NLSV4T240 4-Bit Dual-Supply Inverting Level Translator The NLSV4T240 is a 4−bit configurable dual−supply voltage level translator. The input An and output Bn ports are designed to track two different power supply rails, VCCA and VCCB respectively. Both supply rails are configurable from 0.9 V to 4.5 V allowing universal low−voltage translation from the input An to the output Bn port. http://onsemi.com MARKING DIAGRAM Features • • • • • • • • • Wide VCCA and VCCB Operating Range: 0.9 V to 4.5 V High−Speed w/ Balanced Propagation Delay Inputs and Outputs have OVT Protection to 4.5 V Non−preferential VCCA and VCCB Sequencing Outputs at 3−State until Active VCC is Reached Power−Off Protection Outputs Switch to 3−State with VCCB at GND Ultra−Small Packaging: 1.7 mm x 2.0 mm UQFN12 This is a Pb−Free Device 1 WB = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) PIN ASSIGNMENT OE Typical Applications VCCA 1 • Mobile Phones, PDAs, Other Portable Devices A1 Important Information • ESD Protection for All Pins: HBM (Human Body Model) > 6000 V VCCA 11 VCCB 2 10 B1 A2 3 9 B2 A3 4 8 B3 A4 5 7 B4 VCCB A1 B1 A2 B2 B3 A4 B4 12 6 GND (Top View) ORDERING INFORMATION Device A3 WBMG G UQFN12 MU SUFFIX CASE 523AE NLSV4T240MUTAG Package Shipping† UQFN12 3000/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. OE Figure 1. Logic Diagram © Semiconductor Components Industries, LLC, 2012 February, 2012 − Rev. 2 1 Publication Order Number: NLSV4T240/D NLSV4T240 TRUTH TABLE PIN ASSIGNMENT Inputs PIN FUNCTION VCCA Input Port DC Power Supply VCCB Output Port DC Power Supply GND OE Outputs An Bn L L H Ground L H L An Input Port H X 3−State Bn Output Port OE Output Enable MAXIMUM RATINGS Symbol VCCA, VCCB VI VC VO Rating Value DC Supply Voltage Condition Unit −0.5 to +5.5 V An −0.5 to +5.5 V OE −0.5 to +5.5 V (Power Down) Bn −0.5 to +5.5 (Active Mode) Bn −0.5 to +5.5 V (Tri−State Mode) Bn −0.5 to +5.5 V DC Input Voltage Control Input DC Output Voltage VCCA = VCCB = 0 V IIK DC Input Diode Current −20 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA IO DC Output Source/Sink Current ±50 mA ICCA, ICCB DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. RECOMMENDED OPERATING CONDITIONS Symbol VCCA, VCCB Parameter Bus Input Voltage VC Control Input VIO Bus Output Voltage Dt / DV Max Unit 0.9 4.5 V GND 4.5 V OE GND 4.5 V Bn GND 4.5 V (Active Mode) Bn GND VCCB V (Tri−State Mode) Bn GND 4.5 V −40 +85 °C 0 10 nS Positive DC Supply Voltage VI TA Min (Power Down Mode) Operating Temperature Range Input Transition Rise or Rate VI, from 30% to 70% of VCC; VCC = 3.3 V ±0.3 V http://onsemi.com 2 NLSV4T240 DC ELECTRICAL CHARACTERISTICS −405C to +855C Symbol VIH VIL VOH Parameter Test Conditions Input HIGH Voltage (An, OE) Input LOW