DHX91 DHAN Module DECT-ULE Platform Datasheet Version 1.3 June 2015 Version 1.3 DHX91 DHAN Module Datasheet Headquarters USA DSP Group Inc. 161 S San Antonio Rd Suite 10 Los Altos, CA 94022 Tel: (408)986-4300 Fax:(408)986-4323 APAC China DSP Group (HK) Limited Unit 1-4, 11/F, 909 Cheung Sha Wan Rd. Kowloon Hong Kong Tel: +852-(3965)-5888 Israel DSP Group Ltd. 5 Shenkar Street Herzelia, Israel 4672505 Tel: 972-9-952-9696 Fax: 972-9-954-1234 DSP Group (Shenzhen) Limited Room 1819, 18/F Kerry Centre, Renminnan Road, Shenzhen, China 518001 Tel: +(86 755) 2518 1214 Europe Germany DSPG Technologies GmbH Nelson-Mandela-Platz 18 90459 Nurnberg Tel: +49-911-2001-0 Fax: +49-911-2001-1210 Scotland DSPG Edinburgh Ltd. Geddes House Kirkton North Livingston EH54 6GU Tel: +44-(0)1506-407-730 Ascend Technology Inc. Room 1303, New World Center, No.6009 Yitian Road, Futian District, Shenzhen City, China Tel: +86-755-820-24598 Fax: +86-755-239-82986 Ascend Technology Inc. Rm 607, Hui Huang International Center, 1st Place, Shangdi 10th Road, Haidian District, Beijing City, P.R. Worldwide Sites Japan DSP Group (Japan) Inc. 1-29-1 Nishi-Gotanda Shinagawa-Ku Tokyo 141-0031 Tel:+81-(3)-3493-3050 Tomen Electronics 8-27, Kohnan 1 Chome, Minato-ku, Tokyo 108-8510, Japan Tel: +81-(3)-5462-9619 Fax: +81-(3)-5462-9686 Korea Daesung Semiconductors 140-848, RM 401 Wonhyo BD. 46-1 Wonhyo-ro 3ka, Yongsan-gu, Seoul, Korea Tel: +82-(2)-3272-7300 Fax: +82-(2)-712-4632-3 India DSP Technology Indian Private Limited Information Technology Park Nagawara Village Kasaba Hobli Bangalore 560045 Tel: +91 80 4024 8399 Taiwan Ascendtek Electronics, Inc 11F-7, No. 77, Sec. 1 Hsin Tai Wu Rd., Hsi Chih Taipei Hsien, Taiwan, R.O.C Tel: 886-2-2698-8696 Fax: 886-2-8698-2138 This document is provided by DSP Group, Inc. and/or one or more of its subsidiaries (“DSP Group”). All information and data contained in this document is for informational purposes only, without any commitment on the part of DSP Group, and is not to be considered as an offer for a contract. DSP Group shall not be liable, in any event, for any claims for damages or any other remedy in any jurisdiction whatsoever, whether in an action in contract, tort (including negligence and strict liability) or any other theory of liability, whether in law or equity including, without limitation, claims for damages or any other remedy in whatever jurisdiction, and shall not assume responsibility for patent infringements or other rights to third parties, arising out of or in connection with this document. Further, DSP Group reserves the right to revise this publication and to make changes to its content, at any time, without obligation to notify any person or entity of such revision changes. These materials are copyrighted and any unauthorized use of these materials may violate copyright, trademark, and other laws. Therefore, no part of this publication may be reproduced, photocopied, stored on a retrieval system, or transmitted without the express written consent of DSP Group. Any new issue of this document invalidates previous issues. DSP Group reserves the right to revise this publication and to make changes to its content, at any time, without obligation to notify any person or entity of such revision changes. © 2015 DSP Group Confidential. All rights reserved. June 2015 DSP Group Confidential 2/18 Version 1.3 DHX91 DHAN Module Datasheet Table of Contents TABLE OF CONTENTS 1. INTRODUCTION ........................................................................................................................................... 4 1.1. General Description ................................................................................................................................. 4 1.2. Block Diagram ......................................................................................................................................... 4 1.3. Features .................................................................................................................................................... 5 2. PIN AND SIGNAL DESCRIPTION............................................................................................................... 