+N = 1% Headset = 32 W VP = 3.6V, THD+N = 1% Headset = 16 W VP = 3.6V, THD+N = 1% Headset = 32 W VP = 5.0V, THD+N = 1% Headset = 16 W VP = 5.0V, THD+N = 1% Headset = 32 W PSRR THD+N VP = 2.7 V to 5.0 V Input shorted to ground F = 217 Hz F = 1 kHz Total harmonic distortion + noise (Note 8) Headset = 16 W POUT = 25 mW VN Output noise voltage (Note 8) ZIN Input impedance ZSD Output impedance in shutdown mode UVLO hysteresis Av Unit 5.0 V 6.0 mA 1 V KW 1 ms 160 °C VRMS 27 mW 37 90 64 110 64 −80 −60 dB dB −106 −95 0.01 % A−Weighting filter 7 mVRMS B version only 20 KW 10 KW 2.3 V 100 mV B version only 8. Guaranteed by design and characterized. http://onsemi.com 6 V 190 1 Falling edge Voltage Gain mA mV ±1 0.4 Power supply rejection ratio (Note 8) UVLOHYST Max 1.2 Headset ≥ 16 W UVLO threshold Typ 2.7 Crosstalk (Note 8) UVLO Min −1.53 −1.5 −1.48 V/V NCP2811 TYPICAL OPERATING CHARACTERISTICS 100 100 16 W out of Phase 16 W in Phase 10 THD+N (%) THD+N (%) 10 1 0.1 THD+N_L (%) THD+N_R (%) 0.01 1 0.1 THD+N_L (%) 0.01 THD+N_R (%) 0.001 0 100 20 40 60 80 100 120 140 0.001 160 20 40 60 80 100 120 140 160 180 Pout (mW) Pout (mW) Figure 5. THD+N vs. Pout @ Vp = 3.6 V Figure 6. THD+N vs. Pout @ Vp = 3.6 V 100 16 W in Phase 2.7 V 10 0 16 W out of Phase 2.7 V 10 3.0 V 0.1 THD (%) 3.6 V 1 4.2 V Vp = 5 V 0.01 0.001 0 100 20 40 60 100 120 Vp = 5 V 140 160 0.001 180 0 20 40 60 80 100 120 140 Pout (mW) Figure 7. THD+N vs. Pout LEFT Figure 8. THD+N vs. Pout RIGHT 160 180 100 16 W out of Phase 16 W out of Phase 2.7 V 2.7 V 10 3.0 V 3.6 V 4.2 V Vp = 5 V 1 0.1 3.0 V 3.6 V 1 4.2 V Vp = 5 V 0.1 0.01 0.01 0.001 4.2 V 0.1 Pout (mW) 10 THD (%) 80 3.6 V 1 0.01 THD (%) THD (%) 3.0 V 0 20 40 60 80 100 120 140 160 0.001 180 0 20 40 60 80 100 120 140 Pout (mW) Pout (mW) Figure 9. THD+N vs. Pout LEFT Figure 10. THD+N vs. Pout RIGHT http://onsemi.com 7 160 180 NCP2811 TYPICAL OPERATING CHARACTERISTICS 100 100 32 W in Phase 10 THD+N_L (%) THD+N (%) THD+N (%) 10 1 THD+N_R (%) 0.1 0 100 10 20 30 40 50 60 70 90 80 0.001 100 0 30 40 50 60 70 80 90 100 Figure 12. THD+N vs. Pout @ Vp = 3.6 V 100 32 W in Phase 32 W in Phase 2.7 V 2.7 V 10 3.0 V 3.6 V 4.2 V Vp = 5 V 0.1 3.0 V 3.6 V 4.2 V 1 Vp = 5 V 0.1 0.01 0.01 0 10 20 30 40 50 60 70 80 90 0.001 100 0 10 20 30 40 50 60 70 80 Pout (mW) Pout (mW) Figure 13. THD+N vs. Pout LEFT Figure 14. THD+N vs. Pout RIGHT 90 100 100 100 32 W out of Phase 32 W out of Phase 10 10 2.7 V 3.0 V 3.6 V 1 THD (%) THD (%) 20 Figure 11. THD+N vs. Pout @ Vp = 3.6 V 1 4.2 V 0.1 Vp = 5 V 2.7 V 3.0 V 1 3.6 V 4.2 V 0.1 Vp = 5 V 0.01 0.01 0.001 10 Pout (mW) THD (%) THD (%) THD+N_R (%) 0.1 Pout (mW) 10 0.001 THD+N_L (%) 1 0.01 0.01 0.001 32 W out of Phase 0 10 20 30 40 50 60 70 80 90 0.001 100 0 10 20 30 40 50 60 70 80 Pout (mW) Pout (mW) Figure 15. THD+N vs. Pout LEFT Figure 16. THD+N vs. Pout RIGHT http://onsemi.com 8 90 100 NCP2811 TYPICAL OPERATING CHARACTERISTICS 1 1 0.1 16 W out of Phase VP = 3.6 V VP = 5.0 V 0.01 THD+N (%) THD+N (%) 16 W out of Phase VP = 2.7 V 0.1 VP = 3.6 V 0.01 VP = 2.7 V VP = 5.0 V 0.001 10 100 1,000 10,000 0.001 100,000 10 100 1,000 FREQUENCY (Hz) Figure 17. THD vs. Frequency LEFT @ Pout = 32 mW Figure 18. THD vs. Frequency RIGHT @ Pout = 32 mW 1 32 W out of Phase 32 W out of Phase VP = 2.7 V VP = 3.6 V 0.1 VP = 5.0 V THD+N (%) THD+N (%) VP = 2.7 V 0.01 10 100 1,000 10,000 VP = 5.0 V 0.01 10 100 10,000 100,000 FREQUENCY (Hz) Figure 19. THD vs. Frequency LEFT @ Pout = 32 mW Figure 20. THD vs. Frequency RIGHT @ Pout = 32 mW 80 85°C 70 25°C 25°C 60 100 1,000 FREQUENCY (Hz) 120 85°C 50 80 (mW) (mW) VP = 3.6 V 0.1 0.001 100,000 140 −40°C 60 −40°C 40 30 40 20 