Voltage (An, OE) Output HIGH Voltage Min Max Unit 3.6 – 4.5 0.9 – 4.5 V 2.2 − 2.7 – 3.6 2.0 − 2.3 – 2.7 1.6 − 1.4 − 2.3 0.65 * VCCA − 0.9 – 1.4 0.9 * VCCA − 0.9 – 4.5 − 0.8 2.7 – 3.6 − 0.8 2.3 – 2.7 − 0.7 1.4 − 2.3 − 0.35 * VCCA 0.9 – 1.4 − 0.1 * VCCA IOH = −100 mA; VI = VIL 0.9 – 4.5 0.9 – 4.5 VCCB – 0.2 − IOH = −0.5 mA; VI = VIL 0.9 0.9 0.75 * VCCB − IOH = −2 mA; VI = VIL 1.4 1.4 1.05 − IOH = −6 mA; VI = VIL 1.65 1.65 1.25 − 2.3 2.3 2.0 − 2.3 2.3 1.8 − 2.7 2.7 2.2 − 2.3 2.3 1.7 − IOH = −18 mA; VI = VIL Output LOW Voltage VCCB (V) 3.6 – 4.5 IOH = −12 mA; VI = VIL VOL VCCA (V) 3.0 3.0 2.4 − IOH = −24 mA; VI = VIL 3.0 3.0 2.2 − IOL = 100 mA; VI = VIH 0.9 – 4.5 0.9 – 4.5 − 0.2 IOL = 0.5 mA; VI = VIH 1.1 1.1 − 0.3 IOL = 2 mA; VI = VIH 1.4 1.4 − 0.35 IOL = 6 mA; VI = VIH 1.65 1.65 − 0.3 IOL = 12 mA; VI = VIH 2.3 2.3 − 0.4 2.7 2.7 − 0.4 2.3 2.3 − 0.6 3.0 3.0 − 0.4 IOL = 18 mA; VI = VIH IOL = 24 mA; VI = VIH V V V 3.0 3.0 − 0.55 Input Leakage Current VI = VCCA or GND 0.9 – 4.5 0.9 – 4.5 −1.0 1.0 mA IOFF Power−Off Leakage Current OE = 0 V 0 0.9 – 4.5 0.9 – 4.5 0 −1.0 −1.0 1.0 1.0 mA ICCA Quiescent Supply Current VI = VCCA or GND; IO = 0, VCCA = VCCB 0.9 – 4.5 0.9 − 4.5 − 2.0 mA ICCB Quiescent Supply Current VI = VCCA or GND; IO = 0, VCCA = VCCB 0.9 – 4.5 0.9 − 4.5 − 2.0 mA ICCA + ICCB Quiescent Supply Current VI = VCCA or GND; IO = 0, VCCA = VCCB 0.9 – 4.5 0.9 – 4.5 − 4.0 mA II DICCA Increase in ICC per Input Voltage, Other Inputs at VCCA or GND VI = VCCA – 0.6 V; VI = VCCA or GND 4.5 3.6 4.5 3.6 − 10 5.0 mA DICCB Increase in ICC per Input Voltage, Other Inputs at VCCA or GND VI = VCCA – 0.6 V; VI = VCCA or GND 4.5 3.6 4.5 3.6 − 10 5.0 mA I/O Tri−State Output Leakage Current TA = 25°C, OE = 0 V 0.9 – 4.5 0.9 – 4.5 −1.0 1.0 mA IOZ http://onsemi.com 3 NLSV4T240 TOTAL STATIC POWER CONSUMPTION (ICCA + ICCB) −405C to +855C VCCB (V) 4.5 VCCA (V) Min 3.3 Max Min 2.8 Max Min 1.8 Max Min 0.9 Max Min Max Unit 4.5 2 2 2 2 < 1.5 μA 3.3 2 2 2 2 < 1.5 μA 2.8 <2 <1 <1 < 0.5 < 0.5 μA 1.8 <1 <1 < 0.5 < 0.5 < 0.5 μA 0.9 < 0.5 < 0.5 < 0.5 < 0.5 < 0.5 μA NOTE: Connect ground before applying supply voltage VCCA or VCCB. This device is designed with the feature that the power−up sequence of VCCA and VCCB will not damage the IC. AC ELECTRICAL CHARACTERISTICS −405C to +855C VCCB (V) 4.5 Symbol tPLH, tPHL (Note 1) tPZH, tPZL (Note 1) tPHZ, tPLZ (Note 1) tOSHL, tOSLH (Note 1) Min 3.3 Max Min 2.8 Max Min 1.8 Max Unit 2.1 2.3 nS 2.1 2.3 2.6 2.1 2.3 2.5 2.8 2.1 2.4 2.5 2.7 3.0 1.2 2.4 2.7 2.8 3.0 3.3 4.5 2.6 3.8 4.0 4.1 4.3 3.3 3.7 3.9 4.1 4.3 4.6 2.5 3.9 4.1 4.3 4.5 4.8 1.8 4.1 4.4 4.5 4.7 5.0 1.2 4.4 4.7 4.8 5.0 5.3 4.5 2.6 3.8 4.0 4.1 4.3 3.3 3.7 3.9 4.1 4.3 4.6 2.5 3.9 4.1 4.3 4.5 4.8 1.8 4.1 4.4 4.5 4.7 5.0 1.2 4.4 4.7 4.8 5.0 5.3 