6 2.1. Pin List..................................................................................................................................................... 6 3. MODULE ELECTRICAL SPECIFICATIONS .............................................................................................. 8 3.1. Absolute Maximum Rating ...................................................................................................................... 8 3.2. Recommended Operating Conditions ...................................................................................................... 8 3.3. Power Consumption................................................................................................................................. 9 3.4. Transmitter............................................................................................................................................. 10 3.5. Receiver ................................................................................................................................................. 10 4. MODIFYING MODULE SOFTWARE AND ADJUSTING PARAMETERS ............................................ 11 5. APPLICATION SCHEMATIC GUIDE ........................................................................................................ 11 5.1. Power Supply and Battery Check .......................................................................................................... 11 5.2. UART Interface and Wakeup (Applications running on external MCU) .............................................. 12 5.3. Driving LEDs ........................................................................................................................................ 13 5.4. DHAN Standalone Applications ............................................................................................................ 13 6. APPLICATION PCB DESIGN RECOMMENDATIONS............................................................................ 14 6.1. Antenna Recommendations ................................................................................................................... 14 6.1.1. Wire Antennas ................................................................................................................................ 14 6.1.2. Chip Antennas ................................................................................................................................. 15 6.1.3. Printed Antennas ............................................................................................................................. 15 7. ASSEMBLY INFORMATION ..................................................................................................................... 16 7.1. Mechanical............................................................................................................................................. 16 7.2. Surface Mount ....................................................................................................................................... 16 8. SUPPLEMENTARY INFORMATION ........................................................................................................ 17 8.1. Ordering Information ............................................................................................................................. 17 8.2. Abbreviations Used ............................................................................................................................... 17 8.3. Change Log............................................................................................................................................ 17 LIST OF FIGURES ............................................................................................................................................... 18 LIST OF TABLES ................................................................................................................................................ 