20 0 100,000 FREQUENCY (Hz) 1 0.001 10,000 10 2.7 3.2 3.7 4.2 0 4.7 2.7 3.2 3.7 4.2 4.7 VP (V) VP (V) Figure 21. Maximum Output Power LEFT vs. VP (THD+N < 1%) Figure 22. Maximum Output Power LEFT vs. VP (THD+N < 0.1%) http://onsemi.com 9 NCP2811 TYPICAL OPERATING CHARACTERISTICS 0 −60 −65 −20 −70 (dB) PSRR (dB) −75 −40 −60 Left to Right −90 −95 −100 −80 NCP2811B Left −100 −120 −80 −85 NCP2811B Right 10 100 1000 10,000 100,000 −105 −110 −115 −120 Right to Left 10 100 1000 10,000 FREQUENCY (Hz) FREQUENCY (Hz) Figure 23. PSRR at Vp = 3.6 V Figure 24. Crosstalk vs. Frequency @ Vp = 3.6 V http://onsemi.com 10 100,000 NCP2811 DETAIL OPERATING DESCRIPTION Detailed Descriptions filter with Rin (externally selectable for A version, 20 kW for B version). The size of the capacitor must be large enough to couple in low frequencies without severe attenuation in the audio bandwith (20 Hz – 20 kHz). The cut off frequency for the input high−pass filter is: The NCP2811 is a stereo headphone amplifier with a true ground architecture. This architecture eliminates the need to use 2 external big capacitors required by conventional headphone amplifier. The structure of the NCP2811 is basically composed of 2 true ground amplifiers, an UVLO, a short circuit protection and also a thermal shutdown. A special circuitry is embedded to eliminate any pop and click noise that occurs during turn on and turn off time. The A version has an external gain selectable by two resistor, B version has a gain of 1.5 V/V. Fc + A Fc < 20 Hz is recommended. Charge Pump Capacitor Selection Use ceramic capacitor with low ESR for better performances. X5R / X7R capacitor is recommended. The flying capacitor (C2) serves to transfer charge during the generation of the negative voltage. The CPVM capacitor (C3) must be equal at least to the CFly capacitor to allow maximum transfer charge. The CPVM value must not exceed 1 mF. Higher capacitor value can damage the part. Table 4 suggests typical value and manufacturer: NOCAPt NOCAPt is a patented architecture which requires only 2 small ceramic capacitors. It generates a symmetrical positive and negative voltage and it allows the output of the amplifiers to be biased around the ground. Current Limit Protection Circuit The NCP2811 embed a protection circuitry against short to ground. When an output is shorted to GND and when a signal appears at the input, the current is limited to 300 mA. Table 4. Thermal Overload Protection Internal amplifiers are switched off when the temperature exceed 160°C, and will be switch on again when the temperature decrease below 140°C. Value Reference Package Manufacturer 1 mF C1005X5R0J105K 0402 TDK 1 mF GRM155R60J105K19 0402 Murata Lower value of capacitors can be used but the maximum output power is reduced and the device may not operate to specifications. Under Voltage Lockout When the battery voltage decreases below 2.3 V, the amplifiers are turned off. The hysteresis to turn on it again is 100 mV. Power Supply Decoupling Capacitor (C1) The NCP2811 is a True Ground amplifier which requires the adequate decoupling capacitor to reduce noise and THD+N. Use X5R / X7R ceramic capacitor and place it closed to the CPVDD pin. A value of 1 mF is recommended. Pop and Click Suppression Circuitry The NCP2811 includes a special circuitry to eliminate any pop and click noise during turn on and turn off time. Basic amplifier creates an offset during these transitions at the output which give a parasitic noise called “pop and click noise”. The NCP2811 eliminates this problem. Shutdown Function The device enters in shutdown mode when shutdown