HERMETIC PACKAGE INFORMATION PACKAGE TYPE CERDIP PACKAGE MATERIAL Ceramic DESCRIPTION Package Dimensions mm (inch) WIDTH HEIGHT(2) PACKAGE STYLE = PACKAGE Package Code CODE + Lead Count Flat Pack Glass Sealed Notes 2-June-2010 Lead Frame, Board Type RAIL/BULK Quantity Package Weight(3) (Grams) (.200) Maximum J8 J8 2.54 (.100) 30 110 - 50 0.99 14-Lead CERDIP 7.62 (.300) (.200) Maximum J J14 2.54 (.100) 25 95 - 25 2.09 20-Lead CERDIP (.200) Maximum J J20 2.54 (.100) 15 70 - 18 D8 D8 2.54 (.100) 30 100 - 35 D14 2.54 (.100) 25 85 - 25 D16 2.54 (.100) 25 80 - 25 18-Lead SB D18 2.54 (.100) 20 75 - 20 20-Lead SB D20 2.54 (.100) 15 70 - 20 14-Lead SB Ceramic Theta JA ºC/W 8-Lead CERDIP 8-Lead SB Side-Brazed (Hermetic) Lead Pitch Theta JC mm ºC/W (inches) 16-Lead SB 7.62 (.300) 5.71 (.225) Maximum D 10-Lead Flatpak 7.62 (.300) 2.29 (.090) Maximum W W10 1.27 (.050) 40 170 - 20 0.25 14-Lead Flatpak 7.62 (.300) 2.29 (.090) Maximum W W14 1.27 (.050) 40 160 - 20 0.45 Ceramic (1) Pin common to substrate (2) Unless otherwise stated, Package height is nominal from seating/reference plane to top of package. Consult Package Drawing for details. (3) Individual weight in grams, +/- 10%, of finished product with average die/device inside. 1 of 2 HERMETIC PACKAGE INFORMATION PACKAGE MATERIAL DESCRIPTION TO-3 Metal Can 2-Lead TO-3 TO-5 Metal Can TO-39 Metal Can PACKAGE TYPE Package Dimensions mm (inch) WIDTH HEIGHT(2) 12.70 (.500) 8.51 (.335) K 8.97 (.353) 5.84 (.230) Maximum H 9.14 (.360) 4.7 (.185) Maximum H 8-Lead TO-5 10-Lead TO-5 3-Lead TO-39 4-Lead TO-39 2-Lead TO-46 TO-46 Metal Can 3-Lead TO-46 5.44 (.214) 4-Lead TO-46 TO-52 Metal Can 3-Lead TO-52 PACKAGE STYLE = PACKAGE Package Code CODE + Lead Count 5.44 (.214) 2.67 (.105) Maximum H 3.81 (.150) Maximum E Lead Pitch Theta JC mm ºC/W (inches) Theta JA ºC/W Lead Frame, Board Type RAIL/BULK Quantity Package Weight(3) (Grams) 20/Rail 12.8 K2 - 3 35 1 layer H8 - 40 150 - 0.96 H10 - 38 150 - 1.04 H3 - 15 150 Pin 3(1) 4(1) H4 - 14 150 Pin H2 - 84 440 Pin 2(1) H3 - 80 440 Pin 3(1) 4(1) H4 - 76 440 Pin E3 - n/a 360 Pin 3(1) 0.97 10/Tray 0.29 Notes (1) Pin common to substrate (2) Unless otherwise stated, Package height is nominal from seating/reference plane to top of package. Consult Package Drawing for details. (3) Individual weight in grams, +/- 10%, of finished product with average die/device inside. MARKING INK INFORMATION 1. 2. 3. 4. MARKEM 7261 BLACK PHENOLIC OFFSET PRINT/ cured at 150degC for 3 hours (metal cans) MARKEM 7224 WHITE EPOXY OFFSET PRINT/ cured at 150degC for 4 hours (cerpak and cerdip) MARKEM 7254 GREY PHENOLIC OFFSET PRINT/ cured at 150degC for 4 hours (cerpack and cerdip) TEKA PRINT AG TPC460 WHITE 1-component PAD PRINT/ cured at 150degC for 4 hours (cerpack and cerdip) Please contact LTC for further details on specific device types. 2-June-2010 2 of 2