4.5 0.15 0.15 0.15 0.15 0.15 3.3 0.15 0.15 0.15 0.15 0.15 2.5 0.15 0.15 0.15 0.15 0.15 1.8 0.15 0.15 0.15 0.15 0.15 1.2 0.15 0.15 0.15 0.15 0.15 VCCA (V) Propagation Delay, 4.5 1.6 1.8 2.0 3.3 1.7 1.9 An to Bn 2.8 1.9 1.8 Output Enable, OE to Bn Output Disable, OE to Bn Output to Output Skew, Time 1.2 Max Parameter Min Max Min nS nS nS 1. Propagation delays defined per Figure 2. CAPACITANCE Symbol Parameter Test Conditions Typ (Note 2) Unit CIN Control Pin Input Capacitance VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B 3.5 pF CI/O I/O Pin Input Capacitance VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B 5.0 pF CPD Power Dissipation Capacitance VCCA = VCCB = 3.3 V, VI = 0 V or VCCA, f = 10 MHz 20 pF 2. Typical values are at TA = +25°C. 3. CPD is defined as the value of the IC’s equivalent capacitance from which the operating current can be calculated from: ICC(operating) ^ CPD x VCC x fIN x NSW where ICC = ICCA + ICCB and NSW = total number of outputs switching. http://onsemi.com 4 NLSV4T240 VCC Pulse Generator RL DUT CL VCCO x 2 OPEN GND RL Figure 2. AC (Propagation Delay) Test Circuit Test Switch tPLH, tPHL OPEN tPLZ, tPZL VCCO x 2 tPHZ, tPZH GND CL = 15 pF or equivalent (includes probe and jig capacitance) RL = 2 kW or equivalent ZOUT of pulse generator = 50 W VIH Input (An) Vm Vm tPHL tPLH Output (Bn) Vm 0V VOH Vm VOL Waveform 1 − Propagation Delays tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns VIH OEn Vm Vm tPZH 0V tPHZ Output (Bn) VOH VY Vm ≈0V tPZL tPLZ ≈ VCC Vm Output (Bn) VX VOL Waveform 2 − Output Enable and Disable Times tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 3. AC (Propagation Delay) Test Circuit Waveforms VCC Symbol 3.0 V – 4.5 V 2.3 V − 2.7 V 1.65 V − 1.95 V 1.4 V − 1.6 V 0.9 V − 1.3 V VmA VCCA/2 VCCA/2 VCCA/2 VCCA/2 VCCA/2 VmB VCCB/2 VCCB/2 VCCB/2 VCCB/2 VCCB/2 VX VOL x 0.1 VOL x 0.1 VOL x 0.1 VOL x 0.1 VOL x 0.1 VY VOH x 0.9 VOH x 0.9 VOH x 0.9 VOH x 0.9 VOH x 0.9 http://onsemi.com 5 NLSV4T240 PACKAGE DIMENSIONS UQFN12 1.7x2.0, 0.4P CASE 523AE ISSUE A ÉÉ ÉÉ ÉÉ D PIN 1 REFERENCE 2X 0.10 C 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH 0.03 MAX ON BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. A B L1 DETAIL A E NOTE 5 TOP VIEW DIM A A1 A3 b D E e K L L1 L2 DETAIL B A 0.05 C 12X 0.05 C A1 A3 8X C SIDE VIEW SEATING PLANE K 5 MOUNTING FOOTPRINT SOLDERMASK DEFINED 7 DETAIL A e 1 12X DETAIL B OPTIONAL CONSTRUCTION MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.70 BSC 2.00 BSC 0.40 BSC 0.20 ---0.45 0.55 0.00 0.03 0.15 REF 11 L 2.00 12X L2 BOTTOM VIEW 1 b 0.10 M C A B 0.05 M C 0.32 NOTE 3 2.30 0.40 PITCH 11X 0.22 12X 0.69 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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