signal is low. During the shutdown mode, the DC quiescent current of the circuit does not exceed 500 nA. In this configuration, the output impedance is 10 kW on each output. Gain Setting Resistor Selection (Rin & Rf, A version only) Rin and Rf set the closed loop gain of the amplifier. A low gain configuration (close to 1) minimizes the THD + noise values and maximizes the signal to noise ratio. A closed loop gain in the range of 1 to 10 is recommended to optimize overall system performance. The formula to calculate the gain is: Av + * 1 2pR inC in Output Resistor for Capacitive Drive Capability Under normal operation, NCP2811 maximum direct capacitive load is in the 80 pF range. If, for any reason, high value capacitive loads should be connected to NCP2811 outputs, an additional 10 W resistor should be placed between the NCP2811 output and the capacitive load to ensure amplifier stability. Rf R in Layout Recommendation Connect C1 as close as possible of the Vp pin. Connect C2 and C3 as close as possible of the NCP2811. Route audio signal and AGND far from Vp, CPP, CPM, PVM and PGND to avoid any perturbation due to the switching. Input Capacitor Selection The input coupling capacitor blocks the DC voltage at the amplifier input terminal. This capacitor creates a high−pass http://onsemi.com 11 NCP2811 Table 5. ORDERING INFORMATION Device Package Shipping† NCP2811ADTBR2G TSSOP−14 (Pb−Free) 2500/Tape & Reel NCP2811BDTBR2G TSSOP−14 (Pb−Free) 2500/Tape & Reel NCP2811AFCT1G Flip−Chip 12 (Pb−Free) 3000/Tape & Reel NCP2811BFCT1G Flip−Chip 12 (Pb−Free) 3000/Tape & Reel NCP2811BFCCT1G Flip−Chip 12 (Backside Laminate Coating) (Pb−Free) 3000/Tape & Reel NCP2811AMTTXG WQFN12 (Pb−Fre) 3000/Tape & Reel NCP2811BMTTXG WQFN12 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. PACKAGE DIMENSIONS 12 PIN FLIP−CHIP, 2.0x1.5, 0.5P CASE 499AZ−01 ISSUE O D A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B PIN A1 REFERENCE E 2X 0.10 C 2X 0.10 C TOP VIEW A 0.10 C A2 0.05 C 12X A1 C SIDE VIEW NOTE 3 DIM A A1 A2 b D E e SOLDERING FOOTPRINT* SEATING PLANE A1 e/2 12X e b 0.05 C A B C 0.03 C B A 2 3 0.5 PITCH e 12X 1 MILLIMETERS MIN MAX 0.54 0.60 0.21 0.27 0.33 0.39 0.29 0.34 2.00 BSC 1.50 BSC 0.50 BSC 4 BOTTOM VIEW http://onsemi.com 12 0.25 PACKAGE OUTLINE 0.5 PITCH NCP2811 PACKAGE DIMENSIONS WQFN12 3x3, 0.5P CASE 510AH−01 ISSUE O ÇÇÇ ÇÇÇ ÇÇÇ PIN ONE REFERENCE 2X B A D L1 DETAIL A ALTERNATE CONSTRUCTIONS E ÇÇÇ ÇÇÇ ÉÉÉ 0.10 C 2X EXPOSED Cu 0.10 C TOP VIEW A DETAIL B 0.10 C 13X 0.10 C A1 NOTE 4 C SIDE VIEW MOLD CMPD ÉÉ ÉÉ ÇÇ A1 DETAIL B A3 ALTERNATE CONSTRUCTIONS SEATING PLANE A3 DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.65 0.85 0.00 0.05 0.22 REF 0.20 0.30 3.00 BSC 1.30 1.50 3.00 BSC 1.30 1.50 0.50 BSC 0.20 −−− 0.30 0.50 0.00 0.15 SOLDERING FOOTPRINT* 12X 0.63 PACKAGE OUTLINE D2 DETAIL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L 12X 4 L 1 7 12X E2 2X b 0.10 C A B 1 0.05 C K 2X 1.50 3.30 12X NOTE 3 0.30 12 0.50 PITCH e BOTTOM VIEW DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 13 NCP2811 PACKAGE DIMENSIONS TSSOP−14 CASE 948G−01 ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S N 2X 14 L/2 0.25 (0.010) 8 M B −U− L PIN 1 IDENT. N F 7 1 0.15 (0.006) T U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S S DETAIL E K A −V− ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ ÇÇÇ K1 J J1 SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 −−− 1.20 −−− 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0_ 8_ 0_ 8_ SOLDERING FOOTPRINT 7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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