18 June 2015 DSP Group Confidential 3/18 Version 1.3 DHX91 DHAN Module Datasheet Introduction 1. Introduction 1.1. General Description The DSPG DHAN module is based on the state-of-the-art DHX91 - a 4th generation DECT SOC. The DHAN module is appropriate for the AC or battery powered ULE Node operating in a star network with a ULEcertified Controller at the hub. The DHAN is a “turn-key” solution providing the user with a jump-start in developing a ULE Node Application. It is easily integrated into the smallest of ULE Nodes, providing excellent range with minimized drain on the battery, allowing the designer to focus on developing the application. The complete platform includes an SDK, API GUI, and user documentation. The DHAN module can be used as a standalone solution (with the application running on the DHX91 ARM) or it can provide the wireless connectivity channel for a sensor application running on an external MCU. In the latter case, the MCU communicates with the DHAN via serial UART interface. For the standalone DHAN case (or other cases where customization is required), the user will need to account for replacing the standard HAN-FUN SW stack with a customized stack 1.2. Block Diagram JTAG I2C QSPI DHX91 UART Antenna Matching, external to Module GPIO VCC 13M XTAL ULE IO ULE ADC/DAC DHAN Figure 1-1: DXH91 DHAN Module Block Diagram June 2015 DSP Group Confidential 4/18 Version 1.3 DHX91 DHAN Module Datasheet Introduction 1.3. Features General Appropriate for both battery powered and AC-powered ULE Nodes Includes embedded HAN-FUN ULE SW Stack with welldocumented API for control via external application MCU June 2015 Processor (ARM926 32-bit RISC Controller) and memory appropriate for standalone DHAN solutions (requires SW customization) Best-in-class radio performance Tx power: +23.5 dBm Rx sensitivity: -96 dBm@1000 ppm Support for EU, US and other regional DECT bands Compliance with EN301406, FCC part 15.329 & ARIB STD-T101 Small form factor: 15 mm x 32.5 mm x 3.8 mm Low external BOM Well matched RF Port, easily connected to an off-module 50Ohm antenna Operating temperature: -40° C to +85° C Applications Hibernation mode: low power (<2 uA) DSP Group Confidential Home automation Home security Connected appliances Smart energy 5/18 DHX91 DHAN Module Datasheet Version 1.3 Pin and Signal Description 2. Pin and Signal Description 2.1. Pin List Table 2-1: DHAN Module Pinout PIN NO. NAME 1 GND 2 DCINS NC (Not Connected) 3 DCIN3 Used to monitor battery level via this ADC input. RSTN Pull to GND to force reset. Optionally connect to external MCU output or to a SPST switch (for manual reset) or leave NC 4 5 6 7 GND SCL I2C Clock I/O. Not used by HAN_FUN. Can be left as NC SDA I2C Data I/O, Not used by HAN_FUN. Can be left as NC IIC_ACK I2C ACK, Not used by HAN_FUN. Can be left as NC 8 GPIO7 General Purpose I/O. Can be left NC 9 GPIO8 General Purpose I/O. Can be left NC 10 RxD (GPIO9) 11 TDI JTAG Data In, If not needed, can be left NC 12 TMS JTAG Mode Select, If not needed, can be left NC 13 TDO JTAG Data Out, If not needed, can be left NC 14 TCK JTAG Clock, If not needed, can be left NC 15 RTCK JTAG Reset, If not needed, can be left NC 16-17 GND GND UART Rx 18 TxD (GPIO10) 19 VDD_APU 1.8V test point. 0V during hibernate. Leave NC 20 VDD 1.2V test point. 0V during hibernate. Leave NC VCC Power Supply Input. Connect to Battery or 3V regulated supply 21 UART Tx 22 DOUBCAP2P ULE I/O. If not used, can be left NC 23 DCIN2 ULE I/O. If not used, can be left NC 24 VCC3V 3V test point. 0V during hibernate. Leave NC 25 LEDSINK/DCIN 26-27 June 2015 DESCRIPTION/TYPE GND ULE I/O. If not used, can be left NC GND DSP Group Confidential 6/18 DHX91 DHAN Module Datasheet Version 1.3 PIN NO. 28 AMP2_OUT 29 AMP1_P 30 AMP1_OUT 31 MPWR/ANA2_IN DESCRIPTION/TYPE ULE I/O. If not used, can be left NC ULE non-inverting sensor conditioning input ULE I/O. If not used, can be left NC ULE I/O (or Microphone Power). If not used, can be left NC 32 MIN Leave NC 33 MIP Leave NC 34 ANA_IN1 ULE I/O. If not used, can be left NC 35 SPOUTP Leave NC 36 SPOUTN Leave NC 37 PWM0 38 XIN_32K Leave NC 39 XOUT_32K Leave NC 40 VDD_ULE 1.8V test point. Active during hibernate. Leave NC 41 VCCRF 42-50 June 2015 NAME Pin and Signal Description GND 51 Antenna 52 GND Analog Output Power Supply Input to RF GND RF In/Out, 50 Ohm GND DSP Group Confidential 7/18 Version 1.3 DHX91 DHAN Module Datasheet Module Electrical Specifications 3. Module Electrical Specifications All parameters are for 25ºC. 3.1. Absolute Maximum Rating Table 3-1: Absolute Maximum Rating PIN NAME PIN MIN MAX UNIT VCC 21 -0.3 4.6 V VccRF 41 -0.3 4.6 V I2C 5, 6, 7 -0.3 4.6 V JTAG 11, 12, 13, 14, 15 -0.3 4.6 V GPIO 8, 9, 10, 18 -0.3 4.6 V DCINs,DCIN1,2,3 2, 3, 23, 25 -0.3 4.6 V Storage Temperature - -45 +90 °C 3.2. Recommended Operating Conditions Table 3-2: Recommended Operating Conditions RATING MIN TYP MAX UNIT Operating ambient temperature -40 +25 +85 °C VccRF, VCC 1.95 3.0 3.6 V 0.8 V JTAG, UART DCIN3 June 2015 CONDITIONS VIL VIH VOL VOH (VCC is at nominal 3V) 2.0 0.4 2.4 1.95 3.0 DSP Group Confidential VCC V 8/18 Version 1.3 DHX91 DHAN Module Datasheet Module Electrical Specifications 3.3. Power Consumption Table 3-3: Power Consumption June 2015 PARAMETER TEST CONDITIONS TYP MAX UNIT Tx Current VccRF=3 V VCC=3 V Band=EU @ 23dBm 400 480 mA Tx Current VccRF=3 V VCC=3 V Band=US @ 21 dBm 250 300 mA Rx Current VccRF=3 V VCC=3 V 125 135 mA Hibernation VccRF=3 V VCC=3 V 1.7 2.5 uA DSP Group Confidential 9/18 Version 1.3 DHX91 DHAN Module Datasheet Module Electrical Specifications 3.4. Transmitter Table 3-4: Tx Characteristics CHARACTERISTICS TEST CONDITIONS MIN TYP MAX UNIT NTP VccRF=3 V VCC=3 V Band=EU 22 23 24 dBm NTP VccRF=3 V VCC=3 V Band=US 19 20 21 dBm Harmonics VccRF=3 V VCC=3 V Band=EU & US -40 -35 dBm Transmission Mask EN 301406 Paragraph 5.3.3 Comply Frequency Offset EN 301406 Paragraph 5.3.1 -50 8 +50 KHz Frequency Drift EN 301406 Paragraph 5.3.5 -15 0 +15 KHz/Slot Emission Due Modulation EN 301406 Paragraph 5.3.6.2 M±1 M±2 M±3 M>±3 N/A dBm -20 -42 -47 -50 -8 -30 -40 -44 3.5. Receiver Table 3-5: Rx Characteristics June 2015 CHARACTERISTICS TEST CONDITIONS Sensitivity, BER < 1000ppm VccRF=3 V VCC=3 V Maximum input power VccRF=3 V VCC=3 V MIN DSP Group Confidential TYP MAX UNIT -96 -93 dBm 15 dBm 10/18 Version 1.3 DHX91 DHAN Module Datasheet Application Information 4. Modifying Module Software and Adjusting Parameters The DHAN module is loaded with the standard HAN-FUN image, configured for application control by an external MCU via the UART CMND Node Interface. It is also configured for European band operation, with a generic ID (IPEI in DECT nomenclature) and it will identify itself as a smoke detector. These latter 3 items are configurable ULE parameters that can be modified by the user and stored back into the module nonvolatile memory. However, if the user application is using the DHX91 as a standalone controller (ie no external MCU) or needs some means other than the UART CMND interface for communication between the external MCU and the DHAN – customization and reloading of the software image running on the DHAN is required. Custom software images as well as ULE parameters can be updated either via the JTAG or the UART I/F. DSP Group can supply a tool (Vega Memory Tool) to accomplish both image update and parameter modification using the JTAG I/F. So it is recommended that the customer include test points in the application board layout to access the JTAG port (see schematic tips later on) – at least during development phase. Note, however, that this tool, while appropriate for prototype needs, is likely not suitable for a mass production setting – in particular if a new image needs to be burned. The UART CMND API includes commands for updating parameters. Furthermore, the UART I/F can facilitate more efficient means of erasing and refreshing the software image on the DHAN. So the user should consider exposing this I/F as well for connecting to his production rack. If the application board includes an external MCU, than its UART I/F will need to be tri-stated during this production phase. 5. Application Schematic Guide This section describes how to connect the DHAN to the power supply, to an external MCU via UART and to LED indicators 5.1. Power Supply and Battery Check VCC (21) DHAN VCCRF (41) Bulk Cap* Battery or Regulator Output DCIN3 (3) GND (1,16,17,26,27, 42-50, 52) Notes: 1) Bulk cap is not required when using lithium batteries such CR123A or CR2. Suggest 100µF cap for AA or AAA applications and 500mF for CR2032 Coin-Cell operation 2) DCIN3 is an input to an ADC that monitors the battery level Figure 5-1: Power Supply and Battery Detect Interconnect June 2015 DSP Group Confidential 11/18 Version 1.3 DHX91 DHAN Module Datasheet Application Information 5.2. UART Interface and Wakeup (Applications running on external MCU) In circumstances where the external MCU detects an event that needs to be communicated to the DHAN, it will need to wake up the DHAN from its low current hibernation mode, wait ~10mS for the DHX91 to reboot and then signal to the DHX91 via UART I/F. There are two options for the external MCU to wake the DHAN from hibernation: 1) Apply a rising edge to one of the ULE I/O (configured as a Digital Wakeup), wait ~10mS and begin communication with the DHX91 DHAN via UART. See Figure 5-2 2) Begin communication via UART, with the expectation that it will take ~10mS for the ext MCU to obtain a response from the awaking DHAN. See Figure 5-3 In other circumstances, an incoming Page or Alert from the Controller will be detected by the DHAN. If the external MCU is in a Sleep Mode the DHAN will need to first awake the MCU. Most MCUs will wake upon sensing transitions on the DHAN UART TxD line. However, some may require (prefer) to be woken up by application of a rising edge to a generic digital input at the MCU. This option is also called out in Figure 5-2. GPIO9/RxD(10) TxD GPIO10/TxD (18) RxD DHAN Ext MCU ULE_IO* Wakeup ULE_IO or GPIO Wakeup Note: ULE IOs are pins 22, 25, 28, 30, 31, 34 Figure 5-2: UART I/F with bi-directional, dedicated signals for wakeup DHAN Pin10 Pin30 TxD Ext MCU RxD Pin34 Pin18 TxD Figure 5-3: UART I/F used for wakeup of DHAN June 2015 DSP Group Confidential 12/18 Version 1.3 DHX91 DHAN Module Datasheet Application Information 5.3. Driving LEDs LEDs that need to operate while the DHAN is in hibernation can utilize the ANA_IN1 pin (34) which can be configured as a PWM and the LEDSINK pin (25) which features a PWM with LED sink capabilities. For DHAN active or registration indications, PWM0 (pin37) can also be used. 5.4. DHAN Standalone Applications The DHX91 ULE block includes a Sensor Conditioning Module which can facilitate many types of ULE applications. This module is a highly configurable analog circuit that can be used to interface to a wide variety of sensor transducers. The module is built around the following sub-circuits: Two analog operational amplifiers (op-Amps) with shared bias source Two analog comparators with digital output One configurable digital potentiometer Three configurable ratiometric voltage references with selectable source Several analog distribution MUXes Several sample-and-hold (S&H) mechanisms June 2015 DSP Group Confidential 13/18 Version 1.3 DHX91 DHAN Module Datasheet Application Information 6. Application PCB Design Recommendations It is recommended that unused pads on the Application PCB not be left as isolated islands of copper but rather be anchored with via to inner layers of the PCB. It is also recommend that GND vias be applied liberally in the vicinity of the antenna pin output (Pin 51) and the associated GND pins (42-50 and 52). The following layout recommendations need to be apply on Main Board: 1. Implement a solid ground under the DHAN module. 2. Do not route signal traces under the module. Use the bottom layer for signal routing. 3. Make sure no components are near the antenna. 4. Locate the antenna on the edge of the PCB. 5. Use coplanar wave-guide trace between the DHAN module and antenna, it should be designed to be as short as possible with 50Ω impedance. 6. Add GND vias alongside the RF trace. 7. Route the RF trace with gradual bends and no sharp corners. 8. Design the antenna position according to the common usage/position of the ULE product for optimal range. 6.1. Antenna Recommendations A Pi-scheme should be added between the DHAN module antenna port and the antenna. This circuit will be used for antenna matching, if needed. To Module To Antenna DNP DNP 0 ohm Figure 6-1: Pi-Scheme for Antenna Matching Applications can use chip, wire or printed antennas – the latter being the most cost-effective and assemblyfriendly. However it requires space on the application PCB. 6.1.1. Wire Antennas The wire antenna should be bent according to the cabinet structure one should try to implement minimal of parallel structures. The total length of the wire antenna should be ¼ Lambda (~40.0 mm). It is important to ensure an adequate ground plane near the antenna port in order to obtain maximal antenna gain and efficiency. June 2015 DSP Group Confidential 14/18 Version 1.3 6.1.2. 6.1.3. DHX91 DHAN Module Datasheet Application Information Chip Antennas P/N Manufacture ANT8868LL00R1880A Yageo CAN4311112001881K Yageo W3022 Pulse Elect Printed Antennas The most popular are INV-F-Antenna and monopole antenna, RF CAD tools are recommended to use when designing such, below one can find typical INV-F-Antenna dimensions for DECT band. 85 mil Feeding Point GND 180 mil 25 mil 1060 mil Figure 6-2: INV-F-Antenna Dimension A practical, more compact version of this inverted-F is shown below. Contact DSPG to obtain the design file. June 2015 DSP Group Confidential 15/18 Version 1.3 DHX91 DHAN Module Datasheet Application Information 7. Assembly Information 7.1. Mechanical Shield Pin-1 Pin-16 Typ 1.27 Pin-17 Pin-51 Antenna 15.77 14.50 13.02 1.59 Pin-42 Pin-27 Pin-26 2.60 0.90 3.72 31.45 32.55 Figure 7-1: Module Mechanical Outline Figure 7-2: Recommended PCB Footprint 7.2. Surface Mount The DHAN module uses a flat shield cover for a fully automatic assembly process. For backing and reflow recommendations, use MSL 3 in the JEDEC/IPC standard J-STD-20b. The temperature classification (TC) for the module is 245° C. June 2015 DSP Group Confidential 16/18 Version 1.3 DHX91 DHAN Module Datasheet Supplementary Information 8. Supplementary Information 8.1. Ordering Information Part #: DHX91MDMCFAE5AMI 8.2. Abbreviations Used Table 8-1: Abbreviations ACRONYM DESCRIPTION GPIO General-Purpose Input Output I2C Inter Integrated Circuit JTAG Joint Test Action Group, the common name for the IEEE 1149.1 standard test access port and boundary-scan architecture RF Radio Frequency UART Universal Asynchronous Receiver Transmitter ULE Ultra Low Energy 8.3. Change Log Table 8-2: List of Changes REVISION DATE 1.0 July 2014 1.1 December 2014 Corrected App Schematic February 2015 *Clarified that printed antenna is not incorporated in the module. *Added recommendations for application board PCB June 2015 *Add Application Schematic and Layout *Add PCB footprint *Corrected Part# in Ordering Info 1.2 1.3 June 2015 DESCRIPTION First release DSP Group Confidential 17/18 Version 1.3 DHX91 DHAN Module Datasheet List of Tables LIST OF FIGURES Figure 1-1: DXH91 DHAN Module Block Diagram .................................................................................................... 4 Figure 5-1: Power Supply and Battery Detect Interconnect ........................................................................................ 11 Figure 5-2: UART I/F with bi-directional, dedicated signals for wakeup ................................................................... 12 Figure 5-3: UART I/F used for wakeup of DHAN ...................................................................................................... 12 Figure 6-1: Pi-Scheme for Antenna Matching ............................................................................................................. 14 Figure 6-2: INV-F-Antenna Dimension ...................................................................................................................... 15 Figure 7-1: Module Mechanical Outline ..................................................................................................................... 16 Figure 7-2: Recommended PCB Footprint .................................................................................................................. 16 LIST OF TABLES Table 2-1: DHAN Module Pinout ................................................................................................................................. 6 Table 3-1: Absolute Maximum Rating .......................................................................................................................... 8 Table 3-2: Recommended Operating Conditions .......................................................................................................... 8 Table 3-3: Power Consumption ..................................................................................................................................... 9 Table 3-4: Tx Characteristics ...................................................................................................................................... 10 Table 3-5: Rx Characteristics ...................................................................................................................................... 10 Table 8-1: Abbreviations ............................................................................................................................................. 17 Table 8-2: List of Changes ......................................................................................................................................... 17 June 2015 DSP Group Confidential 18/18